CN114434911B - High-heat-conductivity high-frequency flexible copper-clad plate and preparation method thereof - Google Patents
High-heat-conductivity high-frequency flexible copper-clad plate and preparation method thereof Download PDFInfo
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- CN114434911B CN114434911B CN202210040045.6A CN202210040045A CN114434911B CN 114434911 B CN114434911 B CN 114434911B CN 202210040045 A CN202210040045 A CN 202210040045A CN 114434911 B CN114434911 B CN 114434911B
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B27/00—Layered products comprising a layer of synthetic resin
- B32B27/28—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42
- B32B27/281—Layered products comprising a layer of synthetic resin comprising synthetic resins not wholly covered by any one of the sub-groups B32B27/30 - B32B27/42 comprising polyimides
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
- B32B15/08—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material of synthetic resin
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
- B32B37/1284—Application of adhesive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B7/00—Layered products characterised by the relation between layers; Layered products characterised by the relative orientation of features between layers, or by the relative values of a measurable parameter between layers, i.e. products comprising layers having different physical, chemical or physicochemical properties; Layered products characterised by the interconnection of layers
- B32B7/04—Interconnection of layers
- B32B7/12—Interconnection of layers using interposed adhesives or interposed materials with bonding properties
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C09J121/00—Adhesives based on unspecified rubbers
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J179/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen, with or without oxygen, or carbon only, not provided for in groups C09J161/00 - C09J177/00
- C09J179/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
- C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
- B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
- C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/12—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers
- C09J2301/124—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the arrangement of layers the adhesive layer being present on both sides of the carrier, e.g. double-sided adhesive tape
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
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- C09J2479/00—Presence of polyamine or polyimide
- C09J2479/08—Presence of polyamine or polyimide polyimide
- C09J2479/086—Presence of polyamine or polyimide polyimide in the substrate
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Abstract
The application provides a high-heat-conductivity high-frequency flexible copper-clad plate and a preparation method thereof, wherein the flexible copper-clad plate comprises an adhesive layer, the adhesive layer is obtained by drying glue, and each 100 parts of the glue comprises the following components in parts by weight: 20-35 parts of inorganic filler, 25-35 parts of rubber, 20-35 parts of resin, a curing agent, a metal ion capturing agent and a catalyst. The preparation method comprises glue coating, pressing and rolling. In the flexible copper clad laminate, the obtained flexible copper clad laminate has good high heat conduction and low magnetic loss performance by reasonably designing the addition amount of the inorganic filler, the resin and the rubber, and can meet the requirement of quick transmission of communication signals; the preparation method provided by the application has the advantage of high quality stability of the obtained product.
Description
Technical Field
The application relates to the technical field of flexible copper-clad plate materials, in particular to a high-heat-conductivity high-frequency flexible copper-clad plate and a preparation method thereof.
Background
A Flexible Copper Clad Laminate (FCCL) is a substrate material for flexible printed circuit boards, and is typically composed of a flexible insulating base film and a metal foil. At present, a common soft board substrate mainly comprises Polyimide (PI) and copper foil, however, because the PI and the copper foil have larger dielectric constants and loss factors, larger moisture absorption and poorer reliability, the flexible copper-clad plate has serious high-frequency transmission loss and poorer structural characteristics, so that the flexible copper-clad plate cannot meet the current high-frequency high-speed transmission requirement. The limitation and the disadvantage of the materials promote the development of new materials and new processes in the field, and the high-frequency high-speed flexible copper-clad plate with the characteristics of low signal loss, light weight, multifunction and the like gradually enters the field of view of the masses.
In order to solve the problems of the conventional flexible copper clad laminate at home and abroad, low-dielectric high-performance flexible copper clad laminate products are sequentially introduced, and the products have low dielectric constant, high-frequency loss and high peeling strength, so that the requirements of high-frequency circuit packaging and carriers (printed circuit boards) on the high-frequency microwave flexible copper clad laminate can be well met, but the requirements of signal transmission speed in communication cannot be met at the conventional dielectric constant, high-frequency loss and peeling strength level, and the application range of the flexible copper clad laminate is narrow. Therefore, the flexible copper-clad plate with wide application range is significant.
