CN102958266A - Metal substrate structure and manufacturing method thereof - Google Patents
Metal substrate structure and manufacturing method thereof Download PDFInfo
- Publication number
- CN102958266A CN102958266A CN 201110240223 CN201110240223A CN102958266A CN 102958266 A CN102958266 A CN 102958266A CN 201110240223 CN201110240223 CN 201110240223 CN 201110240223 A CN201110240223 A CN 201110240223A CN 102958266 A CN102958266 A CN 102958266A
- Authority
- CN
- China
- Prior art keywords
- substrate
- phase change
- metal substrate
- material layer
- conductive material
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
Abstract
The invention relates to a metal substrate structure and a manufacturing method thereof. The manufacturing method includes providing a metal plate; forming an insulation dielectric layer below the metal plate; providing a substrate; forming a phase change heat conductive material layer above the substrate; and integrally pressing the substrate with the phase change heat conductive material layer and the metal plate with the insulation dielectric layer below. The metal substrate structure comprises the metal plate, the insulation dielectric layer, the substrate and the phase change conductive material layer. Particularly, the phase change heat conductive material layer is sprayed or printed on the substrate in a printing manner and integrally pressed with the metal plate with the insulation dielectric layer below and comprises epoxy resin, aluminum oxide powder, aluminum nitride powder and graphite powder, gaps of the substrate can be filled, bonding and dielectric strength of the insulation dielectric layer and the substrate are improved, and the problems of proneness to separation and explosion and poor heat conduction are avoided.
Description
Technical field
The present invention is about a kind of board structure and manufacture method, is provided with in its insulation dielectric layer of metallic plate and spraying or wire mark in substrate particularly that the phase change thermal conductive material layer is made secondary operations and through metal substrate structure and the manufacture method of pressing.
Background technology
By general known MPCB plate (multilayer printed circuit board), mainly be to be provided with above it Copper Foil to use as circuit, for the element derivation thermal source that the top is located on the circuit dispels the heat, all with the base material of metal as circuit board, right metal substrate and circuit are conductors, for avoiding causing the conducting short circuit risk, be provided with between the two by high molecular polymer in it and consist of and as the insulation dielectric layer of insulation impedance, add that the product of commonly using are that the sticking mode of mat subsides is connected it with circuit and substrate, again this substrate surface be not smooth be to be consisted of by the low hole of various height, cause and effectively insulation dielectric layer and substrate firmly to be followed, this has obviously caused the obstruction that heat conduction is bad and resistance to pressure is not enough, add that MPCB is along with industry demand also is used for COB (chip on board, Chip on Board) on, the product of commonly using produce too high junction temperature because can't effectively thermal source being derived participant, cause it to use and develop on be subject to many limitations, these have become the important problem of current circuit board development.
Summary of the invention
For solving above-mentioned prior art weak point, main purpose of the present invention is to provide a kind of metal substrate structure and manufacture method, to overcoming difficulty of the prior art, it can effectively be filled and led up the substrate surface hole and can increase dielectric layer and the substrate property followed, dielectric strength and difficult generation plate bursting.
Secondary objective of the present invention, be to provide a kind of metal substrate structure, comprise: a metallic plate, an insulation dielectric layer, a substrate, a phase change thermal conductive material layer, and be provided with mat spraying or wire mark between this insulation dielectric layer and substrate in the phase change thermal conductive material layer of substrate, to fill and lead up the hole of substrate.
Another purpose of the present invention, be to provide a kind of metal substrate manufacture method, its mat between its insulation dielectric layer of circuit board and substrate sprays or wire mark is provided with the phase change thermal conductive material layer in substrate, this phase change thermal conductive material layer is is also filled and led up the hole of substrate with insulation dielectric layer as secondary operations through pressing, increase insulation dielectric layer and the substrate property followed and dielectric strength, be difficult for occuring to separate plate bursting and the bad problem of heat conduction.
The problem that institute of the present invention wish solves, be provided with Copper Foil to use as circuit owing to commonly using its top of product MPCB plate, for the element derivation thermal source that the top is located on the circuit dispels the heat, then with the base material of metal as circuit board, the two is all conductor and causes the conducting short circuit for fear of this in addition, therebetween be provided with by high molecular polymer and consist of and connect as the insulation dielectric layer of insulation impedance and to paste sticking mode, right substrate surface has the low hole of various height, can't be with insulation dielectric layer and substrate effectively firmly then, cause the bad and withstand voltage deficiency of heat conduction and be subject to many limitations using and develop.
