CN101076224A - Aluminum-base printing circuit board and its production - Google Patents
Aluminum-base printing circuit board and its production Download PDFInfo
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- CN101076224A CN101076224A CN 200610040329 CN200610040329A CN101076224A CN 101076224 A CN101076224 A CN 101076224A CN 200610040329 CN200610040329 CN 200610040329 CN 200610040329 A CN200610040329 A CN 200610040329A CN 101076224 A CN101076224 A CN 101076224A
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Abstract
The bottom layer of invention uses aluminium baseboard; the intermediate layer is a heat conduction insulation layer; the surface layer is an electric conduction layer. It features the following: the heat insulation layer is a ceramic-like thin film layer with 10-400 micron thick and >=100Momega insulation resistance, which chemical composition is aluminium oxide. The preparation method comprises: making pretreatment, de-oiling and washing for the surface of the aluminium baseboard using mechanical method or chemical method to form a clean workpiece plane; using the microarc oxide treatment and the microplasma surface ceramic method to make a heat conduction insulation layer on the workpiece surface; finally, overlapping an electric conduction layer on the heat conduction insulation layer; etching circuit pattern.
Description
Technical field
The present invention relates to printed circuit board (PCB), the aluminum-base printing circuit board that uses when relating in particular to large power semiconductor LED (LED) as lighting source, and the manufacture method of this aluminum-base printing circuit board belong to electronics and lighting technical field.
Background technology
It is the printed circuit board (PCB) of base material that large power semiconductor LED (LED) lighting source is mainly used with the metallic aluminum material, in recent years, along with the continuous development of LED scientific research and the continuous lifting of the chip technology level of production, the high-power LED encapsulation technology is ripe day by day, luminous efficiency is greatly improved, and its application is constantly expanded.But LED is luminous to be changed electric energy in the process of luminous energy, because resistance and non-radiative compound is arranged, LED can produce some heat.If these heats can not fully distribute, the LED internal temperature rises, and will cause the LED luminous efficiency to descend; If the LED internal temperature rises too high, LED was lost efficacy, be difficult to guarantee the useful life of LED expection.So as light source, heat radiation still is the huge obstacle of LED operate as normal.
Aspect the design and product research and exploitation of large power semiconductor LED lighting source, what stand in the breach is to select the carrier of the aluminium base printed circuit board (PCB) of metal as LED for use, aluminium base plays fixation on the one hand, play thermolysis on the other hand, the heat that produces during the LED operate as normal is at first derived by aluminum-base printing circuit board.Metallic aluminium base printed circuit board for the processing and manufacturing of utilization traditional handicraft, between upper strata conductive layer and bottom aluminium base, bear the heat conductive insulating layer of electric insulation, its pyroconductivity is lower, as: the thermal conductivity of resin is generally 0.3w/mk, and the also not enough 1w/mk of the thermal conductivity of glass fibre, the wherein most typical aluminium base copper-clad plate that is indicated in U.S. Bei Gesi heat conductive insulating lamination system, its conductive coefficient are also just between 1.1～2.2W/mk.Such metallic aluminium base printed circuit board can not effectively be brought into play the superior function of large power semiconductor LED as lighting source, and the utmost point is necessary to be improved.
Summary of the invention
The objective of the invention is to overcome the deficiencies in the prior art, start with from the structure that changes the heat conductive insulating layer, provide a kind of simple for structure, be easy to process, radiating effect is good is the printed circuit board (PCB) (first purpose) of base material with the aluminium alloy, and the manufacture method of this aluminum-base printing circuit board (second purpose).
First purpose of the present invention is achieved through the following technical solutions:
Aluminum-base printing circuit board, comprise bottom, intermediate layer and superficial layer, bottom adopts metal aluminum substrate, the intermediate layer is the heat conductive insulating layer, superficial layer is a conductive layer, be distributed with conducting channel above, it is characterized in that: described heat conductive insulating layer is the ceramic-like thin layer, and its chemical composition is the oxide alundum (Al of aluminium.
