CN113306227B - High-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate and preparation method thereof - Google Patents

High-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate and preparation method thereof Download PDF

Info

Publication number
CN113306227B
CN113306227B CN202110579176.7A CN202110579176A CN113306227B CN 113306227 B CN113306227 B CN 113306227B CN 202110579176 A CN202110579176 A CN 202110579176A CN 113306227 B CN113306227 B CN 113306227B
Authority
CN
China
Prior art keywords
temperature
clad plate
sheet
parts
dielectric loss
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN202110579176.7A
Other languages
Chinese (zh)
Other versions
CN113306227A (en
Inventor
陈功田
陈建
李海林
彭灿
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Chenzhou Gongtian Electronic Ceramics Technology Co ltd
Original Assignee
Chenzhou Gongtian Electronic Ceramics Technology Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Chenzhou Gongtian Electronic Ceramics Technology Co ltd filed Critical Chenzhou Gongtian Electronic Ceramics Technology Co ltd
Priority to CN202110579176.7A priority Critical patent/CN113306227B/en
Publication of CN113306227A publication Critical patent/CN113306227A/en
Application granted granted Critical
Publication of CN113306227B publication Critical patent/CN113306227B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/005—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising one layer of ceramic material, e.g. porcelain, ceramic tile
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
    • B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/18—Handling of layers or the laminate
    • B32B38/1858—Handling of layers or the laminate using vacuum
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B9/00—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00
    • B32B9/04—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material
    • B32B9/041—Layered products comprising a layer of a particular substance not covered by groups B32B11/00 - B32B29/00 comprising such particular substance as the main or only constituent of a layer, which is next to another layer of the same or of a different material of metal
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/10—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on aluminium oxide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/14—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on silica
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
    • C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
    • C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
    • C04B35/468—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on barium titanates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/01—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics
    • C04B35/46—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates
    • C04B35/462—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates
    • C04B35/465—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates
    • C04B35/47—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on oxide ceramics based on titanium oxides or titanates based on titanates based on alkaline earth metal titanates based on strontium titanates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/50—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on rare-earth compounds
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/515—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics
    • C04B35/52—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite
    • C04B35/524—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products based on non-oxide ceramics based on carbon, e.g. graphite obtained from polymer precursors, e.g. glass-like carbon material
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B35/00—Shaped ceramic products characterised by their composition; Ceramics compositions; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • C04B35/622—Forming processes; Processing powders of inorganic compounds preparatory to the manufacturing of ceramic products
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B32B2307/204—Di-electric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/712—Weather resistant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/732—Dimensional properties
    • B32B2307/734—Dimensional stability
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3217—Aluminum oxide or oxide forming salts thereof, e.g. bauxite, alpha-alumina
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3224—Rare earth oxide or oxide forming salts thereof, e.g. scandium oxide
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3232—Titanium oxides or titanates, e.g. rutile or anatase
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/32—Metal oxides, mixed metal oxides, or oxide-forming salts thereof, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3231—Refractory metal oxides, their mixed metal oxides, or oxide-forming salts thereof
    • C04B2235/3232—Titanium oxides or titanates, e.g. rutile or anatase
    • C04B2235/3234—Titanates, not containing zirconia
    • C04B2235/3236—Alkaline earth titanates
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/34—Non-metal oxides, non-metal mixed oxides, or salts thereof that form the non-metal oxides upon heating, e.g. carbonates, nitrates, (oxy)hydroxides, chlorides
    • C04B2235/3418—Silicon oxide, silicic acids, or oxide forming salts thereof, e.g. silica sol, fused silica, silica fume, cristobalite, quartz or flint
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/02—Composition of constituents of the starting material or of secondary phases of the final product
    • C04B2235/30—Constituents and secondary phases not being of a fibrous nature
    • C04B2235/48—Organic compounds becoming part of a ceramic after heat treatment, e.g. carbonising phenol resins
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/602—Making the green bodies or pre-forms by moulding
    • C04B2235/6025—Tape casting, e.g. with a doctor blade
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/606—Drying
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/60—Aspects relating to the preparation, properties or mechanical treatment of green bodies or pre-forms
    • C04B2235/612—Machining
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/65—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes
    • C04B2235/656—Aspects relating to heat treatments of ceramic bodies such as green ceramics or pre-sintered ceramics, e.g. burning, sintering or melting processes characterised by specific heating conditions during heat treatment
    • C04B2235/6567—Treatment time
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/95—Products characterised by their size, e.g. microceramics
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C—CHEMISTRY; METALLURGY
    • C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
    • C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
    • C04B2235/00—Aspects relating to ceramic starting mixtures or sintered ceramic products
    • C04B2235/70—Aspects relating to sintered or melt-casted ceramic products
    • C04B2235/96—Properties of ceramic products, e.g. mechanical properties such as strength, toughness, wear resistance
    • C04B2235/9607—Thermal properties, e.g. thermal expansion coefficient
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P20/00—Technologies relating to chemical industry
    • Y02P20/10—Process efficiency

Abstract

The invention discloses a high-frequency ultralow dielectric loss microwave ceramic copper-clad plate and a preparation method thereof, wherein the high-frequency ultralow dielectric loss microwave ceramic copper-clad plate comprises the following components in parts by mass: 30-75 parts of ceramic powder, 25-70 parts of polytetrafluoroethylene dispersion resin powder, 15-25 parts of solvent oil and 5-10 parts of absolute ethyl alcohol; the ceramic powder is filled with polytetrafluoroethylene dispersion resin powder, matched with alkane solvent oil and proper amount of absolute ethyl alcohol, and subjected to the working procedures of proportioning, air flow hot mixing, sheet extrusion, rolling and forming, low-temperature baking, high-temperature vacuum forming and the like to obtain the microwave ceramic copper-clad plate with ultralow dielectric loss, stable and adjustable dielectric constant, excellent dimensional stability and weather resistance and capability of meeting the high-frequency and high-frequency ultralow dielectric loss. The invention has simple process, environmental protection and mass industrialized production, and the product has excellent performance, ultra-low dielectric loss, stable dielectric constant, excellent dimensional stability, weather resistance and the like, and is very suitable for being applied to related equipment such as wireless millimeter wave communication and the like.

