CN208444687U - A kind of high-power paster type resistor of high-precision - Google Patents
A kind of high-power paster type resistor of high-precision Download PDFInfo
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- CN208444687U CN208444687U CN201820907052.0U CN201820907052U CN208444687U CN 208444687 U CN208444687 U CN 208444687U CN 201820907052 U CN201820907052 U CN 201820907052U CN 208444687 U CN208444687 U CN 208444687U
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- material strip
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- free copper
- electric resistance
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Abstract
The purpose of the utility model is to provide a kind of high-power paster type resistors of high-precision, including electric resistance alloy material strip and the oxygen-free copper material strip for being welded on electric resistance alloy material strip both ends, wherein the thickness of electric resistance alloy material strip is significantly less than the thickness of oxygen-free copper material strip, the top and bottom of electric resistance alloy material strip are equipped with the epoxy resin layer for insulation, and oxygen-free copper material strip is equipped with tin coating.The utility model solves the difficult status of small size patch electrode production.
Description
Technical field
The utility model belongs to technical field of electronic components, in particular to a kind of high-power patch type electricity of high-precision
Resistance.
Background technique
Precise Alloy patch resistor is widely used in all kinds of circuits as the critical elements in circuit, is that application is wider
General electronic component is particularly suitable for the various circuits using the production of surface-pasted packaging technology.Currently, Precise Alloy pastes
In the production of sheet resistance device, power always be restrict this kind of product an important factor for, in some circuits for needing relatively high power,
For existing device due to the limitation of structure, calorific value is determined by power and the material used, no doubt, uses heat sink material
Good resistance, heat dissipation effect is more preferable, and performance is also more stable, however cost of its production will lead to it is high, it is expensive,
For general resistor designs thinking, using common heat sink material, it to be used for Yi Fashengyin electricity when high-power circuit
Resistance fever and the problem that causes whole accumulated heat, circuit performance unstable, thus general resistor be difficult to meet this it is powerful
Demand.
Existing alloy Chip-R mostly uses metal or ceramics as heat-radiating substrate, resistance alloys is covered on substrate
Layer is used as resistance value live part, using printing insulating cement or pressing insulated rubber film as isolation substrate between substrate and resistive layer
With the effect of resistive layer, copper clad end substrate and resistive layer is electroplated as electrode section in end, middle part coated epoxy resin or
Isolation protective effect has been painted in coating.Chinese patent application 201410296302.8 discloses a kind of high-power Precise Alloy patch
The heat that the advantages of production method of resistor, this technique is that product resistive layer generates can be conducted effectively to heat-radiating substrate
On, but the shortcomings that this technique, is that electro-coppering low efficiency, pollution are big, and only by one layer of glue between substrate and resistive layer
Film insulate, and the various factors (such as stress bending, current impulse) in resistance trimming or use are easy to lead to patch because film layer punctures
Resistance failure.
Utility model content
The purpose of the utility model is to provide one kind not to use copper-plating technique and clever structure high-precision high power
Paster type resistor.
In order to achieve the above object, the technical solution of the utility model are as follows:
A kind of high-power paster type resistor of high-precision, including electric resistance alloy material strip and it is welded on electric resistance alloy material strip both ends
Oxygen-free copper material strip, wherein the thickness of electric resistance alloy material strip is significantly less than the thickness of oxygen-free copper material strip, electric resistance alloy material strip it is upper
The epoxy resin layer for insulation is arranged below, oxygen-free copper material strip is equipped with tin coating.
Preferably, the thickness of oxygen-free copper material strip adds epoxy plus the sum of thickness of tin coating and electric resistance alloy material strip thickness
The sum of thickness of resin layer is equal.
Preferably, nickel coating is additionally provided between the tin coating and oxygen-free copper material strip.
