CN109679288A - A kind of high CTI resin combination of Halogen for copper-clad plate - Google Patents
A kind of high CTI resin combination of Halogen for copper-clad plate Download PDFInfo
- Publication number
- CN109679288A CN109679288A CN201811601758.5A CN201811601758A CN109679288A CN 109679288 A CN109679288 A CN 109679288A CN 201811601758 A CN201811601758 A CN 201811601758A CN 109679288 A CN109679288 A CN 109679288A
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- Prior art keywords
- halogen
- copper
- clad plate
- resin combination
- epoxy resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/56—Amines together with other curing agents
- C08G59/58—Amines together with other curing agents with polycarboxylic acids or with anhydrides, halides, or low-molecular-weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/62—Alcohols or phenols
- C08G59/621—Phenols
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0313—Organic insulating material
- H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
- H05K1/0373—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement containing additives, e.g. fillers
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/22—Halogen free composition
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The present invention discloses a kind of high CTI resin combination of the Halogen for copper-clad plate, by organic solid content based on 100 parts by weight (PHR), composition includes following main component: (a) 60~80PHR of mixture of phosphorous epoxy resin and other epoxy resin；(b) 20~40PHR of curing agent；(c) 0.01~1PHR of curing accelerator；(d) 30~70PHR of inorganic filler；(e) 3~10PHR of phosphonium flame retardant；(f) 0.01~1PHR of silane coupling agent；(g) solvent is appropriate.And there is excellent proof tracking index (CTI >=600V) by copper-clad laminate prepared by above-mentioned halogen-free composition, there are high glass-transition temperature, high heat resistance, fire-retardant the advantages of reaching UL-94V0 grades simultaneously, the environment-protective halogen-free electronic material of the high CTI demands such as white domestic appliances, inverter, outdoor charging pile can be widely used in.
Description
Technical field
The present invention relates to copper-clad laminate field technologies, refer in particular to a kind of high CTI resin of the Halogen for copper-clad plate
Composition can meet halogen-free environmental demand with performances such as high CTI, high glass-transition temperature, high heat resistance, be suitable for inverse
Become the resin combination that the circuit boards such as device, outdoor charging pile use.
Background technique
With the rapid development of electronic technology, the influence that electronic product generates environment is got worse, especially generate big
Electronic waste product is measured, Most electronic product is fire-retardant using halogen system at present, and after halogen system burning, not only smoke amount is big, smell
It is unpleasant, and the very strong hydrogen halide of corrosivity can be generated.
In order to deal carefully with the electric waste of these substantial amounts, while precious resource is recycled, European Union exists
There are within 2002 the instruction of significant impact, respectively WEEE and RoHS instruction to electronic electric equipment product by two.In addition to Europe
Outside alliance, all actively formulation environmental regulation is minimum to which the harmful substance contents in waste can be made to be reduced to for world community, and
It is required that each manufacturer or supplier undertake relevant responsibility, to reduce the impact to environment.Therefore exploitation halogen-free flame-retardant
Baseplate material it is imperative, have become the industrial emphasis of industry.
In order to improve the security reliability of electronic product, special printed circuit board makes under moist, environmental condition easy to pollute
Insulating reliability, the copper-clad plate with high creepage trace index (CTI) is also just come into being, and is widely applied.And
Simple halogen-free copper-clad plate is difficult adverse circumstances, the plate surfaces such as adaptation high pressure, high temperature, humidity, filth and creepage trace easily occurs
Phenomenon leads to fire when serious.
To the operating voltage of the CTI of plate and PCB, minimum wire spacing (minimum leakage distance in IEC-950 standard
Minimum Creepage Distance) relationship dictate, the high copper-clad plate of CTI value is not only suitable in high pollution degree, height
It has a meeting, an audience, etc. well under one's control and closes lower use, be also very suitable for production high density printed wiring board.
Use DICY as curing agent in 106519569 A of Chinese patent CN, though there is preferable phase ratio creepage tracking to refer to
Number (CTI), but its that there are heat resistances is poor, and glass transition temperature is lower, it is difficult to meet the increasingly developed height of current industry
Tg and high heat resistance demand.
Therefore, developing one kind has high relative discharge tracking index (CTI), and has good heat resistance, higher glass
Change transition temperature, the composition epoxy resin for being able to satisfy halogen-free environmental demand is the urgent need of current industry development.
Summary of the invention
In view of this, in view of the deficiencies of the prior art, the present invention aims to provide one kind to be used for copper-clad plate
The high CTI resin combination of Halogen, with this composition production copper-clad laminate have high creepage trace index (CTI
>=600V), good heat resistance, high glass-transition temperature, fire retardant characteristic.
