CN111002688A - Preparation method of flexible foldable insulating heat dissipation material - Google Patents
Preparation method of flexible foldable insulating heat dissipation material Download PDFInfo
- Publication number
- CN111002688A CN111002688A CN201911167159.1A CN201911167159A CN111002688A CN 111002688 A CN111002688 A CN 111002688A CN 201911167159 A CN201911167159 A CN 201911167159A CN 111002688 A CN111002688 A CN 111002688A
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- Prior art keywords
- flexible foldable
- flexible
- heat dissipation
- insulating heat
- dissipation material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
- B32B9/007—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile comprising carbon, e.g. graphite, composite carbon
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
- B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B9/045—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1207—Heat-activated adhesive
- B32B2037/1215—Hot-melt adhesive
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- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Chemical & Material Sciences (AREA)
- Carbon And Carbon Compounds (AREA)
Abstract
The invention discloses a preparation method of a flexible and foldable insulating heat dissipation material, and belongs to the technical field of folding and heat conduction. According to the invention, flexible foldable artificial graphene and a flexible foldable PI raw film are selected to prepare hot melt adhesive, then the flexible foldable artificial graphene and the flexible foldable PI raw film are bonded by the hot melt adhesive at high temperature, and finally the bonded flexible foldable artificial graphene and the flexible foldable PI raw film are subjected to extension pressing by high pressure to form the flexible foldable insulating heat dissipation material. The invention directly produces the flexible and foldable insulating heat dissipation material from the source of raw materials, thereby reducing the manpower, improving the productivity, reducing the process loss and improving the utilization rate of products.
Description
Technical Field
The invention relates to the technical field of folding and heat conduction, in particular to a preparation method of a flexible foldable insulating heat dissipation material.
Background
With the development of electronic products, users have increasingly high power requirements for electronic products, such as thinness and high size, and parts of electronic products. The existing heat conducting products not only need heat dissipation requirements, but also need to be resistant to bending and folding so as to meet the requirements of folding products.
The existing heat-conducting products can be roughly divided into silica gel heat radiation, copper aluminum foil heat radiation and graphite heat radiation. The three products can not meet the requirement of a user on product folding, and the heat conduction product needing heat conduction at present is a material which can quickly conduct heat on XYZ and can resist bending to meet the requirement of folding of the user, so that the electronic product can be protected, and the service life of the electronic product can be prolonged.
The application of the folding heat dissipation direction in the market at present is only to simply attach the PET plus aluminum foil or the PET plus copper foil, so that the product with the attached PET plus aluminum foil or the PET plus copper foil has the following defects:
1. because the copper aluminum foil is made of metal materials and is broken after being folded for hundreds of times, the requirement of multiple folding of a user cannot be met;
2. products (copper, aluminum and the like) applied at present are combined with a PET film, and glue is easy to overflow in the use environment of electronic products, and delamination and falling are easy to cause;
3. the products (copper, aluminum and the like) applied at present are combined with the PET film, and the products are mutually attached in the production process, so that materials are wasted, the working hour is increased, and the production cost of the products is increased.
Disclosure of Invention
The invention aims to solve the technical problems of producing flexible and foldable insulating and heat-dissipating materials, reducing manpower, improving productivity, reducing process loss and improving the utilization rate of products.
In order to solve the technical problems, the invention adopts the following scheme: a preparation method of a flexible foldable insulating heat dissipation material comprises the following specific steps:
the first step is as follows: selecting materials, namely selecting flexible foldable artificial graphene and a flexible foldable PI raw film;
the second step is that: mixing the hot melt adhesive, the adhesive powder and water in proportion, standing, and indirectly heating for dissolving;
the third step: laminating at high temperature, namely laminating the flexible foldable artificial graphene and the flexible foldable PI raw film by using hot-melt glue at high temperature;
the fourth step: and (4) calendering, namely calendering the attached flexible foldable artificial graphene and the flexible foldable PI original film by using high pressure.