Preparation method are as follows: 1) material strip welds, and the oxygen-free copper material strips of volume two and electric resistance alloy material strip are passed through electron beam welding
Together, electric resistance alloy material strip is located between the oxygen-free copper material strips of volume two, and the thickness of electric resistance alloy material strip is significantly less than anaerobic
Copper material strip;2) by after electron beam welding oxygen-free copper-resistance and gold-oxygen-free copper material strip by the punch forming of high-speed punching press, at
Material strip after type includes the oxygen-free copper part of resistor body ontology and electrode, resistance and golden ontology and single, electrode separation, electrode side
Edge connects oxygen-free copper;3) laser resistor trimming forms resistance circuit, adjustment product resistance value to given value range on electric resistance alloy;4)
Encapsulation, with epoxy resin packaged resistance layer;5) it is punched, single resistance is punched by particular manufacturing craft and punching machine;6) it is electroplated, single
Resistance electrode part can be only tin plating, can also first nickel plating, it is then tin plating, it is ensured that the solderability of product.
The beneficial effects of the utility model are:
Thinner electric resistance alloy material strip and the thicker oxygen-free copper material strip of two-end thickness are passed through electronics first by the present invention
Beam welds together, and then forms single resistance side by side by punch forming, then adjust resistance value with laser machine, is finally packaged into
Type, the tin plating production electrode in end.It is to guarantee that the resistive layer at middle part is coating firstly, end oxygen-free copper stripe designs thicker purpose
With the tin plating rear consistency of thickness of end red copper after epoxy resin, ensure that product does not need compared with existing paster technique in this way
First copper facing makes electrode, can directly nickel plating it is tin plating again, a step copper-plating technique is reduced compared with existing paster technique, and copper facing is proper
It is that thickness is maximum in copper electroplating layer nickel layer tin layers well, the minimum step of efficiency restricts the technique of production efficiency, and copper facing is to ring
Border pollution is big, and liquid waste processing is difficult after plating, and production electrode is solved at raw material end, solves small size patch electrode system
Make difficult status.
Detailed description of the invention
Fig. 1 is the schematic diagram of the section structure of the utility model embodiment 1;
Fig. 2 is the schematic diagram of the section structure of the utility model embodiment 2;
In figure: 1, electric resistance alloy material strip;2, oxygen-free copper material strip;3, epoxy resin layer;4, tin coating;5, nickel coating.
Specific embodiment
A kind of embodiment of the utility model is further illustrated with reference to the accompanying drawings.
Embodiment 1: Fig. 1 is referred to:
A kind of high-power paster type resistor of high-precision, including electric resistance alloy material: 1 and it is welded on 1 liang of electric resistance alloy material strip
The oxygen-free copper material strip 2 at end, wherein the thickness of electric resistance alloy material strip 1 is significantly less than the thickness of oxygen-free copper material strip 2, electric resistance alloy material strip
Top and bottom be equipped with for insulation epoxy resin layer 3, oxygen-free copper material strip 3 be equipped with tin coating 4.
The thickness of oxygen-free copper material strip 2 adds epoxy resin plus the sum of thickness of tin coating 4 and 1 thickness of electric resistance alloy material strip
The sum of the thickness of layer 3 is equal.
Preparation method are as follows: 1) material strip welds, and the oxygen-free copper material strips of volume two and electric resistance alloy material strip are passed through electron beam welding
Together, electric resistance alloy material strip is located between the oxygen-free copper material strips of volume two, and the thickness of electric resistance alloy material strip is significantly less than anaerobic
Copper material strip;2) by after electron beam welding oxygen-free copper-resistance and gold-oxygen-free copper material strip by the punch forming of high-speed punching press, at
Material strip after type includes the oxygen-free copper part of resistor body ontology and electrode, resistance and golden ontology and single, electrode separation, electrode side
Edge connects oxygen-free copper;3) laser resistor trimming forms resistance circuit, adjustment product resistance value to given value range on electric resistance alloy;4)
Encapsulation, with epoxy resin packaged resistance layer;5) it is punched, single resistance is punched by particular manufacturing craft and punching machine;6) it is electroplated, single
Resistance electrode part is tin plating.
Embodiment 2: Fig. 2 is referred to:
A kind of high-power paster type resistor of high-precision, including electric resistance alloy material: 1 and it is welded on 1 liang of electric resistance alloy material strip
The oxygen-free copper material strip 2 at end, wherein the thickness of electric resistance alloy material strip 1 is significantly less than the thickness of oxygen-free copper material strip 2, electric resistance alloy material strip
Top and bottom be equipped with for insulation epoxy resin layer 3, oxygen-free copper material strip 3 be equipped with tin coating 4, tin coating 4 and oxygen-free copper material
Nickel coating 5 is additionally provided between band 2.