Disclosure of Invention
Aiming at the defects in the prior art, the application provides the high-heat-conductivity high-frequency flexible copper-clad plate and the preparation method thereof, wherein the obtained flexible copper-clad plate has good high-heat-conductivity and low-magnetic loss performance by reasonably designing the adding amount of the inorganic filler, the resin and the rubber, and can meet the requirement of rapid transmission of communication signals; the preparation method provided by the application has the advantage of high quality stability of the obtained product.
The technical scheme of the application is as follows:
the high-heat-conductivity high-frequency flexible copper-clad plate comprises an adhesive layer, wherein the adhesive layer is obtained by drying glue;
every 100 parts of the glue comprises the following components in parts by weight:
20-35 parts of inorganic filler, 25-35 parts of rubber, 20-35 parts of resin, a curing agent, a metal ion scavenger, a catalyst and a dispersing agent.
Further, every 100 parts of the glue comprises the following components in parts by weight:
27 parts of inorganic filler, 35 parts of rubber, 32 parts of resin, a curing agent, a metal ion scavenger, a catalyst and a dispersing agent; the peel strength of the glue with the composition is up to 1.42kgf/cm; the glue has the highest peel strength at this composition.
Further, the particle size of the inorganic filler is 3-6 mu m; the inorganic filler is in the range of meeting the standard, the peel strength of the obtained flexible copper clad laminate is between 1.08 and 1.15kgf/cm, and the shrinkage is between 0.02 and 0.006 percent, thereby meeting the standard regulation.
Further, the glue is prepared by the following steps: putting the glue components into a high-speed mixing and dispersing machine, and setting the parameters of the dispersing machine as follows: 700r/m 0.5hr,850r/m 0.5hr and 1000r/m 4hr,turn over AD at the 4th hr, so that the glue components are mixed stepwise, and the obtained glue has optimal fluidity and uniformity.
Further, the inorganic filler is modified graphene, and specifically a layer of silane coupling agent is coated on the surface of the graphene; the modified graphene can still keep good heat conduction performance on the premise of reducing the electric conduction performance of the graphene.
Furthermore, the resin is benzoxazine liquid crystal polymer resin, and the resin has excellent bending resistance, corrosion resistance, heat resistance, high strength and low dielectric property, and can effectively meet the requirements of a high-frequency copper-clad plate.
The preparation method of the high-heat-conductivity high-frequency flexible copper-clad plate comprises the following steps:
(1) Coating glue: firstly, glue is input into a liquid storage distribution cavity of a coating die head by adopting an extrusion type spraying process, and is spread onto a coated substrate in a liquid film form at an outlet lip through the transverse homogenization of a strip seam; then controlling the pressure, spraying the glue on the substrate, and utilizing an upper coating die head to uniformly coat the coating on the film, so that the coating is more uniform and smooth; by using the coating mode, the uniformity of glue coating and the thickness precision of the adhesive layer can be ensured, and the actual thickness is +/-1 mu m from the preset thickness;
(2) Pressing: after glue is coated, copper foil is respectively placed on the upper surface and the lower surface of a substrate, and the laminating temperature is controlled between 350 ℃ and 390 ℃;
(3) And (3) rolling: and (3) using an automatic winding machine, wherein the sending tension of the winding machine is 60N, and the winding tension is 60-70N, so that the winding is completed, and the flexible copper-clad plate is obtained.
Further, in the laminating process of the step (2), the laminating temperature is 350 ℃; the peel strength of the product at this time was 1.4-1.5kgf/cm.
Further, in the winding process of the step (3), when the sending tension is 60N and the winding tension is 70N, the appearance and the size of the flexible copper clad laminate are the best and the most stable.
Compared with the prior art, the application has the beneficial effects that:
1. by setting the proportion of the inorganic filler, the rubber and the resin, the glue has good peeling strength, so that when the glue is used in the production of the flexible copper-clad plate, the flexible copper-clad plate with high peeling strength, heat resistance, flame retardance and limit explosion plate meeting the requirements can be obtained.
