CN107613588A - The preparation method and quick-heating type heating board of a kind of quick-heating type heating board - Google Patents
The preparation method and quick-heating type heating board of a kind of quick-heating type heating board Download PDFInfo
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- CN107613588A CN107613588A CN201710693146.2A CN201710693146A CN107613588A CN 107613588 A CN107613588 A CN 107613588A CN 201710693146 A CN201710693146 A CN 201710693146A CN 107613588 A CN107613588 A CN 107613588A
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- 238000010438 heat treatment Methods 0.000 title claims abstract description 123
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000002002 slurry Substances 0.000 claims abstract description 30
- 239000000758 substrate Substances 0.000 claims abstract description 26
- 238000007711 solidification Methods 0.000 claims abstract description 21
- 230000008023 solidification Effects 0.000 claims abstract description 21
- 238000005530 etching Methods 0.000 claims abstract description 18
- 238000009434 installation Methods 0.000 claims abstract description 5
- 239000011214 refractory ceramic Substances 0.000 claims abstract description 5
- 238000004519 manufacturing process Methods 0.000 claims abstract description 4
- 239000000463 material Substances 0.000 claims description 21
- 229910052782 aluminium Inorganic materials 0.000 claims description 19
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 19
- 239000004411 aluminium Substances 0.000 claims description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 238000009413 insulation Methods 0.000 claims description 8
- 230000004888 barrier function Effects 0.000 claims description 7
- 238000007639 printing Methods 0.000 claims description 7
- 238000005507 spraying Methods 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000010949 copper Substances 0.000 claims description 4
- 229910052802 copper Inorganic materials 0.000 claims description 4
- 239000011888 foil Substances 0.000 claims description 4
- 238000003825 pressing Methods 0.000 claims description 4
- 230000015572 biosynthetic process Effects 0.000 claims description 3
- 239000011889 copper foil Substances 0.000 claims description 3
- 238000005520 cutting process Methods 0.000 claims description 3
- 239000007921 spray Substances 0.000 claims description 3
- 239000004952 Polyamide Substances 0.000 claims description 2
- 229920002647 polyamide Polymers 0.000 claims description 2
- 150000002466 imines Chemical class 0.000 claims 1
- 230000008901 benefit Effects 0.000 abstract description 5
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 17
- 238000012360 testing method Methods 0.000 description 12
- 238000005245 sintering Methods 0.000 description 10
- 229910001220 stainless steel Inorganic materials 0.000 description 9
- 239000010935 stainless steel Substances 0.000 description 8
- 206010037660 Pyrexia Diseases 0.000 description 6
- 239000005030 aluminium foil Substances 0.000 description 6
- 238000005485 electric heating Methods 0.000 description 5
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000009841 combustion method Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 238000004134 energy conservation Methods 0.000 description 3
- 239000010408 film Substances 0.000 description 3
- 210000004209 hair Anatomy 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- OAYXUHPQHDHDDZ-UHFFFAOYSA-N 2-(2-butoxyethoxy)ethanol Chemical compound CCCCOCCOCCO OAYXUHPQHDHDDZ-UHFFFAOYSA-N 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 229910052742 iron Inorganic materials 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 239000011490 mineral wool Substances 0.000 description 2
- 239000002861 polymer material Substances 0.000 description 2
- 239000000843 powder Substances 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000008569 process Effects 0.000 description 2
- 239000010409 thin film Substances 0.000 description 2
- FENFUOGYJVOCRY-UHFFFAOYSA-N 1-propoxypropan-2-ol Chemical compound CCCOCC(C)O FENFUOGYJVOCRY-UHFFFAOYSA-N 0.000 description 1
- 241000208340 Araliaceae Species 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 235000005979 Citrus limon Nutrition 0.000 description 1
- 244000131522 Citrus pyriformis Species 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- OHLUUHNLEMFGTQ-UHFFFAOYSA-N N-methylacetamide Chemical compound CNC(C)=O OHLUUHNLEMFGTQ-UHFFFAOYSA-N 0.000 description 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- KJTLSVCANCCWHF-UHFFFAOYSA-N Ruthenium Chemical compound [Ru] KJTLSVCANCCWHF-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 239000011449 brick Substances 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000007822 coupling agent Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 239000013530 defoamer Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000005670 electromagnetic radiation Effects 0.000 description 1
