CN107613588B - Preparation method of quick heating type heating plate and quick heating type heating plate - Google Patents
Preparation method of quick heating type heating plate and quick heating type heating plate Download PDFInfo
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- CN107613588B CN107613588B CN201710693146.2A CN201710693146A CN107613588B CN 107613588 B CN107613588 B CN 107613588B CN 201710693146 A CN201710693146 A CN 201710693146A CN 107613588 B CN107613588 B CN 107613588B
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Classifications
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Abstract
The invention relates to a preparation method of a quick heating plate and the quick heating plate, wherein: the method comprises the following specific steps: 1) Pressing; 2) Etching the circuit; 3) Printing electronic paste; 4) Curing the electronic paste; 5) Spraying a heat insulation layer; 6) Curing again; 7) And installing a high-temperature ceramic binding post to obtain the quick heating type heating plate. The preparation method of the instant heating type heating plate produces the instant heating type heating plate, wherein: the heat-conducting insulating layer, the heating layer and the heat-insulating layer are sequentially overlapped from bottom to top, and the heat-conducting insulating layer is attached to the substrate after being overlapped. The invention has the advantages of low curing temperature, thin thickness, high heat conductivity, low energy consumption and the like, and is more suitable for wide popularization.
Description
Technical Field
The invention relates to the technical field of electric heating, in particular to a preparation method of a quick heating type heating plate and the quick heating type heating plate.
Background
The traditional electronic paste electric heating plate applied at 200 to 300 ℃ basically uses 314 stainless steel as a base material, and then the electronic paste is sintered at high temperature after being printed on the base material, and the traditional production process needs sintering at high Wen Sici, so as to obtain the electronic paste, for example: the common silver-palladium system and ruthenium system electronic paste is produced by the following steps: 1) Printing an insulating layer and sintering at a high temperature of 800 ℃; 2) Printing a conductive layer and sintering at a high temperature of 800 ℃; 3) Printing an electronic paste heating layer and sintering at 800 ℃; 4) Printing an insulating layer and sintering at a high temperature of 800 ℃. The disadvantages are thus as follows: (1) High sintering temperature and multiple sintering times, and limits the application of the material. The slurry must be sintered at high temperature of 800 ℃ so that it cannot be applied to materials with melting point lower than 800 ℃, such as aluminum, iron, high molecular materials, etc.; (2) The thickness of the manufactured heating plate is thicker, the heating plate cannot be thinned and applied, the heating plate can only be applied to stainless steel materials with the thickness of more than 1mm, the materials with small thickness deform after sintering, the printing precision is affected, the power and the service life of the product are affected, and when the application area is larger, the thickness is increased, so that the product cannot be thinned and applied; (3) The heat conductivity coefficient is low, the heat transfer is slow, and because the sintering temperature of the slurry is 800 ℃, the high-melting point 314 stainless steel material is required to be selected, and the heat conductivity coefficient of the stainless steel material is only about 20w/m.K, and the heat efficiency and the product service life are influenced by the parameter.
Chinese patent: application number CN201620243225.4 discloses a double-deck stainless steel heating plate, aims at providing one kind and generates heat the effect more stable, and the intensification is faster, and the electric heat conversion efficiency is higher and electromagnetic radiation is less board that generates heat, including first aluminium foil layer, including first insulating layer, second on insulating layer, first piece that generates heat, intermediate insulating layer, second piece that generates heat, first insulating layer, second insulating layer and second aluminium foil layer down.
In view of this, there is a need in the art for a fast heating plate with high thermal conductivity and low energy consumption.
Disclosure of Invention
The invention aims to provide a quick heating type heating plate.