Description

High-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate and preparation method thereof
Technical Field
The invention relates to the technical field of copper-clad plates, in particular to a high-frequency ultralow dielectric loss microwave ceramic copper-clad plate and a preparation method thereof.
Background
Under the current situation that the demand for 5G communication materials is increasingly strong, the information electronic products are developed towards high frequency, high speed, high precision and high reliability, and the demands for related equipment such as wireless millimeter wave communication are rapidly increased. The polytetrafluoroethylene copper-clad plate mainly takes emulsion and cut film as main materials, and has better electrical performance than the current main current hydrocarbon copper-clad plate, epoxy resin copper-clad plate, PPO copper-clad plate and the like in China. The raw materials and the manufacturing process are high in cost, so that the application of the copper-clad plate is limited, the dielectric constant adjustable range of the manufactured copper-clad plate is narrow and unstable, the dielectric loss is relatively high, the dimensional stability is low, and the weather resistance and the reliability are low. Therefore, a new scheme is needed to be provided for improving the existing copper-clad plate.
Disclosure of Invention
In view of the above, the main purpose of the present invention is to provide a high-frequency ultralow dielectric loss microwave ceramic copper-clad plate and a preparation method thereof, which can effectively solve the problems of high production cost, narrow adjustable range of dielectric constant, instability, relatively high dielectric loss, low dimensional stability, low weather resistance and low reliability of the existing copper-clad plate.
In order to achieve the above purpose, the present invention adopts the following technical scheme:
the preparation method of the high-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate comprises the following components in parts by mass: 30-75 parts of ceramic powder, 25-70 parts of polytetrafluoroethylene dispersion resin powder, 15-25 parts of solvent oil and 5-10 parts of absolute ethyl alcohol; the method comprises the following steps:
(1) And (3) batching: sieving polytetrafluoroethylene dispersion resin powder and ceramic powder respectively, and mixing according to the proportion to obtain a primary mixed material;
(2) And (3) hot mixing of air flow: pouring the primary mixed material obtained in the step (1) into an airflow mixer, adding solvent oil and absolute ethyl alcohol into an oil injection bottle according to the proportion, and circularly mixing for 4 hours at the temperature of 45-65 ℃ to obtain a uniform mixed material, wherein the circulating hot airflow in a sealed cavity is 5-25 kg/time;
(3) Sheet extrusion: sieving the uniformly mixed material obtained in the step (2), pouring the sieved uniformly mixed material into a prepressing forming machine to be prepressed into a cylinder, placing the cylinder in an extruder, extruding a windable film with the width of 10-30cm and the thickness of 1-5mm through a heating cavity and a sheet-shaped basic die opening, wherein the temperature of the heating cavity is 30-50 ℃, and the temperature of the sheet-shaped extrusion die opening is 50-60 ℃;
(4) Rolling and forming into a sheet: rolling the windable film obtained in the step (3) into a sheet for one or more times by an open mill to obtain an adhesive sheet with the width of 45-55cm and the thickness of 0.038-0.75mm, wherein the temperature of the open mill is 60 ℃;
(5) Baking at low temperature: baking the bonding sheet obtained in the step (4) through a degreasing drying oven to remove solvent oil and absolute ethyl alcohol to obtain a baked bonding sheet, wherein the baking temperature is 160-240 ℃/10min/m;
(6) High-temperature vacuum forming: cutting the baked bonding sheet obtained in the step (5), carrying out lamination and double-sided copper coating according to the difference of the thickness of the manufactured copper-clad plate, carrying out hot press molding by an oil pressure vacuum high-temperature press, and completing the preparation under the conditions that the vacuum condition is 90-100Kpa, the material temperature is 380-405 ℃, the pressure is 5-15MPa, and the dwell time is 1 h.
As a preferable scheme, the ceramic powder has a spherical structure, a spherical aggregate structure or a hollow sphere structure, the sphericity of the ceramic powder is more than or equal to 90 percent, and the particle size is 0.5-40 mu m.
As a preferable scheme, the ceramic powder is one or a mixture of more than one of titanium dioxide, silicon dioxide, barium titanate, strontium titanate, aluminum oxide and rare earth.
As a preferable scheme, the solvent oil is one or a mixture of a plurality of odorless kerosene, white oil and isoparaffin.
As a preferable scheme, the temperature of the material in the step (6) is 400 ℃.
As a preferable mode, the extrusion opening of the sheet-shaped extrusion die of the step (3) is 20cm wide.
As a preferable scheme, the open mill in the step (4) is a multi-roll open mill.
The high-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate is prepared by the preparation method of the high-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate.
Compared with the prior art, the invention has obvious advantages and beneficial effects, and in particular, the technical scheme can be as follows:
the ceramic powder is filled with polytetrafluoroethylene dispersion resin powder, matched with alkane solvent oil and proper amount of absolute ethyl alcohol, and subjected to the working procedures of proportioning, air flow hot mixing, sheet extrusion, rolling and sheet forming, low-temperature baking, high-temperature vacuum forming and the like to obtain the microwave ceramic copper-clad plate with ultralow dielectric loss, stable and adjustable dielectric constant, excellent dimensional stability and weather resistance and capability of meeting the high-frequency and high-frequency ultralow dielectric loss; in addition, the invention has simple process, environmental protection and mass industrialized production, and the product has excellent performance, ultra-low dielectric loss, stable dielectric constant, excellent dimensional stability, weather resistance and the like, and is very suitable for being applied to related equipment such as wireless millimeter wave communication and the like.
Drawings
FIG. 1 is a graph showing the dielectric constant 3.0 versus frequency for the preferred embodiment 2 of the present invention;
FIG. 2 is a graph showing the dielectric constant 3.0 versus temperature for the preferred embodiment 2 of the present invention.
Detailed Description