- 238000009956 embroidering Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 229910052707 ruthenium Inorganic materials 0.000 description 1
- DCKVNWZUADLDEH-UHFFFAOYSA-N sec-butyl acetate Chemical compound CCC(C)OC(C)=O DCKVNWZUADLDEH-UHFFFAOYSA-N 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 239000004094 surface-active agent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000005439 thermosphere Substances 0.000 description 1
- 239000002562 thickening agent Substances 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- RBNWAMSGVWEHFP-UHFFFAOYSA-N trans-p-Menthane-1,8-diol Chemical compound CC(C)(O)C1CCC(C)(O)CC1 RBNWAMSGVWEHFP-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Abstract
The present invention relates to a kind of preparation method of quick-heating type heating board and quick-heating type heating board, wherein：Comprise the following steps that：1) press；2) circuit etching；3) printed electronic slurry；4) electric slurry is solidified；5) heat-insulating layer is sprayed；6) solidify again；7) installation refractory ceramics binding post obtains quick-heating type heating board.The quick-heating type heating board of the preparation method production of quick-heating type heating board, wherein：Including substrate, thermally conductive insulating layer, heating layer and heat-insulating layer, the thermally conductive insulating layer, heating layer and heat-insulating layer are superimposed from the bottom to top successively, and the thermally conductive insulating layer is attached at substrate after superposition.The present invention has low solidification temperature, thickness of thin, thermal conductivity high and the low advantage of power consumption, is more suitable for being widely popularized.
Description
Technical field
The present invention relates to electric-heating technology field, it is related to the preparation method and quick-heating type heating board of quick-heating type heating board.
Background technology
The electric slurry electric heat-emitting board of 200 to 300 traditional degree applications, is substantially using 314 Stainless Steels as base material,
Then high-temperature sintered electronic slurry after being printed on base material, and needed in traditional production process by four sintering of high temperature,
It can obtain, such as：Conventional silver-colored palladium system, the procedure for producing of ruthenium electronic paste are as follows：1）Print insulating barrier, 800 degree of sintering of high temperature；
2）Printed conductive layer, 800 degree of sintering of high temperature；3）Printed electronic slurry heating layer, 800 degree of sintering；4）Print insulating barrier, high temperature
800 degree of sintering.Therefore it is as follows to there is shortcoming：（1）Sintering temperature is high, sintering number is more, limits the application of material.- slurry is necessary
800 degree of sintering of high temperature, lead to not be applied on material of the fusing point less than 800 degree, such as aluminium, iron, high polymer material；（2）System
Into heating plate thickness it is thicker, lightening can not apply, can be only applied to thickness more than 1mm Stainless Steel material on, thickness is small
Material deform after sintering, influence printing precision so as to influence the watt level of product and life-span, and when application area is bigger,
Thickness will increase, and product lightening is not applied；（3）Thermal conductivity factor is low, and heat transfer is slow, because the sintering temperature of slurry is 800
Degree, it is therefore necessary to dystectic 314 Stainless Steel material is selected, thermal conductivity factor only 20w/m.K or so without embroidering Steel material, this ginseng
Number influences the thermal efficiency and life of product.
Chinese patent：Application number CN201620243225.4, disclose a kind of double-layer stainless steel heating board, it is desirable to provide one
Kind heating effect is more stable, and heat up rapider, the heating board that electric heating conversion efficiency is higher and electromagnetic radiation is smaller, including the first aluminium
Insulating barrier in layers of foil including first, insulating barrier on second, the first fever tablet, intermediate insulating layer, the second fever tablet, first time absolutely
Edge layer, second time insulating barrier and the second aluminium foil layer.
In consideration of it, urgently there is the quick-heating type heating board that a thermal conductivity is high and power consumption is low in the art.
The content of the invention
The technical problem to be solved in the present invention is to provide a kind of quick-heating type heating board.