2. The flexible copper-clad plate prepared by using the glue provided by the application has the advantages of high thickness uniformity of the adhesive layer and good dimensional stability of the product; the obtained product has good peeling strength, shrinkage and welding resistance, and simultaneously has high heat conduction and low electromagnetic loss, and can meet the requirements of telephone and mobile communication system industries, broadcasting, television, computer and other industries, automobile industry, medical equipment and the like.
3. The preparation method of the flexible copper-clad plate provided by the application has the advantages of simple and easily controlled preparation process and good method stability, and the flexible copper-clad plate prepared by the method has the advantage of high quality consistency.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are required to be used in the description of the embodiments or the prior art will be briefly described below, and it will be obvious to those skilled in the art that other drawings can be obtained from these drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a flexible copper clad laminate of example 2.
In the figure, 1-PI layer, 2-copper foil layer, 3-adhesive layer.
Detailed Description
In order to better understand the technical solutions of the present application, the following description will clearly and completely describe the technical solutions of the embodiments of the present application in conjunction with the embodiments of the present application, and it is obvious that the described embodiments are only some embodiments of the present application, not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, shall fall within the scope of the present application.
In the following examples and comparative examples of the present application, the curing agent was DDS, the catalyst was imidazole catalyst, and the ion scavenger was IEX-100; the inorganic filler is modified graphene, and specifically a layer of silane coupling agent is coated on the surface of the graphene; the resin is benzoxazine liquid crystal polymer resin.
In the following examples of the present application, the thickness of the PI film was 10. Mu.m, and the thickness of the copper foil was 12. Mu.m.
Example 1
25 parts of glues of different weight composition were prepared according to the formula of table 1 below, as follows:
TABLE 1 composition of glue with number 1 to number 25
The glue components in table 1 above were prepared as follows: the glue components are put into a telling mixing and dispersing machine, a mechanical dispersing method and a chemical dispersing method are combined, a high-speed mixing and dispersing machine is used, the viscosity of the glue is improved in a stepped mixing and dispersing mode, and the set parameters are as follows: 700r/m 0.5hr,850r/m 0.5hr,1000r/m 4hr,turn over AD at the 4th hr, to avoid re-agglomeration of the particles after the glue leaves the disperser.
The glues of number 1 to number 25 were respectively subjected to peel strength measurement using a peel strength tester, and the results are shown in table 2, as follows:
TABLE 2 determination of peel strength of glue No. 1-No. 25
| Group of | Peel strength (kgf/cm) |
| Number 1 | 1.42 |
| Number 2 | 1.40 |
| Number 3 | 1.40 |
| Number 4 | 1.39 |
| Number 5 | 1.36 |
| Number 6 | 1.35 |
| Number 7 | 1.39 |
| Number 8 | 1.29 |
| Number 9 | 1.18 |
| Number 10 | 1.36 |
| Number 11 | 1.33 |
| Number 12 | 1.32 |
| Number 13 | 1.28 |
| Number 14 | 1.29 |
| Number 15 | 1.27 |
| Number 16 | 1.28 |
| Number 17 | 1.35 |
| Sequence number18 | 1.33 |
| Number 19 | 1.31 |
| Sequence number 20 | 1.28 |
| Number 21 | 1.37 |
| Number 22 | 1.35 |
| Number 23 | 1.18 |
| Serial number 24 | 1.19 |
| Number 25 | 1.17 |
As can be seen from table 2, the glue provided by the application has good stripping performance.
