CN102555349A - Method for manufacturing ceramic filled polytetrafluoroethylene glass fiber copper-clad substrate - Google Patents
Method for manufacturing ceramic filled polytetrafluoroethylene glass fiber copper-clad substrate Download PDFInfo
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- CN102555349A CN102555349A CN201210040749XA CN201210040749A CN102555349A CN 102555349 A CN102555349 A CN 102555349A CN 201210040749X A CN201210040749X A CN 201210040749XA CN 201210040749 A CN201210040749 A CN 201210040749A CN 102555349 A CN102555349 A CN 102555349A
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- polytetrafluoroethylene
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Abstract
The invention discloses a method for manufacturing a ceramic filled polytetrafluoroethylene glass fiber copper-clad substrate. The method sequentially comprises the following processes of: 1) preparing a polytetrafluoroethylene solution; 2) stirring the prepared polytetrafluoroethylene solution, ceramic powder and a dispersing agent with high-speed stirring equipment to form a solvent; 3) immersing a glass fiber fabric in the solvent to form an impregnated fabric; and 4) sequentially paving a pure polytetrafluoroethylene thin film and the impregnated fabric between copper foil layers, wherein the copper foil layers are connected with the pure polytetrafluoroethylene thin film. According to the method, the ceramic powder, the polytetrafluoroethylene solution and the dispersing agent are mixed and blended together to form common excellent waveguide medium substrates with low dielectric loss and different dielectric constants. The high conductivity of copper foils can be greatly improved through the ceramic filled copper-clad substrate, the copper-clad substrate also has high heat conductivity, and the stripping strength of the substrate can be greatly improved.
Description
Technical field
The present invention relates to a kind of manufacturing of electrically-conductive backing plate, particularly a kind of copper-clad base plate manufacturing approach that adopts ceramic filled polytetrafluoroethylene glass fibre.
Background technology
Printed circuit board (PCB) is a pcb board, and being fit together by nonconducting media substrate and Copper Foil forms, and is the basic material of electronic product.The employed base material of pcb board is made up of polyflon and glass fibre, and the product of this base material is used very extensively, is the maximum PCB of use amount of present electronics industry.In recent years, along with the high speed development of electronics industry especially communication industry, the frequency of application is increasingly high, and the base material of employed PCB can not be ignored the influence of electrical property, causes increasing product can not make with traditional PCB.In addition, in some occasions, the environment for use of electronic product is abominable especially, for example at high temperature, and high pressure, environment such as high humidity are had higher requirement to the physicochemical property of the base material that uses of PCB.
And at present; Continuous progress along with electronic technology; Electronics and IT products constantly develop to high frequencyization, high speed direction; Traditional baseplate material is substituted by high speed, high reliability ceramic substrate material gradually, often uses ceramic copper-clad base plate use electrically-conductive backing plate as template in the power electronics industry, and wherein the polytetrafluoroethylene (PTFE) glass fibre is because its anti-250 ℃ of high temperature, anti--100 ℃ low temperature, corrosion-resistant, characteristics such as height lubricates, electric property excellence become common used material; Ceramic copper-clad base plate is because of high-k and low-loss; Excellent characteristic such as lamination process pressure is little, temperature is low and be able to aspect the high-frequency microwave circuit to be widely used, but when practical application, common substrate intermediate laminate combines to occur the drawback of undercapacity with Copper Foil; The polytetrafluoroethylene (PTFE) glass fibre covers copper and has also that dielectric constant is low, the shortcoming of the big plate of loss in addition, has influenced result of use.
Summary of the invention
In order to overcome the deficiency of prior art, the present invention provides a kind of copper-clad base plate manufacturing approach that adopts ceramic filled polytetrafluoroethylene glass fibre.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of ceramic filled polytetrafluoroethylene glass fibre copper-clad base plate manufacturing approach, its technical process comprises successively:
1) configuration polytetrafluoroethylene liquid;
2) utilize the polytetrafluoroethylene liquid that configures and ceramic powder and dispersant high-speed mixing equipment to carry out stir process and form solvent;
3) glass fabric infiltration in solvent, formation impregnated fabric;
4) between copper foil layer, lay according to the order of pure polytetrafluoroethylene film, impregnated fabric, wherein copper foil layer all is connected with pure polytetrafluoroethylene film.