To achieve the above object, the present invention is using following technical solution:
A kind of high CTI resin combination of Halogen for copper-clad plate, by organic solid content based on 100 parts by weight (PHR), group
Closing object includes following main component:
(a) 60~80PHR of mixture of phosphorous epoxy resin and other epoxy resin；
(b) 20~40PHR of curing agent；
(c) 0.01~1PHR of curing accelerator；
(d) 30~70PHR of inorganic filler；
(e) 3~10PHR of phosphonium flame retardant；
(f) 0.01~1PHR of silane coupling agent；
(g) solvent is appropriate.
As a preferred embodiment, the phosphorous epoxy resin is in the derivative modified epoxy resin of DOPO or DOPO
It is one or more.
As a preferred embodiment, other described epoxy resin include one or more, the structure of following epoxy resin
Formula are as follows:
As a preferred embodiment, the curing agent is one of acid anhydrides, DDS, DOPO phenol-formaldehyde resin modified or a variety of.
As a preferred embodiment, the acid anhydrides is one of phenylethylene-maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride
Or it is a variety of.
As a preferred embodiment, the inorganic filler is aluminium hydroxide, boehmite, silica, talcum powder, aluminosilicate
One or more of salt.
As a preferred embodiment, the phosphonium flame retardant is three (2,6- 3,5-dimethylphenyl) phosphines, 10- (2,5- dihydroxy
Phenyl) miscellaneous -10- phosphine phenanthrene -10- oxide of -9,10- dihydro-9-oxy, 2,6- bis- (2,6- 3,5-dimethylphenyl) phosphino- benzene, 10- benzene
In the miscellaneous -10- phosphine phenanthrene -10- oxide of base -9,10- dihydro-9-oxy or polyphenylene oxide phosphonitrile and its derivative any one or
At least two mixture.
As a preferred embodiment, the curing accelerator is imidazoles curing accelerator, includes 2-methylimidazole, 2-
One of ethyl -4-methylimidazole, 2- phenylimidazole, 2- undecyl imidazole are a variety of.
As a preferred embodiment, the solvent is acetone, butanone, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, hexamethylene
One of ketone is a variety of.
The present invention has obvious advantages and beneficial effects compared with the existing technology, specifically, by above-mentioned technical proposal
Known to:
One, the high CTI composition epoxy resin of Halogen of the present invention has adjusted system aluminium hydroxide, boehmite ratio, and collaboration contains
While phosphorus epoxy and phosphonium flame retardant meet UL-94V0 grades of flame-retardancy requirements, have high creepage trace index, CTI >=
600V。
Two, the high CTI composition epoxy resin of the present invention chooses high Tg curing agent instead of the use of dicyandiamide, with
Also its glass transition temperature is improved while high heat resistance and there is good machining property.
Three, the high CTI composition epoxy resin of Halogen of the present invention uses environment-friendly type phosphorous flame-retardant, can be made into suitable for white
Household electrical appliances, inverter, outdoor charging pile etc. have the copper-clad laminate of environmentally friendly use demand.
Specific embodiment
Present invention discloses a kind of high CTI resin combinations of Halogen for copper-clad plate, press 100 weight with organic solid content
Part (PHR) meter, composition include following main component:
(a) 60~80PHR of mixture of phosphorous epoxy resin and other epoxy resin；
(b) 20~40PHR of curing agent；
(c) 0.01~1PHR of curing accelerator；
(d) 30~70PHR of inorganic filler；
(e) 3~10PHR of phosphonium flame retardant；
(f) 0.01~1PHR of silane coupling agent；
(g) solvent is appropriate.
The phosphorous epoxy resin is one of derivative modified epoxy resin of DOPO or DOPO or a variety of.It is described its
His epoxy resin includes one or more, the structural formula of following epoxy resin are as follows:
The curing agent is one of acid anhydrides, DDS, DOPO phenol-formaldehyde resin modified or a variety of.The acid anhydrides is styrene-
One of maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride are a variety of.
The inorganic filler is one or more of aluminium hydroxide, boehmite, silica, talcum powder, alumino-silicate.
The phosphonium flame retardant is three (2,6- 3,5-dimethylphenyl) phosphines, 10- (2,5- dihydroxy phenyl) -9,10- dihydro -9-
Oxa- -10- phosphine phenanthrene -10- oxide, 2,6- bis- (2,6- 3,5-dimethylphenyl) phosphino- benzene, 10- phenyl -9,10- dihydro-9-oxy be miscellaneous -
In 10- phosphine phenanthrene -10- oxide or polyphenylene oxide phosphonitrile and its derivative any one or at least two mixture.
The curing accelerator be imidazoles curing accelerator, include 2-methylimidazole, 2-ethyl-4-methylimidazole,
One of 2- phenylimidazole, 2- undecyl imidazole are a variety of.
The solvent is one of acetone, butanone, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, cyclohexanone or a variety of.
