CN113211903A - Production method of ceramic-filled type hydrocarbon resin copper-clad plate - Google Patents
Production method of ceramic-filled type hydrocarbon resin copper-clad plate Download PDFInfo
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- CN113211903A CN113211903A CN202110617264.1A CN202110617264A CN113211903A CN 113211903 A CN113211903 A CN 113211903A CN 202110617264 A CN202110617264 A CN 202110617264A CN 113211903 A CN113211903 A CN 113211903A
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- ceramic
- hydrocarbon resin
- clad plate
- copper
- silane coupling
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- 239000000919 ceramic Substances 0.000 title claims abstract description 56
- 239000013032 Hydrocarbon resin Substances 0.000 title claims abstract description 39
- 229920006270 hydrocarbon resin Polymers 0.000 title claims abstract description 39
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 17
- 239000000843 powder Substances 0.000 claims abstract description 19
- 239000006087 Silane Coupling Agent Substances 0.000 claims abstract description 17
- 239000000945 filler Substances 0.000 claims abstract description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 15
- 238000007650 screen-printing Methods 0.000 claims abstract description 15
- 239000002002 slurry Substances 0.000 claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 13
- 238000001035 drying Methods 0.000 claims abstract description 12
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 11
- 239000011889 copper foil Substances 0.000 claims abstract description 11
- 238000011049 filling Methods 0.000 claims abstract description 11
- 238000002156 mixing Methods 0.000 claims abstract description 11
- 238000005245 sintering Methods 0.000 claims abstract description 10
- 238000007639 printing Methods 0.000 claims abstract description 8
- 238000007731 hot pressing Methods 0.000 claims abstract description 7
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 238000004381 surface treatment Methods 0.000 claims abstract description 5
- 239000010949 copper Substances 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 4
- 239000011268 mixed slurry Substances 0.000 claims abstract description 3
- 238000005303 weighing Methods 0.000 claims abstract description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 9
- 239000001257 hydrogen Substances 0.000 claims description 9
- 229920005989 resin Polymers 0.000 claims description 9
- 239000011347 resin Substances 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 8
- 238000005096 rolling process Methods 0.000 claims description 6
- 235000012239 silicon dioxide Nutrition 0.000 claims description 4
- 239000000377 silicon dioxide Substances 0.000 claims description 4
- 239000002356 single layer Substances 0.000 claims description 4
- 238000003756 stirring Methods 0.000 claims description 4
- 239000004408 titanium dioxide Substances 0.000 claims description 4
- 239000005062 Polybutadiene Substances 0.000 claims description 3
- 229920002857 polybutadiene Polymers 0.000 claims description 3
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 claims description 2
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 claims description 2
- 229910002113 barium titanate Inorganic materials 0.000 claims description 2
- JRPBQTZRNDNNOP-UHFFFAOYSA-N barium titanate Chemical compound [Ba+2].[Ba+2].[O-][Ti]([O-])([O-])[O-] JRPBQTZRNDNNOP-UHFFFAOYSA-N 0.000 claims description 2
- XBYNNYGGLWJASC-UHFFFAOYSA-N barium titanium Chemical compound [Ti].[Ba] XBYNNYGGLWJASC-UHFFFAOYSA-N 0.000 claims description 2
- AOWKSNWVBZGMTJ-UHFFFAOYSA-N calcium titanate Chemical compound [Ca+2].[O-][Ti]([O-])=O AOWKSNWVBZGMTJ-UHFFFAOYSA-N 0.000 claims description 2
- 229920001577 copolymer Polymers 0.000 claims description 2
- 239000010410 layer Substances 0.000 claims description 2
- LDWBQADKOUWRIR-UHFFFAOYSA-N n-trimethoxysilylaniline Chemical compound CO[Si](OC)(OC)NC1=CC=CC=C1 LDWBQADKOUWRIR-UHFFFAOYSA-N 0.000 claims description 2
- 229920001195 polyisoprene Polymers 0.000 claims description 2
- VEALVRVVWBQVSL-UHFFFAOYSA-N strontium titanate Chemical compound [Sr+2].[O-][Ti]([O-])=O VEALVRVVWBQVSL-UHFFFAOYSA-N 0.000 claims description 2
- YUYCVXFAYWRXLS-UHFFFAOYSA-N trimethoxysilane Chemical compound CO[SiH](OC)OC YUYCVXFAYWRXLS-UHFFFAOYSA-N 0.000 claims description 2
- 239000004744 fabric Substances 0.000 abstract description 9