For the effect that guarantees that glass fabric soaks into, the glass fabric in the said step 3 floods 5～10min after in the dewaxing machine of 400 ℃ of heating, handling 30min in silane coupler surface modification liquid, carries out sintering machine baking 30min.
In order to guarantee to lay the effect of lamination, said step 4 is in the lamination machine of 390 ℃ of temperature, 20Pa pressure, to handle 12 hours, guarantees closely to connect between pure polytetrafluoroethylene film, impregnated fabric and the copper foil layer.
The invention has the beneficial effects as follows: the present invention adopts the preparation method of ceramic filled polytetrafluoroethylene fibrous glass copper-clad plate, utilizes ceramic powder, and polytetrafluoroethylene liquid and dispersant three add together merges; Formation has the excellent microwave-medium substrate of the differing dielectric constant of low dielectric loss general character; And the high conductive characteristic of the copper-clad base plate of ceramic filling material ability large increase Copper Foil also has high-termal conductivity, and the peel strength of ability large increase substrate; Compare with present common preparation method; The detection of the dielectric constant of ceramic wafer and loss under equal conditions and parameter, its dielectric constant reaches more than 3.0, and loss is less than 1 * 10
-3In addition, through the design of pure polytetrafluoroethylene film, its peel strength has improved more than 60% than common substrate; Can realize reverse Copper Foil like this; Copper Foil light face contacts with medium, and its adhesion strength still can reach the requirement of standard code, because of Copper Foil light face contacts with medium; Also improved the non-uniform phenomenon that causes the signal transmission because of the coarse injustice of Copper Foil; Improve performance indications such as passive intermodulation, and be difficult to realize dissolving below 300 ℃, thereby be applicable to the manufacturing of the large power, electrically subtemplate of electric power, electronic applications.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the present invention is further specified.
Fig. 1 is a copper-clad base plate structural representation of the present invention.
The specific embodiment
With reference to Fig. 1.A kind of ceramic filled polytetrafluoroethylene glass fibre copper-clad base plate manufacturing approach, its technical process comprises successively:
1) configuration polytetrafluoroethylene liquid;
2) utilizing the polytetrafluoroethylene liquid that configures and ceramic powder and dispersant high-speed mixing equipment to carry out stir process forms solvent, the solvent that is made into is well combined with glass fabric, be presented as the increase of glass fabric and Copper Foil peel strength on the macroscopic view;
3) after glass fabric is handled 30min in the dewaxing machine of 400 ℃ of heating; In silane coupler surface modification liquid, flood 5～10min; After carrying out sintering machine baking 30min; Glue is set on the glass fabric, accomplishes and handle the back glass fabric infiltration formation impregnated fabric 2 in solvent;
4) will steep sheet in advance and cut out deflash; Select smooth, as not have dirt place to cut into designated shape; Between copper foil layer 1, lay according to the order of pure polytetrafluoroethylene film 3, impregnated fabric 2, and in the lamination machine of 390 ℃ of temperature, 20Pa pressure, handled 12 hours, wherein copper foil layer 1 can be that individual layer or the end, face are double-deck; And all directly be connected, thereby strengthened the peel strength of copper foil layer 1 with medium with pure polytetrafluoroethylene film 3.
The substrate that preparation is accomplished has high-k, few, the resistance to chemical attack of dielectric loss factor; Good weatherability; Water imbibition is low, use bandwidth, characteristics such as adhesive force is good, tensile strength is high, long service life, and being difficult to realize dissolving below 300 ℃, has good performance advantage.
