CN110588116A

CN110588116A - Flame-retardant heat-resistant copper foil-coated epoxy glass fiber cloth-based laminated board and preparation method thereof

Info

Publication number: CN110588116A
Application number: CN201910833281.1A
Authority: CN
Inventors: 李洪彬
Original assignee: Chongqing Dekai Industry Ltd By Share Ltd
Current assignee: Chongqing Dekai Industry Ltd By Share Ltd
Priority date: 2019-09-04
Filing date: 2019-09-04
Publication date: 2019-12-20

Abstract

The invention provides a flame-retardant heat-resistant copper-clad foil epoxy fiberglass cloth-based laminated board and a preparation method thereof, wherein the preparation method mainly comprises the following steps of 101, filler dispersion: taking 90-100 parts of bisphenol A type bromine epoxy resin, adding 8-12 parts of DMF (dimethyl formamide) into the bisphenol A type bromine epoxy resin, mixing and stirring, adding 70-80 parts of silicon dioxide or aluminum hydroxide or barium sulfate or zinc sulfate while stirring, and then accelerating stirring to form a dispersed filler; step 102, putting resin into a groove; 103, adding a curing agent; step 104, stopping the machine and measuring the S/G; step 2, impregnation; step 3, stacking; step 4, combining; and 5, pressing, and 6, cutting. The invention has the beneficial effects that the inorganic filler with a certain proportion is introduced to replace part of epoxy resin, so that the heat resistance of the glass fiber cloth substrate is effectively improved.

Description

Flame-retardant heat-resistant copper foil-coated epoxy glass fiber cloth-based laminated board and preparation method thereof

Technical Field

The invention relates to the technical field of electronic materials, in particular to a flame-retardant heat-resistant copper-clad foil epoxy fiberglass cloth-based laminated board and a preparation method thereof.

Background

Copper Clad Laminate (CCL) is a product which is prepared by using wood pulp paper or glass fiber cloth as a reinforcing material, soaking the reinforcing material with resin, coating Copper foil on one side or two sides, and carrying out hot pressing. The copper-clad plate is a basic material in the electronic industry, is mainly used for processing and manufacturing Printed Circuit Boards (PCBs), and is widely applied to electronic products such as televisions, radios, computers, mobile communication and the like.

The copper-clad plates available in the market can be mainly classified into the following types from the viewpoint of base materials: paper substrate, glass fiber fabric substrate, synthetic fiber fabric substrate, nonwoven fabric substrate, and composite substrate.

The preparation process flow of the glass fiber cloth substrate is as follows approximately: cutting → pre-stacking → combining → pressing → disassembling → cutting → packaging → warehousing → delivering.

The traditional glass fiber cloth substrate is formed by the cross-linking reaction of epoxy resin and a curing agent, and the heat resistance of the glass fiber cloth substrate is poor because the thermal expansion coefficient of the epoxy resin is as high as 80 PPm/DEG C.

In addition, a general glass fiber cloth substrate uses polyamine, acid anhydride, polyphenol, polythiol, or the like as a curing agent, and has weak peel strength.

Disclosure of Invention

The invention aims to overcome the defects in the prior art, provides a flame-retardant heat-resistant copper foil-coated epoxy glass fiber cloth-based laminated board and a preparation method thereof, and aims to solve the problems of poor heat resistance and weak peeling strength of a glass fiber cloth substrate in the prior art.

In order to solve the technical problems, the invention adopts the following technical scheme:

a preparation method of a flame-retardant heat-resistant copper foil-coated epoxy fiberglass cloth-based laminated board comprises the following steps:

step 1, preparing ingredients;

wherein, the preparation of the ingredients comprises the following steps:

step 101, filler dispersion: taking 90-100 parts of bisphenol A type bromine epoxy resin, adding 8-12 parts of DMF (dimethyl formamide) into the bisphenol A type bromine epoxy resin, mixing and stirring, adding 70-80 parts of silicon dioxide or aluminum hydroxide or barium sulfate or zinc sulfate while stirring, and then accelerating stirring to form a dispersed filler;

step 102, resin entering: mixing 2-4 parts of tetrafunctional epoxy resin and 180-220 parts of bisphenol A type bromine epoxy resin to form mixed resin, and mixing the mixed resin with the dispersed filler obtained in the step 101 to obtain a mixture;

