CN103547074A - High frequency metal core circuit substrate production method - Google Patents
High frequency metal core circuit substrate production method Download PDFInfo
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- CN103547074A CN103547074A CN201310476142.0A CN201310476142A CN103547074A CN 103547074 A CN103547074 A CN 103547074A CN 201310476142 A CN201310476142 A CN 201310476142A CN 103547074 A CN103547074 A CN 103547074A
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Abstract
The invention discloses a high frequency metal core circuit substrate production method. The method includes adopting tetrafluoroethylene powder and polyphenylene ether powder, performing ball-milling through a ball milling machine, then placing substrate dielectric material in a mole, forming a substrate dielectric material layer at high temperature in a pressed manner, selecting glass fiber cloth, placing in PTFE resin, preimpregnating through an impregnator, producing glass cloth impregnated bonding sheet by high-temperature sintering, finally selecting a copper foil layer, an insulation dielectric material layer, a glass cloth impregnated bonding sheet and a metal core, arranging the insulation dielectric material layer above the copper foil layer, inserting the glass cloth impregnated bonding sheet between the insulation dielectric material layer and the copper foil layer and bonding, arranging the metal core above the insulation dielectric material layer, inserting the glass cloth impregnated bonding sheet between the insulation dielectric material layer and the metal core and bonding, and finally forming in a pressed manner with pressure in the high-temperature environment. The high frequency metal core circuit substrate has the advantage of simple structure, reasonable design, good insulation, low thermal resistance, high thermal conductivity, good radiating performance, stable and reliable performance, and low producing cost.
Description
Technical field
The present invention relates to circuit board, especially a kind of manufacture method of electric metal base circuit board.
Background technology
Along with the development of high power, high-density electronic device and the continuous progress of electronic technology, electronic product forward is light, thin, little, the development of multifunction aspect, and traditional circuit base plate is substituted by the high-frequency circuit substrate of high speed, high reliability gradually.Copper foil clad plate of polytetrafluoroethylglass glass cloth is because of low dielectric, low dielectric loss, low water absorption, the good characteristics such as serviceability temperature scope is wide are subject to client's favor in high-frequency circuit substrate, bearing great current, powerful electric metal base circuit board is widely applied, on circuit board, the heat dissipation problem of electronic device becomes increasingly conspicuous thereupon, the bonding of thicker Copper Foil and dielectric layer, peel strength is crucial, peel strength after bonding sheet technology forms the adhesion between metallic matrix and copper foil layer and circuit layer plays most important effect, peel strength index after thermal stress is not less than 1.05N/mm, this is a critical index of this substrate production of puzzlement always, because its molecule of polytetrafluoroethylglass glass cloth coated copper coin dielectric material polyflon (PTFE) has the fluorine-containing shell of one deck natural instincts outward, there is outstanding not viscosity energy, be applied to after high heat-resisting environment, circuit board line layer easily comes off or ruptures, cause on circuit board components and parts overheated, thereby make the reliability decrease of complete machine.
Summary of the invention
The invention provides a kind of manufacture method of electric metal base circuit board, the advantages such as that the electric metal base circuit board that the method is made has is simple in structure, good insulation preformance, the high heat conduction of low thermal resistance, excellent radiation performance, stable performance, reliable, cost of manufacture is low and can use for a long time under hot and humid environment.
The present invention has adopted following technical scheme: a kind of manufacture method of electric metal base circuit board, it comprises the following steps: step 1, make high heat conductive insulating layer of dielectric material, adopt the pure polytetrafluoroethylene powder of low-k to mix with the binding medium layer thickness requirement according to a certain percentage of polyphenylene oxide powder, through ball mill ball milling a period of time, form substrate media material, then substrate media material is placed in to mould and forms substrate media material layer through high-temperature laminating; Step 2, makes polytetrafluoroethyldispersion dispersion and glass cloth impregnation bonding sheet, chooses glass fabric and puts into PTFE resin and carry out pre-preg through cement dipping machine, then after high temperature sintering, makes glass cloth impregnation adhesive sheet; Step 3, make electric metal base circuit board, choose copper foil layer, dielectric material layer, glass cloth impregnation bonding sheet, metal base, dielectric material layer is arranged on to the top of Copper Foil, middle by glass cloth impregnation bonding sheet interval bonding, insulating medium layer top is metal substrate, middle by glass cloth impregnation bonding sheet interval bonding, compressing finally by hot environment processing with pressure.
