CN104985909A - Manufacturing method for high-thermal-conductivity and high-heat-resistance copper-clad plate - Google Patents
Manufacturing method for high-thermal-conductivity and high-heat-resistance copper-clad plate Download PDFInfo
- Publication number
- CN104985909A CN104985909A CN201510317910.7A CN201510317910A CN104985909A CN 104985909 A CN104985909 A CN 104985909A CN 201510317910 A CN201510317910 A CN 201510317910A CN 104985909 A CN104985909 A CN 104985909A
- Authority
- CN
- China
- Prior art keywords
- high heat
- preparation
- heat conduction
- copper
- overlay coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/12—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by using adhesives
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/04—Layered products comprising a layer of metal comprising metal as the main or only constituent of a layer, which is next to another layer of the same or of a different material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B15/00—Layered products comprising a layer of metal
- B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/06—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the heating method
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B37/00—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding
- B32B37/10—Methods or apparatus for laminating, e.g. by curing or by ultrasonic bonding characterised by the pressing technique, e.g. using action of vacuum or fluid pressure
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
- B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
- B32B2262/10—Inorganic fibres
- B32B2262/101—Glass fibres
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/302—Conductive
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2307/00—Properties of the layers or laminate
- B32B2307/30—Properties of the layers or laminate having particular thermal properties
- B32B2307/306—Resistant to heat
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B32—LAYERED PRODUCTS
- B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
- B32B2551/00—Optical elements
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
Landscapes
- Chemical & Material Sciences (AREA)
- Physics & Mathematics (AREA)
- Fluid Mechanics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a manufacturing method for a high-thermal-conductivity and high-heat-resistance copper-clad plate. The method comprises the steps of preparing a veneer glue solution and an inner material layer glue solution, applying the glue solutions, and conducting overlapping and hot pressing. The veneer glue solution comprises modified epoxy resin, four-functional-group epoxy resin, an amine curing agent, an imidazole curing accelerator, a silane coupling agent KH560, an efficient fire retardant and a veneer filler and adopts a composition of any one or more of acetone, butanone and dimethyl formamide as a solvent for preparation. The inner material layer glue solution comprises low-brominated epoxy resin, an amine curing agent, an imidazole curing accelerator, a silane coupling agent KH560 and an inner material layer filler and adopts a composition of any one or more of acetone, butanone and dimethyl formamide as a solvent for preparation. According to the copper-clad plate obtained through the manufacturing method, the CTI value is larger than or equal to 600 V, the copper-clad plate has the efficient heat conduction performance, the heat conductivity is larger than or equal to 1.7 W/mk, and the using requirement for the higher safety of an LED product can be met; the copper-clad plate has the perfect heat resistance.
Description
Technical field
The present invention relates to copper-clad plate field, particularly relate to the preparation method of the high heat conduction of a kind of LED, high heat-resisting, high CTI FR-4 copper-clad plate.
Background technology
LED (semiconductor two pole luminous tube) is called as forth generation light source technology, have: the features such as energy-saving and environmental protection, life-span length, low-power consumption, high brightness, be widely used in the fields such as various instruction, display, decoration, illumination, especially LED illumination market is considered to the application that LED is most important, most develops always.LED is as solid-state light cold light source of new generation, throws light on for a long time in the various places being applicable to people closely bound up; Along with the development of LED technology, wideling popularize of application, its luminous efficiency and the caloric value increased substantially are faced with harsh challenge, in the led element, if the thermal impedance of module and circuit board is excessive, its luminous efficiency will reduce, so how substrate discharges the amount of heat of generation and high-termal conductivity just becomes key.
The U.S. UL with IEC is according to CTI (the relative electric trace index) level of insulating materials, and delimiting CTI value >=600V is highest ranking, and the copper-clad plate that CTI value is low uses for a long time under the adverse circumstances such as high pressure, high temperature, humidity, is easier to produce creepage trace; CTI value≤the 400V of current common composite-based copper clad plate (CEM-3) and the copper-clad plate of classical V-belt driving base, all can not meet the instructions for use of electric equipment products greater security; LED product is much in outwork state, environment is relatively more severe, so possess high proof tracking, is one of key factor affecting LED product security, and the wire pitch of circuit board is less in the led element, the copper-clad plate of high CTI is just applicable to making high density circuit board very much.