The invention adopts the following technical scheme:
the invention provides a preparation method of a quick heating type heating plate, which comprises the following specific steps:
1) Pressing: firstly, stacking a substrate, a heat-conducting insulating layer and a conductor circuit layer in sequence from bottom to top, and laminating by a laminating machine to obtain a composite board, wherein the laminating temperature is 300 ℃;
2) Etching a circuit: cutting the composite board into required size, and etching the designed circuit to the cut conductor circuit layer by using an etching machine;
3) Printing electronic paste: printing the medium-temperature cured electronic paste onto a circuit of the conductor circuit layer to form a heating element layer;
4) Curing the electronic paste: placing the composite board printed with the medium-temperature curing electronic paste into a curing machine for curing, wherein the curing temperature is controlled to be 200 ℃ for 10 minutes;
5) Spraying a heat insulation layer: then spraying a heat insulation layer on the heating element layer in a spraying mode;
6) And (3) curing again: after spraying the heat insulation layer, putting the heat insulation layer into a curing machine, heating to a certain temperature, and curing for 4 hours;
7) And finally, installing and connecting the high-temperature ceramic binding post to the conductor circuit layer to obtain the quick heating type heating plate.
Further, in the step 6), the temperature is first raised to 200 ℃ for curing, and the temperature is then kept for 30 minutes after reaching 200 ℃, then the temperature is raised to 300 ℃, and the temperature is then kept for 120 minutes after reaching 300 ℃ for curing, and then the temperature is lowered and the curing is completed.
The preparation method of the instant heating type heating plate produces the instant heating type heating plate, wherein: the heat-conducting insulating layer, the heating layer and the heat-insulating layer are sequentially overlapped from bottom to top, and the heat-conducting insulating layer is attached to the substrate after being overlapped;
the heating layer comprises a heating body layer attached to the heat conduction insulating layer and a conductor circuit layer arranged between the heating body layer and the heat insulation insulating layer, and the conductor circuit layer is electrically connected with a power supply;
the heating circuit layer is a thin film material formed by printing electronic paste or made of the electronic paste.
Further, the substrate is made of a high thermal conductivity material, such as aluminum or copper material.
Further, the thickness of the substrate is 0.05mm-0.25mm.
Further, an etching circuit for bearing the conductor layer is etched between the heating body layer and the heat conduction insulating layer.
Further, the conductor circuit layer is made of copper, aluminum, copper foil or aluminum foil materials.
Further, after the heat conducting insulating layer, the heating layer and the heat insulating layer are sequentially overlapped, the heat conducting insulating layer is attached to one surface or two symmetrical surfaces of the substrate.
Further, the heat-conducting insulating layer is made of a heat-conducting polyimide material.
Further, the quick heating plate is further provided with a heat-preserving fireproof layer or a heat-insulating cover plate layer, the heat-preserving fireproof layer or the heat-insulating cover plate layer is overlapped on the upper portion of the heat-insulating layer, and the heat-preserving fireproof layer or the heat-insulating cover plate layer is made of fireproof rock wool.
An electric heating apparatus comprising a rapid heating panel as claimed in any one of the preceding claims.
Compared with the prior art, the invention has the beneficial effects that:
the invention adopts the aluminum plate with high cost performance as the base material of the heating plate, has low price, and has the characteristics of light and thin application, quick heat conduction and energy conservation. The invention has the advantages compared with the traditional electric heating plate that:
the curing temperature is low: the aluminum material is used as a base material, and the curing temperature of the electronic paste is 300 ℃ which is far lower than the curing temperature of the stainless steel heating sheet 800 ℃.
Can be applied in light and thin applications: the invention can be applied to aluminum foils with minimum thickness of 0.05mm and total thickness of 0.25mm, and the application does not occupy space.
High heat conductivity coefficient and fast heat transfer: the heat conduction coefficient of the heating sheet is 280w/m.k, and the heat conduction is more than 10 times of that of stainless steel.
Bendable application: the aluminum plate or the aluminum foil can be processed and applied by disassembling and bending according to the requirements, and the flexibility is high.
The invention has the advantages of low curing temperature, thin thickness, high heat conductivity, low energy consumption and the like, and is more suitable for wide popularization.
Drawings
FIG. 1 is a schematic cross-sectional view of a structure of a quick heating type heating plate;
FIG. 2 is a schematic cross-sectional view of another embodiment;
FIG. 3 is a schematic cross-sectional view of a dual-layer instant heating plate structure.
