CN204131823U - Novel high heat-conduction circuit board - Google Patents
Novel high heat-conduction circuit board Download PDFInfo
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- CN204131823U CN204131823U CN201420461275.0U CN201420461275U CN204131823U CN 204131823 U CN204131823 U CN 204131823U CN 201420461275 U CN201420461275 U CN 201420461275U CN 204131823 U CN204131823 U CN 204131823U
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- circuit board
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- high heat
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Abstract
The utility model relates to a kind of novel high heat-conduction circuit board, and it has better heat conduction and radiating effect, and the anti-vitrification point performance of higher resistance to gentleness, efficiently solves the heat dissipation problem of circuit board.The utility model comprises circuit board substrate, circuit board substrate adopts AlSiC substrate, in AlSiC substrate, SiC:Al ratio is 7:3, circuit board substrate arranges substrate insulating layer, substrate insulating layer adopts and is formed on circuit board substrate by dielectric slurry sintering, and conductive circuit layer adopts and formed on substrate insulating layer by electric slurry sintering.The novel high heat-conduction circuit board of the utility model is single sided board, double sided board or multi-layer sheet.
Description
one, technical field:
The utility model relates to a kind of circuit board, especially relates to a kind of novel high heat-conduction circuit board.
two, background technology:
Circuit board is the supporting body of electronic device, is requisite part in an electronic product or electric equipment.Along with the development of electronics, electrical technology, also more and more higher to the requirement of circuit board.At present, most of circuit board is all adopt metal substrate, and at press fit of metal substrate insulating cement pad, then bond Copper Foil, pressing heat-conducting pad is not fine in heat conduction and heatproof, vitrification point etc., thus affects the performance of whole circuit board.
three, utility model content:
The utility model is in order to solve the weak point in above-mentioned background technology, and provide a kind of novel high heat-conduction circuit board, it has better heat conduction and radiating effect, and the anti-vitrification point performance of higher resistance to gentleness, efficiently solves the heat dissipation problem of circuit board.
For achieving the above object, the technical solution adopted in the utility model is:
A kind of novel high heat-conduction circuit board, comprise circuit board substrate, it is characterized in that: circuit board substrate adopts AlSiC substrate, circuit board substrate arranges substrate insulating layer, substrate insulating layer adopts and is formed on circuit board substrate by dielectric slurry sintering, and conductive circuit layer adopts and formed on substrate insulating layer by electric slurry sintering.
In AlSiC substrate, SiC:Al ratio is (5-7): (5-3).
Substrate insulating layer adopts electronic isolation dielectric paste sintering to be formed.
Conductive circuit layer adopt: electric slurry be electronic silver paste.
Substrate insulating layer adopts and is formed on circuit board substrate by dielectric slurry silk screen printing sintering, and conductive circuit layer adopts and formed on substrate insulating layer by electric slurry silk screen printing sintering.
Described novel high heat-conduction circuit board is single sided board, double sided board or multi-layer sheet.
Compared with prior art, the advantage that has of the utility model and effect as follows:
In the utility model, circuit board substrate is the AlSiC substrate with heat conductivility, substrate insulating layer adopts and is formed at AlSiC substrate printing-sintering electric slurry, conductive circuit layer adopts at substrate insulating layer printing-sintering wire line, and conductive circuit layer sintering temperature is lower than the electric slurry destroying insulating barrier sintering temperature.The utility model adopts silver slurry as conductive circuit layer, utilizes the feature of AlSiC high conductive high strength, realizes thinner board production, utilize print production scheme more easily to realize the board production of thermoelectricity isolating construction mode.The utility model circuit board has better heat conduction and radiating effect, and the anti-vitrification point performance of higher resistance to gentleness, efficiently solves the heat dissipation problem of circuit board.
four, accompanying drawing illustrates:
Fig. 1 is partial cutaway schematic of the present utility model.
In figure, 1-AlSiC substrate, 2-substrate insulating layer, 3-conductive circuit layer.
five, embodiment:
The present embodiment is the utility model preferred implementation, and other all Principles and methods are identical with the present embodiment or close, all within the utility model protection range.
The utility model is a kind of novel high heat-conduction circuit board, comprises circuit board substrate, and circuit board substrate adopts SiC:Al ratio in AlSiC substrate 1, AlSiC substrate 1 to be (5-7): (5-3).Circuit board substrate arranges substrate insulating layer 2, and substrate insulating layer 2 adopts and is formed on circuit board substrate by electronic isolation dielectric paste silk screen printing sintering, and conductive circuit layer 3 adopts and formed on substrate insulating layer by electronic silver paste silk screen printing sintering.The novel high heat-conduction circuit board of the utility model is single sided board, double sided board or multi-layer sheet.