After promulgating from European Union ROHS instruction, require to use the voice of unleaded solder encapsulation more surging, along with the arrival in unleaded epoch, nowadays unleaded solder melt temperature about 220 DEG C has been become from the melt temperature 183 DEG C of the leaded eutectic solder flux of tradition, solder temperature increases substantially, and therefore requires that substrate has better heat resistance to meet the leadless process of PCB.
The publication number announced on October 5th, 2011 is the patent of invention " the high heat-resisting CEM-3 copper-clad plate of the high heat conduction of LED " of CN.102205675, obtained composite-based copper clad plate not only has outside the key propertys such as good electric property, also has good thermal conductivity, heat resistance etc.But the CTI value of its material may not necessarily >=600V, and due to glass mat stability, bending strength, moisture-proof etc. poor, thus the stability etc. of product quality after PCB processability and processing may be affected.
In addition, at present, in LED-baseplate, general is all adopt CEM-3 composite base plate as substrate materials, the vitrification point of general common CEM-3 copper-clad plate, resistance to dip solderability, insulaion resistance, electric properties etc. all can reach the standard of FR-4 copper-clad plate, difference is the dimensional stability of CEM-3 material, flexural strength, moisture-proof is lower than FR-4 copper-clad plate, thermal coefficient of expansion is higher than FR-4 copper-clad plate, thus affect the stability etc. of PCB processability and the rear product quality of processing, and dimensional stability is related to the precision of wiring board processing and components and parts assembling, the sheet material that thermal coefficient of expansion is excessive, its through hole reliability is poor, this sheet material is violent dilation when PCB hot air leveling or wave-soldering, easily occur that through hole breaks, form open circuit, LED product some be in outwork state for a long time, as moisture-proof is poor, use under rugged environment for a long time, be easier to the phenomenon such as layering occurs, thus affect the service life etc. of LED product.
Summary of the invention
The object of the present invention is to provide a kind of CTI value can reach the high heat conduction of LED of the highest ranking that UL and IEC delimit, the preparation method of high heat-resisting, high CTI FR-4 copper-clad plate.
To achieve these goals, the preparation method of high heat conduction provided by the invention, high heat-resistant copper-clad panel, the steps include: to prepare overlay coating glue respectively and interior bed of material glue---gluing---is superimposed, hot pressing;
Overlay coating glue composition comprises: modified epoxy, four functional group's epoxy resin, amine curing agent, imidazoles curing accelerator, silane coupler KH560, efficient flame-retarding agent and overlay coating filler; Adopt acetone, butanone, the composition of any or more than one is prepared as solvent in dimethyl formamide;
Interior bed of material glue composition comprises: low brominated epoxy, amine curing agent, imidazoles curing accelerator, silane coupler KH560 and interior bed of material filler; Adopt acetone, butanone, the composition of any or more than one is prepared as solvent in dimethyl formamide;
Gluing comprises overlay coating gluing and interior bed of material gluing, and gluing process is: by glass fabric leaching with the overlay coating glue prepared or interior bed of material glue, dries obtained prepreg through vertical gluing machine;
Superimposed, hot pressing: put up bed of material prepreg in surface layer prepreg and more than by two neatly superimposed, two-sided coated with Copper Foil, compressing through vacuum hotpressing machine.
In some embodiments, in overlay coating glue, each Parts by Ingredients is:
In some embodiments, in interior bed of material glue, each Parts by Ingredients is:
In some embodiments, modified epoxy is epoxide equivalent 312 ~ 338g/eq modified epoxy, and its bromine content is 13% ~ 15%.
In some embodiments, low brominated epoxy is the low brominated epoxy of epoxide equivalent 412 ~ 437g/eq, and its bromine content is 20%.
In some embodiments, four functional group's epoxy resin are epoxide equivalent 192 ~ 206g/eq tetra-functional group epoxy resin.
In some embodiments, adopt dicyandiamide as amine curing agent.
In some embodiments, adopt methylimidazole as imidazoles curing accelerator.
In some embodiments, efficient flame-retarding agent is Sb
2o
3(antimony oxide).
In some embodiments, overlay coating filler is ultrafine aluminium hydroxide, and its particle diameter D50≤1.9um.
In some embodiments, interior bed of material filler adopts aluminium oxide, high-purity magnesium oxide, silica, talcum powder as filler.
In some embodiments, adopt acetone and dimethyl formamide combination as solvent.