The marks in the figure are as follows: 1-base plate, 2 a-heat conduction insulating layer, 2 b-second heat conduction insulating layer, 3 a-conductor circuit layer, 3 b-second conductor circuit layer, 4 a-heating body layer, 4 b-second heating body layer, 5 a-heat insulation insulating layer, 5 b-second heat insulation insulating layer, 6-heat preservation fireproof layer, 7 a-heat insulation cover plate layer and 7 b-second heat insulation cover plate layer.
Detailed Description
The present invention will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present invention more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the invention.
In the description of the present invention, it should be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present invention and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present invention, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the embodiments of the present invention, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured" and the like are to be construed broadly and include, for example, either permanently connected, removably connected, or integrally formed; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present invention can be understood by those of ordinary skill in the art according to the specific circumstances.
The embodiment provides a preparation method of a quick heating type heating plate, which comprises the following specific steps:
1) Pressing: firstly, stacking a substrate, a heat-conducting insulating layer and a conductor circuit layer in sequence from bottom to top, and laminating by a laminating machine to obtain a composite board, wherein the laminating temperature is 300 ℃;
2) Etching a circuit: cutting the composite board into required size, and etching the designed circuit to the cut conductor circuit layer by using an etching machine;
3) Printing electronic paste: printing the medium-temperature cured electronic paste onto a circuit of the conductor circuit layer to form a heating element layer;
4) Curing the electronic paste: placing the composite board printed with the medium-temperature curing electronic paste into a curing machine for curing, wherein the curing temperature is controlled to be 200 ℃ for 10 minutes;
5) Spraying a heat insulation layer: then spraying a heat insulation layer on the heating element layer in a spraying mode;
6) And (3) curing again: after spraying the heat insulation layer, putting the heat insulation layer into a curing machine, heating to a certain temperature, and curing for 4 hours;
7) And finally, installing and connecting the high-temperature ceramic binding post to the conductor circuit layer to obtain the quick heating type heating plate.
Further, in the step 6), the temperature is first raised to 200 ℃ for curing, and the temperature is then kept for 30 minutes after reaching 200 ℃, then the temperature is raised to 300 ℃, and the temperature is then kept for 120 minutes after reaching 300 ℃ for curing, and then the temperature is lowered and the curing is completed. It can be understood that the whole curing process is 4 hours, and the curing is performed by heat preservation for 30 minutes after 200 ℃, the curing time must be ensured by heat preservation for 120 minutes after 300 ℃, and the heating and cooling time can be adjusted correspondingly.
Referring to fig. 1, the present invention further provides a quick heating type heating plate, wherein: the heat-conducting insulating layer 2a, the heating layer and the heat-insulating layer 5a are sequentially overlapped from bottom to top, and the heat-conducting insulating layer 2a is attached to the substrate 1 after being overlapped;
the heating layer comprises a conductor circuit layer 3a attached to the heat conduction insulating layer 2a and a heating body layer 4a arranged between the conductor circuit layer 3a and the heat insulation insulating layer 5a, and the conductor circuit layer 3a is electrically connected with a power supply; the heating element layer 4a is formed by printing electronic paste in the embodiment; in another embodiment, the heat-generating body layer 4a is made of a thin film material made of electronic paste. The electronic paste in the embodiment comprises nano metal powder, including one or a combination of more of silver powder, copper powder, nickel powder, molybdenum powder, carbon powder, mica powder and the like; thixotropic agents, including one or more combinations of Ding Bingzhi, polyamide wax, hydrogenated castor oil; a thickener comprising one or more combinations of ethylcellulose or KB 6650; solvents including one or more combinations of diethylene glycol, propylene glycol propyl ether, methylacetamide, tributyl citrate, butyl carbitol ester, terpineol; a spiranthes etchant; a defoaming agent; a coupling agent, KH550; high temperature silicone resins and surfactants.
The preparation of the electronic paste comprises the following steps: mixing, emulsifying, grinding, reacting, standing, and finally obtaining the electronic paste.