step 103, adding a curing agent: will be provided with5～8Adding dicyandiamide and 0.1-0.2 part of catalyst dimethylimidazole or 1-cyano 2-ethyl 4-methylimidazole into the mixture obtained in the step 102, and continuously stirring to enable the mixture and the mixture to fully generate a curing reaction to form an ingredient;

step 104, stopping and measuring S/G: extracting a sample from the ingredients formed in the step 103, measuring the S/G (gel time) value of the sample, and if the measured S/G range is within the interval of 250-260S, entering the next step if the ingredients are qualified;

step 2, impregnation: soaking glass fiber cloth into the ingredients prepared in the step 1, and drying to obtain a semi-solid sheet;

and 3, stacking: stacking at least one prepreg to a certain preset thickness so as to meet the requirements of different thicknesses;

and 4, combining: covering a single-sided or double-sided copper foil on the prepreg stacked in the step 3, combining the prepreg with a die, and then sending the combined prepreg into a hot press;

step 5, pressing: melting the resin in the prepreg at high temperature, and expelling bubbles under high pressure to gradually harden the resin and bond the resin with the copper foil to form a substrate;

step 6, checking: and cutting off the edge materials of the laminated substrate, and then checking the appearance, the thickness and the like to obtain a finished product.

Preferably, in the step 101, after the addition of the silica is completed, the rotation speed is not lower than 1000 r/Min.

Preferably, in the step 101, after the addition of the silica is completed, the stirring time is not less than 4.5H.

Preferably, in the step 103, the stirring is continuously carried out for not less than 5H.

Preferably, in the step 2, the specific steps of immersing the glass fiber cloth into the furnish prepared in the step 1 are as follows: driving the electronic-grade glass fiber cloth on a cloth rack of an impregnation machine, controlling the glass fiber cloth to advance by tension, enabling the glass cloth to pass through an impregnation groove full of glue, enabling the glass cloth soaked with the glue to enter an oven, volatilizing redundant solvent and carrying out further reaction on resin and a curing agent; and drying to obtain the semi-fixing sheet.

Preferably, the mold in the step 4 is a steel plate.

Preferably, in the pressing process in the step 5, the temperature is increased to 1.2-1.8 ℃/min, the pressure is 3.0Mpa, and the vacuum is 730 mmhg.

Preferably, in the step 104, the step of,

if the S/G is longer, adding 0.01-0.1 part of catalyst for accelerating the reaction;

if the S/G is shorter, additionally preparing a new ingredient with long S/G length according to the steps 101-103, uniformly mixing the new ingredient with the original ingredient, and then detecting the S/G, wherein in the preparation process of the new ingredient, the addition amount of the bisphenol A type bromine epoxy resin is increased by 10-20%.

Preferably, the temperature is controlled between 25 ℃ and 50 ℃ during the step 103 of curing.

The flame-retardant heat-resistant copper-clad foil epoxy fiberglass cloth-based laminated board prepared by the preparation method.

Has the advantages that:

the traditional glass fiber cloth substrate is formed by the cross-linking reaction of epoxy resin and a curing agent, and the heat resistance of the glass fiber cloth substrate is poor because the thermal expansion coefficient of the epoxy resin is as high as 80 PPm/DEG C. The invention introduces a certain proportion of inorganic filler (silicon dioxide, the thermal expansion coefficient of which is about 10-15 PPm/DEG C) to replace part of epoxy resin, thereby effectively improving the heat resistance of the glass fiber cloth substrate.

In general, a glass fabric substrate uses polyamine, acid anhydride, polyphenol, polythiol, or the like as a curing agent, and the curing agent has weak bonding force with a copper foil and weak peeling strength because no polar substance exists between molecules. The invention adopts a certain proportion of curing agent dicyandiamide or diaminodiphenyl sulfone with a molecular structure having polarity, and amine substances in the diaminodiphenyl sulfone or dicyandiamide curing agent belong to polar substances, so that the bonding force between the whole system and the copper foil can be improved, the adhesive force between an epoxy resin interface and the copper foil is enhanced, and the epoxy resin interface and the copper foil have higher peel strength.