In some embodiments, in overlay coating gumming step, gluing speed is 16 ~ 20m, oil temperature is 212 ~ 228 DEG C, controling parameters; Its prepreg gel time is 112 ~ 128S, and solids content is 44.5 ~ 45.5%, and fluidity is 22 ~ 25%;
In interior bed of material gumming step, gluing speed is 12 ~ 20m, oil temperature is 212-228 DEG C, controling parameters; Its prepreg gel time is 102 ~ 128S, and solids content is 42 ~ 53%, and fluidity is 15 ~ 34%;
In superimposed, heat-press step, pressing parameter control be: vacuum 20 → 60torro, pressure 0.4 ~ 3.2Mpa, temperature of heat plate 122 ~ 198 DEG C, heating rate 2 ~ 3 DEG C/min, altogether press time 118 ~ 158min.
The preparation method of high heat conduction provided by the invention, high heat-resistant copper-clad panel, compared with prior art, has the following advantages:
The mode that the present invention is separately modulated by overlay coating glue and interior bed of material glue, the modified epoxy that brominated amount is lower is used in formula, interpolation is specifically designed to the filler of raising sheet material CTI value in a large number and adds a large amount of excellent high-efficiency heat conduction type filler and other functional form fillers, improves the various performances of sheet material; By the substrate after hot-forming, its CTI value >=600V, and there is efficient heat conductivility, its thermal conductivity >=1.7W/mk, can meet the instructions for use of LED product greater security, also can well solve LED product quick heat radiating problem; Also there is splendid heat resistance simultaneously, meet PCB leadless process; At present in LED-baseplate, general is all adopt CEM-3 composite base plate as substrate materials, the present invention all uses glass fabric as reinforcing material first, the deficiency in some performances of composite base plate is made up with this, as: the problems such as the dimensional stability of CEM-3 material, flexural strength, moisture-proof are poor, and the coefficient of expansion is higher.
Detailed description of the invention
Explanation that the present invention is described in further detail below by specific embodiment.
The preparation method of high heat conduction provided by the invention, high heat-resistant copper-clad panel, the steps include: to prepare overlay coating glue respectively and interior bed of material glue---gluing---is superimposed, hot pressing.
S1: preparation overlay coating glue
Overlay coating glue comprises following composition (weight portion):
According to said ratio institute association surface layer with after glue uniform stirring 8h, gel time 264S.
Wherein, epoxide equivalent is 320g/eq, the modified epoxy (this resin is bisphenol A type epoxy resin and brominated epoxy resin copolymer) of bromine content 14.5%; The height of bromine content directly can have influence on sheet material CTI is worth height, because brominated flame-retardant instability when being heated, and easy carbonization;
Four functional group's epoxy resin of epoxide equivalent 195g/eq; Main Function: improve sheet material heat resistance and resistance to UV-block;
Sb
2o
3as efficient flame-retarding agent; Main Function: with bromine cooperative flame retardant, after making up bromine content reduction with this, flame retardant effect is not good.
S2: bed of material glue in preparation
Interior bed of material glue comprises following composition (weight portion)
After joining interior bed of material glue uniform stirring 8h according to said ratio, gel time 252S.
Wherein, aluminium oxide, high-purity magnesium oxide, silica, talcum powder are as filler, and aluminium oxide, high-purity magnesium oxide have high thermal conductivity, and silica can improve sheet material heat resistance, mechanical strength etc.
S3: overlay coating gluing
By glass fabric leaching with above-mentioned obtained overlay coating glue, dry obtained prepreg through vertical gluing machine; Gluing speed 18.5m/min, oil temperature 218 DEG C, controling parameters; Its prepreg gel time is 115 ± 5S, solids content 45%, fluidity 23.8%.
S4: interior bed of material gluing
By glass fabric leaching with above-mentioned obtained in bed of material glue, dry obtained prepreg through vertical gluing machine; Gluing speed 12m/min, oil temperature 215 DEG C, controling parameters; Its prepreg gel time is 105 ± 5S, solids content 55%, fluidity 33.4%.
S5: superimposed
According to sheet material desired thickness, for 1.0mm heavy-gauge sheeting, by neatly superimposed for the overlay coating prepreg R/C45% and 2 of 2 first-class glue interior bed of material prepreg R/C55%, overlay coating prepreg is positioned at the upper and lower both sides of bed of material prepreg.