Further in the embodiment shown in fig. 1, the substrate 1 is made of an aluminum material, the thickness of the aluminum substrate is 0.05mm, and the thickness of the heat conducting insulating layer 2a, the conductor line layer 3a, the heating element layer 4a and the heat insulating layer 5a is 0.05mm, respectively, because the substrate can be made thinner, and the instant heating plate can be controlled to 0.25mm. The purpose of reducing the thickness of the heating plate is achieved, so that the occupation ratio of the heater is effectively reduced, meanwhile, the heat conductivity coefficient of the aluminum substrate is high and reaches 280w/m.K at the highest, and the high heat conductivity of the aluminum substrate can achieve the effects of quick heating and energy saving, so that the heat conductivity is better compared with that of a traditional high-temperature curing electric heating plate.
In other embodiments, the substrate 1 is made of an iron material or a polymer material having a high thermal conductivity, and the thickness of the substrate 1 is controlled to be in the range of 0.05mm to 0.25mm. It should be noted that the thickness of the substrate 1 may be set according to the thickness requirement of the electric heating plate.
Further in this embodiment, an etching circuit for carrying the heating element layer 4a is etched between the conductor circuit layer 3a and the heat conductive insulating layer 2 a. The etched circuit is designed according to the heating requirement of the heating plate, then the etched circuit is etched on the conductor circuit layer 3a by an etching machine, and the electronic paste is printed on the etched circuit to obtain the integral heating body. Etched circuitry and heat generation layer power densities designed according to heat generation rate and heat generation requirements may vary. The etched circuits are uniformly distributed on the heating plate, so that the heating uniformity can be effectively ensured.
Further in this embodiment, the conductor circuit layer 3a is provided with two connecting posts for electrically connecting to a power source. The connecting column is a high-temperature ceramic binding post and is used for being connected with an external power supply to supply power to the high-temperature ceramic binding post, so that the purpose of electric heating is achieved.
In this embodiment, the conductor circuit layer 3a is made of copper, aluminum or copper foil or aluminum foil, and the minimum thickness of the conductor circuit layer 3a is 0.25mm, so that the overall thickness of the heating plate can be effectively reduced.
Further in this embodiment shown in fig. 1, the heat conducting insulating layer 2a, the heating layer and the heat insulating layer 5a are sequentially stacked, and then the heat conducting insulating layer 2a is attached to one surface of the substrate 1. The heating plate with one side is obtained by the design structure, and the requirements of most heating equipment can be met.
In another embodiment, the heat conducting and insulating layer 2a, the heating layer and the heat insulating layer 5a are sequentially stacked, and then the heat conducting and insulating layer 2a is attached to two surfaces of the substrate 1, and an axisymmetric structure is formed by taking the substrate 1 as an axisymmetric structure. The double-sided heating structure can meet the requirement of heating equipment with larger heating value or heating required by double sides.
In the embodiment shown in fig. 3, a second heat conducting insulating layer 2b, a second conductor circuit layer 3b, a second heating body layer 4b and a second heat conducting insulating layer 5b are added on the basis of the single-layer quick heating plate by taking the substrate 1 as an axisymmetric way, so that a double-sided quick heating plate is formed.
Further referring to fig. 1, the heat-conducting insulating layer 2a is made of heat-conducting polyimide material or heat-conducting modified epoxy resin, which not only plays an insulating role to ensure the safety of the electric heating plate, but also effectively ensures the heat conductivity. The heat insulation layer 5a is made of heat insulation polyimide or heat insulation type modified epoxy resin, so that the safety of the electric heating plate is guaranteed due to the insulation effect, the heat insulation property is effectively guaranteed, the heat is effectively guaranteed not to be lost, and the efficiency is improved.
Further, as shown in fig. 2 and 3, the rapid heating plate is further provided with a heat-insulating fireproof layer or heat-insulating cover plate layer 7a, and the heat-insulating fireproof layer or heat-insulating cover plate layer 7a is made of fireproof rock wool. The thermal insulation fireproof layer or the thermal insulation cover plate layer 7a is overlapped on the upper portion of the thermal insulation layer 5 a.