Further, above-mentioned aluminum-base printing circuit board, wherein, the thickness range of described ceramic-like thin layer is 10～400 microns, its insulation resistance 〉=100M Ω.
Again further, above-mentioned aluminum-base printing circuit board, wherein, the electric conducting material of described conductive layer is copper, gold, silver or palladium, the local or whole of conductive layer can also coated with indium billon or gold-tin alloy.
Further, above-mentioned aluminum-base printing circuit board, wherein, described aluminum-base printing circuit board is " single sided board " or " double sided board ".
Second purpose of the present invention is achieved through the following technical solutions:
The manufacture method of aluminum-base printing circuit board may further comprise the steps: 1. adopt machinery or chemical method to carry out preliminary treatment for the substrate surface of metal aluminum substrate, deoil, wash, form the smooth workpiece planarization of cleaning; 2. adopt the method for differential arc oxidation or microplasma surface ceramic deposition, at pretreated surface of the work processing and fabricating heat conductive insulating layer; 3. further cover conductive layer in the outside of heat conductive insulating layer, and then facet etch is made the conducting wire on conductive layer.
Further, in the manufacture method of above-mentioned aluminum-base printing circuit board, 2. step adopts the method for differential arc oxidation to carry out, promptly on workpiece, apply voltage, the metal of surface of the work and electrolyte solution are interacted, form micro-arc discharge at surface of the work with mao power source, under high temperature and effect of electric field, the aluminum metal surface forms intensified ceramic shape oxide-film, then this oxide-film is sealed processing, makes the heat conductive insulating layer of aluminum-base printing circuit board after the drying.
Again further, in the manufacture method of above-mentioned aluminum-base printing circuit board, 3. step is all to cover conductive layer in the outside of heat conductive insulating layer earlier, and then facet etch is made the conducting wire on conductive layer; Perhaps at the outside of heat conductive insulating layer topical application protecting film, the method by sputter or evaporation is directly made the conducting wire at the position of not doing to protect then.
Further, in the manufacture method of above-mentioned aluminum-base printing circuit board, described aluminum-base printing circuit board is " double sided board ", and preliminary treatment is carried out on two surfaces up and down for metal aluminum substrate in the manufacturing process respectively, and further processing and fabricating heat conductive insulating layer, conductive layer and conducting wire.
Like this, the present invention abandons traditional approach and adopts glass fabric bonding sheet or epoxide resin polymer, adopt new structure and process technology, develop the aluminum-base printing circuit board that a kind of suitable LED uses as lighting source, its outstanding substantive distinguishing features and marked improvement is embodied in:
(1) to be processed into aluminium oxide ceramics shape film be a kind of emerging technology to surface of aluminum plate, differential arc oxidation method process stabilizing is reliable, process equipment is simple, easily manufactured, main chemical reaction carries out at normal temperatures, be easy to control, the chemical pretreatment solution that uses in the course of processing is an environment-friendly type, meets the environment protection emission requirement.
(2) antistatic performance is good.When oxidated layer thickness 100 μ m, surface insulation resistance can reach 100M Ω, shows according to interrelated data, when the sheet resistance of material is between 10K Ω～100G Ω, be called static dissipative material,, prevent the electrostatic breakdown light-emitting diode so the present invention can effectively be spread static.
(3) good heat dissipation effect.The thermal resistance of alundum (Al ceramic-like film is lower, its thermal conductivity is 40w/mk, be higher than general fiber and resin far away, the large power semiconductor LED lighting source is used this aluminum-base printing circuit board, has effective heat dissipation channel, can easily break through of the restriction of great power LED heating problem, " temperature rise " dropped to minimum level to the influence of great power LED stability semiconductor illuminating light source design.
(4) aluminum oxide film film heat resistance and corrosion resistance are good, evenly fine and close, firm with the metallic aluminium matrix bond, can overcome the effect that causes because of the coefficients of expansion different between circuit layer, insulating heat-conductive layer and the metal-based layer effectively, can bear machinings such as boring, punching, cutting.