Embodiment: (see Fig. 1)
1) circuit board substrate:
Circuit board substrate is AlSiC substrate 1, and in this example, in AlSiC substrate 1, SiC:Al is (5-7): (5-3); In concrete enforcement, other also can be adopted than row;
2) substrate insulating layer 2:
Substrate insulating layer 2 in embodiment is printing-sintering electronic media slurries on AlSiC substrate 1, and wherein thickness can adjust print pass as required;
3) conductive circuit layer 3:
In the present embodiment, conductive circuit layer 3 is arranged on substrate insulating layer 2, adopts conductor silver slurry, by silk screen printing sintering on substrate insulating layer 2; The thickness of conductive circuit layer 3 can carry out the adjustment of print pass as required, reaches requirement;
Circuit board in the utility model can be designed to lamina, i.e. printed medium slurry on AlSiC substrate 1, form insulating barrier, then printing-sintering conductor paste in face forms conductive layer on the insulating layer, circuit board in the utility model also can be designed to double sided board and multi-layer sheet, repeats 2,3 steps.
Claims (6)
1. a novel high heat-conduction circuit board, comprise circuit board substrate, it is characterized in that: circuit board substrate adopts AlSiC substrate (1), circuit board substrate arranges substrate insulating layer (2), substrate insulating layer (2) adopts and is formed on circuit board substrate by dielectric slurry sintering, and conductive circuit layer (3) adopts and above formed at substrate insulating layer (2) by electric slurry sintering.
2. novel high heat-conduction circuit board according to claim 1, is characterized in that: in AlSiC substrate (1), SiC:Al ratio is 5-7: 5-3.
3. novel high heat-conduction circuit board according to claim 2, is characterized in that: substrate insulating layer (2) adopts electronic isolation dielectric paste sintering to be formed.
4. novel high heat-conduction circuit board according to claim 3, is characterized in that: the electric slurry that conductive circuit layer (3) adopts is electronic silver paste.
5. novel high heat-conduction circuit board according to claim 4, it is characterized in that: substrate insulating layer (2) adopts and formed on circuit board substrate by dielectric slurry silk screen printing sintering, conductive circuit layer (3) adopts and is above formed at substrate insulating layer (2) by electric slurry silk screen printing sintering.
6. novel high heat-conduction circuit board according to claim 5, is characterized in that: described novel high heat-conduction circuit board is single sided board, double sided board or multi-layer sheet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420461275.0U CN204131823U (en) | 2014-08-15 | 2014-08-15 | Novel high heat-conduction circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420461275.0U CN204131823U (en) | 2014-08-15 | 2014-08-15 | Novel high heat-conduction circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204131823U true CN204131823U (en) | 2015-01-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420461275.0U Active CN204131823U (en) | 2014-08-15 | 2014-08-15 | Novel high heat-conduction circuit board |
Country Status (1)
| Country | Link |
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| CN (1) | CN204131823U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107613588A (en) * | 2017-08-14 | 2018-01-19 | 深圳市维特欣达科技有限公司 | The preparation method and quick-heating type heating board of a kind of quick-heating type heating board |
| CN107949177A (en) * | 2017-12-01 | 2018-04-20 | 深圳市百柔新材料技术有限公司 | A kind of method of full addition manufacture printed circuit |
| CN109168274A (en) * | 2018-10-15 | 2019-01-08 | 安徽银点电子科技有限公司 | A method of preparing circuit board |
-
2014
- 2014-08-15 CN CN201420461275.0U patent/CN204131823U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107613588A (en) * | 2017-08-14 | 2018-01-19 | 深圳市维特欣达科技有限公司 | The preparation method and quick-heating type heating board of a kind of quick-heating type heating board |
| CN107613588B (en) * | 2017-08-14 | 2023-12-05 | 深圳市维特欣达科技有限公司 | Preparation method of quick heating type heating plate and quick heating type heating plate |
| CN107949177A (en) * | 2017-12-01 | 2018-04-20 | 深圳市百柔新材料技术有限公司 | A kind of method of full addition manufacture printed circuit |
| CN109168274A (en) * | 2018-10-15 | 2019-01-08 | 安徽银点电子科技有限公司 | A method of preparing circuit board |
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