- 239000003365 glass fiber Substances 0.000 abstract description 9
- 238000004891 communication Methods 0.000 abstract description 6
- 229910052573 porcelain Inorganic materials 0.000 abstract description 2
- 238000002360 preparation method Methods 0.000 description 8
- 238000005470 impregnation Methods 0.000 description 5
- 229910010293 ceramic material Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009775 high-speed stirring Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/01—Layered products comprising a layer of metal all layers being exclusively metallic
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B33/00—Layered products characterised by particular properties or particular surface features, e.g. particular surface coatings; Layered products designed for particular purposes not covered by another single class
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/14—Printing or colouring
- B32B38/145—Printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B38/00—Ancillary operations in connection with laminating processes
- B32B38/16—Drying; Softening; Cleaning
- B32B38/164—Drying
Abstract
A production method of a ceramic filling type hydrocarbon resin copper-clad plate comprises the following steps: the ceramic filler is subjected to surface treatment by using a silane coupling agent; weighing the ceramic filler with the surface treated, hydrocarbon resin and a curing agent in proportion, adding a proper amount of solvent to adjust viscosity, and fully mixing by using a mixing device; defoaming the mixed slurry by using a slurry defoaming device; performing screen printing on the defoamed slurry on the surface of the copper foil, drying at low temperature after printing is completed, repeating the screen printing process for many times, stopping after the required thickness is reached, and covering the surface with copper foil; and carrying out hot-pressing sintering on the copper foil-clad plates with the two surfaces to prepare the ceramic-filled type hydrocarbon resin copper-clad plate. The problem of current glass fiber cloth inorganic porcelain powder filling hydrocarbon resin class copper-clad plate have X, Y orientation electrical property difference is solved. The method is widely applied to the fields of modern microwave electronic communication such as high-end electronic products including microwave communication, active phased array radars, unmanned vehicle-mounted radars and the like.
Description
Technical Field
The invention belongs to the field of electronic components, in particular to the field of microwave electronic components, and further belongs to the field of microwave electronic component ceramic materials.
Background
With the development of high-end electronic products such as microwave communication, active phased array radar, unmanned vehicle-mounted radar and the like. The microwave circuit board of the high-frequency signal transmission characteristic design requirement has the characteristics of low dielectric, low loss, low thermal expansion coefficient and good processing dimensional stability, the hydrocarbon resin mainly comprises polybutadiene, polystyrene, polypropylene and other materials, the dielectric constant of the hydrocarbon resin is 2.4-2.8, the dielectric loss of the hydrocarbon resin is 0.0002-0.0006, the hydrocarbon resin is excellent in electrical property and is often used for processing a copper-clad plate, a thermosetting hydrocarbon polymer is obtained through a cross-linking curing reaction, the dimensional stability problem in the PCB processing process is ensured, the existing hydrocarbon resin copper-clad plate is mainly prepared in a mode of adopting glass fiber cloth as a reinforcing material and adopting inorganic ceramic powder as a filler, the copper-clad plate prepared by adopting the traditional impregnation process has the problem of electrical property difference in the X, Y direction, the defects of the copper-clad plate become more obvious along with the promotion of the application frequency range of the communication field, and the invention aims at providing the preparation method for filling the hydrocarbon resin by adopting the high-proportion ceramic filler, therefore, the isotropy of the electrical property of the copper-clad plate is ensured, the thermal expansion coefficient is low, and the use frequency band of the copper-clad plate is improved.