Drawings

FIG. 1 shows a flow chart of the preparation in the example of the present invention.

In order to more clearly illustrate the detailed description of the invention or the technical solutions in the prior art, the drawings that are needed in the detailed description of the invention or the prior art will be briefly described below. Throughout the drawings, like elements or portions are generally identified by like reference numerals. In the drawings, elements or portions are not necessarily drawn to scale.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

The embodiment of the invention relates to a preparation method of a flame-retardant heat-resistant copper-clad foil epoxy fiberglass cloth-based laminated board.

Example 1:

1. preparing materials:

(1) and (3) filler dispersion: adding 96 parts by weight of bisphenol A type bromine epoxy resin into a high-speed stirrer barrel, adding 10 parts by weight of dimethyl formamide (DMF) (the DMF mainly adjusts viscosity to enable the filler to be better dispersed), pushing the batching barrel to a high-speed stirrer, starting the high-speed stirrer, adding 75 parts by weight of the filler (in the embodiment, the filler is silicon dioxide, the filler is powdery and has the purity of more than 99%), adding the filler while stirring, starting to stir each tank for more than 4.5H (hours) after the addition is finished, and starting to stir at least 1000r/Min when the filler is dispersed;

(2) resin tank feeding: then 3 parts of tetrafunctional epoxy resin and 200 parts of bisphenol A type bromine epoxy resin are added into a batching big tank according to the weight parts, after the resin amount is added, the resin with the filler is added into the batching tank, a stirrer is started during adding, the resin with the filler is added while stirring, before adding, the filler is confirmed to be completely dispersed in the resin (no agglomeration is seen by eyes, the complete dispersion can be seen), and the high-speed stirring and dispersion are continuously needed when the dispersion is not complete;

(3) adding a curing agent: after all the raw materials are added into a batching vat, 6.5 parts of curing agent dicyandiamide and 0.15 part of catalyst 1-cyano-2-ethyl-4-methylimidazole are added into the batching vat to fully generate curing reaction with the epoxy resin. Note: the process requires continuous stirring for more than 5H (hours) and the temperature is controlled at 30 ℃.

The cured resin and the curing agent are subjected to complete cross-linking reaction to form a high-density network structure. The filler is uniformly distributed in the resin. After curing, the heat resistance of the resin (including the filler) is greatly enhanced.

(4) Stopping and measuring S/G: after the reaction is carried out for 5 hours, a proper amount of glue solution is extracted by using a sampling product to test the S/G (curing time) of the glue solution in a laboratory, and the S/G range of the glue solution with the formula is as follows: 250S/G-260S/G. And after the product is qualified, carrying out the next step of impregnation and gluing production. If the S/G is too long, a proper amount of catalyst can be added to accelerate the reaction. If the S/G is shorter, glue with long S/G needs to be additionally arranged for uniform mixing. The preparation method can be configured by referring to the method, but the addition amount of the bisphenol A type bromine epoxy resin is 10-20% of the original formula.

1.1 the glue mainly comprises the following materials: 1. epoxy resin

2. Curing agent: dicyandiamide

3.1-cyano 2-ethyl 4-methylimidazole (catalyst)

4. Dimethylformamide (DMF) solvent

5. Silicon dioxide (Filler)

6. Tetrafunctional epoxy resin

Epoxy resins are typically stored by dissolving them in acetone and holding them in an iron drum at about 80% by weight.

The dicyandiamide is used as a curing agent, and the resin is subjected to crosslinking curing reaction at a proper temperature.

1-cyano-2-ethyl-4-methylimidazole is used as a catalyst to initiate and accelerate the curing speed, which is obvious for S/G adjustment.

DMF is used as a solvent for adjusting the viscosity of the glue and maintaining a relatively uniform and stable system, which is important for the sizing and semi-curing reaction in the TREATING process.

2. Impregnation:

the procedure is to immerse the glass fiber cloth into the prepared glue, and then to dry the glass fiber cloth to obtain a semi-solid piece with proper parameters for subsequent production.