Example 2
Glue with the number 1, the number 2 and the number 3 provided in the embodiment 1 is respectively applied to the preparation of the flexible copper clad laminate, and the process is as follows:
(1) Coating glue: firstly, glue is input into a liquid storage distribution cavity of a coating die head by adopting an extrusion type spraying process, and is spread onto a coated substrate in a liquid film form at an outlet lip through the transverse homogenization of a strip seam; using a coater, setting the pressure of the coater to be 0.2MPa, spraying glue on the PI film, and using an upper coating die head to uniformly coat the coating on the film, wherein the coating thickness of the glue is 6 mu m;
(2) Pressing: after glue is coated, copper foils are respectively placed on the upper surface and the lower surface of a substrate, and the lamination temperature is controlled to be 350 ℃;
(3) And (3) rolling: using an automatic winding machine, wherein the sending tension of the winding machine is 60N, and the winding tension is 70N, so that winding is completed, and a flexible copper-clad plate is obtained; the flexible copper-clad plate comprises a PI layer, a copper foil layer and an adhesive layer;
wherein the adhesive layer is obtained after the glue is cured, the copper foil layer is provided with two layers, one copper foil layer is connected with the upper surface of the PI layer through the adhesive layer, and the other copper foil layer is connected with the lower surface of the PI layer through the other adhesive layer, as shown in figure 1;
the flexible copper-clad laminate A prepared by the glue with the number 1, the flexible copper-clad laminate B prepared by the glue with the number 2 and the flexible copper-clad laminate C prepared by the glue with the number 3 are detected, and the results are shown in Table 3.
TABLE 3 Performance detection of Flexible copper-clad laminate A, flexible copper-clad laminate B and Flexible copper-clad laminate C
It can be seen from table 3 that the products produced using the high peel strength glue have the most excellent properties, meeting the specifications of the industry standard.
Example 3
In this example, the effect of filler particle size variation on glue performance was investigated.
In this example, experimental glue a and experimental glue B were set;
the experimental glue A differs from the glue of the number 1 in example 1 in that the filler particle size is 4 μm;
the experimental glue B differs from the glue of number 1 in example 1 in that the filler particle size is 6. Mu.m.
Comparative example 1
In this comparative example, comparative glue A differs from glue number 1 of example 1 in that the filler particle size was 10. Mu.m.
The test glue a, the test glue B and the comparative water a in the test example 3 and the comparative water a in the comparative example 1 were used in the preparation of the flexible copper-clad laminate, the preparation method was the same as in the test example 2, the flexible copper-clad laminate D obtained by using the test glue a, the flexible copper-clad laminate E obtained by using the test glue B and the comparative flexible copper-clad laminate a obtained by using the comparative water a were tested, and the test results of the flexible copper-clad laminate a prepared by using the glue of the serial number 1 were summarized, and the results are shown in table 4.
Table 4 detection results of flexible copper-clad laminate a, comparative flexible copper-clad laminate a, flexible copper-clad laminate D and flexible copper-clad laminate E
As can be seen from the combination of Table 4, the filler particle size has a large influence on the product, and when the filler particle size is 10 mu m, the peel strength of the obtained comparative flexible copper-clad plate A does not accord with the standard regulation, so that the setting of the filler particle size in the application has important significance on the performance of the product.
Example 4
In this embodiment, the glue used is glue with number 1 in embodiment 1;
the difference between the preparation method of the present example and that of example 2 is that the coating thickness was 4 μm, 8 μm and 10 μm, respectively, to obtain a flexible copper-clad plate F, a flexible copper-clad plate G and a flexible copper-clad plate H in this order; the flexible copper clad laminate F, the flexible copper clad laminate G and the flexible copper clad laminate H were tested and the test results were summarized with the flexible copper clad laminate a, and the results are shown in table 5.
TABLE 5 detection of Flexible copper-clad laminate F, flexible copper-clad laminate G and Flexible copper-clad laminate H Performance
It can be seen from table 5 that the thickness of the glue has a direct effect on the signal transmission speed and the adhesion of the product, and it can be seen from table 5 that the thickness of the glue provided by the application can meet the signal transmission requirement, and the viscosity, peel strength, high-frequency loss and other properties of the product are most excellent when the thickness of the glue is 6 μm.
Example 5
In this example, the glue of the serial number 1 in example 1 was used to prepare a flexible copper-clad laminate at a lamination temperature different from that of example 2, and the lamination temperature was 370 ℃ and 390 ℃ respectively to obtain a flexible copper-clad laminate I and a flexible copper-clad laminate J respectively.