In view of the above, the present invention is particularly proposed.
Disclosure of Invention
The purpose of the invention is: the problem of current glass fiber cloth inorganic porcelain powder filling hydrocarbon resin class copper-clad plate have X, Y orientation electrical property difference is solved.
The technical conception adopted by the invention is as follows: the preparation method is characterized in that glass fiber cloth is omitted, the traditional glass fiber cloth impregnation process is replaced by a preparation method of filling hydrocarbon resin with high-proportion ceramic filler, and ceramic materials are uniformly dispersed in the hydrocarbon resin in a slurry rolling or high-speed stirring mode, so that the problem of anisotropy of the glass fiber cloth impregnation mode is solved, namely the problem of difficulty in preparing the high-frequency microwave composite medium substrate by filling the hydrocarbon resin with the ceramic filler is solved. Meanwhile, the plate is prepared in a multilayer screen printing mode in the preparation process, the thickness uniformity is well controlled, and the thickness precision of a single-layer film can be controlled within +/-0.2 mu m.
Therefore, the invention provides a production method of a ceramic filling type hydrocarbon resin copper-clad plate, which comprises the following steps:
(1) the ceramic filler is subjected to surface treatment by using a silane coupling agent, the ceramic filler can be one or more of silicon dioxide, barium titanium micro-dielectric ceramic, titanium dioxide, calcium titanate and strontium titanate materials, the silane coupling agent is one or more (more than two) of trimethoxy silane coupling agent, aminopropyl trimethoxy silane coupling agent and phenylamino trimethoxy silane coupling agent, and the using amount of the silane coupling agent is 1-3 wt% of the mass of the ceramic filler;
(2) weighing the ceramic filler with the surface treated, hydrocarbon resin and a curing agent in proportion, adding a proper amount of solvent to adjust the viscosity, wherein the ceramic powder content is 70-80 wt%, the hydrocarbon resin content is 20-30 wt%, the curing agent content is 1-3 wt%, and the solvent content is 20-40 wt% of the ceramic powder, and fully mixing by using a mixing device which is slurry rolling equipment or stirring equipment;
(3) defoaming the mixed slurry by using a slurry defoaming device for 20-60 min;
(4) performing screen printing on the defoamed slurry on the surface of the copper foil, drying at low temperature after printing is completed, repeating the screen printing process for many times, stopping after the required thickness is reached, and covering the surface with copper foil; the thickness of the printing single layer film is between 10 and 20 mu m, the drying temperature is between 45 and 70 ℃, and the drying time is between 5 and 10 min;
(5) and carrying out hot-pressing sintering on the two-sided copper clad laminate at the temperature of 220-270 ℃ and under the pressure of 2-5 MPa to prepare the ceramic-filled type hydrocarbon resin copper clad laminate, wherein the method can realize continuous adjustment of the dielectric constant by adjusting the type and the content of the ceramic filler, and the dielectric constant of the prepared laminate is 3.2-10.2.
The production method of the ceramic filling type hydrocarbon resin copper-clad plate has the following characteristics:
the preparation method is characterized in that glass fiber cloth is omitted, the traditional glass fiber cloth impregnation process is replaced by a preparation method of filling hydrocarbon resin with high-proportion ceramic filler, ceramic materials are uniformly dispersed in the hydrocarbon resin in a slurry rolling or high-speed stirring mode, and therefore the problem of anisotropy of the glass fiber cloth impregnation mode is solved, meanwhile, the plate is prepared in a multilayer screen printing mode in the preparation process, the thickness uniformity is well controlled, and the thickness precision of a single-layer film can be controlled within +/-0.2 mu m.
The ceramic-filled carbon-hydrogen resin copper-clad plate prepared by the method has a plate dielectric constant of 3.2-10.2, and is continuously adjustable.
The method is of great importance to the development of the high-frequency microwave composite dielectric substrate industry.
