CN102126313A - High-frequency composite medium copper clad substrate - Google Patents
High-frequency composite medium copper clad substrate Download PDFInfo
- Publication number
- CN102126313A CN102126313A CN2011100022736A CN201110002273A CN102126313A CN 102126313 A CN102126313 A CN 102126313A CN 2011100022736 A CN2011100022736 A CN 2011100022736A CN 201110002273 A CN201110002273 A CN 201110002273A CN 102126313 A CN102126313 A CN 102126313A
- Authority
- CN
- China
- Prior art keywords
- medium
- copper clad
- material layer
- composite medium
- medium module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Landscapes
- Laminated Bodies (AREA)
Abstract
The invention discloses a high-frequency composite medium copper clad substrate. The substrate comprises a medium module (1), wherein a copper clad layer (3) is arranged on one side of the medium module (1); a polytetrafluoroethylene (PP) film (2) is arranged between the medium module (1) and the copper clad layer (3); a composite medium material layer (4) is arranged on the other side of the medium module (1), and the copper clad layer (3) is arranged on the composite medium material layer (4); and the PP film (2) is arranged between the composite medium material layer (4) and the copper clad layer (3). The high-frequency composite medium copper clad substrate can meet the requirements of different industries on special impedance and dielectric constant to microwave high-frequency circuits, ensures that a medium material cannot be layered when the application frequency is lower than 1GHz, and the temperature approaches glass temperature, and has excellent bonding force, excellent performance and stable chemical property.
Description
Technical field
The present invention relates to a kind of high frequency composite medium copper-covered aluiminium base plate.
Background technology
Along with the continuous development of scientific and technological information network technology, to the corresponding raising that requires of high frequency composite,, the special impedance of board substrate also to be had higher requirement for satisfying different clients' needs, ultrahigh speed, hyperfrequency microwave technology are widely used.In the commercial microwave circuit, general complex media material is when operating temperature is higher, will deliquescing with the rising of temperature, dielectric constant and impedance behavior all can change thereupon, and cause the dielectric layer lamination, unstable chemcial property, poor, the electrical property reduction of Copper Foil adhesion.
Summary of the invention
The invention provides a kind of high frequency composite medium copper-covered aluiminium base plate, it can satisfy special impedance and the dielectric constant requirement that different industries proposes microwave high-frequency circuit, dielectric material can layering when applying frequency is lower than 1GHZ, temperature near glass temperature, has good bonding force, excellent performance and highly stable chemistry.
The present invention has adopted following technical scheme: a kind of high frequency composite medium copper-covered aluiminium base plate, and it comprises medium module, is provided with copper foil layer in the one side of medium module, is provided with polytetrafluoroethylene (PTFE) PP film between described medium module and the copper foil layer; Another side at medium module is provided with the complex media material layer, and the complex media material layer is provided with copper foil layer, is provided with polytetrafluoroethylene (PTFE) PP film between described complex media material layer and the copper foil layer.
Described medium module is formed by the pressing at high temperature of PPO powder; Described complex media material is mixed by golden red stone flour and insulating glass sealant and forms.
The present invention has following beneficial effect: the present invention adopts medium module that the pressing of PPO powder forms as substrate, and the client can freely select the thickness of design medium module according to product.The complex media material is mixed in proportion by golden red stone flour and insulating glass sealant, by adjusting and satisfy different industries to the proportioning of golden red stone flour and insulating glass sealant to the special impedance of microwave high-frequency circuit proposition and the specific (special) requirements of dielectric constant.Adopt superpower polytetrafluoroethylene (PTFE) PP film to be with the super pressure-high temperature pressing in the middle of during the lamination copper foil layer, polytetrafluoroethylene (PTFE) PP film has good bonding force, even temperature can layering during near vitrification point yet, has electric property excellent under highly stable chemistry and the high-frequency high temperature, be specially adapted to the application of high-speed digital circuit, the emission of microwave and accept system or the like.
Description of drawings
Fig. 1 is a structural representation of the present invention
The specific embodiment
In Fig. 1, the present invention is a kind of high frequency composite medium copper-covered aluiminium base plate, and it comprises the medium module 1 that is formed by the pressing at high temperature of PPO powder.One side at medium module 1 is provided with copper foil layer 3, is provided with polytetrafluoroethylene (PTFE) PP film 2 between described medium module 1 and the copper foil layer 3.Another side at medium module 1 is provided with complex media material layer 4, and complex media material layer 4 is provided with copper foil layer 3, is provided with polytetrafluoroethylene (PTFE) PP film 2 between described complex media material layer 4 and the copper foil layer 3.Described complex media material layer 4 mixes the mixture of forming in proportion by golden red stone flour and insulating glass sealant, by adjusting and satisfy different industries to the proportioning of golden red stone flour and insulating glass sealant to the special impedance of microwave high-frequency circuit proposition and the specific (special) requirements of dielectric constant.
Claims (3)
1. a high frequency composite medium copper-covered aluiminium base plate is characterized in that it comprises medium module (1), is provided with copper foil layer (3) in the one side of medium module (1), is provided with polytetrafluoroethylene (PTFE) PP film (2) between described medium module (1) and the copper foil layer (3); Another side at medium module (1) is provided with complex media material layer (4), and complex media material layer (4) is provided with copper foil layer (3), is provided with polytetrafluoroethylene (PTFE) PP film (2) between described complex media material layer (4) and the copper foil layer (3).
2. a kind of high frequency composite medium copper-covered aluiminium base plate according to claim 1 is characterized in that described medium module (1) is to be formed by the pressing at high temperature of PPO powder.