S6: hot pressing
Superimposed good plate is two-sided coated with Copper Foil, hot-forming through vacuum hotpressing machine, and concrete pressing parameter is as follows:
Vacuum: 20 → 60torro
Surface pressure: 0.4 ~ 2.8Mpa
Temperature: 120 ~ 195 DEG C
Heating rate: 2 DEG C/min
Press time altogether: 155min
When temperature is the highest 195 DEG C, also should be maximal pressure 2.8Mpa mutually, this stage running time is 40min.
By above-mentioned steps, the test data of obtained high heat conduction, the preparation method of high heat-resistant copper-clad panel is:
In sum, the preparation method of high heat conduction provided by the invention, high heat-resistant copper-clad panel, by the mode that overlay coating glue and interior bed of material glue are separately modulated, the modified epoxy that brominated amount is lower is used in formula, interpolation is specifically designed to the filler of raising sheet material CTI value in a large number and adds a large amount of excellent high-efficiency heat conduction type filler and other functional form fillers, improves the various performances of sheet material; By the substrate after hot-forming, its CTI value >=600V, and there is efficient heat conductivility, its thermal conductivity >=1.7W/mk, can meet the instructions for use of LED product greater security, also can well solve LED product quick heat radiating problem; Also there is splendid heat resistance simultaneously, meet PCB leadless process; At present in LED-baseplate, general is all adopt CEM-3 composite base plate as substrate materials, the present invention all uses glass fabric as reinforcing material first, the deficiency in some performances of composite base plate is made up with this, as: the problems such as the dimensional stability of CEM-3 material, flexural strength, moisture-proof are poor, and the coefficient of expansion is higher.
A series of detailed description listed is above only illustrating for feasibility embodiment of the present invention; they are also not used to limit the scope of the invention, all do not depart from the skill of the present invention equivalent implementations done of spirit or change all should be included within protection scope of the present invention.
To those skilled in the art, obviously the invention is not restricted to the details of above-mentioned one exemplary embodiment, and when not deviating from spirit of the present invention or essential characteristic, the present invention can be realized in other specific forms.Therefore, no matter from which point, all should embodiment be regarded as exemplary, and be nonrestrictive, scope of the present invention is limited by claims instead of above-mentioned explanation, and all changes be therefore intended in the implication of the equivalency by dropping on claim and scope are included in the present invention.
In addition, be to be understood that, although this description is described according to embodiment, but not each embodiment only comprises an independently technical scheme, this narrating mode of description is only for clarity sake, those skilled in the art should by description integrally, and the technical scheme in each embodiment also through appropriately combined, can form other embodiments that it will be appreciated by those skilled in the art that.
Claims (10)
1. the preparation method of high heat conduction, high heat-resistant copper-clad panel, the steps include: to prepare overlay coating glue respectively and interior bed of material glue---gluing---is superimposed, hot pressing;
It is characterized in that, described overlay coating glue composition comprises: modified epoxy, four functional group's epoxy resin, amine curing agent, imidazoles curing accelerator, silane coupler KH560, efficient flame-retarding agent and overlay coating filler; Adopt acetone, butanone, the composition of any or more than one is prepared as solvent in dimethyl formamide;
Described interior bed of material glue composition comprises: low brominated epoxy, amine curing agent, imidazoles curing accelerator, silane coupler KH560 and interior bed of material filler; Adopt acetone, butanone, the composition of any or more than one is prepared as solvent in dimethyl formamide;
Described gluing comprises overlay coating gluing and interior bed of material gluing, and described gluing process is: by glass fabric leaching with the overlay coating glue prepared or interior bed of material glue, dries obtained prepreg through vertical gluing machine;
Superimposed, hot pressing: put up bed of material prepreg in surface layer prepreg and more than by two neatly superimposed, two-sided coated with Copper Foil, compressing through vacuum hotpressing machine.
2. the preparation method of high heat conduction according to claim 1, high heat-resistant copper-clad panel, is characterized in that, in described overlay coating glue, each Parts by Ingredients is:
3. the preparation method of high heat conduction according to claim 1, high heat-resistant copper-clad panel, is characterized in that, in described interior bed of material glue, each Parts by Ingredients is:
4. the preparation method of high heat conduction according to claim 2, high heat-resistant copper-clad panel, is characterized in that, described modified epoxy is epoxide equivalent 312 ~ 338g/eq modified epoxy, and its bromine content is 13% ~ 15%.