The production method of the ceramic-filled type carbon-hydrogen resin copper-clad plate is widely applied to the fields of modern microwave electronic communication such as high-end electronic products including microwave communication, active phased array radar, unmanned vehicle-mounted radar and the like.
Drawings
None.
Detailed Description
A production method of a ceramic filling type hydrocarbon resin copper-clad plate comprises the following specific implementation steps:
(1) performing surface treatment on the ceramic powder by using a silane coupling agent, wherein the using amount of the silane coupling agent is 2 percent of that of the ceramic powder;
(2) mixing (1-A-B) ceramic powder, A hydrocarbon resin and B curing agent according to a weight percentage of A, B, wherein the total mass fraction of the ceramic powder, the hydrocarbon resin and the curing agent is 1, adding a proper amount of cyclohexane as a solvent, adjusting the viscosity, and uniformly mixing by using a stirring device or a slurry rolling device; the ceramic powder is 70-80%, the hydrocarbon resin is 20-30%, the curing agent is 1-3%, the hydrocarbon resin is one or more of polybutadiene, styrene-butadiene-divinylbenzene copolymer and polyisoprene, and the ceramic powder is one or more (more than two) of titanium dioxide, silicon dioxide and barium titanate;
(3) defoaming the slurry by using a defoaming machine; defoaming time is 30 min;
(4) carrying out surface screen printing by using a copper foil as a carrier, and drying in a drying oven at 60 ℃ for 10min after printing is finished;
(5) repeating the silk-screen printing process until the required thickness is reached, and covering a layer of copper foil on the surface; the silk-screen printing speed is 50 mm/s-100 mm/s, the printing gap is 0.7 mm-1.0 mm, and the pressure is 3 Kg-4.2 Kg;
(6) and carrying out hot-pressing sintering on the plate, wherein the hot-pressing sintering temperature is 250 ℃, the sintering time is 2h, and the pressure is 3 Mpa.
Preparation material data are shown in table 1:
finally, it should be noted that: the above examples are merely examples for clarity of illustration, and the present invention includes but is not limited to the above examples, which are not necessarily exhaustive of all embodiments. Other variations and modifications will be apparent to persons skilled in the art in light of the above description. Embodiments that meet the requirements of the present invention are within the scope of the present invention.
Claims (10)
1. A production method of a ceramic filling type hydrocarbon resin copper-clad plate is characterized by comprising the following steps:
(1) the ceramic filler is subjected to surface treatment by using a silane coupling agent, wherein the using amount of the silane coupling agent is 1-3 wt% of the weight of the ceramic filler;
(2) weighing the ceramic filler with the surface treated, hydrocarbon resin and a curing agent in proportion, and adding a proper amount of solvent to adjust the viscosity; according to the weight percentage, the ceramic powder is 70-80%, the hydrocarbon resin is 20-30%, the curing agent is 1-3%, and the solvent is 20-40% of the weight of the ceramic powder, and a mixing device is used for fully mixing;
(3) defoaming the mixed slurry by using a slurry defoaming device for 20-60 min;
(4) performing screen printing on the defoamed slurry on the surface of the copper foil, drying at low temperature after printing is completed, repeating the screen printing process for many times, stopping after the required thickness is reached, and covering the surface with copper foil;
(5) and carrying out hot-pressing sintering on the copper foil clad plates with the two surfaces at the sintering temperature of 220-270 ℃ and the pressure of 2-5 MPa to prepare the ceramic filled type hydrocarbon resin copper clad plate.
2. The method for producing the ceramic-filled carbon-hydrogen resin copper-clad plate according to claim 1, wherein the ceramic filler is one or more of silicon dioxide, barium titanium micro-medium ceramic, titanium dioxide, calcium titanate and strontium titanate.
3. The method for producing the ceramic-filled carbon-hydrogen resin copper-clad plate according to claim 1, wherein the silane coupling agent is one or more of trimethoxy silane coupling agent, aminopropyl trimethoxy silane coupling agent and anilino trimethoxy silane coupling agent.