Dielectric material influences dielectric property has two: comprise dielectric constant and loss.Its medium dielectric constant microwave medium becomes one of design parameter at the above high frequency of 100MHZ, just different design demand differing dielectric constant values.Higher when frequency, the base material of pcb board significantly increases the loss meeting of signal.Different base materials differs greatly to the loss of signal; For example the base material of traditional P CB can not use in a lot of occasions the loss of signal; Material different has different dielectric properties and physical characteristic, and some materials are dielectric property preferably, and are low like high-frequency loss; But physical characteristic may not meet the requirements, and is poor like cohesive force.And other dielectric material characteristic is bad but have good physical characteristic.If carry out physical mixed by different materials, the uniformity that needs only mixing is much smaller than operation wavelength, and its dielectric property can be between the dielectric property separately of two kinds of (or multiple) materials.And physical characteristic also can direction as requested be improved.
According to the preparation method of ceramic filled polytetrafluoroethylene fibrous glass of the present invention copper-clad plate, the detection of the dielectric constant of ceramic wafer and loss under equal conditions and parameter, its dielectric constant reaches more than 3.0, and loss is less than 1 * 10
-3
Through the strippable substrate intensity detection, shown in the following table of its result, in 25mm length stripping process, it is 23.03N that minimum is peeled off pulling force, and maximum is peeled off pulling force and reached 34.22N, and mean value is far longer than more than the 15N that requires in the standard at 30N.
After carrying out bed course by requirement according to the invention, the detection of the peel strength of the substrate after carrying out laminated bonding under equal conditions and the parameter, its peel strength reaches more than the 25N/C ㎡, has improved 60% than the peel strength of common substrate.Thereby improved the adhesion strength of circuit and medium, prevented the disengaging of circuit and substrate media, guaranteed the stable of high-frequency signal transmission, prolonged the service life of wiring board greatly.
In addition, the substrate that carries out the bed course pressing by requirement according to the invention is because of its peel strength has improved more than 60% than common substrate; Can realize reverse Copper Foil like this; Copper Foil light face contacts with medium, and its adhesion strength still can reach the requirement (peel strength is more than 15 N/C ㎡) of standard code, because of Copper Foil light face contacts with medium; Analyze from microcosmic; Signal can not cause inhomogeneous that signal transmits because of the coarse injustice of copper foil layer 1 in the circuit transport process, thereby improves performance indications such as passive intermodulation.
Claims (3)
1. ceramic filled polytetrafluoroethylene glass fibre copper-clad base plate manufacturing approach is characterized in that its technical process comprises successively:
1) configuration polytetrafluoroethylene liquid;
2) utilize the polytetrafluoroethylene liquid that configures and ceramic powder, coupling agent and dispersant high-speed mixing equipment to carry out stir process formation solvent;
3) glass fabric infiltration in solvent, formation impregnated fabric (2);
4) between copper foil layer (1), lay according to the order of pure polytetrafluoroethylene film (3), impregnated fabric (2), wherein copper foil layer (1) all is connected with pure polytetrafluoroethylene film (3).
2. a kind of ceramic filled polytetrafluoroethylene glass fibre copper-clad base plate manufacturing approach according to claim 1; It is characterized in that: the glass fabric in the said step 3 is handled 30min in the dewaxing machine of 400 ℃ of heating after; In silane coupler surface modification liquid, flood 5～10min, carry out sintering machine baking 30min.
3. a kind of ceramic filled polytetrafluoroethylene glass fibre copper-clad base plate manufacturing approach according to claim 1 is characterized in that: said step 4 is in the lamination machine of 390 ℃ of temperature, 20Pa pressure, to handle 12 hours.