In order to achieve the above object, the invention provides a kind of metal substrate structure, it includes:
One metallic plate;
One insulation dielectric layer is located at the metallic plate below;
One substrate;
One phase change thermal conductive material layer, spraying or wire mark are pressed into one on substrate and with the metallic plate of below tool insulation dielectric layer.
It provides a kind of metal substrate manufacture method the present invention, and it comprises the following steps:
One, provides a metallic plate;
Two, form an insulation dielectric layer in the metallic plate below;
Three, provide a substrate;
Four, form a phase change and lead material layer in the substrate top;
Five, this is provided with has that phase change is led the substrate of material layer and the metallic plate of below tool insulation dielectric layer is pressed into one.
The preferably, its substrate of the present invention is metal substrate.
The preferably, its metal substrate of the present invention is aluminium base.
Further, its phase change thermal conductive material layer of the present invention further includes epoxy resin, alumina powder, aluminium nitride powder, alpha-silicon nitride powders and powdered graphite.
The preferably, the alumina powder of its phase change thermal conductive material layer of the present invention accounts for the 10-20 of the percentage of whole volume.
The preferably, the aluminium nitride powder of its phase change thermal conductive material layer of the present invention accounts for thousand minutes 3-30 of whole volume.
The preferably, the alpha-silicon nitride powders of its phase change thermal conductive material layer of the present invention accounts for thousand minutes 3-30 of whole volume.
The preferably, the powdered graphite of its phase change thermal conductive material layer of the present invention accounts for thousand minutes 1-2 of whole volume.
Beneficial effect of the present invention is, metal substrate structure and the manufacture method of invention, can be in its insulation dielectric layer of circuit board and substrate intercropping secondary operations, it is provided with the phase change thermal conductive material layer that is made of epoxy resin, alumina powder, aluminium nitride powder, alpha-silicon nitride powders, powdered graphite with spraying or wire mark mode in substrate, become one through pressing and insulation dielectric layer again, can effectively fill and lead up the substrate surface hole and can increase dielectric layer and the substrate property followed, dielectric strength and difficult generation plate bursting.
Description of drawings
Fig. 1: the profile that is provided with phase change thermal conductive material layer structure for circuit board of the present invention.
Fig. 2: be the enforcement illustration of its press fit of circuit boards phase change thermal conductive material layer of the present invention.
Fig. 3: be the calcspar of manufacture method of the present invention.
[main element symbol description]
1 ... substrate
10 ... the phase change thermal conductive material layer
100 ... epoxy resin
101 ... alumina powder
102 ... aluminium nitride powder
103 ... alpha-silicon nitride powders
104 ... powdered graphite
11 ... insulation dielectric layer
12 ... metallic plate
2 ... pinch roller
Embodiment
The effect of understanding inventive features of the present invention, content and advantage and reaching for the expensive auditor of profit, hereby the present invention is cooperated accompanying drawing, and be described in detail as follows with the expression-form of embodiment, and it is employed graphic in literary composition, its purport only is the usefulness of signal and aid illustration book, may not be the true ratio after the invention process and precisely configuration, thus should not limit the invention to claim in the actual enforcement with regard to appended graphic ratio and configuration relation, close chat first bright.
See also Fig. 1, shown in Figure 2, for circuit board of the present invention is provided with the profile of phase change thermal conductive material layer structure, the enforcement illustration of its press fit of circuit boards phase change thermal conductive material layer of the present invention, a kind of metal substrate structure of the present invention includes in a preferred embodiment: a metallic plate 12, an insulation dielectric layer 11, a substrate 1, a phase change thermal conductive material layer 10.
An aforesaid metallic plate 12 is a plate body, and is provided with thereon the Copper Foil as circuit.
An aforesaid insulation dielectric layer 11 is located at metallic plate 12 belows, to be provided as the usefulness of insulation.
An aforesaid substrate 1, for the metal substrate of heat conduction can be provided, it is positioned at metallic plate 12 belows that the below has insulation dielectric layer 11; be aluminium base in this metal substrate of the present embodiment; but do not limit the present invention with this, it also can be the substrate of various materials, all belongs to protection scope of the present invention.
An aforesaid phase change thermal conductive material layer 10, with the spraying or wire mark on substrate 1, and being pressed into one with the metallic plate 12 of below tool insulation dielectric layer 11, this phase change thermal conductive material layer 10 further includes epoxy resin 100, alumina powder 101, aluminium nitride powder 102, alpha-silicon nitride powders 103 and powdered graphite 104 and consists of.