The present invention adopts the following technical scheme that：
The invention provides a kind of preparation method of quick-heating type heating board, comprise the following steps that：
1) press：First, substrate, thermally conductive insulating layer and conductive layer stacked in order from the bottom to top successively and with pressing
Machine is pressed to obtain hard board, and it is 300 DEG C to press the temperature controlled；
2) circuit etching：Hard board is cut into demand size, and with etching machine by after designed circuit etching to cutting
In conductive layer；
3) printed electronic slurry：Intermediate temperature setting electric slurry is printed onto formation heater layer above the circuit of conductive layer；
4) electric slurry is solidified：The hard board for printing intermediate temperature setting electric slurry is put into curing and solidified, solidification control
The temperature of system is 200 DEG C and solidified 10 minutes；
5) heat-insulating layer is sprayed：Then heater layer sprays heat-insulating layer above with the mode of spraying；
6) solidify again：Spraying heat-insulating layer after be put into curing be heated to certain temperature carry out solidification 4 hours；
7) installation of refractory ceramics binding post is finally connected to conductive layer and obtains quick-heating type heating board.
Further, temperature is risen into 200 DEG C of solidifications first when solidifying again described in step 6), and after reaching 200 DEG C
Insulation is solidified for 30 minutes, rises to 300 DEG C followed by by temperature, being incubated 120 minutes after reaching 300 DEG C is solidified, and is connect
Cooling and take out completion solidification.
The quick-heating type heating board of the preparation method production of quick-heating type heating board, wherein：Including substrate, thermally conductive insulating layer, hair
Thermosphere and heat-insulating layer, the thermally conductive insulating layer, heating layer and heat-insulating layer are superimposed from the bottom to top successively, and after superposition
The thermally conductive insulating layer is attached at substrate；
The heating layer includes the heater layer for being attached to thermally conductive insulating layer, and is located between heater layer and heat-insulating layer
Conductive layer, conductive layer electric connection of power supply；
Heating line layer is formed for electric slurry printing or the thin-film material made of electric slurry.
Further, the substrate is made of a highly heat conductive material, such as aluminium or copper product.
Further, the thickness of the substrate is 0.05mm-0.25mm.
Further, the circuit etching for carrying conductor layer is etched between the heater layer and thermally conductive insulating layer.
Further, the conductive layer is made up of copper, aluminium, copper foil or aluminum foil material.
Further, after the thermally conductive insulating layer, heating layer and heat-insulating layer are sequentially overlapped, the thermally conductive insulating layer patch
Invest a face of substrate or symmetrical two faces.
Further, the thermally conductive insulating layer is made up of heat-conducting type polyimide material.
Further, the quick-heating type heating board is additionally provided with insulated fire layer or heat-insulated cover layer, the insulated fire
Layer or heat-insulated cover layer are superimposed upon heat-insulating layer top, the insulated fire layer or heat-insulated cover layer as fire prevention rock wool system
Into.
A kind of electric heating equipment, that includes the quick-heating type heating board described in above-mentioned any one.
Compared with prior art, the beneficial effects of the present invention are：
Base material of the present invention using cost-effective aluminium sheet as heating board, it is cheap, have concurrently lightening application, heat conduction it is fast/
The characteristics of energy-conservation.Benefit of the invention relative to traditional electric heat-emitting board：
Solidification temperature is low：Aluminum is as base material, and the solidification temperature of the electric slurry in the present invention is 300 degree, well below
The solidification temperature that 800 degree of Stainless Steel fever tablet.
Lightening it can apply：The present invention can be applied on minimum 0.05mm aluminium foil, gross thickness minimum 0.25mm, application
Do not take up space.
Thermal conductivity factor is high, and heat transfer is fast：Fever tablet, thermal conductivity factor 280w/m.k, heat conduction are more than 10 times of Stainless Steel.
Bent application：Aluminium sheet or aluminium foil can be according to needing into the processed and applied such as curved is torn open, and flexibility is big.
The present invention has low solidification temperature, thickness of thin, thermal conductivity high and the low advantage of power consumption, is more suitable for being widely popularized.
Brief description of the drawings
Fig. 1 is quick-heating type heating harden structure schematic cross-sectional view；
Fig. 2 is the structure schematic cross-sectional view of another embodiment；
Fig. 3 is double-deck quick-heating type heating harden structure schematic cross-sectional view.
Identified in figure：1- substrates, 2a- thermally conductive insulating layer, the thermally conductive insulating layer of 2b- second, 3a- conductive layers, 3b- second
Conductive layer, 4a- heaters layer, the second heaters of 4b- layer, 5a- heat-insulating layers, the heat-insulating layers of 5b- second, 6- insulations
The heat-insulated cover layer of fireprotection layer, 7a-, the second heat-insulated cover layers of 7b-.