Solvent only uses during the preparation process, as needed appropriate addition, and the amount of addition is unlimited, and final product of the invention does not contain
Solvent.
With multiple embodiments, invention is further described in detail below:
Main component code name is as follows:
(A) epoxy resin:
A1:DOPO modified epoxy；
A2:BPA type novolac epoxy resin；
A3: chain extension BPA type epoxy resin.
(B) curing agent:
B1:DICY；
B2:DOPO phenol-formaldehyde resin modified；
B3:DDS；
B4: phenylethylene-maleic anhydride (EF-30)；
B5: linear phenolic resin.
(C) inorganic filler:
C1: aluminium hydroxide；
C2: boehmite；
C3: alumino-silicate.
(D) curing accelerator:
D: diethyl tetramethyl imidazoles.
(E): phosphonium flame retardant:
E: polyphenylene oxide phosphonitrile.
(F) silane coupling agent:
F: silane coupling agent.
(G) solvent:
G: butanone.
Above-mentioned resin is mixed according to the ratio in Table 1, is then coated on reinforcing material E-Glass, in 171 DEG C of ovens
Baking 3-5min obtains prepreg, and respectively covering a 1OZ copper foil up and down with 8 prepregs is folded structure, is put into laminating machine and presses
Conjunction obtains laminate, carries out characteristic evaluation with this laminate.
The formula (parts by weight) of 1 composition of table
| Code name | Embodiment 1 | Embodiment 2 | Embodiment 3 | Comparative example 1 | Comparative example 2 | Comparative example 3 |
| A1 | 35 | 25 | 20 | 35 | 25 | 20 |
| A2 | 35 | 35 | 40 | 35 | 25 | 15 |
| A3 | 10 | 10 | 20 | 30 | ||
| B1 | 4 | |||||
| B2 | 10 | 10 | 10 | 10 | 12 | 10 |
| B3 | 5 | 5 | 9 | 5 | ||
| B4 | 15 | 15 | 11 | 14 | 20 | |
| B5 | 20 | |||||
| C1 | 25 | 25 | 25 | 25 | 25 | 40 |
| C2 | 25 | 35 | 35 | 35 | 40 | |
| C3 | 25 | |||||
| D | 0.5 | 0.6 | 0.6 | 0.6 | 0.6 | 0.6 |
| E | 3 | 5 | 5 | 3 | 3 | 5 |
| F | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 | 0.1 |
| G | 85 | 85 | 85 | 85 | 85 | 85 |
2 characteristic evaluation of table
The test method of the above characteristic is as follows:
(1) water imbibition: for ratio of the weight difference relative to example weight before PCT before and after PCT boiling 1h.
(2) PCT is the boiling 1h in 121 DEG C of 105KPa pressure cookers, is immersed in 288 DEG C of tin furnaces, and plate bursting separation time is recorded.
(3) it thermally stratified layer time T-288: is measured according to IPC-TM-650 2.4.24.1 method.
(4) glass transition temperature (Tg): according to differential scanning calorimetry (DSC), according to IPC-TM-6502.4.25 institute
Defined DSC method is measured.
(5) it flammability: is measured according to 94 vertical combustion of UL.
In conclusion high CTI composition epoxy resin of the invention has high creepage trace index CTI >=600V,
There is high glass-transition temperature, high heat resistance and good machining using copper-clad laminate made of the composition
Performance, anti-flammability reach the characteristics such as UL94V-0 grades, are suitable for pb-free solder.
The above described is only a preferred embodiment of the present invention, be not intended to limit the scope of the present invention,
Therefore any subtle modifications, equivalent variations and modifications to the above embodiments according to the technical essence of the invention, still
Belong in the range of technical solution of the present invention.
Claims (9)
1. a kind of high CTI resin combination of Halogen for copper-clad plate, it is characterised in that: press 100 parts by weight with organic solid content
(PHR) it counts, composition includes following main component:
(a) 60~80PHR of mixture of phosphorous epoxy resin and other epoxy resin；
(b) 20~40PHR of curing agent；
(c) 0.01~1PHR of curing accelerator；
(d) 30~70PHR of inorganic filler；
(e) 3~10PHR of phosphonium flame retardant；
(f) 0.01~1PHR of silane coupling agent；
(g) solvent is appropriate.
2. the high CTI resin combination of a kind of Halogen for copper-clad plate according to claim 1, it is characterised in that: described
Phosphorous epoxy resin is one of derivative modified epoxy resin of DOPO or DOPO or a variety of.
3. the high CTI resin combination of a kind of Halogen for copper-clad plate according to claim 1, it is characterised in that: described
Other epoxy resin include one or more, the structural formula of following epoxy resin are as follows:
。
4. the high CTI resin combination of a kind of Halogen for copper-clad plate according to claim 1, it is characterised in that: described
Curing agent is one of acid anhydrides, DDS, DOPO phenol-formaldehyde resin modified or a variety of.