Please be shown in Figure 3, be the calcspar of manufacture method of the present invention, metal substrate manufacture method of the present invention in a preferred embodiment, the step of its associated methods:
One, provides a metallic plate 12, can be a plate body.
Two, form an insulation dielectric layer 11 in metallic plate 12 belows.
Three, provide a substrate 1, be aluminium base in this substrate 1 of the present embodiment, but do not limit the present invention with this, it also can be various metal substrates for heat conduction, all belongs to protection scope of the present invention.
Four, form a phase change thermal conductive material layer 10 in substrate 1 top, this phase change thermal conductive material layer 10 further includes epoxy resin 100, alumina powder 101, aluminium nitride powder 102, alpha-silicon nitride powders 103 and powdered graphite 104, wherein, the alumina powder 101 of phase change thermal conductive material layer 10 accounts for percent 10-20 of whole volume; And the aluminium nitride powder 102 of phase change thermal conductive material layer 10 accounts for thousand/3-30 of whole volume; And the alpha-silicon nitride powders 103 of phase change thermal conductive material layer 10 accounts for thousand/3-30 of whole volume; In addition, 104 thousand/1-2 that account for whole volume of the powdered graphite of its phase change thermal conductive material layer 10 of the present invention.
Five, the metallic plate 12 that this is provided with substrate 1 with phase change thermal conductive material layer 10 and below tool insulation dielectric layer 11 utilizes pinch roller 2 (as shown in Figure 2) to be pressed into one with the integral body (as shown in Figure 1) of forming circuit plate.
By enforcement of the present invention, because its top of the present invention is provided with the insulation dielectric layer 11 of metallic plate 12 and 1 its spraying of substrate or wire mark and is provided with the secondary operations that a phase change thermal conductive material layer 10 is done in substrate 1, again through being pressed into one, this phase change thermal conductive material layer 10 includes epoxy resin 100, alumina powder 101, aluminium nitride powder 102, alpha-silicon nitride powders 103 and powdered graphite 104 again, therefore can fill and lead up at least the hole of substrate 1, and can increase insulation dielectric layer 11 and follow property and dielectric strength with substrate 1, be difficult for occuring to separate plate bursting and the bad problem of heat conduction.
Take a broad view of above-mentioned known to, the present invention is breaking through previous manufacturing technology and the difficulty of structure, and has really reached the effect that institute's wish is promoted, and the also easy course of processing that reaches of think of of the non-known technology of being familiar with and technique person institute,
Moreover, all open or deliver its novelty that has, progressive, novelty before the present patent application, the aobvious application important document that has met the patent of invention of home and abroad, the whence proposes patent application in accordance with the law, earnestly asks your office and checks and approves this part application for a patent for invention case, to encourage invention, to feeling moral just.
Above-described embodiment only is explanation technological thought of the present invention and characteristics, its purpose makes the personage who has the knack of this skill can understand content of the present invention and is implementing accordingly, when not limiting claim of the present invention with this, the equalization of namely generally doing according to disclosed spirit changes or modifies, and must be encompassed in the claim of the present invention.
Claims (9)
1. a metal substrate structure is characterized in that, it comprises:
One metallic plate;
One insulation dielectric layer is located at the metallic plate below;
One substrate;
One phase change thermal conductive material layer, spraying or wire mark are pressed into one on substrate and with the metallic plate of below tool insulation dielectric layer.
2. metal substrate structure as claimed in claim 1 is characterized in that, the phase change thermal conductive material layer further includes epoxy resin, alumina powder, aluminium nitride powder, alpha-silicon nitride powders and powdered graphite.
3. metal substrate structure as claimed in claim 1 or 2 is characterized in that, substrate is metal substrate.
4. metal substrate structure as claimed in claim 3 is characterized in that, metal substrate is aluminium base.
5. a metal substrate manufacture method is characterized in that, its step comprises:
One, provides a metallic plate;
Two, form an insulation dielectric layer in the metallic plate below;
Three, provide a substrate;
Four, form a phase change and lead material layer in the substrate top;
Five, this is provided with has that phase change is led the substrate of material layer and the metallic plate of below tool insulation dielectric layer is pressed into one.
6. metal substrate manufacture method as claimed in claim 5 is characterized in that, the phase change thermal conductive material layer further includes epoxy resin, alumina powder, aluminium nitride powder, alpha-silicon nitride powders and powdered graphite.
7. such as claim 5 or 6 described metal substrate manufacture methods, it is characterized in that, substrate is metal substrate.