The method comprises the following specific steps: the electronic-grade glass fiber cloth is driven on a cloth frame of an impregnation machine, the advance of the electronic-grade glass fiber cloth is controlled by tension, the glass cloth can pass through an impregnation tank (glue is pumped into the impregnation tank through a pipeline) which is impregnated with the glue, the glass fiber cloth impregnated with the glue can enter an oven, redundant solvent is volatilized, and further reaction of resin and curing agent is carried out. After drying, the product is a semi-finished product: prepreg (PP for short).

3. Stacking:

and matching PP with different PP numbers according to different thicknesses and plan requirements. And sending the stacked materials into a combination chamber.

4. Combining:

covering the PP stacked in front with a copper foil on one side or two sides, adding the die-steel plate, combining, and feeding into a hot press.

5. And (3) laminating:

melting the resin in the prepreg at high temperature, and expelling bubbles under high pressure to gradually harden the resin and adhere the resin to the copper foil. The fluidity of the resin is affected by the filler.

Hot-pressing procedure description: the hot pressing is to melt the (B-stage) semi-cured resin at high temperature and high pressure, completely expel the gas and completely cure the resin, and complete the firm bonding between the pp layers and the copper foil. According to the diffusion principle, the bonding is realized by mutual diffusion and permeation between macromolecules on the interface, and then interweaving is generated. In some embodiments, a hot and cold split vacuum laminator can be used for hot pressing, and the main process parameters are temperature rise, pressure and vacuum degree control. In this example, the temperature is controlled to 1.2-1.8 deg.C/min, the pressure is 3.0MPa, and the vacuum is 730 mmhg.

6. And (3) cutting and checking:

and cutting off the edge materials of the laminated substrate, and then, inspecting the appearance, the thickness and the like and then discharging. And obtaining the finished product of the flame-retardant heat-resistant copper foil-clad epoxy fiberglass cloth-based laminated board.

Example 2:

1. preparing materials:

(1) and (3) filler dispersion: firstly, 90 parts by weight of bisphenol A type bromine epoxy resin is added into a high-speed stirrer barrel, then 8 parts of dimethyl formamide (DMF) is added (DMF is mainly used for adjusting viscosity and enabling the filler to be better dispersed), the batching barrel is pushed to a position below the high-speed stirrer, the high-speed stirrer is started, 70 parts of filler (in the embodiment, the filler is aluminum hydroxide, the filler is in a powder shape, and the purity is more than 99 percent) is added, the filler is added while stirring, each tank is started to stir for more than 4.5H (hours) after the addition is finished, and when the filler is dispersed, the high-speed stirring is started to be more than 1000 r/Min;

(2) resin tank feeding: 2 parts of tetrafunctional epoxy resin and 180 parts of bisphenol A type bromoepoxy resin are added into a batching big tank according to the weight parts, after the addition of the resin amount is finished, the resin with the filler is added into the batching tank, a stirrer is started during the addition, the resin with the filler is added while stirring, before the addition, the filler is confirmed to be completely dispersed in the resin (no agglomeration is observed visually, the complete dispersion can be regarded as the complete dispersion), and the incomplete dispersion is continuously stirred and dispersed at a high speed;

(3) adding a curing agent: after all the raw materials are added into a batching vat, 5 parts of curing agent dicyandiamide and 0.1 part of catalyst 2-MI (dimethylimidazole) are added into the batching vat, so that the curing reaction is fully generated between the raw materials and the epoxy resin. Note: the process requires continuous stirring for more than 5H (hours) and the temperature is controlled at 30 ℃.

1.1 the glue mainly comprises the following materials: 1. epoxy resin

2. Curing agent: dicyandiamide

3. Dimethyl imidazole (catalyst)

4. Dimethylformamide (DMF) solvent

5. Aluminium hydroxide (Filler)

6. Tetrafunctional epoxy resin

2-MI is used as a catalyst to initiate and accelerate the cure rate, which is evident in the S/G adjustment.

DMF is used as a solvent for adjusting the viscosity of the glue and maintaining a relatively uniform and stable system of the glue, which is important for the sizing and semi-curing reaction in the Treating process.