5. the high CTI resin combination of a kind of Halogen for copper-clad plate according to claim 4, it is characterised in that: described
Acid anhydrides is one of phenylethylene-maleic anhydride, tetrahydrophthalic anhydride, hexahydrophthalic anhydride or a variety of.
6. the high CTI resin combination of a kind of Halogen for copper-clad plate according to claim 1, it is characterised in that: described
Inorganic filler is one or more of aluminium hydroxide, boehmite, silica, talcum powder, alumino-silicate.
7. the high CTI resin combination of a kind of Halogen for copper-clad plate according to claim 1, it is characterised in that: described
Phosphonium flame retardant is three (2,6- 3,5-dimethylphenyl) phosphines, the miscellaneous -10- phosphine of 10- (2,5- dihydroxy phenyl) -9,10- dihydro-9-oxy
Miscellaneous -10- phosphine the phenanthrene-of phenanthrene -10- oxide, 2,6- bis- (2,6- 3,5-dimethylphenyl) phosphino- benzene, 10- phenyl -9,10- dihydro-9-oxy
In 10- oxide or polyphenylene oxide phosphonitrile and its derivative any one or at least two mixture.
8. the high CTI resin combination of a kind of Halogen for copper-clad plate according to claim 1, it is characterised in that: described
Curing accelerator is imidazoles curing accelerator, includes 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- phenylimidazole, 2-
One of undecyl imidazole is a variety of.
9. the high CTI resin combination of a kind of Halogen for copper-clad plate according to claim 1, it is characterised in that: described
Solvent is one of acetone, butanone, propylene glycol monomethyl ether, propylene glycol methyl ether acetate, cyclohexanone or a variety of.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811601758.5A CN109679288A (en) | 2018-12-26 | 2018-12-26 | A kind of high CTI resin combination of Halogen for copper-clad plate |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811601758.5A CN109679288A (en) | 2018-12-26 | 2018-12-26 | A kind of high CTI resin combination of Halogen for copper-clad plate |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110343365A (en) * | 2019-07-04 | 2019-10-18 | 建滔(广州)高新材料有限公司 | A kind of copper-clad plate high CTI epoxy resin and preparation method thereof |
| CN110872430A (en) * | 2019-11-29 | 2020-03-10 | 陕西生益科技有限公司 | High CTI resin composition, prepreg, laminated board and metal foil-clad laminated board |
| CN111704785A (en) * | 2020-06-19 | 2020-09-25 | 林州致远电子科技有限公司 | Glue solution for halogen-free high-CTI copper-clad plate and preparation method and application thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090176104A1 (en) * | 2008-01-04 | 2009-07-09 | Li-Chun Chen | Resin composition and application thereof |
| CN102585440A (en) * | 2012-01-16 | 2012-07-18 | 广州宏仁电子工业有限公司 | High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate |
| CN104479295A (en) * | 2014-12-09 | 2015-04-01 | 广东生益科技股份有限公司 | Halogen-free resin composition and copper-clad plate prepared by using composition |
| CN106166874A (en) * | 2016-06-29 | 2016-11-30 | 上海南亚覆铜箔板有限公司 | Halogen-free copper-clad plate and preparation method thereof |
-
2018
- 2018-12-26 CN CN201811601758.5A patent/CN109679288A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20090176104A1 (en) * | 2008-01-04 | 2009-07-09 | Li-Chun Chen | Resin composition and application thereof |
| CN102585440A (en) * | 2012-01-16 | 2012-07-18 | 广州宏仁电子工业有限公司 | High-CTI (comparative tracking index) halogen-free flame retardant resin composition for copper-clad laminate |
| CN104479295A (en) * | 2014-12-09 | 2015-04-01 | 广东生益科技股份有限公司 | Halogen-free resin composition and copper-clad plate prepared by using composition |
| CN106166874A (en) * | 2016-06-29 | 2016-11-30 | 上海南亚覆铜箔板有限公司 | Halogen-free copper-clad plate and preparation method thereof |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110343365A (en) * | 2019-07-04 | 2019-10-18 | 建滔(广州)高新材料有限公司 | A kind of copper-clad plate high CTI epoxy resin and preparation method thereof |
| CN110343365B (en) * | 2019-07-04 | 2022-03-18 | 建滔(广州)高新材料有限公司 | High CTI epoxy resin for copper-clad plate and preparation method thereof |
| CN110872430A (en) * | 2019-11-29 | 2020-03-10 | 陕西生益科技有限公司 | High CTI resin composition, prepreg, laminated board and metal foil-clad laminated board |
| CN111704785A (en) * | 2020-06-19 | 2020-09-25 | 林州致远电子科技有限公司 | Glue solution for halogen-free high-CTI copper-clad plate and preparation method and application thereof |
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Application publication date: 20190426 |