The invention discloses a preparation method of a high-frequency ultralow dielectric loss microwave ceramic copper-clad plate, which comprises the following components in parts by mass: 30-75 parts of ceramic powder, 25-70 parts of polytetrafluoroethylene dispersion resin powder, 15-25 parts of solvent oil and 5-10 parts of absolute ethyl alcohol; the method comprises the following steps:
(1) And (3) batching: and respectively sieving polytetrafluoroethylene dispersion resin powder and ceramic powder, and mixing according to the proportion to obtain a primary mixed material.
(2) And (3) hot mixing of air flow: pouring the primary mixed material obtained in the step (1) into an airflow mixer, adding solvent oil and absolute ethyl alcohol into an oil injection bottle according to the proportion, and circularly mixing for 4 hours at the temperature of 45-65 ℃ to obtain a uniform mixed material, wherein the circulating hot airflow in a sealed cavity is 5-25 kg/time; the oil spraying bottle has the function of controlling the oil filling precision and spraying, so that the mixing is more uniform; the spray is regularly and quantitatively sprayed under circulating hot air, the purpose of the hot air is to prepare the preparation for the next step of fully lubricating and uniformly mixing solvent oil, polytetrafluoroethylene dispersion resin powder and ceramic powder molecules, and meanwhile, the mixing and curing time is shortened due to the addition of absolute ethyl alcohol, so that the obtained uniformly mixed material is more uniform and more sufficient.
(3) Sheet extrusion: sieving the uniformly mixed material obtained in the step (2), pouring the sieved uniformly mixed material into a prepressing forming machine to be prepressed into a cylinder, placing the cylinder in an extruder, extruding a windable film with the width of 10-30cm and the thickness of 1-5mm through a heating cavity and a sheet-shaped basic die opening, wherein the temperature of the heating cavity is 30-50 ℃, and the temperature of the sheet-shaped extrusion die opening is 50-60 ℃.
(4) Rolling and forming into a sheet: rolling the windable film obtained in the step (3) into a sheet for one or more times by an open mill to obtain an adhesive sheet with the width of 45-55cm and the thickness of 0.038-0.75mm, wherein the temperature of the open mill is 60 ℃; in the industry, the maximum width of the high-performance film material is 30cm by using pure polytetrafluoroethylene extrusion calendaring, the calendaring width is limited by circular extrusion into a bar shape, and the bottleneck of the ceramic filled polytetrafluoroethylene copper-clad plate by using extrusion calendaring is wide-width improvement and how ceramic powder is completely mixed, uniformly dispersed and extruded; the purpose of the broad width promotion is to match the subsequent circuit board processing plant process, and the small size caused by the too small width will increase the mass production and subsequent processing cost.
(5) Baking at low temperature: baking the bonding sheet obtained in the step (4) through a degreasing drying oven to remove solvent oil and absolute ethyl alcohol to obtain a baked bonding sheet, wherein the baking temperature is 160-240 ℃/10min/m; according to the dielectric constants of the copper-clad plates, the bonding sheets are required to be longitudinally pulled up for shaping in the baking process, the speed is not too high, the film is too dry due to the too high temperature, so that the defect of holes is formed after the lamination is carried out, the solvent oil is not completely volatilized due to the too low temperature, and lamination bubbles or the situation that dielectric loss is increased and peeled off is caused.
(6) High-temperature vacuum forming: cutting the baked bonding sheet obtained in the step (5), carrying out lamination and double-sided copper coating according to the difference of the thickness of the manufactured copper-clad plate, carrying out hot press molding by an oil pressure vacuum high-temperature press, and completing the preparation under the conditions that the material temperature is 380-405 ℃, the pressure is 5-15MPa and the dwell time is 1 h; typically 18um electrolytic copper foil is selected.
The ceramic powder has a spherical structure, a spherical aggregate structure or a hollow sphere structure, the sphericity of the ceramic powder is more than or equal to 90 percent, and the particle size is 0.5-40 mu m; the spherical filler can provide higher filling proportion and excellent dimensional stability, the highest 80% filler ratio of the polytetrafluoroethylene dispersion resin powder with high density and high tensile strength is matched, and the filler ratio and electrical performance are further improved by using different filler compound particle sizes; taking the distribution of 10 μm as an example, the typical compounding is 4:2:3:1, namely the particle size below 10 μm accounts for 40%, the particle size of 10-20 μm accounts for 20%, the particle size of 20-30 μm accounts for 30%, and the particle size of 30-40 μm accounts for 10%. Polytetrafluoroethylene dispersion resin powder with different densities and tensile strengths is selected according to different dielectric constants. A typical relative density is 2.2g/cm and the pull-up strength is 24MPa.
The ceramic powder is one or a mixture of more of titanium dioxide, silicon dioxide, barium titanate, strontium titanate, aluminum oxide and rare earth.
The solvent oil is one or more of odorless kerosene, white oil and isoparaffin.
The temperature of the material in the step (6) is 400 ℃, the temperature of the oil pressure vacuum press with the temperature of 400 ℃ is more uniform than the temperature of the hot plate of the electric heating press, the performance of the plate is more stable to a certain extent, and the mass production is easier to control.
And (3) the extrusion opening of the sheet extrusion die in the step (3) is 20cm wide.
The open mill in the step (4) is a multi-roller open mill, which is beneficial to wide-width lifting.
The invention also discloses a high-frequency ultralow dielectric loss microwave ceramic copper-clad plate which is prepared by the preparation method of the high-frequency ultralow dielectric loss microwave ceramic copper-clad plate.
The invention is described in further detail below in a number of examples:
example 1:
(1) And (3) batching: 50 parts of polytetrafluoroethylene dispersion resin powder and 30 parts of ceramic powder are respectively sieved and mixed according to the proportion to obtain a primary mixed material.
(2) And (3) hot mixing of air flow: pouring the primary mixed material obtained in the step (1) into an airflow mixer, adding 22 parts of odorless kerosene and 5 parts of absolute ethyl alcohol into an oil injection bottle according to the proportion, and circularly mixing for 4 hours at the temperature of 45 ℃ to obtain a uniform mixed material, wherein the circulating hot airflow in a sealed cavity is 15 kg/time.