Comparative example 2
The difference between this comparative example and example 5 is that the lamination temperature was 310 ℃ and 330 ℃ respectively, and a comparative flexible copper-clad laminate B and a comparative flexible copper-clad laminate C were obtained respectively.
The products obtained in example 5 and comparative example 2 were tested and the performance results of the products were summarized with those of the flexible copper clad laminate a, and the results are shown in table 6.
Table 6 detection results of Flexible copper-clad laminate I, flexible copper-clad laminate J, comparative Flexible copper-clad laminate B, comparative Flexible copper-clad laminate C
| Product(s) | Pressing temperature (. Degree. C.) | Peel strength (kgf/cm) |
| Comparative Flexible copper-clad laminate B | 310 | 0.87 |
| Comparative Flexible copper-clad plate C | 330 | 0.94 |
| Flexible copper-clad plate A | 350 | 1.34 |
| Flexible copper-clad plate I | 370 | 1.32 |
| Flexible copper-clad plate J | 390 | 1.16 |
As can be seen from table 6, under the condition of reducing the lamination temperature, the peel strength of the product is greatly changed, and the standard requirement cannot be met, so that the lamination strength has important significance for preparing the flexible copper-clad plate.
Example 6
In this embodiment, the glue with the number 1 in the embodiment 1 is different from the glue in the embodiment 2 in that when the sending tension is 60N and the winding tension is 60N, the product is a flexible copper-clad plate K.
Comparative example 3
The difference between the comparative example and example 6 is that when the delivery tension is 60N and the winding tension is 40N, the prepared product is a comparative flexible copper-clad plate D; when the sending tension is 60N and the winding tension is 100N, the prepared product is the comparative flexible copper-clad plate E.
The products obtained in example 6 and comparative example 3 were tested and the results of the performance of the flexible copper clad laminate a were summarized and shown in table 7.
Table 7 test results of Flexible copper-clad laminate K, comparative Flexible copper-clad laminate D, comparative Flexible copper-clad laminate E
Comparative example 4
In the comparative example, the glue with the number 1 in the example 1 is different from the glue in the example 2 in that when the winding tension is 70N and the sending tension is 30N, the prepared product is a comparative flexible copper-clad plate F; when the winding tension is 70N and the sending tension is 40N, the prepared product is a comparative flexible copper-clad plate G; when the winding tension is 70N and the sending tension is 100N, the prepared product is the comparative flexible copper-clad plate H.
The product obtained in comparative example 4 was tested and the performance results of the product were summarized with those of the flexible copper-clad laminate a, and the results are shown in table 8.
Table 8 compares the detection results of the flexible copper-clad plate F and the flexible copper-clad plate H
As can be seen from table 7 and table 8, the sending tension and the winding tension of the flexible copper clad laminate have a great influence on the appearance, dimensional stability and performance of the product in the preparation process. Therefore, the selection of the proper delivery tension and take-up tension is important to product production.
Example 7
The same method as in example 2 was used to prepare 5 batches of flexible copper-clad laminate using the glue of serial number 1 provided in example 1, and the peel strength test was performed on the 5 batches of product, and the peel strength of the 5 batches of product was summarized with that of flexible copper-clad laminate a of example 2, and the results are shown in table 9.
TABLE 9 peel strength test between different batches
| Numbering device | Batch 1 | Batch 2 | Batch 3 | Batch 4 | Batch 5 | Flexible copper-clad plate A |
| Peel strength (kgf/cm) | 1.31 | 1.35 | 1.30 | 1.33 | 1.34 | 1.34 |
It can be seen from Table 9 that the products prepared from the same glue composition have small peel strength difference, which indicates that the preparation method of the application has high stability and strong repeatability.
Although the present application has been described in detail by way of reference to preferred embodiments, the present application is not limited thereto. Various equivalent modifications and substitutions may be made in the embodiments of the present application by those skilled in the art without departing from the spirit and scope of the present application, and it is intended that all such modifications and substitutions be within the scope of the present application/be within the scope of the present application as defined by the appended claims. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.