In described step 1, ball mill Ball-milling Time is 24 hours, and substrate media material is placed in mould and forms substrate media material layer through 285 ℃ of temperature pressings; In described step 2, choose glass fabric that thickness is less than 0.03mm and put into PTFE resin and carry out pre-preg through cement dipping machine, then after 230 ℃ of high temperature sinterings, make described glass cloth impregnation adhesive sheet; In described step 3, to select thickness be the copper foil layer of 35um-280um to copper foil layer; In described step 3, the sheet material of Metal Substrate substrate is any one in aluminium, aluminium alloy, copper, copper alloy, stainless steel; In described step 3, hot environment is 288 ℃.
The present invention has following beneficial effect: the present invention uses polytetrafluoroethylene powder to mix with polyphenylene oxide powder through the latter made substrate media material of ball mill ball milling, be applied in high heat-resisting environment, heat stress index reaches 288 ℃, 120S and not affected by humiture, under atmospheric environment, use and still there is good electrical insulating property for a long time, do not change the physics and chemistry performance of substrate material, long service life, this dielectric material is the insulating material of the high heat conduction of low thermal resistance, at the temperature of 290 ℃, use indeformable, still have good intensity and insulation property, cost of manufacture is low; High-power for bearing great current, load, circuit layer Copper Foil requires the very large ability of damming, and copper thickness requires to use the Copper Foil of 35um-280um; Use polytetrafluoroethyldispersion dispersion and glass cloth impregnation bonding sheet, the bonding that is conducive to copper foil layer and metal substrate and dielectric material, viscoelastic property is good, improves the peel strength of substrate, particularly be applied to high heat-resisting environment, solve the poor problem of Copper Foil cohesive force; Use metal substrate as supporting object, there is high-termal conductivity, be suitable for board circuit processing technology, the conventional mechanical processing such as applicable boring, punching and cutting, cut down finished cost, and can bear machinery and thermal stress, suitable power assembly surface mounts SMT technique, without radiator, volume dwindles greatly, and radiating effect is fabulous.
Embodiment
The invention provides a kind of manufacture method of electric metal base circuit board, it comprises the following steps: step 1, make high heat conductive insulating layer of dielectric material, according to dielectric constant, require to select ratio requirement to adopt the pure polytetrafluoroethylene powder of low-k to mix with the binding medium layer thickness requirement according to a certain percentage of polyphenylene oxide powder, through ball mill ball milling, within 24 hours, form substrate media material, then substrate media material is placed in to mould and forms substrate media material layer through 285 ℃ of high-temperature laminatings; Step 2, makes polytetrafluoroethyldispersion dispersion and glass cloth impregnation bonding sheet, chooses glass fabric that thickness is less than 0.03mm and puts into PTFE resin and carry out pre-preg through cement dipping machine, then under 230 ℃ of high temperature, after sintering, makes glass cloth impregnation adhesive sheet; Step 3, make electric metal base circuit board, choosing thickness is 35um-280um copper foil layer, dielectric material layer, glass cloth impregnation bonding sheet, metal base, the sheet material of Metal Substrate substrate is any one in aluminium, aluminium alloy, copper, copper alloy, stainless steel, dielectric material layer is arranged on to the top of Copper Foil, middle by glass cloth impregnation bonding sheet interval bonding, insulating medium layer top is metal substrate, middle by glass cloth impregnation bonding sheet interval bonding, compressing finally by 288 ℃ of hot environment processing with pressure.
Claims (5)
1. a manufacture method for electric metal base circuit board, is characterized in that it comprises the following steps:
Step 1, make high heat conductive insulating layer of dielectric material, adopt the pure polytetrafluoroethylene powder of low-k to mix with polyphenylene oxide powder, through ball mill ball milling, form substrate media material, then substrate media material is placed in to mould and forms substrate media material layer through 285 ℃ of pressings;
Step 2, makes polytetrafluoroethyldispersion dispersion and glass cloth impregnation bonding sheet, chooses glass fabric and puts into PTFE resin and carry out pre-preg through cement dipping machine, then after 230 ℃ of sintering, makes glass cloth impregnation adhesive sheet;
Step 3, make electric metal base circuit board, choose copper foil layer, dielectric material layer, glass cloth impregnation bonding sheet, metal base, dielectric material layer is arranged on to the top of Copper Foil, middle by glass cloth impregnation bonding sheet interval bonding, insulating medium layer top is metal substrate, middle by glass cloth impregnation bonding sheet interval bonding, compressing finally by 288 ℃ of environment processing with pressure.