(3) Sheet extrusion: sieving the uniformly mixed material obtained in the step (2), pouring the sieved uniformly mixed material into a prepressing forming machine to be prepressed into a cylinder, placing the cylinder in an extruder, extruding a windable film with the width of 10-30cm and the thickness of 1-5mm through a heating cavity and a sheet-shaped basic die opening, wherein the temperature of the heating cavity is 40 ℃, and the temperature of the sheet-shaped extrusion die opening is 56 ℃.
(4) Rolling and forming into a sheet: and (3) carrying out one or more times of die rolling and sheeting on the windable film obtained in the step (3) through a multi-roll mill to obtain the adhesive sheet with the width of 45-55cm and the thickness of 0.038-0.75mm, wherein the temperature of the multi-roll mill is 60 ℃.
(5) Baking at low temperature: and (3) baking the bonding sheet obtained in the step (4) through a degreasing drying oven to remove odorless kerosene and absolute ethyl alcohol, so as to obtain a baked bonding sheet, wherein the baking temperature is 240 ℃/10min/m.
(6) High-temperature vacuum forming: and (3) cutting the baked bonding sheet obtained in the step (5), laminating and double-sided copper coating according to the thickness difference of the manufactured copper-clad plate, performing hot press forming through an oil pressure vacuum high-temperature press, wherein the vacuum condition is 90Kpa, and the baking bonding sheet is manufactured at the material temperature of 405 ℃, the pressure of 10MPa and the dwell time of 1 h.
Example 2:
(1) And (3) batching: sieving 25 parts of polytetrafluoroethylene dispersion resin powder and 50 parts of ceramic powder respectively, and mixing according to the proportion to obtain a primary mixed material.
(2) And (3) hot mixing of air flow: pouring the primary mixed material obtained in the step (1) into an airflow mixer, adding 15 parts of odorless kerosene and 8 parts of absolute ethyl alcohol into an oil injection bottle according to the proportion, and circularly mixing for 4 hours at the temperature of 55 ℃ to obtain a uniform mixed material, wherein the circulation hot airflow in a sealed cavity is 25 kg/time.
(3) Sheet extrusion: sieving the uniformly mixed material obtained in the step (2), pouring the sieved uniformly mixed material into a prepressing forming machine to be prepressed into a cylinder, placing the cylinder in an extruder, extruding a windable film with the width of 10-30cm and the thickness of 1-5mm through a heating cavity and a sheet-shaped basic die opening, wherein the temperature of the heating cavity is 45 ℃, and the temperature of the sheet-shaped extrusion die opening is 50 ℃.
(4) Rolling and forming into a sheet: and (3) carrying out one or more times of die rolling and sheeting on the windable film obtained in the step (3) through a multi-roll mill to obtain the adhesive sheet with the width of 45-55cm and the thickness of 0.038-0.75mm, wherein the temperature of the multi-roll mill is 60 ℃.
(5) Baking at low temperature: and (3) baking the bonding sheet obtained in the step (4) through a degreasing drying oven to remove odorless kerosene and absolute ethyl alcohol, so as to obtain a baked bonding sheet, wherein the baking temperature is 200 ℃/10min/m.
(6) High-temperature vacuum forming: and (3) cutting the baked bonding sheet obtained in the step (5), laminating and double-sided copper coating according to the thickness difference of the manufactured copper-clad plate, and performing hot press molding by an oil pressure vacuum high-temperature press under the vacuum condition of 100Kpa, wherein the material temperature is 400 ℃, the pressure is 15MPa, and the dwell time is 1 h.
Example 3:
(1) And (3) batching: 68 parts of polytetrafluoroethylene dispersion resin powder and 75 parts of ceramic powder are respectively sieved and mixed according to the proportion to obtain a primary mixed material.
(2) And (3) hot mixing of air flow: pouring the primary mixed material obtained in the step (1) into an airflow mixer, adding 25 parts of odorless kerosene and 8 parts of absolute ethyl alcohol into an oil injection bottle according to the proportion, and circularly mixing for 4 hours at the temperature of 65 ℃ to obtain a uniform mixed material, wherein the circulating hot airflow in a sealed cavity is 20 kg/time.
(3) Sheet extrusion: sieving the uniformly mixed material obtained in the step (2), pouring the sieved uniformly mixed material into a prepressing forming machine to be prepressed into a cylinder, placing the cylinder in an extruder, extruding a windable film with the width of 10-30cm and the thickness of 1-5mm through a heating cavity and a sheet-shaped basic die opening, wherein the temperature of the heating cavity is 30 ℃, and the temperature of the sheet-shaped extrusion die opening is 52 ℃.
(4) Rolling and forming into a sheet: and (3) carrying out one or more times of die rolling and sheeting on the windable film obtained in the step (3) through a multi-roll mill to obtain the adhesive sheet with the width of 45-55cm and the thickness of 0.038-0.75mm, wherein the temperature of the multi-roll mill is 60 ℃.
(5) Baking at low temperature: and (3) baking the bonding sheet obtained in the step (4) through a degreasing drying oven to remove odorless kerosene and absolute ethyl alcohol, so as to obtain a baked bonding sheet, wherein the baking temperature is 160 ℃/10min/m.
(6) High-temperature vacuum forming: and (3) cutting the baked bonding sheet obtained in the step (5), laminating and double-sided copper coating according to the thickness difference of the manufactured copper-clad plate, performing hot press forming through an oil pressure vacuum high-temperature press, wherein the vacuum condition is 97Kpa, and the baking bonding sheet is manufactured at the material temperature of 380 ℃, the pressure of 12MPa and the dwell time of 1 h.
Example 4:
(1) And (3) batching: after 70 parts of polytetrafluoroethylene dispersion resin powder and 68 parts of ceramic powder are respectively sieved, the mixture is mixed according to the proportion to obtain a primary mixed material.
(2) And (3) hot mixing of air flow: pouring the primary mixed material obtained in the step (1) into an airflow mixer, adding 22 parts of odorless kerosene and 10 parts of absolute ethyl alcohol into an oil injection bottle according to the proportion, and circularly mixing for 4 hours at the temperature of 45 ℃ to obtain a uniform mixed material, wherein the circulating hot airflow in a sealed cavity is 5 kg/time.
(3) Sheet extrusion: sieving the uniformly mixed material obtained in the step (2), pouring the sieved uniformly mixed material into a prepressing forming machine to be prepressed into a cylinder, placing the cylinder in an extruder, extruding a windable film with the width of 10-30cm and the thickness of 1-5mm through a heating cavity and a sheet-shaped basic die opening, wherein the temperature of the heating cavity is 47 ℃, and the temperature of the sheet-shaped extrusion die opening is 60 ℃.