4. The method for producing the ceramic-filled type hydrocarbon resin copper-clad plate according to claim 1, wherein the mixing device is a slurry rolling device or a stirring device.
5. The method for producing the ceramic-filled carbon-hydrogen resin copper-clad plate according to claim 1, wherein the thickness of the single-layer film of the screen printing paste is 10 μm to 20 μm.
6. The method for producing the ceramic-filled type carbon-hydrogen resin copper-clad plate according to claim 1, wherein the drying temperature for the low-temperature drying is 45-70 ℃, and the drying time is 5-10 min.
7. The production method of the ceramic-filled carbon-hydrogen resin copper-clad plate according to claim 1, wherein the dielectric constant of the plate of the ceramic-filled carbon-hydrogen resin copper-clad plate is 3.2-10.2, and the dielectric constant of the plate is continuously adjustable.
8. The production method of the ceramic-filled type hydrocarbon resin copper-clad plate according to claim 1, characterized by comprising the following specific implementation steps:
(1) performing surface treatment on the ceramic powder by using a silane coupling agent, wherein the using amount of the silane coupling agent is 2 percent of that of the ceramic powder;
(2) mixing (1-A-B) ceramic powder, A hydrocarbon resin and B curing agent according to a ratio of A, B, wherein the total mass fraction of the ceramic powder, the hydrocarbon resin and the curing agent is 1, adding a proper amount of cyclohexane as a solvent, adjusting the viscosity, and uniformly mixing by using a stirring device or a slurry rolling device;
the ceramic powder content is 70-80%, the hydrocarbon resin content is 20-30%, and the curing agent content is 1-3%;
(3) defoaming the slurry by using a defoaming machine for 30 min;
(4) carrying out surface screen printing by using a copper foil as a carrier, and drying in a drying oven at 60 ℃ for 10min after printing is finished;
(5) repeating the silk-screen printing process until the required thickness is reached, and covering a layer of copper foil on the surface; the silk-screen printing speed is 50 mm/s-100 mm/s, the printing gap is 0.7 mm-1.0 mm, and the pressure is 3 Kg-4.2 Kg;
(6) and carrying out hot-pressing sintering on the plate, wherein the hot-pressing sintering temperature is 250 ℃, the sintering time is 2h, and the pressure is 3 Mpa.
9. The method for producing the ceramic-filled type hydrocarbon resin copper-clad plate according to claim 8, wherein the hydrocarbon resin is one or more of polybutadiene, styrene-butadiene-divinylbenzene copolymer and polyisoprene.
10. The method for producing the ceramic-filled carbon-hydrogen resin copper-clad plate according to claim 8, wherein the ceramic powder is one or more of titanium dioxide, silicon dioxide and barium titanate.