8. metal substrate manufacture method as claimed in claim 7 is characterized in that, metal substrate is aluminium base.
9. metal substrate manufacture method as claimed in claim 6, it is characterized in that, the alumina powder of phase change thermal conductive material layer accounts for percent 10-20 of whole volume, aluminium nitride powder accounts for thousand/3-30 of whole volume, alpha-silicon nitride powders accounts for thousand/3-30 of whole volume, and powdered graphite accounts for thousand/1-2 of whole volume.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110240223 CN102958266A (en) | 2011-08-19 | 2011-08-19 | Metal substrate structure and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201110240223 CN102958266A (en) | 2011-08-19 | 2011-08-19 | Metal substrate structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102958266A true CN102958266A (en) | 2013-03-06 |
Family
ID=47766282
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201110240223 Pending CN102958266A (en) | 2011-08-19 | 2011-08-19 | Metal substrate structure and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102958266A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103702511A (en) * | 2013-12-31 | 2014-04-02 | 广东生益科技股份有限公司 | High thermal conductivity metal substrate and manufacturing method thereof |
| CN106455308A (en) * | 2016-08-23 | 2017-02-22 | 青岛墨金烯碳新材料科技有限公司 | Graphene and carbon fiber composite high-thermal-conductivity circuit board and preparation method thereof |
| CN110310829A (en) * | 2019-05-23 | 2019-10-08 | 深圳先进技术研究院 | Buried capacitor material, preparation method and printed wiring board |
-
2011
- 2011-08-19 CN CN 201110240223 patent/CN102958266A/en active Pending
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103702511A (en) * | 2013-12-31 | 2014-04-02 | 广东生益科技股份有限公司 | High thermal conductivity metal substrate and manufacturing method thereof |
| CN106455308A (en) * | 2016-08-23 | 2017-02-22 | 青岛墨金烯碳新材料科技有限公司 | Graphene and carbon fiber composite high-thermal-conductivity circuit board and preparation method thereof |
| CN106455308B (en) * | 2016-08-23 | 2018-10-02 | 青岛墨金烯碳新材料科技有限公司 | A kind of graphene carbon fiber composite high heat conduction wiring board and preparation method thereof |
| CN110310829A (en) * | 2019-05-23 | 2019-10-08 | 深圳先进技术研究院 | Buried capacitor material, preparation method and printed wiring board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN103358631B (en) | One is buried dielectric layer for capacity materials, is buried capacity materials, preparation method and its usage | |
| JP2013038263A (en) | Laminated inductor and method for manufacturing the same | |
| CN107068251A (en) | Isolated bus, the manufacture method of isolated bus and electronic equipment | |
| CN102958266A (en) | Metal substrate structure and manufacturing method thereof | |
| CN105210462B (en) | The manufacturing method and substrate having built-in components of substrate having built-in components | |
| CN102223767A (en) | Production process for high heat-conduction circuit board | |
| CN205611056U (en) | Thermoelectric separation composite metal circuit board | |
| CN208444687U (en) | A kind of high-power paster type resistor of high-precision | |
| TWI609381B (en) | Method of fabricating high-conductivity thick-film copper paste coated with nano-silver for being sintered in the air | |
| CN204131823U (en) | Novel high heat-conduction circuit board | |
| JP2009111331A (en) | Printed-circuit substrate and manufacturing method therefor | |
| EP4279265A3 (en) | Conductive paste, laminate body, method of bonding copper laminate/copper electrode and conductor | |
| CN101826427A (en) | Current protective element structure and manufacturing method thereof | |
| JP5108162B1 (en) | Multilayer inductor | |
| CN203775528U (en) | Heat dissipation type aluminum-silver copper-clad plate | |
| CN104582291A (en) | Manufacturing method of high-frequency LTCC circuit module substrate | |
| CN205069252U (en) | Slim surface mounting heavy current PTC component | |
| CN203167424U (en) | Aluminum-base circuit board | |
| CN109757032A (en) | A kind of method of metal-foil circuits and wire circuit produced with combination circuit board | |
| CN102126313A (en) | High-frequency composite medium copper clad substrate | |
| CN202634882U (en) | Substrate used for flexible printed circuit board | |
| CN102065634A (en) | LED high-frequency aluminum-based circuit board | |
| CN202601229U (en) | Copper-embedded aluminum copper composite plate band | |
| CN201401860Y (en) | Electric heater based on ceramic heating assembly | |
| JP2006310583A (en) | Composite substrate and manufacturing method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20130306 |