3. a kind of high frequency composite medium copper-covered aluiminium base plate according to claim 1 is characterized in that described complex media material layer (4) is mixed by golden red stone flour and insulating glass sealant to form.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100022736A CN102126313A (en) | 2011-01-05 | 2011-01-05 | High-frequency composite medium copper clad substrate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011100022736A CN102126313A (en) | 2011-01-05 | 2011-01-05 | High-frequency composite medium copper clad substrate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN102126313A true CN102126313A (en) | 2011-07-20 |
Family
ID=44264721
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011100022736A Pending CN102126313A (en) | 2011-01-05 | 2011-01-05 | High-frequency composite medium copper clad substrate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102126313A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102421243A (en) * | 2011-08-06 | 2012-04-18 | 倪新军 | Microwave high-frequency circuit board |
| CN102711373A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Microwave high-frequency metal matrix circuit board substrate |
| CN110053345A (en) * | 2019-04-29 | 2019-07-26 | 泰州博远科技咨询有限公司 | A kind of TP type microwave composite medium copper-covered aluiminium base plate |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1701950A (en) * | 2005-06-23 | 2005-11-30 | 朱德明 | Metal based board with copper foil coated compound medium |
| CN1799830A (en) * | 2005-12-30 | 2006-07-12 | 顾根山 | Wide-dielectric constant polytetrafluoroethylene glass cloth coated copper foil plate |
| CN101521988A (en) * | 2009-03-27 | 2009-09-02 | 浙江大学 | Preparation method of metal base copper-clad plate and copper-clad sectional material |
| CN101707853A (en) * | 2009-02-24 | 2010-05-12 | 常州市超顺电子技术有限公司 | Metal matrix copper-clad laminate |
| CN101913274A (en) * | 2010-07-16 | 2010-12-15 | 顾根山 | Ferritic based composite-dielectric copper clad laminate |
| CN201979757U (en) * | 2011-01-05 | 2011-09-21 | 倪新军 | High-frequency composite medium covered with copper foil substrate |
-
2011
- 2011-01-05 CN CN2011100022736A patent/CN102126313A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1701950A (en) * | 2005-06-23 | 2005-11-30 | 朱德明 | Metal based board with copper foil coated compound medium |
| CN1799830A (en) * | 2005-12-30 | 2006-07-12 | 顾根山 | Wide-dielectric constant polytetrafluoroethylene glass cloth coated copper foil plate |
| CN101707853A (en) * | 2009-02-24 | 2010-05-12 | 常州市超顺电子技术有限公司 | Metal matrix copper-clad laminate |
| CN101521988A (en) * | 2009-03-27 | 2009-09-02 | 浙江大学 | Preparation method of metal base copper-clad plate and copper-clad sectional material |
| CN101913274A (en) * | 2010-07-16 | 2010-12-15 | 顾根山 | Ferritic based composite-dielectric copper clad laminate |
| CN201979757U (en) * | 2011-01-05 | 2011-09-21 | 倪新军 | High-frequency composite medium covered with copper foil substrate |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102421243A (en) * | 2011-08-06 | 2012-04-18 | 倪新军 | Microwave high-frequency circuit board |
| CN102711373A (en) * | 2012-05-11 | 2012-10-03 | 倪新军 | Microwave high-frequency metal matrix circuit board substrate |
| CN110053345A (en) * | 2019-04-29 | 2019-07-26 | 泰州博远科技咨询有限公司 | A kind of TP type microwave composite medium copper-covered aluiminium base plate |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102555349A (en) | Method for manufacturing ceramic filled polytetrafluoroethylene glass fiber copper-clad substrate | |
| CN206840863U (en) | Combined type LCP high-frequency high-speed Double-sided copper clad laminates | |
| CN105244076B (en) | A kind of environment-friendly type, low loading conductive silver paste and preparation method thereof | |
| CN104717839B (en) | Heavy copper circuit board and preparation method thereof | |
| JP3238556U (en) | Application molding method for new material layer structure of high frequency wiring board and its product | |
| CN206932462U (en) | Combined type LCP high-frequency high-speed FRCC base materials | |
| CN102126313A (en) | High-frequency composite medium copper clad substrate | |
| CN205255668U (en) | Low dielectricity glued membrane | |
| CN201979757U (en) | High-frequency composite medium covered with copper foil substrate | |
| CN102689464A (en) | Metamaterial composite plates and processing method thereof | |
| JP2008034742A (en) | Circuit board, and method of manufacturing circuit board | |
| CN201700081U (en) | Polytetrafluoroethylene glass fibre basal plate | |
| CN104582291A (en) | Manufacturing method of high-frequency LTCC circuit module substrate | |
| CN204968231U (en) | Ceramic base and basic multilayer circuit board that combines of epoxy | |
| CN104010436A (en) | Flexible metal-coated substrate with electromagnetic shielding effect and manufacturing technology | |
| CN208197731U (en) | A kind of high performance copper clad laminate using polytetrafluoroethylene (PTFE) filling Film laminated glass cloth | |
| CN102958266A (en) | Metal substrate structure and manufacturing method thereof | |
| CN204031574U (en) | A kind of printed circuit board (PCB) with copper base | |
| CN102427666A (en) | Manufacturing method of high frequency microwave circuit board base material | |
| CN102076164B (en) | Microwave high-frequency circuit board | |
| CN103287012B (en) | Medium substrate based on composite and manufacture method thereof | |
| CN201700082U (en) | Polytetrafluoroethylene glass fiber ceramic base plate | |
| CN201986258U (en) | Microwave high-frequency circuit board | |
| CN102036472A (en) | Microwave high-frequency metal base circuit board | |
| CN203733545U (en) | Small-size ceramic thick film radio frequency resistor |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C02 | Deemed withdrawal of patent application after publication (patent law 2001) | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20110720 |