Embodiment
In order to make the purpose , technical scheme and advantage of the present invention be clearer, below in conjunction with drawings and Examples, to this hair
It is bright to be further elaborated.It should be appreciated that the specific embodiments described herein are merely illustrative of the present invention, and it is unlimited
The fixed present invention.
In the description of the invention, it is to be understood that term " length ", " width ", " on ", " under ", "front", "rear",
The orientation or position relationship of the instruction such as "left", "right", " vertical ", " level ", " top ", " bottom " " interior ", " outer " is based on accompanying drawing institutes
The orientation or position relationship shown, it is for only for ease of the description present invention and simplifies description, rather than instruction or the dress for implying meaning
Put or element there must be specific orientation, with specific azimuth configuration and operation, therefore it is not intended that to limit of the invention
System.
In addition, term " first ", " second " are only used for describing purpose, and it is not intended that instruction or hint relative importance
Or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be expressed or
Implicitly include one or more this feature.In the description of the invention, " multiple " are meant that two or more,
Unless otherwise specifically defined.
In embodiments of the present invention, unless otherwise clearly defined and limited, term " installation ", " connected ", " connection ",
Terms such as " fixations " should be interpreted broadly, for example, it may be fixedly connected or be detachably connected, or integrally；Can be with
It is mechanical connection or electrical connection；Can be joined directly together, can also be indirectly connected by intermediary, can be two
The connection of individual element internal or the interaction relationship of two elements.For the ordinary skill in the art, Ke Yigen
Understand the concrete meaning of above-mentioned term in the present invention according to concrete condition.
A kind of preparation method of quick-heating type heating board is present embodiments provided, is comprised the following steps that：
1) press：First, substrate, thermally conductive insulating layer and conductive layer stacked in order from the bottom to top successively and with pressing
Machine is pressed to obtain hard board, and it is 300 DEG C to press the temperature controlled；
2) circuit etching：Hard board is cut into demand size, and with etching machine by after designed circuit etching to cutting
In conductive layer；
3) printed electronic slurry：Intermediate temperature setting electric slurry is printed onto formation heater layer above the circuit of conductive layer；
4) electric slurry is solidified：The hard board for printing intermediate temperature setting electric slurry is put into curing and solidified, solidification control
The temperature of system is 200 DEG C and solidified 10 minutes；
5) heat-insulating layer is sprayed：Then heater layer sprays heat-insulating layer above with the mode of spraying；
6) solidify again：Spraying heat-insulating layer after be put into curing be heated to certain temperature carry out solidification 4 hours；
7) installation of refractory ceramics binding post is finally connected to conductive layer and obtains quick-heating type heating board.
Further, temperature is risen into 200 DEG C of solidifications first when solidifying again described in step 6), and after reaching 200 DEG C
Insulation is solidified for 30 minutes, rises to 300 DEG C followed by by temperature, being incubated 120 minutes after reaching 300 DEG C is solidified, and is connect
Cooling and take out completion solidification.It will be seen that being 4 hours for whole solidification process, and it is incubated 30 minutes after 200 DEG C and is solidified,
Being incubated the 120 minutes time solidified after 300 DEG C must assure that, and heat up and the time of cooling can adjust accordingly.
Shown in refer to the attached drawing 1, present invention also offers a kind of quick-heating type heating board, wherein：Including substrate 1, heat conductive insulating
Layer 2a, heating layer and heat-insulating layer 5a, the thermally conductive insulating layer 2a, heating layer and heat-insulating layer 5a are folded from the bottom to top successively
Add, and the thermally conductive insulating layer 2a is attached at substrate 1 after superposition；
The heating layer includes being attached to thermally conductive insulating layer 2a conductive layer 3a, and be located at conductive layer 3a with it is heat-insulated
Heater layer 4a between insulating barrier 5a, conductive layer 3a electric connection of power supply；The heater layer 4a is in the present embodiment
Electric slurry printing forms；Heater layer 4a thin-film materials made of electric slurry in further embodiment.In embodiment
Electric slurry is to include nano metal powder, including the one or more such as silver powder, copper powder, nickel powder, molybdenum powder, carbon dust, mica powder
Combination；Thixotropic agent, include one or more combinations of the fat of fourth third, polyamide wax, rilanit special；Thickener, including ethyl are fine
Tie up one or more combinations in element or KB6650；Solvent, including diethylene glycol, propylene glycol propyl ether, methylacetamide, lemon
One or more combinations in sour tri butyl ester, butyl carbitol, butyl carbitol mould acid fat, terpinol；Silk ribbon attached to an official seal or a medal loses agent；Defoamer；
Coupling agent, KH550；High temperature silicone resin and surfactant.