(4) Rolling and forming into a sheet: and (3) carrying out one or more times of die rolling and sheeting on the windable film obtained in the step (3) through a multi-roll mill to obtain the adhesive sheet with the width of 45-55cm and the thickness of 0.038-0.75mm, wherein the temperature of the multi-roll mill is 60 ℃.
(5) Baking at low temperature: and (3) baking the bonding sheet obtained in the step (4) through a degreasing drying oven to remove odorless kerosene and absolute ethyl alcohol, so as to obtain a baked bonding sheet, wherein the baking temperature is 200 ℃/10min/m.
(6) High-temperature vacuum forming: and (3) cutting the baked bonding sheet obtained in the step (5), carrying out lamination and double-sided copper coating according to the thickness difference of the manufactured copper-clad plate, carrying out hot press molding by an oil pressure vacuum high-temperature press, and completing the preparation at the material temperature of 390 ℃ under the pressure of 5MPa for 1h under the vacuum condition of 100 Kpa.
Example 5:
(1) And (3) batching: sieving 40 parts of polytetrafluoroethylene dispersion resin powder and 50 parts of ceramic powder respectively, and mixing according to the proportion to obtain a primary mixed material.
(2) And (3) hot mixing of air flow: pouring the primary mixed material obtained in the step (1) into an airflow mixer, adding 18 parts of white oil and 6 parts of absolute ethyl alcohol into an oil injection bottle according to the proportion, and circularly mixing for 4 hours at the temperature of 55 ℃ to obtain a uniform mixed material, wherein the circulating hot airflow in a sealed cavity is 18 kg/time.
(3) Sheet extrusion: sieving the uniformly mixed material obtained in the step (2), pouring the sieved uniformly mixed material into a prepressing forming machine to be prepressed into a cylinder, placing the cylinder in an extruder, extruding a windable film with the width of 10-30cm and the thickness of 1-5mm through a heating cavity and a sheet-shaped basic die opening, wherein the temperature of the heating cavity is 50 ℃, and the temperature of the sheet-shaped extrusion die opening is 52 ℃.
(4) Rolling and forming into a sheet: and (3) carrying out one or more times of die rolling and sheeting on the windable film obtained in the step (3) through a multi-roll mill to obtain the adhesive sheet with the width of 45-55cm and the thickness of 0.038-0.75mm, wherein the temperature of the multi-roll mill is 60 ℃.
(5) Baking at low temperature: and (3) baking the bonding sheet obtained in the step (4) through a degreasing drying oven to remove white oil and absolute ethyl alcohol, so as to obtain a baked bonding sheet, wherein the baking temperature is 180 ℃/10min/m.
(6) High-temperature vacuum forming: and (3) cutting the baked bonding sheet obtained in the step (5), laminating and double-sided copper coating according to the thickness difference of the manufactured copper-clad plate, performing hot press forming through an oil pressure vacuum high-temperature press, and completing the preparation at the material temperature of 388 ℃, the pressure of 6MPa and the pressure maintaining time of 1h under the vacuum condition of 93 Kpa.
Example 6:
(1) And (3) batching: 46 parts of polytetrafluoroethylene dispersion resin powder and 53 parts of ceramic powder are respectively sieved and mixed according to the proportion to obtain a primary mixed material.
(2) And (3) hot mixing of air flow: pouring the primary mixed material obtained in the step (1) into an airflow mixer, adding 16 parts of white oil and 5 parts of absolute ethyl alcohol into an oil injection bottle according to the proportion, and circularly mixing for 4 hours at the temperature of 55 ℃ to obtain a uniform mixed material, wherein the circulation hot airflow in a sealed cavity is 16 kg/time.
(3) Sheet extrusion: sieving the uniformly mixed material obtained in the step (2), pouring the sieved uniformly mixed material into a prepressing forming machine to be prepressed into a cylinder, placing the cylinder in an extruder, extruding a windable film with the width of 10-30cm and the thickness of 1-5mm through a heating cavity and a sheet-shaped basic die opening, wherein the temperature of the heating cavity is 45 ℃, and the temperature of the sheet-shaped extrusion die opening is 56 ℃.
(4) Rolling and forming into a sheet: and (3) carrying out one or more times of die rolling and sheeting on the windable film obtained in the step (3) through a multi-roll mill to obtain the adhesive sheet with the width of 45-55cm and the thickness of 0.038-0.75mm, wherein the temperature of the multi-roll mill is 60 ℃.
(5) Baking at low temperature: and (3) baking the bonding sheet obtained in the step (4) through a degreasing drying oven to remove white oil and absolute ethyl alcohol, so as to obtain a baked bonding sheet, wherein the baking temperature is 186 ℃/10min/m.
(6) High-temperature vacuum forming: and (3) cutting the baked bonding sheet obtained in the step (5), laminating and double-sided copper coating according to the thickness difference of the manufactured copper-clad plate, performing hot press forming through an oil pressure vacuum high-temperature press, wherein the vacuum condition is 93Kpa, and the baking bonding sheet is manufactured at the temperature of 386 ℃, the pressure of 7MPa and the dwell time of 1 h.
Example 7:
(1) And (3) batching: after 48 parts of polytetrafluoroethylene dispersion resin powder and 69 parts of ceramic powder are respectively sieved, the mixture is mixed according to the proportion to obtain a primary mixed material.
(2) And (3) hot mixing of air flow: pouring the primary mixed material obtained in the step (1) into an airflow mixer, adding 23 parts of isoparaffin and 8 parts of absolute ethyl alcohol into an oil injection bottle according to the proportion, and circularly mixing for 4 hours at the temperature of 58 ℃ to obtain a uniform mixed material, wherein the circulating hot airflow in a sealed cavity is 23 kg/time.
(3) Sheet extrusion: sieving the uniformly mixed material obtained in the step (2), pouring the sieved uniformly mixed material into a prepressing forming machine to be prepressed into a cylinder, placing the cylinder in an extruder, extruding a windable film with the width of 10-30cm and the thickness of 1-5mm through a heating cavity and a sheet-shaped basic die opening, wherein the temperature of the heating cavity is 43 ℃, and the temperature of the sheet-shaped extrusion die opening is 54 ℃.
(4) Rolling and forming into a sheet: and (3) carrying out one or more times of die rolling and sheeting on the windable film obtained in the step (3) through a multi-roll mill to obtain the adhesive sheet with the width of 45-55cm and the thickness of 0.038-0.75mm, wherein the temperature of the multi-roll mill is 60 ℃.
(5) Baking at low temperature: and (3) baking the bonding sheet obtained in the step (4) through a degreasing drying oven to remove isoparaffin and absolute ethyl alcohol, so as to obtain a baked bonding sheet, wherein the baking temperature is 198 ℃/10min/m.