As a further scheme of the invention, the method for hot melting the glue comprises the following steps: mixing the rubber powder and water according to the proportion of 1: 3-1: 5, standing for 30-60 min, and after the rubber powder expands, indirectly heating to completely dissolve the rubber powder.
As a further scheme of the invention, the indirect heating temperature range is 120-140 ℃, and the indirect heating time range is 30-50 min.
As a further scheme of the present invention, the third high temperature bonding method is: and (3) laminating the flexible foldable artificial graphene and the flexible foldable PI original film by using hot-melt glue at the temperature of 180-200 ℃.
As a further aspect of the present invention, the fourth rolling method includes: and (4) extending and pressing the flexible foldable artificial graphene and the flexible foldable PI raw film laminating material into a flexible foldable insulating heat dissipation material by using 80-120 t of pressure.
The invention has the advantages and positive effects that: because the invention adopts the technical scheme, the production efficiency and the cost are greatly reduced, and the safety of the product use is enhanced as follows: the flexible and foldable PI is adopted for wrapping, the surface is smooth, and poor surface can be reduced; the hot-melt glue is adopted, after the production of the product is finished, the glue is in a solid state, and poor glue overflow cannot be generated in the subsequent production; the invention can obtain the thinnest product with the thickness of 0.03MM, and can meet the requirement of a client on thinning the product structure; the material can be folded for more than 10 ten thousand times, and the heat conductivity coefficient in the XY axial direction can reach 800W/MK; meanwhile, the PI film is wrapped up and down, so that the PI film is insulated in the XYZ axial direction; multiple laminating processes of a single product are reduced, a large amount of labor and machines are not needed for laminating, and labor and equipment cost is reduced; more than 200M of each coil can be realized, the loss of the next procedure is greatly reduced, and the loss of the next procedure is reduced by 10 percent; under the subsequent electronic product use environment, the phenomenon of layering and falling can not be generated, and the safety of the electronic product is greatly improved.
Drawings
Fig. 1 is a flow chart of a method for preparing a flexible and foldable insulating heat dissipation material according to the present invention.
FIG. 2 is a report of performance testing of a method for preparing a flexible and foldable insulating heat dissipating material according to the present invention.
FIG. 3 is a graph of the thermal diffusivity versus thermal conductivity analysis of a sample of the present invention.
Detailed Description
The technical solution of the present invention is described in full and clearly below by way of example applications.
Examples
As shown in figure 1, a flexible and foldable coiled artificial graphene and a flexible and foldable PI raw film are selected, then rubber powder and water are mixed according to the mixing ratio of 1: 3-1: 5, standing is carried out for 30-60 min, indirect heating is carried out after the rubber powder absorbs water and expands, the indirect heating temperature is 120-140 ℃, the indirect heating time is 30-50 min until the rubber powder is completely dissolved to form an ultrathin non-base material hot melt adhesive, the flexible and foldable coiled artificial graphene and the flexible and foldable PI raw film are attached to an attaching machine at 180-200 ℃ by the ultrathin non-base material hot melt adhesive, finally, a graphene sheet layer is subjected to rolling at the pressure of 80-120 t, and the flexible and foldable insulating heat dissipation material can be prepared, and is tested to have the folding times of more than 10 ten thousand times and the thermal diffusion coefficient of 550mm2And the thermal conductivity is more than 800W/M.K.
Inspecting a product
As shown in fig. 2, the sample of the present invention can be folded 20 ten thousand times without damage.
As shown in FIG. 3, the sample of the flexible foldable insulating heat sink material of the present invention has a thermal diffusivity of 550mm2And the thermal conductivity is more than 800W/M.K.
Although specific embodiments of the present invention have been described above, it will be appreciated by those skilled in the art that these are merely examples and that many variations or modifications may be made to the embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims.