An electric heating apparatus comprising a rapid heating panel as claimed in any one of the preceding claims.
The instant heating panel obtained in this example was subjected to the following experiment:
| project | Test name | Test method | Test results |
| 1 | High temperature operation | 350 ℃ for 48 hours, no abnormality of the film layer and no falling off in the 3M600 adhesive tape test | No abnormality |
| 2 | High and low temperature impact | The test is carried out between two thermostats, the high temperature is set to 350 ℃, and the low temperature is set to- 50 ℃, the components are put into a high-temperature box for 1 hour, and then are taken out and put into a low-temperature box for 1 hour The device is cycled for 5 times and can bear no change after cold-hot alternating test The shape can still work normally, and the film layer does not fall off | No abnormality |
| 3 | Power attenuation | The element continuously works for 100 hours under rated voltage and simulation conditions, and the initial state of the element is recorded The functional attenuation is less than or equal to 10 percent by comparing the initial power with the power at the end of the test | 2.20% |
| 4 | Life test | The element is powered on for 1 hour under rated voltage and simulation conditions, and then is powered off 30 minutes to room temperature, allowing forced cooling, accumulating working time to 3000 hours, sex Can meet the requirements of tests 2 and 3, and the power attenuation is not more than 20 percent | <10% |
| 5 | Leakage current testing | The element being under normal conditionsWorking to adjust test voltage to rated power 1.15 times, when the element is stable in operation (the water heating element has an observation time of 10S, the observation time of the air heating element is 15S, and the highest is in the observation interval When the temperature point changes by less than 2K, the element is operated to be stable), and leakage is measured The leakage current of the element at the working temperature is in accordance with GB4706.1 13.2 is not more than 0.5mA | < 0.2mA |
| 6 | Electrical strength testing | Immediately after the leakage current test is completed, the test voltage is 1000V, and the operation is performed The electrical strength at temperature should meet the specification of 13.3 in GB4706.1, element Is capable of withstanding 1000V voltage at a frequency of 50Hz for one minute, test During the test, no flashover breakdown phenomenon should occur | No abnormality |
| 7 | Abnormal operation | The voltage is regulated to 1.24 times of rated power and is continued until the operation is stable or the element Damage, no flame or molten metal spray should occur to the element, no electric shock should be generated Risk of | No abnormality |
| 8 | Uniformity of temperature | Three points are respectively and averagely taken along the length direction and the width direction, nine points are used in total, more The road temperature tester performs temperature test simultaneously, records the extremely difference between each point | <5 degrees |
| 9 | Dry heating temperature resistance | The edges of the element are raised in a room temperature environment by refractory bricks, and the element is applied 10% rated voltage, measuring surface highest temperature, recording when reaching working stability Recording the value, calculating the temperature difference ratio, and then adjusting the voltage test according to the temperature difference ratio to directly test Until the difference between the dry heating temperature and the temperature resistant temperature is less than 5 ℃. Dry burning temperature resistance test After cooling, the film layer is not fallen off or damaged, and the insulating property meets the requirements Performance requirements of items 2 and 3, resistance change of cold state resistance is not more than 5% | No abnormality |
In summary, the instant heating panel produced in this example was tested to fully satisfy the requirements and to be excellent in performance as compared with the conventional heating panel. The comparison of the product of this example with a conventional electric heating plate is as follows:
from the above, the aluminum plate with high cost performance is adopted as the base material of the heating plate, the price is lower than that of the stainless steel heating plate, and the aluminum plate has the characteristics of light weight, application, quick heat conduction and energy conservation. The invention has the advantages compared with the traditional electric heating plate that:
the curing temperature is low: the aluminum material is used as a base material, and the curing temperature of the electronic paste is 300 ℃ which is far lower than the curing temperature of the stainless steel heating sheet 800 ℃.
Can be applied in light and thin applications: the invention can be applied to aluminum foils with minimum thickness of 0.05mm and total thickness of 0.25mm, and the application does not occupy space.