(5) have excellent heat dispersion and capability of electromagnetic shielding, the product of great power LED is developed to high density, high-power direction.The present invention is owing to have good dimensional stability and machining property, can be used for making the larger area wiring board and placement element bigger, that weight is heavier on it, can directly use metal substrate ground connection, have more wide application prospect improving the compatible aspect of performance of electronics.
(6) can make the conducting wire of multiple material.According to functional requirement, take vacuum sputtering or vacuum evaporation process can use various material conducting wire easily, by topical application protecting film, can directly make the conducting wire at the position of not doing to protect at the surface conductance layer.
Description of drawings
Fig. 1 is aluminum-base printing circuit board structural representation (double sided board);
Fig. 2 is aluminum-base printing circuit board structural representation (single sided board);
Fig. 3 is the manufacture craft flow chart of aluminum-base printing circuit board of the present invention.
Embodiment
As everyone knows, the various printed circuit board (PCB)s of extensive use in electron trade.These printed circuit board (PCB)s existing " single sided board " also have " double sided board ", when they are used for circuit design, adopt surface mounting technology (SMT) usually, to improve the packing density of electronic devices and components, dwindle small product size, reduce the production assembly cost.
Aluminum-base printing circuit board is a kind of Metal Substrate copper-clad plate of uniqueness, and it has good heat-conducting, electrical insulation properties and machining property.Aluminium base can replace frangible ceramic substrate, obtains better mechanical endurance; And aluminium base can very effectively be handled thermal diffusion, thereby reduces the product operating temperature, improves product power density and reliability, prolongs the useful life of product.So aluminium base is an important kind of printed circuit board (PCB).
Fig. 1, Fig. 2 are respectively the structural representations of aluminum-base printing circuit board " double sided board " and " single sided board ".As can be seen from Figure 1, the basic structure of aluminum-base printing circuit board is divided into three layers: 11 and 15 is external table surface layer, i.e. conductive layer.The electric conducting material that conductive layer uses is Copper Foil, and thickness is generally 18～140 μ m, and the ifs circuit layer requires to have very big current capacity, just needs to use thicker Copper Foil.12 and 14 is intermediate layers, i.e. the heat conductive insulating layer.Insulation technology is the key of aluminum-base printing circuit board, the general epoxy glass cloth bonding sheet of high heat conduction or the special high-thermal-conductivity epoxy resin polymer of adopting of dielectric, the thickness of heat conductive insulating layer is 80～100 μ m, require on the technical performance that thermal resistance is little, adhesive property is good, have the ability of resistant to thermal aging, and can bear machinery and thermal stress.The 13rd, base foundation layer, i.e. metal-based layer.Metal substrate uses aluminium sheet, requires substrate to have very strong dimensional stability and machining property, has good thermal diffusivity.Corresponding with Fig. 1,21 is conductive layers, the 22nd in the middle of Fig. 2, heat conductive insulating layer, the 23rd, metal-based layer.
Usually, the making of metallic aluminium base printed circuit board material plate and production are continued to use following process and carried out: the common used thickness of base material is 0.5～3 millimeter metallic aluminium or other aluminum alloy plate materials, large-area substrate surface utilization machinery and chemical method are carried out preliminary treatment earlier, form bright and clean smooth plane, the epoxy glass fabric of very thin one deck is covered in the shop then, heat conductive insulating layer in the middle of the one deck of the coated again specific polymers that has constitutes, surface in the intermediate layer covers Copper Foil again, through hot pressing processing, trilaminate material presses together about making, and forms the aluminum base copper clad panel material.Adopt the printed substrate manufacture craft to process the conducting wire at last, pass through mechanical stamping processing and surface cleaning processing again, make practical metal circuit board.
The aluminum-base printing circuit board that said method is made, the heat conductivility of its heat conductive insulating layer is not very good, during especially for packaged high-power LED, it is particularly outstanding that this drawback seems, constituted restriction for bringing into play many excellent properties of great power LED when the lighting source better.