5. the preparation method of high heat conduction according to claim 3, high heat-resistant copper-clad panel, is characterized in that, described low brominated epoxy is the low brominated epoxy of epoxide equivalent 412 ~ 437g/eq, and its bromine content is 20%.
6. the preparation method of high heat conduction according to claim 2, high heat-resistant copper-clad panel, is characterized in that, described four functional group's epoxy resin are epoxide equivalent 192 ~ 206g/eq tetra-functional group epoxy resin.
7. the high heat conduction according to Claims 2 or 3, the preparation method of high heat-resistant copper-clad panel, is characterized in that, adopts dicyandiamide as described amine curing agent.
8. the high heat conduction according to Claims 2 or 3, the preparation method of high heat-resistant copper-clad panel, is characterized in that, adopts methylimidazole as imidazoles curing accelerator.
9. the preparation method of high heat conduction according to claim 2, high heat-resistant copper-clad panel, is characterized in that, described efficient flame-retarding agent is Sb
2o
3(antimony oxide), described overlay coating filler is ultrafine aluminium hydroxide, and its particle diameter D50≤1.9um, described interior bed of material filler adopts aluminium oxide, high-purity magnesium oxide, silica, talcum powder as filler.
10. the high heat conduction according to Claims 2 or 3, the preparation method of high heat-resistant copper-clad panel, it is characterized in that, adopt acetone and dimethyl formamide combination as solvent, in overlay coating gumming step, gluing speed is 16 ~ 20m, oil temperature is 212 ~ 228 DEG C, controling parameters; Its prepreg gel time is 112 ~ 128S, and solids content is 44.5 ~ 45.5%, and fluidity is 22 ~ 25%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510317910.7A CN104985909A (en) | 2015-06-05 | 2015-06-05 | Manufacturing method for high-thermal-conductivity and high-heat-resistance copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510317910.7A CN104985909A (en) | 2015-06-05 | 2015-06-05 | Manufacturing method for high-thermal-conductivity and high-heat-resistance copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN104985909A true CN104985909A (en) | 2015-10-21 |
Family
ID=54297856
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201510317910.7A Pending CN104985909A (en) | 2015-06-05 | 2015-06-05 | Manufacturing method for high-thermal-conductivity and high-heat-resistance copper-clad plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104985909A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105542394A (en) * | 2015-12-23 | 2016-05-04 | 陕西生益科技有限公司 | Halogen-free resin composition and application thereof |
| CN105667012A (en) * | 2016-01-15 | 2016-06-15 | 广德龙泰电子科技有限公司 | Lead-free copper clad laminate with CAF resistance and high Tg |
| CN107245221A (en) * | 2017-05-23 | 2017-10-13 | 建滔电子材料（江阴）有限公司 | A kind of unleaded high heat-resistant copper-clad panel production glue |
| CN110437585A (en) * | 2019-08-15 | 2019-11-12 | 重庆德凯实业股份有限公司 | One kind covering copper foil epoxy glass fiber fabric base laminate and its preparation process |
| CN110588116A (en) * | 2019-09-04 | 2019-12-20 | 重庆德凯实业股份有限公司 | Flame-retardant heat-resistant copper foil-coated epoxy glass fiber cloth-based laminated board and preparation method thereof |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101864146A (en) * | 2010-06-13 | 2010-10-20 | 宏昌电子材料股份有限公司 | Epoxy resin composition for printed circuit copper-clad plate |
| CN104002524A (en) * | 2014-04-18 | 2014-08-27 | 南通诺德电子有限公司 | Making method for high thermal conductive, high heat resistant and high CTI FR-4 copper-clad plate |
| CN104527159A (en) * | 2014-12-11 | 2015-04-22 | 广东生益科技股份有限公司 | Thermosetting resin composition for degradable heat-conducting aluminum based copper clad laminate, heat-conducting aluminum based copper clad laminate, preparation method and recovery method thereof |
-
2015
- 2015-06-05 CN CN201510317910.7A patent/CN104985909A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101864146A (en) * | 2010-06-13 | 2010-10-20 | 宏昌电子材料股份有限公司 | Epoxy resin composition for printed circuit copper-clad plate |
| CN104002524A (en) * | 2014-04-18 | 2014-08-27 | 南通诺德电子有限公司 | Making method for high thermal conductive, high heat resistant and high CTI FR-4 copper-clad plate |