High heat conductivity coefficient and fast heat transfer: the heat conduction coefficient of the heating sheet is 280w/m.k, and the heat conduction is more than 20 times of that of stainless steel.
Bendable application: the aluminum plate or the aluminum foil can be processed and applied by disassembling and bending according to the requirements, and the flexibility is high.
Double-sided heating: the power density can be doubled.
The foregoing description of the preferred embodiments of the invention is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the invention.
Claims (8)
1. A preparation method of a quick heating type heating plate is characterized by comprising the following steps: the method comprises the following specific steps:
1) Pressing: sequentially stacking the substrate, the heat-conducting insulating layer and the conductor circuit layer from bottom to top and laminating by a laminating machine to obtain a composite board, wherein the laminating temperature is controlled to be 300 ℃;
2) Etching a circuit: cutting the composite board into required size, and etching the designed circuit to the cut conductor circuit layer by using an etching machine;
3) Printing electronic paste: printing the medium-temperature cured electronic paste onto a circuit of the conductor circuit layer to form a heating element layer;
4) Curing the electronic paste: placing the composite board printed with the medium-temperature curing electronic paste into a curing machine for curing, wherein the curing temperature is controlled to be 200 ℃ for 10 minutes;
5) Spraying a heat insulation layer: then spraying a heat insulation layer on the heating element layer in a spraying mode;
6) And (3) curing again: after spraying the heat insulation layer, putting the heat insulation layer into a curing machine, heating to a certain temperature, and curing for 4 hours; when the curing is performed again, the temperature is firstly increased to 200 ℃ for curing, and the temperature is kept for 30 minutes after reaching 200 ℃, then the temperature is increased to 300 ℃, and the temperature is kept for 120 minutes after reaching 300 ℃ for curing, and then the curing is completed after cooling and taking out;
7) And finally, installing and connecting the high-temperature ceramic binding post to the conductor circuit layer to obtain the quick heating type heating plate.
2. The instant heating panel produced by the method for producing an instant heating panel according to claim 1, wherein: the heat-conducting insulating layer (2 a), the heating layer and the heat-insulating layer (5 a) are sequentially overlapped from bottom to top, and the heat-conducting insulating layer (2 a) is attached to the substrate (1) after the heat-conducting insulating layer (2 a) is overlapped;
the heating layer comprises a conductor circuit layer (3 a) attached to the heat conduction insulating layer (2 a), and a heating body layer (4 a) arranged between the conductor circuit layer (3 a) and the heat insulation insulating layer (5 a), wherein the conductor circuit layer (3 a) is electrically connected with a power supply;
the heating body layer (4 a) is formed by printing medium-temperature curing electronic paste; the conductor circuit layer (3 a) is made of copper, aluminum, copper foil or aluminum foil materials.
3. A quick heating plate as claimed in claim 2, wherein: the thickness of the heat insulation layer is controlled to be 0.05-0.2mm.
4. A quick heating plate as claimed in claim 2, wherein: the substrate is made of a highly thermally conductive material.
5. A quick heating plate as claimed in claim 2 or 4, wherein: the thickness of the substrate is 0.05mm-0.25mm.
6. A quick heating plate as claimed in claim 2, wherein: the heat conduction insulating layer (2 a) is made of a heat conduction polyimide material.
7. A quick heating plate as claimed in claim 2, wherein: the thickness of the heat conduction insulating layer (2 a) is controlled to be 0.05-0.25mm.
8. A quick heating plate as claimed in claim 2, wherein: the quick heating type heating plate is characterized in that a heat preservation fireproof layer (6) or a heat insulation cover plate layer (7 a) is further arranged, and the heat preservation fireproof layer (6) or the heat insulation cover plate layer (7 a) is overlapped on the upper portion of the heat insulation layer (5 a).