2. the manufacture method of electric metal base circuit board according to claim 1, is characterized in that in described step 1, ball mill Ball-milling Time is 24 hours, and substrate media material is placed in mould and forms substrate media material layer through 285 ℃ of temperature pressings.
3. the manufacture method of electric metal base circuit board according to claim 1, it is characterized in that choosing in described step 2 glass fabric that thickness is less than 0.03mm and put into PTFE resin and carry out pre-preg through cement dipping machine, then after 230 ℃ of high temperature sinterings, make described glass cloth impregnation adhesive sheet.
4. the manufacture method of electric metal base circuit board according to claim 1, is characterized in that in described step 3 that it is the copper foil layer of 35um-280um that copper foil layer is selected thickness.
5. the manufacture method of electric metal base circuit board according to claim 1, the sheet material that it is characterized in that Metal Substrate substrate in described step 3 is any one in aluminium, aluminium alloy, copper, copper alloy, stainless steel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310476142.0A CN103547074A (en) | 2013-10-13 | 2013-10-13 | High frequency metal core circuit substrate production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310476142.0A CN103547074A (en) | 2013-10-13 | 2013-10-13 | High frequency metal core circuit substrate production method |
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| CN103547074A true CN103547074A (en) | 2014-01-29 |
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| CN201310476142.0A Pending CN103547074A (en) | 2013-10-13 | 2013-10-13 | High frequency metal core circuit substrate production method |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602454A (en) * | 2014-12-22 | 2015-05-06 | 泰州市博泰电子有限公司 | Production method of PTFE (Poly Tetra Fluoro Ethylene) high-frequency metal matrix nano composite circuit substrate |
| CN104708869A (en) * | 2015-03-25 | 2015-06-17 | 广东美的制冷设备有限公司 | Aluminum-based copper-clad plate with high thermal conductivity and manufacturing method thereof |
| CN105007690A (en) * | 2015-07-14 | 2015-10-28 | 泰州市博泰电子有限公司 | Method for manufacturing arc-shaped high-frequency ceramic module substrate |
| US10421855B2 (en) | 2017-01-18 | 2019-09-24 | Ventec Electronics (Suzhou) Co., Ltd. | Fluorinated vinyl polymer resin composition, prepreg and laminate materials containing the same |
| CN112538186A (en) * | 2019-09-04 | 2021-03-23 | 广东生益科技股份有限公司 | Interlayer bonding sheet for multilayer board and preparation method and application thereof |
| CN114900964A (en) * | 2022-05-13 | 2022-08-12 | 泰州市博泰电子有限公司 | Production and processing method of PTFE (polytetrafluoroethylene) high-frequency metal composite circuit board |
-
2013
- 2013-10-13 CN CN201310476142.0A patent/CN103547074A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104602454A (en) * | 2014-12-22 | 2015-05-06 | 泰州市博泰电子有限公司 | Production method of PTFE (Poly Tetra Fluoro Ethylene) high-frequency metal matrix nano composite circuit substrate |
| CN104708869A (en) * | 2015-03-25 | 2015-06-17 | 广东美的制冷设备有限公司 | Aluminum-based copper-clad plate with high thermal conductivity and manufacturing method thereof |
| CN105007690A (en) * | 2015-07-14 | 2015-10-28 | 泰州市博泰电子有限公司 | Method for manufacturing arc-shaped high-frequency ceramic module substrate |
| US10421855B2 (en) | 2017-01-18 | 2019-09-24 | Ventec Electronics (Suzhou) Co., Ltd. | Fluorinated vinyl polymer resin composition, prepreg and laminate materials containing the same |
| CN112538186A (en) * | 2019-09-04 | 2021-03-23 | 广东生益科技股份有限公司 | Interlayer bonding sheet for multilayer board and preparation method and application thereof |
| CN114900964A (en) * | 2022-05-13 | 2022-08-12 | 泰州市博泰电子有限公司 | Production and processing method of PTFE (polytetrafluoroethylene) high-frequency metal composite circuit board |
| CN114900964B (en) * | 2022-05-13 | 2023-10-24 | 泰州市博泰电子有限公司 | Production and processing method of PTFE high-frequency metal composite circuit board |
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| PB01 | Publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20140129 |
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| WD01 | Invention patent application deemed withdrawn after publication |