| CN104527159A (en) * | 2014-12-11 | 2015-04-22 | 广东生益科技股份有限公司 | Thermosetting resin composition for degradable heat-conducting aluminum based copper clad laminate, heat-conducting aluminum based copper clad laminate, preparation method and recovery method thereof |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105542394A (en) * | 2015-12-23 | 2016-05-04 | 陕西生益科技有限公司 | Halogen-free resin composition and application thereof |
| CN105542394B (en) * | 2015-12-23 | 2017-10-24 | 陕西生益科技有限公司 | A kind of halogen-free resin composition and its application |
| CN105667012A (en) * | 2016-01-15 | 2016-06-15 | 广德龙泰电子科技有限公司 | Lead-free copper clad laminate with CAF resistance and high Tg |
| CN107245221A (en) * | 2017-05-23 | 2017-10-13 | 建滔电子材料（江阴）有限公司 | A kind of unleaded high heat-resistant copper-clad panel production glue |
| CN107245221B (en) * | 2017-05-23 | 2019-06-07 | 建滔电子材料（江阴）有限公司 | Glue is used in a kind of unleaded high heat-resistant copper-clad panel production |
| CN110437585A (en) * | 2019-08-15 | 2019-11-12 | 重庆德凯实业股份有限公司 | One kind covering copper foil epoxy glass fiber fabric base laminate and its preparation process |
| CN110588116A (en) * | 2019-09-04 | 2019-12-20 | 重庆德凯实业股份有限公司 | Flame-retardant heat-resistant copper foil-coated epoxy glass fiber cloth-based laminated board and preparation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104002524B (en) | Making method for high thermal conductive, high heat resistant and high CTI FR-4 copper-clad plate | |
| CN104985909A (en) | Manufacturing method for high-thermal-conductivity and high-heat-resistance copper-clad plate | |
| CN100519179C (en) | Preparation method of glass transition temperature halogenless fire retardant glass cloth laminated board | |
| CN102134375B (en) | Halogen-free Tg resin composite and presoaked material and laminated board made by adopting same | |
| CN103881299B (en) | Non-halogen resin composition and application thereof | |
| CN105172297A (en) | Flame-resistant and heat-resistant copper clad laminate preparation method | |
| TW201348323A (en) | Halogen-free resin composition | |
| CN109575523B (en) | High-thermal-conductivity resin composition for copper-clad plate | |
| EP2706091A1 (en) | Epoxy resin composition, and prepreg and copper clad laminate made therefrom | |
| CN103554834A (en) | Halogen-free high frequency resin composition | |
| CN102205675A (en) | High thermal conductivity and high heat-resistant copper-clad lamination of CEM-3 grade for LED | |
| CN103724997B (en) | A kind of Halogen low water suction thermoset fire-proof resin composition and application | |
| CN109337288A (en) | A kind of unleaded high CTI resin combination for copper-clad plate | |
| CN111704785A (en) | Glue solution for halogen-free high-CTI copper-clad plate and preparation method and application thereof | |
| CN106274003A (en) | A kind of high Tg, low Dk and the manufacture method of low Df copper-clad plate | |
| CN101955678B (en) | Flame retardant thermosetting resin composition and copper-clad plate | |
| CN104002538A (en) | Making method for super-thick copper foil and high heat-conducting copper clad laminate | |
| CN108456387B (en) | Glass fiber-free polytetrafluoroethylene film, and manufacturing method and application thereof | |
| CN109679288A (en) | A kind of high CTI resin combination of Halogen for copper-clad plate | |
| CN109265654A (en) | Resin combination and its manufactured prepreg, laminate | |
| CN105694451A (en) | A halogen-free resin composition, a prepreg, a laminated plate and a circuit board | |
| TWI421297B (en) | Halogen-free resin composition and its application of copper foil substrate and printed circuit board | |
| CN104531030A (en) | Epoxy resin adhesive, flexible copper-clad plate prepared from adhesive and preparation method of flexible copper-clad plate | |
| CN106218192A (en) | A kind of manufacture method of high heat-resisting CEM 3 copper-clad plate of LED halogen-free high-thermal-conductivity | |
| CN110435254B (en) | Preparation method of CEM-3 copper-clad plate with high heat resistance and high CTI (comparative tracking index) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20151021 |
|
| WD01 | Invention patent application deemed withdrawn after publication |