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| CN201210040749XA CN102555349A (en) | 2012-02-22 | 2012-02-22 | Method for manufacturing ceramic filled polytetrafluoroethylene glass fiber copper-clad substrate |
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| CN201210040749XA CN102555349A (en) | 2012-02-22 | 2012-02-22 | Method for manufacturing ceramic filled polytetrafluoroethylene glass fiber copper-clad substrate |
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Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104448826A (en) * | 2014-10-28 | 2015-03-25 | 桐乡市科力复合材料有限公司 | Preparation method of polyphenylene sulfide, polytetrafluoroethylene and glass fiber cloth film-shaped ternary composite material |
| CN105624885A (en) * | 2015-12-25 | 2016-06-01 | 浙江科力新材料科技有限公司 | High-temperature-resistance garment steamer cord fabric prepared from polyphenylene sulfide, polytetrafluoroethylene and glass fibers and preparation method of cord fabric |
| CN105862395A (en) * | 2016-04-28 | 2016-08-17 | 江苏富仕德科技发展有限公司 | High-thermal-conductivity-coefficient glass fiber cloth and manufacturing method thereof |
| CN107746272A (en) * | 2017-08-16 | 2018-03-02 | 电子科技大学 | Microwave-medium ceramics, polytetrafluoroethylene (PTFE) ceramic composite substrate and preparation method |
| CN108226753A (en) * | 2017-12-25 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | Detection method, computer equipment and the storage medium of printed board passive intermodulation |
| CN108449890A (en) * | 2018-03-27 | 2018-08-24 | 广东生益科技股份有限公司 | A kind of production method of the multi-layer PCB containing PTFE |
| CN109648935A (en) * | 2018-12-24 | 2019-04-19 | 嘉兴佳利电子有限公司 | A kind of preparation process of PTFE Ceramic Composite high-frequency copper-clad plate |
| CN109677057A (en) * | 2017-10-18 | 2019-04-26 | 泰州市旺灵绝缘材料厂 | A kind of polytetrafluoroethylglass glass cloth ceramic membrane copper coated foil plate and preparation method thereof |
| CN109677060A (en) * | 2017-10-18 | 2019-04-26 | 泰州市旺灵绝缘材料厂 | A kind of wide-dielectric constant insulating medium layer copper coated foil plate and preparation method thereof |
| CN109760384A (en) * | 2018-12-24 | 2019-05-17 | 嘉兴佳利电子有限公司 | A kind of preparation method of high dielectric constant composite laminate |
| CN110372980A (en) * | 2019-07-15 | 2019-10-25 | 嘉兴佳利电子有限公司 | A kind of low water absorption, high copper foil adhesive force PTFE ceramic composite substrate production method |
| CN110606698A (en) * | 2019-11-01 | 2019-12-24 | 中国电子科技集团公司第四十六研究所 | Microwave composite dielectric substrate with high uniformity and low thermal expansion coefficient and preparation process thereof |
| CN113306227A (en) * | 2021-05-26 | 2021-08-27 | 郴州功田电子陶瓷技术有限公司 | High-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate and preparation method thereof |
| CN114309955A (en) * | 2022-01-13 | 2022-04-12 | 江苏富乐华半导体科技股份有限公司 | Ceramic copper-clad substrate and laser processing technology thereof |
| CN114559724A (en) * | 2022-03-02 | 2022-05-31 | 江苏生益特种材料有限公司 | Ceramic polytetrafluoroethylene high-frequency copper-clad plate and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101295556A (en) * | 2008-06-13 | 2008-10-29 | 顾根山 | Copper foil clad plate of polytetrafluoroethylene glass cloth with wide dielectric constant |
| CN102166852A (en) * | 2010-12-31 | 2011-08-31 | 广东生益科技股份有限公司 | Preparation method of PTFE (polytetrafluoroethylene) copper-clad plate with high elastic modulus |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101295556A (en) * | 2008-06-13 | 2008-10-29 | 顾根山 | Copper foil clad plate of polytetrafluoroethylene glass cloth with wide dielectric constant |
| CN102166852A (en) * | 2010-12-31 | 2011-08-31 | 广东生益科技股份有限公司 | Preparation method of PTFE (polytetrafluoroethylene) copper-clad plate with high elastic modulus |