Claims (5)
1. A preparation method of a flexible foldable insulating heat dissipation material is characterized by comprising the following steps: the method comprises the following specific steps:
the first step is as follows: selecting materials, namely selecting flexible foldable artificial graphene and a flexible foldable PI raw film;
the second step is that: mixing the hot melt adhesive, the adhesive powder and water in proportion, standing, and indirectly heating for dissolving;
the third step: laminating at high temperature, namely laminating the flexible foldable artificial graphene and the flexible foldable PI raw film by using hot-melt glue at high temperature;
the fourth step: and (4) calendering, namely calendering the attached flexible foldable artificial graphene and the flexible foldable PI original film by using high pressure.
2. The method for preparing a flexible foldable insulating heat dissipation material as claimed in claim 1, wherein: the method for hot melting the glue comprises the following steps: mixing the rubber powder and water according to the proportion of 1: 3-1: 5, standing for 30-60 min, and after the rubber powder expands, indirectly heating to completely dissolve the rubber powder.
3. The method for preparing a flexible foldable insulating heat dissipation material as claimed in claim 1, wherein: the indirect heating temperature range is 120-140 ℃, and the indirect heating time range is 30-50 min.
4. The method for preparing a flexible foldable insulating heat dissipation material as claimed in claim 1, wherein: the third high-temperature laminating method comprises the following steps: and (3) laminating the flexible foldable artificial graphene and the flexible foldable PI original film by using hot-melt glue at the temperature of 180-200 ℃.
5. The method for preparing a flexible foldable insulating heat dissipation material as claimed in claim 1, wherein: the fourth step of rolling method comprises: and (3) carrying out extension pressing on the flexible foldable artificial graphene and the flexible foldable PI original film laminating material by using the pressure of 80 t-120 t to prepare the flexible foldable insulating heat dissipation material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911167159.1A CN111002688A (en) | 2019-11-25 | 2019-11-25 | Preparation method of flexible foldable insulating heat dissipation material |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911167159.1A CN111002688A (en) | 2019-11-25 | 2019-11-25 | Preparation method of flexible foldable insulating heat dissipation material |
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| Publication Number | Publication Date |
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| CN111002688A true CN111002688A (en) | 2020-04-14 |
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| CN201911167159.1A Pending CN111002688A (en) | 2019-11-25 | 2019-11-25 | Preparation method of flexible foldable insulating heat dissipation material |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112757724A (en) * | 2020-12-29 | 2021-05-07 | 宁波世一科技有限责任公司 | Flexible metal-based graphene electrothermal material and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105605332A (en) * | 2016-01-21 | 2016-05-25 | 中国石油大学(北京) | Carbon-fiber-based reinforcing ring of pipe penetrating through active fault area |
| CN106113731A (en) * | 2016-06-23 | 2016-11-16 | 深圳市莱必德电子材料有限公司 | Graphene heat conduction and heat radiation film |
-
2019
- 2019-11-25 CN CN201911167159.1A patent/CN111002688A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105605332A (en) * | 2016-01-21 | 2016-05-25 | 中国石油大学(北京) | Carbon-fiber-based reinforcing ring of pipe penetrating through active fault area |
| CN106113731A (en) * | 2016-06-23 | 2016-11-16 | 深圳市莱必德电子材料有限公司 | Graphene heat conduction and heat radiation film |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112757724A (en) * | 2020-12-29 | 2021-05-07 | 宁波世一科技有限责任公司 | Flexible metal-based graphene electrothermal material and preparation method thereof |
| CN112757724B (en) * | 2020-12-29 | 2022-05-20 | 杭州宜联研仿科技有限公司 | Preparation method of flexible metal-based graphene electrothermal material |
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| TA01 | Transfer of patent application right |
Effective date of registration: 20210705 Address after: 516000 No.4, Xingping East Road, Dongxing District, Dongjiang Science Park, Zhongkai high tech Zone, Huizhou City, Guangdong Province Applicant after: Huizhou Zhidong Precision Technology Co.,Ltd. Address before: 215100 No.68 Caixing Road, Cailian village, Linhu Town, Wuzhong District, Suzhou City, Jiangsu Province Applicant before: Suzhou Yingshun insulating material Co.,Ltd. |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20200414 |
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| RJ01 | Rejection of invention patent application after publication |