Prepare electric slurry process：Mixing-emulsification-grinding-reaction-standing, finally obtains electric slurry.
Further in the present embodiment shown in refer to the attached drawing 1, the substrate 1 is made up of aluminum, manufactured aluminium base thickness of slab
Spend for 0.05mm, because substrate can accomplish that relatively thin therefore obtained quick-heating type heating board can control 0.25mm, and now
Thermally conductive insulating layer 2a, conductive layer 3a, heater layer 4a and heat-insulating layer 5a difference thickness are 0.05mm.Reach reduction
The purpose of heater plate thickness, so as to effectively reduce the accounting rate of heater, while the thermal conductivity factor of aluminium base is high, up to
280w/m.K, the high heat conduction of aluminium base can reach the effect of fast heat and energy-conservation, therefore relative to traditional hot setting electric hot plate
For thermal conductivity it is better.
In a further embodiment, the substrate 1 is made up of the high iron material of thermal conductivity factor or high polymer material, embodiment
Value range of the middle thickness control by the substrate 1 in 0.05mm-0.25mm.It is to be noted that the thickness of substrate 1 can root
Set according to the thickness requirement of electric hot plate.
It is further in the present embodiment, it is etched with being used to carry hair between the conductive layer 3a and thermally conductive insulating layer 2a
Hot body layer 4a circuit etching.Circuit etching is designed according to the heating demands of heating board, then by etching machine in conductor lines
Road floor 3a etches to obtain circuit etching, and electric slurry is printed onto circuit etching and obtains overall heater.According to electrothermal calefactive rate and
The circuit etching and heating layer power density of caloric value Demand Design can change.Circuit etching is uniformly distributed on heating board,
It can effectively ensure that the uniformity of heating.
Further in the present embodiment, the conductive layer 3a is provided with two line posts, for electric connection of power supply.Connection
Post is that refractory ceramics binding post is used for that to connect external power source to be its power supply, reaches the purpose of electricity heating.
Further in the present embodiment, the conductive layer 3a is made up of copper, aluminium or copper foil, aluminum foil material, and leads
Body line layer 3a designs minimum thickness 0.25mm, can effectively reduce the integral thickness of heating board.
It is further in the present embodiment shown in refer to the attached drawing 1, the thermally conductive insulating layer 2a, heating layer and heat-insulating layer 5a
It is sequentially overlapped the face that the rear thermally conductive insulating layer 2a is attached at substrate 1.The heating of one side is obtained by above-mentioned design structure
Plate, it disclosure satisfy that the demand of most heat-producing device.
It is further in another embodiment, after the thermally conductive insulating layer 2a, heating layer and heat-insulating layer 5a are sequentially overlapped
The thermally conductive insulating layer 2a is attached at two faces of substrate 1, and it is axially symmetric structure to be formed with substrate 1.And the knot of Double-side heating
Structure disclosure satisfy that caloric value is bigger or the heat-producing device of two-sided requirement heating.
In the present embodiment shown in refer to the attached drawing 3 on the basis of individual layer quick-heating type heating board with substrate 1 be axial symmetry increase
Second thermally conductive insulating layer 2b, the second conductive layer 3b, the second heater layer 4b and the second thermally conductive insulating layer 5b, so as to be formed
Two-sided quick-heating type heating board.
Further shown in refer to the attached drawing 1, the thermally conductive insulating layer 2a is heat-conducting type polyimide material or heat-conducting type
Modified epoxy is made, and not only plays the safety that insulating effect ensures electric hot plate, also effectively ensures thermal conductivity.It is described every
Thermal insulation layer 5a is made up of heat insulation type polyimides or heat-insulated heat type modified epoxy, not only plays insulating effect and ensures electric heating
The safety of plate, also effectively ensure thermal insulation, be effectively guaranteed heat and be unlikely to be lost in raising efficiency.