Claims (4)
1. The high-heat-conductivity high-frequency flexible copper-clad plate comprises an adhesive layer, wherein the adhesive layer is obtained by drying glue,
every 100 parts of the glue comprises the following components in parts by weight:
20-35 parts of inorganic filler, 25-35 parts of rubber, 20-35 parts of resin, a curing agent, a metal ion scavenger, a catalyst and a dispersing agent;
the particle size of the inorganic filler is 3-6 mu m;
the inorganic filler is modified graphene, and specifically a layer of silane coupling agent is coated on the surface of the graphene;
the resin is benzoxazine liquid crystal polymer resin;
the preparation method of the high-heat-conductivity high-frequency flexible copper-clad plate comprises the following steps:
(1) Coating glue: firstly, glue is input into a liquid storage distribution cavity of a coating die head by adopting an extrusion type spraying process, and is spread onto a coated substrate in a liquid film form at an outlet lip through the transverse homogenization of a strip seam; then controlling the pressure, spraying the glue on the substrate, and coating the coating on the film by using an upper coating die head for standby;
(2) Pressing: after glue is coated, copper foil is respectively placed on the upper surface and the lower surface of a substrate, and the laminating temperature is controlled between 350 ℃ and 390 ℃;
(3) And (3) rolling: and (3) using an automatic winding machine, wherein the sending tension of the winding machine is 60N, and the winding tension is 60-70N, so that the winding is completed, and the flexible copper-clad plate is obtained.
2. The high-heat-conductivity high-frequency flexible copper-clad plate according to claim 1, wherein each 100 parts of the glue comprises the following components in parts by weight:
27 parts of inorganic filler, 35 parts of rubber, 32 parts of resin, a curing agent, a metal ion scavenger, a catalyst and a dispersing agent.
3. The high-heat-conductivity high-frequency flexible copper-clad plate according to claim 1, wherein in the lamination process of the step (2), the lamination temperature is 350 ℃; the peel strength of the product at this time was 1.4-1.5kgf/cm.
4. The high-heat-conductivity high-frequency flexible copper-clad plate according to claim 1, wherein in the winding process of the step (3), the transmission tension is 60N and the winding tension is 70N.
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| CN105172270A (en) * | 2014-05-27 | 2015-12-23 | 广东生益科技股份有限公司 | Thermosetting resin sandwich preimpregnation body and preparation method thereof, and copper-clad plate |
| WO2017111254A1 (en) * | 2015-12-21 | 2017-06-29 | 주식회사 두산 | Electromagnetic wave shielding film and manufacturing method therefor |
| CN111253709A (en) * | 2020-04-02 | 2020-06-09 | 厦门英勒威新材料科技有限公司 | Copper-clad plate glue solution and black low-transmittance copper-clad plate |
| JP2021027311A (en) * | 2019-11-13 | 2021-02-22 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding wiring circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7887927B2 (en) * | 2007-03-09 | 2011-02-15 | Nanotek Instruments, Inc. | Highly conductive, multi-layer composite precursor composition to fuel cell flow field plate or bipolar plate |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105172270A (en) * | 2014-05-27 | 2015-12-23 | 广东生益科技股份有限公司 | Thermosetting resin sandwich preimpregnation body and preparation method thereof, and copper-clad plate |
| WO2017111254A1 (en) * | 2015-12-21 | 2017-06-29 | 주식회사 두산 | Electromagnetic wave shielding film and manufacturing method therefor |
| JP2021027311A (en) * | 2019-11-13 | 2021-02-22 | 東洋インキＳｃホールディングス株式会社 | Electromagnetic wave shielding sheet and electromagnetic wave shielding wiring circuit board |
| CN111253709A (en) * | 2020-04-02 | 2020-06-09 | 厦门英勒威新材料科技有限公司 | Copper-clad plate glue solution and black low-transmittance copper-clad plate |
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