(6) High-temperature vacuum forming: and (3) cutting the baked bonding sheet obtained in the step (5), carrying out lamination and double-sided copper coating according to the thickness difference of the manufactured copper-clad plate, carrying out hot press molding by an oil pressure vacuum high-temperature press, and completing the preparation at the material temperature of 396 ℃ under the pressure of 6MPa for 1 h.
Example 8:
(1) And (3) batching: sieving 30 parts of polytetrafluoroethylene dispersion resin powder and 50 parts of ceramic powder respectively, and mixing according to the proportion to obtain a primary mixed material.
(2) And (3) hot mixing of air flow: pouring the primary mixed material obtained in the step (1) into an airflow mixer, adding 15 parts of isoparaffin and 9 parts of absolute ethyl alcohol into an oil injection bottle according to the proportion, and circularly mixing for 4 hours at the temperature of 50 ℃ to obtain a uniform mixed material, wherein the circulating hot airflow in a sealed cavity is 16 kg/time.
(3) Sheet extrusion: sieving the uniformly mixed material obtained in the step (2), pouring the sieved uniformly mixed material into a prepressing forming machine to be prepressed into a cylinder, placing the cylinder in an extruder, extruding a windable film with the width of 10-30cm and the thickness of 1-5mm through a heating cavity and a sheet-shaped basic die opening, wherein the temperature of the heating cavity is 40 ℃, and the temperature of the sheet-shaped extrusion die opening is 58 ℃.
(4) Rolling and forming into a sheet: and (3) carrying out one or more times of die rolling and sheeting on the windable film obtained in the step (3) through a multi-roll mill to obtain the adhesive sheet with the width of 45-55cm and the thickness of 0.038-0.75mm, wherein the temperature of the multi-roll mill is 60 ℃.
(5) Baking at low temperature: and (3) baking the bonding sheet obtained in the step (4) through a degreasing drying oven to remove isoparaffin and absolute ethyl alcohol, so as to obtain a baked bonding sheet, wherein the baking temperature is 235 ℃/10min/m.
(6) High-temperature vacuum forming: and (3) cutting the baked bonding sheet obtained in the step (5), carrying out lamination and double-sided copper coating according to the thickness difference of the manufactured copper-clad plate, carrying out hot press molding by an oil pressure vacuum high-temperature press, and completing the preparation at the material temperature of 398 ℃ under the pressure of 6MPa for 1h under the vacuum condition.
Example 9:
(1) And (3) batching: sieving 65 parts of polytetrafluoroethylene dispersion resin powder and 50 parts of ceramic powder respectively, and mixing according to the proportion to obtain a primary mixed material.
(2) And (3) hot mixing of air flow: pouring the primary mixed material obtained in the step (1) into an airflow mixer, adding 16 parts of isoparaffin and 6 parts of absolute ethyl alcohol into an oil injection bottle according to the proportion, and circularly mixing for 4 hours at the temperature of 55 ℃ to obtain a uniform mixed material, wherein the circulating hot airflow in a sealed cavity is 20 kg/time.
(3) Sheet extrusion: sieving the uniformly mixed material obtained in the step (2), pouring the sieved uniformly mixed material into a prepressing forming machine to be prepressed into a cylinder, placing the cylinder in an extruder, extruding a windable film with the width of 10-30cm and the thickness of 1-5mm through a heating cavity and a sheet-shaped basic die opening, wherein the temperature of the heating cavity is 50 ℃, and the temperature of the sheet-shaped extrusion die opening is 55 ℃.
(4) Rolling and forming into a sheet: and (3) carrying out one or more times of die rolling and sheeting on the windable film obtained in the step (3) through a multi-roll mill to obtain the adhesive sheet with the width of 45-55cm and the thickness of 0.038-0.75mm, wherein the temperature of the multi-roll mill is 60 ℃.
(5) Baking at low temperature: and (3) baking the bonding sheet obtained in the step (4) through a degreasing drying oven to remove isoparaffin and absolute ethyl alcohol, so as to obtain a baked bonding sheet, wherein the baking temperature is 180 ℃/10min/m.
(6) High-temperature vacuum forming: and (3) cutting the baked bonding sheet obtained in the step (5), laminating and double-sided copper coating according to the thickness difference of the manufactured copper-clad plate, performing hot press forming through an oil pressure vacuum high-temperature press, wherein the vacuum condition is 93Kpa, and the baking bonding sheet is manufactured at the material temperature of 400 ℃, the pressure of 10MPa and the dwell time of 1 h.
The samples obtained in the above examples were subjected to performance tests, and the test results are shown in table 1.
TABLE 1
The testing method comprises the following steps:
1. the thickness was measured using a thickness detector.
2. The peel strength was measured according to the method prescribed in IPC-TM-650 by 2.4.8.
3. Copper-containing tin bleaches were measured as specified by method 2.6.8 in IPC-TM-650.
4. Dielectric constants were measured at 1GHz and 10GHz by using SPDR (splite post dielectric resonator) method.
5. Dielectric loss was measured at 10GHz by SPDR (splite post dielectric resonator) method.
6. The coefficient of thermal expansion was measured using the method specified in IPC-TM-650 as 2.4.41.
At present, the main flow of the market requires a board to be DK3.0, and the lowest loss of the board is 0.00035 corresponding to DK3.0-0.254mm, so that the test of dielectric constant stability is carried out on the sample obtained in the embodiment 2, the test results are shown in fig. 1 and 2, the stability of the dielectric constant of the board under different frequencies is proved in fig. 1, the inherent stability of the board in the frequency is illustrated, and convenience is provided for circuit design; fig. 2 demonstrates the stability of the dielectric constant of the sheet material at different temperatures, demonstrating that the material maintains stable dielectric constant characteristics over a wide range of temperature variations. The curves of fig. 1 and 2 were both obtained by the stripline test.
According to the results, the copper-clad plate manufactured by the method has high heat resistance, ultralow dielectric loss, stable and adjustable dielectric constant, excellent dimensional stability, weather resistance and the like, and can meet different high requirements of a high-frequency transmission system on a printed circuit board.
The foregoing description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so any minor modifications, equivalent changes and modifications made to the above embodiments according to the technical principles of the present invention are still within the scope of the technical solutions of the present invention.