Priority Applications (1)
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CN202110617264.1A CN113211903A (en) | 2021-06-03 | 2021-06-03 | Production method of ceramic-filled type hydrocarbon resin copper-clad plate |
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CN202110617264.1A CN113211903A (en) | 2021-06-03 | 2021-06-03 | Production method of ceramic-filled type hydrocarbon resin copper-clad plate |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113910703A (en) * | 2021-09-14 | 2022-01-11 | 浙江大学 | Hydrocarbon resin-based flexible high-frequency copper clad laminate material and preparation method thereof |
CN114474878A (en) * | 2022-03-02 | 2022-05-13 | 江苏生益特种材料有限公司 | Copper-clad plate and manufacturing method thereof |
CN114890712A (en) * | 2022-05-19 | 2022-08-12 | 中国振华集团云科电子有限公司 | Preparation method of copper-clad plate with high thermal stability |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101585955A (en) * | 2008-12-31 | 2009-11-25 | 广东生益科技股份有限公司 | Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil |
CN103773266A (en) * | 2014-01-16 | 2014-05-07 | 陕西生益科技有限公司 | Adhesive and preparation method thereof as well as preparation technology of halogen-free aluminium base copper-clad plate based on adhesive |
CN104496268A (en) * | 2014-12-16 | 2015-04-08 | 中国电子科技集团公司第四十六研究所 | Preparation method of microwave composite dielectric substrate with high frequency and high dielectric property |
EP2896653A1 (en) * | 2012-09-14 | 2015-07-22 | Shengyi Technology Co., Ltd | Epoxy resin composition, and, prepreg and copper clad laminate manufactured using the composition |
CN105949717A (en) * | 2016-05-05 | 2016-09-21 | 廊坊市高瓷新材料科技有限公司 | Flame retardant organic ceramic substrate composition, flame retardant organic ceramic substrate, making method thereof and copper-clad plate |
CN108189520A (en) * | 2017-12-28 | 2018-06-22 | 浙江华正新材料股份有限公司 | A kind of production method of modified polytetrafluoroethylcopper copper clad plate |
CN108501488A (en) * | 2018-05-18 | 2018-09-07 | 吴东建 | A kind of high-frequency high-speed copper-clad plate and preparation method thereof |
CN108901130A (en) * | 2018-05-18 | 2018-11-27 | 吴东建 | A kind of high-frequency high-speed flexibility coat copper plate and preparation method thereof |
CN112552630A (en) * | 2020-12-10 | 2021-03-26 | 广东生益科技股份有限公司 | Resin composition, resin glue solution containing resin composition, prepreg, laminated board, copper-clad plate and printed circuit board |
-
2021
- 2021-06-03 CN CN202110617264.1A patent/CN113211903A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101585955A (en) * | 2008-12-31 | 2009-11-25 | 广东生益科技股份有限公司 | Resin composition, resin-coated copper foil produced by same and copper-clad plate produced by utilizing resin-coated copper foil |
EP2896653A1 (en) * | 2012-09-14 | 2015-07-22 | Shengyi Technology Co., Ltd | Epoxy resin composition, and, prepreg and copper clad laminate manufactured using the composition |
CN103773266A (en) * | 2014-01-16 | 2014-05-07 | 陕西生益科技有限公司 | Adhesive and preparation method thereof as well as preparation technology of halogen-free aluminium base copper-clad plate based on adhesive |
CN104496268A (en) * | 2014-12-16 | 2015-04-08 | 中国电子科技集团公司第四十六研究所 | Preparation method of microwave composite dielectric substrate with high frequency and high dielectric property |
CN105949717A (en) * | 2016-05-05 | 2016-09-21 | 廊坊市高瓷新材料科技有限公司 | Flame retardant organic ceramic substrate composition, flame retardant organic ceramic substrate, making method thereof and copper-clad plate |
CN108189520A (en) * | 2017-12-28 | 2018-06-22 | 浙江华正新材料股份有限公司 | A kind of production method of modified polytetrafluoroethylcopper copper clad plate |
CN108501488A (en) * | 2018-05-18 | 2018-09-07 | 吴东建 | A kind of high-frequency high-speed copper-clad plate and preparation method thereof |
CN108901130A (en) * | 2018-05-18 | 2018-11-27 | 吴东建 | A kind of high-frequency high-speed flexibility coat copper plate and preparation method thereof |
CN112552630A (en) * | 2020-12-10 | 2021-03-26 | 广东生益科技股份有限公司 | Resin composition, resin glue solution containing resin composition, prepreg, laminated board, copper-clad plate and printed circuit board |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113910703A (en) * | 2021-09-14 | 2022-01-11 | 浙江大学 | Hydrocarbon resin-based flexible high-frequency copper clad laminate material and preparation method thereof |
CN114474878A (en) * | 2022-03-02 | 2022-05-13 | 江苏生益特种材料有限公司 | Copper-clad plate and manufacturing method thereof |
CN114890712A (en) * | 2022-05-19 | 2022-08-12 | 中国振华集团云科电子有限公司 | Preparation method of copper-clad plate with high thermal stability |
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