2. Impregnation:

3. Stacking:

4. Combining:

5. And (3) laminating:

6. And (3) cutting and checking:

Example 3:

1. preparing materials:

(1) and (3) filler dispersion: firstly, 100 parts by weight of bisphenol A type bromine epoxy resin is added into a high-speed stirrer barrel, 12 parts of dimethyl formamide (DMF) is added (DMF is mainly used for adjusting viscosity and enabling the filler to be better dispersed), the batching barrel is pushed to a position below the high-speed stirrer, the high-speed stirrer is started, 80 parts of filler (in the embodiment, the type of the filler is barium sulfate, the filler is powdery, the purity is more than 99 percent) is added, the filler is added while stirring, each tank is started to stir for more than 4.5H (hours) after the addition is finished, and when the filler is dispersed, the high-speed stirring is started to be more than 1000 r/Min;

(2) resin tank feeding: then 4 parts of tetrafunctional epoxy resin and 220 parts of bisphenol A type bromine epoxy resin are added into a batching big tank according to the weight parts, after the resin amount is added, the resin with the filler is added into the batching tank, a stirrer is started during adding, the resin with the filler is added while stirring, before adding, the filler is confirmed to be completely dispersed in the resin (no agglomeration is observed visually, the complete dispersion can be regarded as complete dispersion), and the high-speed stirring is continuously used for dispersing when the incomplete dispersion is not obtained;

(3) adding a curing agent: after all the raw materials are added into a batching vat, 8 parts of curing agent dicyandiamide and 0.2 part of catalyst 2-MI (dimethylimidazole) are added into the batching vat, so that the curing reaction is fully generated between the curing agent dicyandiamide and the epoxy resin. Note: the process requires continuous stirring for more than 5H (hours) and the temperature is controlled at 30 ℃.

1.1 the glue mainly comprises the following materials: 1. epoxy resin

2. Curing agent: dicyandiamide

3. Dimethyl imidazole (catalyst)

4. Dimethylformamide (DMF) solvent

5. Barium sulfate (Filler)

6. Tetrafunctional epoxy resin

2. Impregnation:

3. Stacking:

and matching PP with different PP numbers according to different thicknesses according to the plan requirement. And sending the stacked materials into a combination chamber.

4. Combining:

5. And (3) laminating:

6. And (3) cutting and checking:

Comparative example 1 (without silica instead of part of the resin):

1. preparing materials:

(1) and (3) filler dispersion: firstly, 100 parts by weight of bisphenol A type bromine epoxy resin is added into a high-speed stirrer barrel, 12 parts of dimethyl formamide (DMF) is added (DMF is mainly used for adjusting viscosity to enable filler to be better dispersed), the batching barrel is pushed to the position below the high-speed stirrer, the high-speed stirrer is started, 80 parts of bisphenol A type bromine epoxy resin is added, the filler is added while stirring, each tank is started to stir for more than 4.5H (hours) after the addition is finished, and the high-speed stirring is started to reach more than 1000r/Min when the filler is dispersed;

1.1 the glue mainly comprises the following materials: 1. epoxy resin

2. Curing agent: dicyandiamide

3. Dimethyl imidazole (catalyst)

4. Dimethylformamide (DMF) solvent

5. Tetrafunctional epoxy resin

2. Impregnation:

3. Stacking:

4. Combining:

5. And (3) laminating:

6. And (3) cutting and checking:

Comparative example 2 (with other curing agents):

1. preparing materials:

(3) adding a curing agent: after all the raw materials are added into a batching vat, 6.5 parts of curing agent polyamine and 0.15 part of catalyst 1-cyano-2-ethyl-4-methylimidazole are added into the batching vat to fully generate curing reaction with the epoxy resin. Note: the process requires continuous stirring for more than 5H (hours) and the temperature is controlled at 30 ℃.

1.1 the glue mainly comprises the following materials: 1. epoxy resin

2. Curing agent: polyamines

3. Dimethyl imidazole (catalyst)

4. Dimethylformamide (DMF) solvent

5. Tetrafunctional epoxy resin

2. Impregnation:

3. Stacking:

4. Combining:

5. And (3) laminating:

6. And (3) cutting and checking:

The following table is a table of performance parameters of the flame-retardant and heat-resistant copper foil-clad epoxy fiberglass cloth-based laminate obtained in each example.