Claims (8)

1. The preparation method of the high-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate is characterized by comprising the following components in parts by mass: 30-75 parts of ceramic powder, 25-70 parts of polytetrafluoroethylene dispersion resin powder, 15-25 parts of solvent oil and 5-10 parts of absolute ethyl alcohol; the method comprises the following steps:
(1) And (3) batching: sieving polytetrafluoroethylene dispersion resin powder and ceramic powder respectively, and mixing according to the proportion to obtain a primary mixed material;
(2) And (3) hot mixing of air flow: pouring the primary mixed material obtained in the step (1) into an airflow mixer, adding solvent oil and absolute ethyl alcohol into an oil injection bottle according to the proportion, and circularly mixing for 4 hours at the temperature of 45-65 ℃ to obtain a uniform mixed material, wherein the circulating hot airflow in a sealed cavity is 5-25 kg/time;
(3) Sheet extrusion: sieving the uniformly mixed material obtained in the step (2), pouring the sieved uniformly mixed material into a prepressing forming machine to be prepressed into a cylinder, placing the cylinder in an extruder, extruding a windable film with the width of 10-30cm and the thickness of 1-5mm through a heating cavity and a sheet-shaped basic die opening, wherein the temperature of the heating cavity is 30-50 ℃, and the temperature of the sheet-shaped extrusion die opening is 50-60 ℃;
(4) Rolling and forming into a sheet: rolling the windable film obtained in the step (3) into a sheet for one or more times by an open mill to obtain an adhesive sheet with the width of 45-55cm and the thickness of 0.038-0.75mm, wherein the temperature of the open mill is 60 ℃;
(5) Baking at low temperature: baking the bonding sheet obtained in the step (4) through a degreasing drying oven to remove solvent oil and absolute ethyl alcohol to obtain a baked bonding sheet, wherein the baking temperature is 160-240 ℃/10min/m;
(6) High-temperature vacuum forming: cutting the baked bonding sheet obtained in the step (5), carrying out lamination and double-sided copper coating according to the difference of the thickness of the manufactured copper-clad plate, carrying out hot press molding by an oil pressure vacuum high-temperature press, and completing the preparation under the conditions that the vacuum condition is 90-100Kpa, the material temperature is 380-405 ℃, the pressure is 5-15MPa, and the dwell time is 1 h.
2. The method for preparing the high-frequency ultralow dielectric loss microwave ceramic copper-clad plate according to claim 1, which is characterized by comprising the following steps: the ceramic powder has a spherical structure, a spherical aggregate structure or a hollow sphere structure, the sphericity of the ceramic powder is more than or equal to 90 percent, and the particle size is 0.5-40 mu m.
3. The method for preparing the high-frequency ultralow dielectric loss microwave ceramic copper-clad plate according to claim 1, which is characterized by comprising the following steps: the ceramic powder is one or a mixture of more of titanium dioxide, silicon dioxide, barium titanate, strontium titanate, aluminum oxide and rare earth.
4. The method for preparing the high-frequency ultralow dielectric loss microwave ceramic copper-clad plate according to claim 1, which is characterized by comprising the following steps: the solvent oil is one or more of odorless kerosene, white oil and isoparaffin.
5. The method for preparing the high-frequency ultralow dielectric loss microwave ceramic copper-clad plate according to claim 1, which is characterized by comprising the following steps: the temperature of the material in the step (6) is 400 ℃.
6. The method for preparing the high-frequency ultralow dielectric loss microwave ceramic copper-clad plate according to claim 1, which is characterized by comprising the following steps: and (3) the extrusion opening of the sheet extrusion die in the step (3) is 20cm wide.
7. The method for preparing the high-frequency ultralow dielectric loss microwave ceramic copper-clad plate according to claim 1, which is characterized by comprising the following steps: the open mill in the step (4) is a multi-roller open mill.
8. A high-frequency ultralow dielectric loss microwave ceramic copper-clad plate is characterized in that: prepared by the preparation method of the high-frequency ultralow dielectric loss microwave ceramic copper-clad plate according to any one of claims 1 to 7.
CN202110579176.7A 2021-05-26 2021-05-26 High-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate and preparation method thereof Active CN113306227B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202110579176.7A CN113306227B (en) 2021-05-26 2021-05-26 High-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202110579176.7A CN113306227B (en) 2021-05-26 2021-05-26 High-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate and preparation method thereof