On the other hand, in nature, aluminium is electric conductivity good metal element, and the oxide alundum (Al of aluminium then is the insulating material of function admirable.The thickness of alundum (Al film is when 100 μ m, and its surface insulation resistance can reach more than the 100M Ω; Simultaneously, the thermal conductivity of alundum (Al film can reach 40w/mk, is higher than general fiber and resin far away, and the film quality is evenly fine and close, and thermal endurance and corrosion resistance are good.
Therefore, the present invention proposes a kind of with the aluminum-base printing circuit board of ceramic-like thin layer as the heat conductive insulating layer, and the chemical composition of this ceramic-like thin layer is the oxide of aluminium, and its main component is alundum (Al.
The basic structure of this aluminum-base printing circuit board also is divided into three layers, is example with Fig. 2 " single sided board ", and 21 is external table surface layer---conductive layer, and it can be the metal level that all covers, and also can be the conducting wire that directly makes; 22 is the intermediate thermal conductivity insulating barrier, is the alundum (Al ceramic-like film that the aluminium base surface oxidation forms afterwards, and thickness is 10～400 μ m, its insulation resistance 〉=100M Ω; The 23rd, the metal aluminum substrate of bottom.
The manufacture method of aluminum-base printing circuit board of the present invention may further comprise the steps: 1. adopt machinery or chemical method to carry out preliminary treatment for the substrate surface of metal aluminum substrate, deoil, wash, form the smooth workpiece planarization of cleaning; 2. at pretreated surface of the work processing and fabricating heat conductive insulating layer; 3. further cover conductive layer in the outside of heat conductive insulating layer, and then facet etch is made the conducting wire on conductive layer.
The making of heat conductive insulating layer is a key of the present invention, can adopt the method for differential arc oxidation or microplasma surface ceramic deposition, surface of aluminum plate is oxidized to alundum (Al ceramic-like film, further takes the technology of vacuum sputtering or vacuum evaporation to make conductive layer above the ceramic membrane at this then.
Differential arc oxidation or microplasma surface ceramic deposition technology, be meant on the basis of common anode oxidation, utilize the reaction that arc discharge strengthens and activation takes place on anode, thereby form a kind of processing method of the reinforcement oxide ceramic membrane of high-quality at the surface of the work that with aluminium, titanium, magnesium metal and alloy thereof is material.Fig. 3 is the process chart that adopts differential arc oxidization technique processing.During fabrication and processing, the common used thickness of aluminum metal base material is 0.5～3 millimeter metallic aluminium or other aluminum alloy plate materials, large-area substrate surface need adopt machinery and chemical method to carry out preliminary treatment equally, through deoiling and washing, to form the smooth plane of cleaning.On workpiece, apply voltage with mao power source then, the metal and the electrolyte solution of surface of the work are interacted, form micro-arc discharge at surface of the work, under high temperature and effect of electric field, the aluminum metal surface oxidation forms intensified ceramic shape oxide-film, clean with pure water, this oxide-film is sealed processing, the oven dry back forms the heat conductive insulating layer of aluminum-base printing circuit board.
After differential arc oxidization technique processing, aluminium base surface ceramic shape oxide-film densification, even, colour consistency is good, thickness range can be controlled at 10～400 microns, hardness and relative wear resistance are improved, anti-oxidant and decay resistance improves greatly, and the heat resistance of alundum (Al is higher than 2000 ℃.It is very satisfied that the bond strength of ceramic-like oxide-film and base aluminum material is also made us.
The heat conductive insulating layer is made and is finished, and can process conductive layer at its skin, and arrange the conducting wire.The manufacture method of conductive layer and conducting wire can take to make earlier the metal level that all covers on the heat conductive insulating layer, and then the conducting wire is made in etching on metal level; Also can take under the prerequisite of topical application protecting film the conducting wire that directly makes by sputter or evaporation at the position of not doing to protect.