Table 1 the performance parameters of each of the examples table T288 indicates the maximum time that the substrate can withstand the high temperatures of welding at 288 c without blistering, delamination, and other decomposition phenomena. As can be seen from the above table, the Tg in comparative example 1 is significantly lower than that in examples 1 to 3 of the present invention, because the present invention introduces a certain proportion of inorganic filler (such as silica, whose thermal expansion coefficient is about 10-15 PPm/DEG C) to replace part of epoxy resin, which effectively improves the heat resistance of the glass fiber cloth substrate.

The peel strength in comparative example 2 is obviously lower than that in examples 1 to 3, because the amine substance in the diaminodiphenyl sulfone or dicyandiamide curing agent of the invention belongs to a polar substance, the bonding force between the whole system and the copper foil can be improved, the adhesion between the epoxy resin interface and the copper foil is enhanced, and the peel strength is higher.

According to the invention, the glass fiber cloth-based laminated board prepared by the reasonable proportioning of the ingredients has good performance, low manufacturing cost and high cost performance.

The invention will now be further described with reference to the accompanying drawings. The above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention, and they should be construed as being included in the following claims and description.

Claims

1. The preparation method of the flame-retardant heat-resistant copper foil-coated epoxy fiberglass cloth-based laminated board is characterized by comprising the following steps of:

step 1, preparing ingredients;

wherein, the preparation of the ingredients comprises the following steps:

step 103, adding a curing agent: adding 5-8 parts of dicyandiamide and 0.1-0.2 part of catalyst dimethylimidazole or 1-cyano 2-ethyl 4-methylimidazole into the mixture obtained in the step 102, and continuously stirring to enable the mixture and the mixture to fully generate a curing reaction to form an ingredient;

step 104, stopping and measuring S/G: extracting a sample from the ingredients formed in the step 103, measuring the S/G value of the sample, and if the measured S/G range is within the interval of 250-260S, entering the next step if the ingredients are qualified;

2. The method for preparing a flame-retardant heat-resistant copper foil-coated epoxy glass fiber cloth base laminated board according to claim 1, wherein in the step 101, after the addition of the silicon dioxide is completed, the rotating speed is not lower than 1000 r/Min.

3. The method for preparing the flame-retardant heat-resistant copper foil-coated epoxy fiberglass cloth-based laminated board as claimed in claim 1 or 2, wherein in the step 101, after the addition of the silicon dioxide is completed, the stirring time is not less than 4.5H.

4. The method for preparing the flame-retardant heat-resistant copper foil-coated epoxy fiberglass cloth-based laminated board as claimed in claim 1, wherein in the step 103, the stirring is continuously carried out for not less than 5H.

5. The method for preparing the flame-retardant and heat-resistant copper foil-coated epoxy fiberglass cloth-based laminated board as claimed in claim 1, wherein in the step 2, the specific steps of immersing the fiberglass cloth into the ingredients prepared in the step 1 are as follows: driving the electronic-grade glass fiber cloth on a cloth rack of an impregnation machine, controlling the glass fiber cloth to advance by tension, enabling the glass cloth to pass through an impregnation groove full of glue, enabling the glass cloth soaked with the glue to enter an oven, volatilizing redundant solvent and carrying out further reaction on resin and a curing agent; and drying to obtain the semi-fixing sheet.

6. The method for preparing the flame-retardant and heat-resistant copper foil-coated epoxy fiberglass cloth-based laminated board as claimed in claim 1, wherein the mold in the step 4 is a mold-steel plate.

7. The method for preparing the flame-retardant heat-resistant copper foil-coated epoxy fiberglass cloth-based laminated board as claimed in claim 1, wherein in the step 5, during the pressing process, the temperature is controlled to be 1.2-1.8 ℃/min, the pressure is 3.0Mpa, and the vacuum is 730 mmhg.

8. The method for preparing the flame-retardant and heat-resistant copper foil-coated epoxy fiberglass cloth-based laminated board as claimed in claim 1, wherein in the step 104,

9. The method for preparing the flame-retardant and heat-resistant copper foil-coated epoxy fiberglass cloth-based laminated board as claimed in claim 1, wherein the temperature is controlled to be between 25 and 50 ℃ during the curing process of step 103.

10. The flame-retardant heat-resistant copper-clad epoxy fiberglass cloth-based laminated board prepared by the preparation method of claims 1-9.