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| CN111511049A (en) * | 2020-05-26 | 2020-08-07 | 江苏智先生电器有限公司 | Heating plate and manufacturing method thereof |
| CN114025441A (en) * | 2021-11-21 | 2022-02-08 | 付思学 | Heating plate and processing method thereof |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200280241Y1 (en) * | 2002-04-02 | 2002-07-02 | 박금자 | A board type heater |
| CN101076224A (en) * | 2006-05-16 | 2007-11-21 | 南京汉德森科技股份有限公司 | Aluminum-base printing circuit board and its production |
| CN102184915A (en) * | 2011-04-06 | 2011-09-14 | 周波 | High-power base plate effectively integrating circuit board and radiator and manufacturing method thereof |
| CN102427617A (en) * | 2011-09-02 | 2012-04-25 | 西安盖沃热能科技有限公司 | Unidirectional heat transfer flame retardation PTC macromolecule self-limiting temperature electrothermal film and preparation method thereof |
| CN102595766A (en) * | 2011-01-07 | 2012-07-18 | 昆山雅森电子材料科技有限公司 | Flexible copper-foil high thermal conductivity substrate and manufacturing method thereof |
| CN103596303A (en) * | 2013-10-22 | 2014-02-19 | 江苏博肯碳晶材料科技有限公司 | Preparation method for graphene carbon crystal polymeric heating plate |
| CN103744276A (en) * | 2014-02-12 | 2014-04-23 | 东莞市东思电子技术有限公司 | Thick film heating component for laser printer and production method thereof |
| KR101399980B1 (en) * | 2012-12-28 | 2014-05-29 | 하이쎌(주) | Heat-dissipating flexible module for led using carbon fiber substrate and method for manufacturing the same |
| JP2014116351A (en) * | 2012-12-06 | 2014-06-26 | Nippon Multi Kk | High thermal-conductivity printed wiring board and method of manufacturing the same |
| CN204131823U (en) * | 2014-08-15 | 2015-01-28 | 西安明科微电子材料有限公司 | Novel high heat-conduction circuit board |
| CN207070375U (en) * | 2017-08-14 | 2018-03-02 | 深圳市维特欣达科技有限公司 | A kind of quick-heating type heating board and electric heating equipment |
-
2017
- 2017-08-14 CN CN201710693146.2A patent/CN107613588B/en active Active
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR200280241Y1 (en) * | 2002-04-02 | 2002-07-02 | 박금자 | A board type heater |
| CN101076224A (en) * | 2006-05-16 | 2007-11-21 | 南京汉德森科技股份有限公司 | Aluminum-base printing circuit board and its production |
| CN102595766A (en) * | 2011-01-07 | 2012-07-18 | 昆山雅森电子材料科技有限公司 | Flexible copper-foil high thermal conductivity substrate and manufacturing method thereof |
| CN102184915A (en) * | 2011-04-06 | 2011-09-14 | 周波 | High-power base plate effectively integrating circuit board and radiator and manufacturing method thereof |
| CN102427617A (en) * | 2011-09-02 | 2012-04-25 | 西安盖沃热能科技有限公司 | Unidirectional heat transfer flame retardation PTC macromolecule self-limiting temperature electrothermal film and preparation method thereof |
| JP2014116351A (en) * | 2012-12-06 | 2014-06-26 | Nippon Multi Kk | High thermal-conductivity printed wiring board and method of manufacturing the same |
| KR101399980B1 (en) * | 2012-12-28 | 2014-05-29 | 하이쎌(주) | Heat-dissipating flexible module for led using carbon fiber substrate and method for manufacturing the same |
| CN103596303A (en) * | 2013-10-22 | 2014-02-19 | 江苏博肯碳晶材料科技有限公司 | Preparation method for graphene carbon crystal polymeric heating plate |
| CN103744276A (en) * | 2014-02-12 | 2014-04-23 | 东莞市东思电子技术有限公司 | Thick film heating component for laser printer and production method thereof |
| CN204131823U (en) * | 2014-08-15 | 2015-01-28 | 西安明科微电子材料有限公司 | Novel high heat-conduction circuit board |
| CN207070375U (en) * | 2017-08-14 | 2018-03-02 | 深圳市维特欣达科技有限公司 | A kind of quick-heating type heating board and electric heating equipment |
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