The thickness of oxygen-free copper material strip 2 adds epoxy resin plus the sum of thickness of tin coating 4 and 1 thickness of electric resistance alloy material strip
The sum of the thickness of layer 3 is equal.
Preparation method are as follows: 1) material strip welds, and the oxygen-free copper material strips of volume two and electric resistance alloy material strip are passed through electron beam welding
Together, electric resistance alloy material strip is located between the oxygen-free copper material strips of volume two, and the thickness of electric resistance alloy material strip is significantly less than anaerobic
Copper material strip;2) by after electron beam welding oxygen-free copper-resistance and gold-oxygen-free copper material strip by the punch forming of high-speed punching press, at
Material strip after type includes the oxygen-free copper part of resistor body ontology and electrode, resistance and golden ontology and single, electrode separation, electrode side
Edge connects oxygen-free copper;3) laser resistor trimming forms resistance circuit, adjustment product resistance value to given value range on electric resistance alloy;4)
Encapsulation, with epoxy resin packaged resistance layer;5) it is punched, single resistance is punched by particular manufacturing craft and punching machine;6) it is electroplated, single
The nickel plating of resistance electrode part elder generation, then it is tin plating, it is ensured that the solderability of product.
The above is not limit the technical scope of the present invention, all according to the utility model technical spirit
To any modification, equivalent variations and modification made by above embodiment, the model of the technical solution of the utility model is still fallen within
In enclosing.
Claims (3)
1. a kind of high-power paster type resistor of high-precision, it is characterised in that: including electric resistance alloy material strip and be welded on resistance conjunction
The oxygen-free copper material strip at golden material strip both ends, wherein the thickness of electric resistance alloy material strip is significantly less than the thickness of oxygen-free copper material strip, and resistance closes
The top and bottom of golden material strip are equipped with the epoxy resin layer for insulation, and oxygen-free copper material strip is equipped with tin coating.
2. the high-power paster type resistor of high-precision according to claim 1, it is characterised in that: the thickness of oxygen-free copper material strip
In addition the sum of thickness of tin coating is equal plus the sum of the thickness of epoxy resin layer with electric resistance alloy material strip thickness.
3. the high-power paster type resistor of high-precision according to claim 1, it is characterised in that: the tin coating and anaerobic
Nickel coating is additionally provided between copper material strip.
Priority Applications (1)
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CN201820907052.0U CN208444687U (en) | 2018-06-12 | 2018-06-12 | A kind of high-power paster type resistor of high-precision |
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CN201820907052.0U CN208444687U (en) | 2018-06-12 | 2018-06-12 | A kind of high-power paster type resistor of high-precision |
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CN208444687U true CN208444687U (en) | 2019-01-29 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109950012A (en) * | 2019-02-15 | 2019-06-28 | 广东福德电子有限公司 | A kind of heat sink resistance and preparation method thereof |
CN112687441A (en) * | 2020-12-08 | 2021-04-20 | 深圳市业展电子有限公司 | Process for improving product yield by changing adhesive sealing mode of chip resistor |
CN116313342A (en) * | 2023-01-10 | 2023-06-23 | 普森美微电子技术(苏州)有限公司 | Local plastic-packaged antioxidant high-power alloy resistor and preparation method thereof |
-
2018
- 2018-06-12 CN CN201820907052.0U patent/CN208444687U/en active Active
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109950012A (en) * | 2019-02-15 | 2019-06-28 | 广东福德电子有限公司 | A kind of heat sink resistance and preparation method thereof |
CN112687441A (en) * | 2020-12-08 | 2021-04-20 | 深圳市业展电子有限公司 | Process for improving product yield by changing adhesive sealing mode of chip resistor |
CN116313342A (en) * | 2023-01-10 | 2023-06-23 | 普森美微电子技术(苏州)有限公司 | Local plastic-packaged antioxidant high-power alloy resistor and preparation method thereof |
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