Further shown in refer to the attached drawing 2 and 3 on the basis of above-mentioned, the quick-heating type heating board is additionally provided with insulated fire
Layer or heat-insulated cover layer 7a, the insulated fire layer or heat-insulated cover layer 7a are made up of fire prevention rock wool.The insulated fire
Layer or heat-insulated cover layer 7a are superimposed upon heat-insulating layer 5a tops.
A kind of electric heating equipment, that includes the quick-heating type heating board described in above-mentioned any one.
The quick-heating type heating board obtained in the present embodiment is tested as follows：
| Project | Test name | Test method | Result of the test |
| 1 | Hot operation | 350 degree are run 48 hours, and film layer is without exception, and 3M600 adhesive tape tests are without coming off | It is without exception |
| 2 | High/low-temperature impact | Experiment is carried out between two insulating boxs, and high temperature sets 350 degree, the degree of low temperature setting -50, element is put into high-temperature cabinet 1 hour, then takes out and is put into cryogenic box 1 hour, circulates 5 times, should be able to bear cold After hot Alternating Test, element is not deformed, and remains to normal work, and film layer is not fallen off | It is without exception |
| 3 | Power attenuation | Continuously work 100h, the contrast of power when recording its initial power and off-test, function decay with regard to≤10% element under rated voltage and simulated conditions | 2.20% |
| 4 | Life test | Element energization work 1 hour under rated voltage and simulated conditions, 30 minutes are then powered off to room temperature, it is allowed to forcing functions, cumulative operation time reach 3000h, and performance meets the requirement of experiment 2 and 3, Power attenuation is not more than 20% | <10% |
| 5 | Leakage current testing | Element works under normal operation, at 1.15 times of Adjustment Tests voltage to rated output, after element manipulation is stable（Water heating elements observation time is 10S, when observing air Between be 15s, in observation interval, when the change of maximum temperature point is less than 2K, element has worked to stable）, leakage current is measured, the leakage current of element at the working temperature should meet in GB4706.1 13.2 regulation is no more than 0.5mA | < 0.2mA |
| 6 | Hi-pot test | Carried out immediately after the completion of leakage current testing, test voltage 1000V, the electrical strength under operating temperature should meet in GB4706.1 13.3 regulation, and it is 50Hz that the insulation of element, which should be able to be subjected to frequency, 1000V voltages last one minute, during experiment, flashover breakdown phenomenon should not occur | It is without exception |
| 7 | Non-normal working | Voltage is adjusted to 1.24 times of rated output, is continued that to working stability or component wear, element jet flames and molten metal should be occurred without, should not be produced shock hazard | It is without exception |
| 8 | Temperature homogeneity | Length direction and width averagely take three points respectively, totally nine points, with multi way temperature it is tester simultaneous when carry out temperature test, record the extreme difference between each point | <5 degree |
| 9 | Dry combustion method temperature resistant capability | The edge of element is maked somebody a mere figurehead in room temperature environment with refractory brick, applies 10% rated voltage to element, measurement surface maximum temperature, when reaching working stability, records the value, calculating temperature difference ratio, then Voltage tester is adjusted according to Temperature Difference Ratio, until dry combustion method temperature and heatproof temperature difference are less than within 5 degree.After the experiment cooling of dry combustion method heatproof, film layer does not fall off or damaged, and insulating properties meet more than requirement The performance requirement of pilot project 2 and 3, the change in resistance of cold-state resistance are not more than 5% | It is without exception |
In summary, the quick-heating type heating board through being produced in overtesting the present embodiment fully meets requirement, and the relative biography of performance
The heating plate of system is according to outstanding.The contrast of the present embodiment product and traditional electric boiling plate is as follows：
From the foregoing, it will be observed that the present invention using cost-effective aluminium sheet as the base material of heating board, price is cheap compared with Stainless Steel heating board,
Have concurrently lightening application, heat conduction it is fast/energy-conservation the characteristics of.Benefit of the invention relative to traditional electric heat-emitting board：
Solidification temperature is low：Aluminum is as base material, and the solidification temperature of the electric slurry in the present invention is 300 degree, well below
The solidification temperature that 800 degree of Stainless Steel fever tablet.
Lightening it can apply：The present invention can be applied on minimum 0.05mm aluminium foil, gross thickness minimum 0.25mm, application
Do not take up space.
Thermal conductivity factor is high, and heat transfer is fast：Fever tablet, thermal conductivity factor 280w/m.k, heat conduction are more than 20 times of Stainless Steel.
Bent application：Aluminium sheet or aluminium foil can be according to needing into the processed and applied such as curved is torn open, and flexibility is big.
Double-side heating：It can increase and be twice power density.
The foregoing is merely illustrative of the preferred embodiments of the present invention, is not intended to limit the invention, all essences in the present invention
All any modification, equivalent and improvement made within refreshing and principle etc., should be included in the scope of the protection.
Claims (10)
- A kind of 1. preparation method of quick-heating type heating board, it is characterised in that：Comprise the following steps that：1) press：Substrate, thermally conductive insulating layer and conductive layer are stacked in order from the bottom to top successively and entered with pressing machine Row pressing obtains hard board, and it is 300 DEG C to press the temperature controlled；2) circuit etching：Hard board is cut into demand size, and with etching machine by after designed circuit etching to cutting In conductive layer；3) printed electronic slurry：Intermediate temperature setting electric slurry is printed onto formation heater layer above the circuit of conductive layer；4) electric slurry is solidified：The hard board for printing intermediate temperature setting electric slurry is put into curing and solidified, solidification control The temperature of system is 200 DEG C and solidified 10 minutes；5) heat-insulating layer is sprayed：Then heater layer sprays heat-insulating layer above with the mode of spraying；6) solidify again：Spraying heat-insulating layer after be put into curing be heated to certain temperature carry out solidification 4 hours；7) installation of refractory ceramics binding post is finally connected to conductive layer and obtains quick-heating type heating board.
- 2. the preparation method of quick-heating type heating board as claimed in claim 1, it is characterised in that：When solidifying again described in step 6) Temperature is risen into 200 DEG C of solidifications first, and is incubated 30 minutes after reaching 200 DEG C and is solidified, 300 are risen to followed by by temperature DEG C, after reaching 300 DEG C being incubated 120 minutes is solidified, and then cooling, which is taken out, completes solidification.
- 3. the quick-heating type heating board of the preparation method production of quick-heating type heating board as claimed in claim 1, it is characterised in that：Including Substrate（1）, thermally conductive insulating layer（2a）, heating layer and heat-insulating layer（5a）, the thermally conductive insulating layer（2a）, heating layer and heat-insulated Insulating barrier（5a）It is superimposed from the bottom to top successively, and the thermally conductive insulating layer after superposition（2a）It is attached at substrate（1）；The heating layer includes being attached to thermally conductive insulating layer（2a）Conductive layer（3a）, and it is located at conductive layer（3a） With heat-insulating layer（5a）Between heater layer（4a）, conductive layer（3a）Electric connection of power supply；The heater layer（4a）Formed for the printing of intermediate temperature setting electric slurry.
- 4. quick-heating type heating board as claimed in claim 3, it is characterised in that：The heat-insulating layer thickness control is in 0.05- 0.2mm。
- 5. quick-heating type heating board as claimed in claim 3, it is characterised in that：The substrate is made of a highly heat conductive material.
- 6. the quick-heating type heating board as described in claim 3 or 5, it is characterised in that：The thickness of the substrate is 0.05mm- 0.25mm。
- 7. quick-heating type heating board as claimed in claim 3, it is characterised in that：The conductive layer（3a）For copper, aluminium, copper foil Or aluminum foil material is made.
- 8. quick-heating type heating board as claimed in claim 3, it is characterised in that：The thermally conductive insulating layer（2a）For heat-conducting type polyamides Imines material is made.
- 9. quick-heating type heating board as claimed in claim 3, it is characterised in that：The thermally conductive insulating layer（2a）Thickness control exists 0.05-0.25mm。
- 10. quick-heating type heating board as claimed in claim 3, it is characterised in that：It is anti-that the quick-heating type heating board is additionally provided with insulation Fire bed（6）Or heat-insulated cover layer（7a）, the insulated fire layer（6）Or heat-insulated cover layer（7a）It is superimposed upon heat-insulating layer （5a）Top.
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| CN114025441A (en) * | 2021-11-21 | 2022-02-08 | 付思学 | Heating plate and processing method thereof |
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