Wherein, vacuum sputtering is to utilize vacuum ion sputtering, makes article plated metal atom, need not to add any chemical agent in the processing; Vacuum evaporation is that the heating of metal steaming source is made it the surface of nature attached to aluminium matter base material.The thickness of conductive layer relies on repeatedly processing accumulation or does further to adjust by electroplating.
Usually, the conducting wire of conductive layer adopts metallic copper to make.But,, can also use or on the copper layer, assist metals such as using gold, silver, palladium to make the conducting wire according to the application demand of printed circuit board (PCB); At all right special coating by vaporization indium gold of the chip paster part of direct packaged high-power LED, Jin Xi or similar alloy, to form the alloy coat that is fit to the die bottom surface welding.
When aluminum-base printing circuit board was " double sided board " shown in Figure 1, preliminary treatment all will be carried out in two surfaces up and down for metal aluminum substrate 13 in the manufacturing process, and distinguished processing and fabricating heat conductive insulating layer 12/14, conductive layer 11/15, and corresponding conducting wire.
Need to prove; aluminum-base printing circuit board provided by the invention is mainly used in some specific power-type electronic circuit and device; be particularly useful for the large power semiconductor LED lighting source; but protection scope of the present invention is not so limited; every employing equivalents or equivalence are replaced and the technical scheme of formation, all drop within the claim scope of the present invention.
Claims (9)
1. aluminum-base printing circuit board, comprise bottom, intermediate layer and superficial layer, bottom adopts metal aluminum substrate, the intermediate layer is the heat conductive insulating layer, superficial layer is a conductive layer, be distributed with conducting channel above, it is characterized in that: described heat conductive insulating layer is the ceramic-like thin layer, and its chemical composition is the oxide alundum (Al of aluminium.
2. aluminum-base printing circuit board according to claim 1 is characterized in that: the thickness range of described ceramic-like thin layer is 10～400 microns, its insulation resistance 〉=100M Ω.
3. aluminum-base printing circuit board according to claim 1 is characterized in that: the electric conducting material of described conductive layer is copper, gold, silver or palladium.
4. aluminum-base printing circuit board according to claim 3 is characterized in that: the part of described conductive layer or integral body also scribble indium billon or gold-tin alloy.
5. aluminum-base printing circuit board according to claim 1 is characterized in that: described aluminum-base printing circuit board is " single sided board " or " double sided board ".
6. the manufacture method of the described aluminum-base printing circuit board of claim 1 may further comprise the steps: 1. adopt machinery or chemical method to carry out preliminary treatment for the substrate surface of metal aluminum substrate, deoil, wash, form the smooth workpiece planarization of cleaning; 2. adopt the method for differential arc oxidation or microplasma surface ceramic deposition, at pretreated surface of the work processing and fabricating heat conductive insulating layer; 3. further cover conductive layer in the outside of heat conductive insulating layer, and then facet etch is made the conducting wire on conductive layer.
7. the manufacture method of aluminum-base printing circuit board according to claim 6, it is characterized in that: 2. step adopts the method for differential arc oxidation to carry out, promptly on workpiece, apply voltage with mao power source, the metal and the electrolyte solution of surface of the work are interacted, form micro-arc discharge at surface of the work, under high temperature and effect of electric field, the aluminum metal surface forms intensified ceramic shape oxide-film, then this oxide-film is sealed processing, make the heat conductive insulating layer of aluminum-base printing circuit board after the drying.
8. the manufacture method of aluminum-base printing circuit board according to claim 6 is characterized in that: 3. step is all to cover conductive layer in the outside of heat conductive insulating layer earlier, and then facet etch is made the conducting wire on conductive layer; Perhaps at the outside of heat conductive insulating layer topical application protecting film, the method by sputter or evaporation is directly made the conducting wire at the position of not doing to protect then.
9. the manufacture method of aluminum-base printing circuit board according to claim 6, it is characterized in that: described aluminum-base printing circuit board is " double sided board ", preliminary treatment is carried out on two surfaces up and down for metal aluminum substrate in the manufacturing process respectively, and further processing and fabricating heat conductive insulating layer, conductive layer and conducting wire.
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