Cited By (22)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104448826A (en) * | 2014-10-28 | 2015-03-25 | 桐乡市科力复合材料有限公司 | Preparation method of polyphenylene sulfide, polytetrafluoroethylene and glass fiber cloth film-shaped ternary composite material |
| CN105624885A (en) * | 2015-12-25 | 2016-06-01 | 浙江科力新材料科技有限公司 | High-temperature-resistance garment steamer cord fabric prepared from polyphenylene sulfide, polytetrafluoroethylene and glass fibers and preparation method of cord fabric |
| CN105862395A (en) * | 2016-04-28 | 2016-08-17 | 江苏富仕德科技发展有限公司 | High-thermal-conductivity-coefficient glass fiber cloth and manufacturing method thereof |
| CN105862395B (en) * | 2016-04-28 | 2018-01-16 | 江苏富仕德科技发展有限公司 | High thermal conductivity coefficient glass fabric and its manufacture method |
| CN107746272A (en) * | 2017-08-16 | 2018-03-02 | 电子科技大学 | Microwave-medium ceramics, polytetrafluoroethylene (PTFE) ceramic composite substrate and preparation method |
| CN107746272B (en) * | 2017-08-16 | 2020-12-04 | 电子科技大学 | Microwave dielectric ceramic, polytetrafluoroethylene-ceramic composite substrate and preparation method |
| CN109677057A (en) * | 2017-10-18 | 2019-04-26 | 泰州市旺灵绝缘材料厂 | A kind of polytetrafluoroethylglass glass cloth ceramic membrane copper coated foil plate and preparation method thereof |
| CN109677060A (en) * | 2017-10-18 | 2019-04-26 | 泰州市旺灵绝缘材料厂 | A kind of wide-dielectric constant insulating medium layer copper coated foil plate and preparation method thereof |
| CN108226753B (en) * | 2017-12-25 | 2020-08-18 | 广州兴森快捷电路科技有限公司 | Printed board passive intermodulation detection method, computer equipment and storage medium |
| CN108226753A (en) * | 2017-12-25 | 2018-06-29 | 广州兴森快捷电路科技有限公司 | Detection method, computer equipment and the storage medium of printed board passive intermodulation |
| CN108449890A (en) * | 2018-03-27 | 2018-08-24 | 广东生益科技股份有限公司 | A kind of production method of the multi-layer PCB containing PTFE |
| CN109760384A (en) * | 2018-12-24 | 2019-05-17 | 嘉兴佳利电子有限公司 | A kind of preparation method of high dielectric constant composite laminate |
| CN109648935A (en) * | 2018-12-24 | 2019-04-19 | 嘉兴佳利电子有限公司 | A kind of preparation process of PTFE Ceramic Composite high-frequency copper-clad plate |
| CN110372980A (en) * | 2019-07-15 | 2019-10-25 | 嘉兴佳利电子有限公司 | A kind of low water absorption, high copper foil adhesive force PTFE ceramic composite substrate production method |
| CN110372980B (en) * | 2019-07-15 | 2021-10-08 | 嘉兴佳利电子有限公司 | Manufacturing method of PTFE ceramic composite substrate with low water absorption and high copper foil adhesive force |
| CN110606698A (en) * | 2019-11-01 | 2019-12-24 | 中国电子科技集团公司第四十六研究所 | Microwave composite dielectric substrate with high uniformity and low thermal expansion coefficient and preparation process thereof |
| CN110606698B (en) * | 2019-11-01 | 2021-12-31 | 中国电子科技集团公司第四十六研究所 | Microwave composite dielectric substrate with high uniformity and low thermal expansion coefficient and preparation process thereof |
| CN113306227A (en) * | 2021-05-26 | 2021-08-27 | 郴州功田电子陶瓷技术有限公司 | High-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate and preparation method thereof |
| CN113306227B (en) * | 2021-05-26 | 2023-08-15 | 郴州功田电子陶瓷技术有限公司 | High-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate and preparation method thereof |
| CN114309955A (en) * | 2022-01-13 | 2022-04-12 | 江苏富乐华半导体科技股份有限公司 | Ceramic copper-clad substrate and laser processing technology thereof |
| CN114309955B (en) * | 2022-01-13 | 2023-03-14 | 江苏富乐华半导体科技股份有限公司 | Ceramic copper-clad substrate and laser processing technology thereof |
| CN114559724A (en) * | 2022-03-02 | 2022-05-31 | 江苏生益特种材料有限公司 | Ceramic polytetrafluoroethylene high-frequency copper-clad plate and preparation method thereof |
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Application publication date: 20120711 |