Publications (2)

Publication Number Publication Date
CN113306227A CN113306227A (en) 2021-08-27
CN113306227B true CN113306227B (en) 2023-08-15

Family

ID=77375127

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202110579176.7A Active CN113306227B (en) 2021-05-26 2021-05-26 High-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate and preparation method thereof

Country Status (1)

Country Link
CN (1) CN113306227B (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN114509474A (en) * 2022-01-28 2022-05-17 山东国瓷功能材料股份有限公司 Detection method for dielectric property of ceramic powder and application thereof
CN114889273B (en) * 2022-03-23 2023-05-26 电子科技大学 Glass fiber-free ceramic/hydrocarbon resin-based microwave dielectric substrate and preparation method thereof

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102555349A (en) * 2012-02-22 2012-07-11 珠海国能复合材料科技有限公司 Method for manufacturing ceramic filled polytetrafluoroethylene glass fiber copper-clad substrate
CN104647868A (en) * 2015-02-10 2015-05-27 郴州功田电子陶瓷技术有限公司 Manufacturing method for polytetrafluoroethylene copper-clad plate
CN107474312A (en) * 2017-06-12 2017-12-15 电子科技大学 The preparation method of ceramic filled polytetrafluoroethylglass microwave composite medium substrate
WO2020114419A1 (en) * 2018-12-04 2020-06-11 大金氟化工（中国）有限公司 Preparation method for polytetrafluoroethylene composition, polytetrafluoroethylene composition, forming product, conductive pipe, heat conduction film, and substrate ccl

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9455064B2 (en) * 2012-12-12 2016-09-27 Centre for Materials for Electronics Technology (C-MET) Ceramic filled fluoropolymer compositions, methods and applications thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102555349A (en) * 2012-02-22 2012-07-11 珠海国能复合材料科技有限公司 Method for manufacturing ceramic filled polytetrafluoroethylene glass fiber copper-clad substrate
CN104647868A (en) * 2015-02-10 2015-05-27 郴州功田电子陶瓷技术有限公司 Manufacturing method for polytetrafluoroethylene copper-clad plate
CN107474312A (en) * 2017-06-12 2017-12-15 电子科技大学 The preparation method of ceramic filled polytetrafluoroethylglass microwave composite medium substrate
WO2020114419A1 (en) * 2018-12-04 2020-06-11 大金氟化工（中国）有限公司 Preparation method for polytetrafluoroethylene composition, polytetrafluoroethylene composition, forming product, conductive pipe, heat conduction film, and substrate ccl

Also Published As

Publication number Publication date
CN113306227A (en) 2021-08-27

Similar Documents

Publication Publication Date Title
CN110698112B (en) Preparation method of low-dielectric-constant microwave dielectric substrate containing hollow ceramic powder
CN113306227B (en) High-frequency ultralow-dielectric-loss microwave ceramic copper-clad plate and preparation method thereof
CN108790327B (en) High-performance copper-clad plate with polytetrafluoroethylene filled film and composite glass cloth and manufacturing process thereof
CN110734614A (en) PTFE (Polytetrafluoroethylene) substrate material for high-frequency copper-clad plate and preparation method thereof
CN115610044B (en) Low-loss PTFE-based microwave composite dielectric substrate and preparation method thereof
CN111016231A (en) PTFE ceramic film for 5G network high-performance copper-clad plate and processing method thereof
CN108358505B (en) Fluororesin intermediate medium layer filled with microwave dielectric ceramic powder and preparation method thereof
CN112111176B (en) Boron nitride-coated polytetrafluoroethylene composite filler, prepreg prepared from same and high-thermal-conductivity carbon-hydrogen copper-clad plate
CN113845740B (en) Preparation method of high-thermal-conductivity polytetrafluoroethylene composite film material
CN113211903A (en) Production method of ceramic-filled type hydrocarbon resin copper-clad plate
CN115594512A (en) PTFE (polytetrafluoroethylene) -ceramic slurry for high-frequency microwaves, sintered film of PTFE-ceramic slurry, and preparation methods and applications of PTFE-ceramic slurry and sintered film
CN102719043A (en) Novel high-reliability microwave sheet material
CN104629251A (en) Flame retardant composition and application thereof
CN105130274B (en) A kind of microwave composite medium substrate of high thermal stability and preparation method thereof
CN108456387A (en) A kind of no glass type polytetrafluoroethylene (PTFE) film, production method and its application
CN109575482B (en) Substrate material for high-frequency copper-clad plate and preparation method thereof
CN110602888A (en) Preparation method of aluminum-lined high-frequency substrate
CN106671517A (en) Composition of fluorine-containing resin and compound ceramic fillers and high-frequency copper-clad laminate manufactured from composition
CN112172210B (en) Preparation method of liquid crystal polymer film with low dielectric constant and low dielectric loss
CN114989567A (en) Epoxy resin composite heat conducting fin and preparation method thereof
CN115246999A (en) Modified thermotropic liquid crystal polymer material, rigid copper-clad plate and preparation method thereof
CN111441139B (en) Preparation method of liquid crystal polymer film
CN114379188A (en) Preparation method of low-dielectric low-loss polyolefin copper-clad plate
CN114316522A (en) High-performance liquid crystal polymer composite material and application thereof
CN208197731U (en) A kind of high performance copper clad laminate using polytetrafluoroethylene (PTFE) filling Film laminated glass cloth

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant