CN109651763A - A kind of compositions of thermosetting resin and prepreg, laminate and metal-clad laminate using it - Google Patents

A kind of compositions of thermosetting resin and prepreg, laminate and metal-clad laminate using it Download PDF

Info

Publication number
CN109651763A
CN109651763A CN201811588483.6A CN201811588483A CN109651763A CN 109651763 A CN109651763 A CN 109651763A CN 201811588483 A CN201811588483 A CN 201811588483A CN 109651763 A CN109651763 A CN 109651763A
Authority
CN
China
Prior art keywords
parts
epoxy resin
compositions
thermosetting resin
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201811588483.6A
Other languages
Chinese (zh)
Other versions
CN109651763B (en
Inventor
游江
黄天辉
林伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shengyi Technology Co Ltd
Original Assignee
Shengyi Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shengyi Technology Co Ltd filed Critical Shengyi Technology Co Ltd
Priority to CN201811588483.6A priority Critical patent/CN109651763B/en
Publication of CN109651763A publication Critical patent/CN109651763A/en
Application granted granted Critical
Publication of CN109651763B publication Critical patent/CN109651763B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/14—Layered products comprising a layer of metal next to a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/18—Layered products comprising a layer of metal comprising iron or steel
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B15/00—Layered products comprising a layer of metal
    • B32B15/20—Layered products comprising a layer of metal comprising aluminium or copper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/02—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by structural features of a fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B5/00—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts
    • B32B5/22—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed
    • B32B5/24—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer
    • B32B5/26—Layered products characterised by the non- homogeneity or physical structure, i.e. comprising a fibrous, filamentary, particulate or foam layer; Layered products characterised by having a layer differing constitutionally or physically in different parts characterised by the presence of two or more layers which are next to each other and are fibrous, filamentary, formed of particles or foamed one layer being a fibrous or filamentary layer another layer next to it also being fibrous or filamentary
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
    • C08G59/4223—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof aromatic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J5/00—Manufacture of articles or shaped materials containing macromolecular substances
    • C08J5/24—Impregnating materials with prepolymers which can be polymerised in situ, e.g. manufacture of prepregs
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/02—Fibres or whiskers
    • C08K7/04—Fibres or whiskers inorganic
    • C08K7/14—Glass
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K7/00—Use of ingredients characterised by shape
    • C08K7/16—Solid spheres
    • C08K7/18—Solid spheres inorganic
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/036—Multilayers with layers of different types
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2250/00—Layers arrangement
    • B32B2250/40—Symmetrical or sandwich layers, e.g. ABA, ABCBA, ABCCBA
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/02—Composition of the impregnated, bonded or embedded layer
    • B32B2260/021—Fibrous or filamentary layer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2260/00—Layered product comprising an impregnated, embedded, or bonded layer wherein the layer comprises an impregnation, embedding, or binder material
    • B32B2260/04—Impregnation, embedding, or binder material
    • B32B2260/046—Synthetic resin
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2262/00—Composition or structural features of fibres which form a fibrous or filamentary layer or are present as additives
    • B32B2262/10—Inorganic fibres
    • B32B2262/101—Glass fibres
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/02—Synthetic macromolecular particles
    • B32B2264/0214—Particles made of materials belonging to B32B27/00
    • B32B2264/0257—Polyolefin particles, e.g. polyethylene or polypropylene homopolymers or ethylene-propylene copolymers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/101—Glass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/102—Oxide or hydroxide
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/10—Inorganic particles
    • B32B2264/104—Oxysalt, e.g. carbonate, sulfate, phosphate or nitrate particles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2264/00—Composition or properties of particles which form a particulate layer or are present as additives
    • B32B2264/12—Mixture of at least two particles made of different materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/20—Properties of the layers or laminate having particular electrical or magnetic properties, e.g. piezoelectric
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/30—Properties of the layers or laminate having particular thermal properties
    • B32B2307/306—Resistant to heat
    • B32B2307/3065—Flame resistant or retardant, fire resistant or retardant
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/714—Inert, i.e. inert to chemical degradation, corrosion
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2307/00—Properties of the layers or laminate
    • B32B2307/70—Other properties
    • B32B2307/726—Permeability to liquids, absorption
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B2457/00—Electrical equipment
    • B32B2457/08—PCBs, i.e. printed circuit boards
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2363/00—Characterised by the use of epoxy resins; Derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Materials Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Laminated Bodies (AREA)

Abstract

The present invention provides a kind of compositions of thermosetting resin and use its prepreg, laminate and metal-clad laminate.The compositions of thermosetting resin includes epoxy resin, dicyclopentadiene phenolic active ester and the esters curing agent with Formulas I structure.The present invention uses the esters curing agent with Formulas I structure to cooperate with cured epoxy resin with dicyclopentadiene phenolic active ester, secondary hydroxyl isopolarity group is not generated in the curing process, and contain a large amount of hydrophobic groupings in cured product, while guarantee cured product glass transition temperature with higher, its water absorption rate and dielectric loss factor can be substantially reduced.There is good heat resistance, moisture-proof, dielectric properties, anti-flammability, processability and chemical resistance using the laminate and metal-clad laminate of compositions of thermosetting resin preparation.

Description

A kind of compositions of thermosetting resin and using its prepreg, laminate and cover metal Foil laminate
Technical field
The invention belongs to printed circuit board technology fields, and in particular to a kind of compositions of thermosetting resin and use the pre- of its Leaching material, laminate and metal-clad laminate.
Background technique
The high speed and multifunction handled with electronic product information, applying frequency are continuously improved, it is desirable that dielectric constant (Dk) and dielectric loss value (Df) is lower and lower, therefore reduce that Dk/Df has become substrate dealer chases hot spot.In order to realize height Glass transition temperature (Tg) and low Df, various low polar resins, such as active ester is widely used, wherein being most widely used Be dicyclopentadiene phenolic active ester.The cured product of dicyclopentadiene phenolic active ester and epoxy resin has excellent Jie Electrical property and bonding force, but there is a problem that water absorption rate is high, glass transition temperature is lower.
In addition, halogen-free flame-retardant copper-clad laminate is developed under the general trend of events that " green " " environmental protection " is strengthened in the whole world The hot spot of industry, each copper-clad laminate producer all release the halogen-free flameproof copper-clad laminate of oneself one after another.At present in the industry most Common halogen-free flame retardants is still based on phosphorus flame retardant, and phosphorus flame retardant is easier the moisture absorption compared to bromide fire retardant, therefore General halogen-free board is more obvious compared to the higher disadvantage of bromine tie-plate material water absorption rate.
High water absorbing capacity will cause plate dielectric properties and obviously deteriorate because of the moisture absorption, it is also possible to will lead to substrate in printed circuit It is heated due to plate bursting after the moisture absorption when plate (PCB) is processed.Therefore under the premise of guaranteeing excellent dielectric properties, how to reduce bicyclic The water absorption rate of pentadiene phenolic active ester Halogen system, and the glass transition temperature for improving cured product becomes a technology difficulty Topic.
Copper-clad plate benzoxazine resin commonly used in the trade reduces solidfied material water absorption rate, however the dielectricity of benzoxazine resin Can be poor, and polar functionalities in molecular structure, the dielectricity of meeting severe exacerbation dicyclopentadiene phenolic active ester Halogen system Energy and heat resistance.
Therefore, how while guaranteeing that copper-clad plate has good dielectric properties, its water absorption rate is reduced, its glass is improved Changing transition temperature is this field urgent problem to be solved.
Summary of the invention
In view of the deficiencies of the prior art, the present invention intends to provide a kind of compositions of thermosetting resin and use Its prepreg, laminate and metal-clad laminate.Using the compositions of thermosetting resin preparation laminate and cover metal Foil laminate has high glass-transition temperature, low water absorption, low-k, low dielectric loss factor, high-fire resistance and good Good chemical resistance.
To achieve this purpose, the present invention adopts the following technical scheme:
In a first aspect, the present invention provides a kind of compositions of thermosetting resin, which is characterized in that the thermosetting resin combination Object includes following component: epoxy resin, dicyclopentadiene phenolic active ester and esters curing agent；
The esters curing agent has Formulas I structure:
Wherein, R1-R8It is each independently selected from hydrogen atom, C1-C10Aliphatic alkyl, C3-C10Alicyclic alkyl or C6-C10 One of aromatic hydrocarbyl, and it is not all hydrogen atom；
X is selected from-O- ,-S- ,-CH2Or-C (CH3)2One of；
Y is selected from C1-C10Aliphatic alkyl, C3-C10Alicyclic alkyl or C6-C10One of aromatic hydrocarbyl；
N is the integer of 1-10.
The present invention uses the esters curing agent with Formulas I structure to cooperate with cured epoxy tree with dicyclopentadiene phenolic active ester Rouge does not generate secondary hydroxyl isopolarity group in the curing process, and contains a large amount of hydrophobic groupings in cured product, is guaranteeing admittedly While changing product has good dielectric properties, its glass transition temperature can be significantly improved, and reduce its water absorption rate, so that Cured product dielectric constant and dielectric loss factor are more stable.Using the compositions of thermosetting resin preparation laminate and cover Metal foil laminate has high glass-transition temperature, low water absorption, low-k, low dielectric loss factor, high-fire resistance With good chemical resistance.
In the present invention, the C1-C10Aliphatic alkyl refer to containing 1-10 (such as 1,2,3,4,5,6, 7,8,9 or 10) aliphatic alkyl of carbon atom；Such as can be methyl, ethyl, propyl, butyl, amyl, hexyl, Heptyl, octyl, nonyl or decyl etc..
The C3-C10Alicyclic alkyl refers to containing 3-10 (such as 3,4,5,6,7,8,9 or 10 It is a) alicyclic alkyl of carbon atom；Such as can be cyclopropyl, cyclobutyl, cyclopenta or cyclohexyl etc..
The C6-C10Aromatic hydrocarbyl refers to the rouge containing 6-10 (such as 6,7,8,9 or 10) carbon atoms Fat race alkyl；Such as can be phenyl, benzyl, phenethyl or phenylpropyl etc..
N can be 1,2,3,4,5,6,7,8,9 or 10 in Formulas I.
It is solid with the epoxy resin, dicyclopentadiene phenolic active ester and esters as the preferred technical solution of the present invention The total weight number of agent is 100 parts of meters, and the compositions of thermosetting resin includes: 40-70 parts of epoxy resin, 10-35 parts pairs Cyclopentadiene phenolic active ester and 5-25 parts of esters curing agent.
Unless otherwise specified, heretofore described " esters curing agent " each means the esters curing agent with Formulas I structure.
In the present invention, the parts by weight of the epoxy resin can be 40 parts, 42 parts, 45 parts, 48 parts, 50 parts, 52 parts, 55 Part, 58 parts, 60 parts, 62 parts, 65 parts, 68 parts or 70 parts etc..
The parts by weight of the dicyclopentadiene phenolic active ester can be 10 parts, 12 parts, 13 parts, 15 parts, 16 parts, 18 Part, 20 parts, 22 parts, 23 parts, 25 parts, 26 parts, 28 parts, 30 parts, 32 parts, 33 parts or 35 parts etc..
The parts by weight of the esters curing agent can be 5 parts, 6 parts, 8 parts, 10 parts, 12 parts, 13 parts, 15 parts, 16 parts, 18 Part, 20 parts, 22 parts, 23 parts or 25 parts etc..
The present invention is by epoxy resin, dicyclopentadiene phenolic active ester and esters curing agent under above-mentioned specific ratio It cooperates, can further promote the comprehensive performance of its cured product and laminate prepared therefrom.If epoxy resin contains Measure very few, the processing performance that will lead to laminate is poor；If the additive amount of epoxy resin is excessive, cured product and layer will lead to The glass transition temperature of pressing plate is lower, and dielectric properties are poor.Dicyclopentadiene phenolic active ester is with making main curing agent, Neng Goufu Cured product and laminate high-fire resistance, excellent dielectric properties and bonding force are given, if dicyclopentadiene phenolic active ester contains It measures very few, it is poor to will lead to solidfied material dielectric properties；If the content of dicyclopentadiene phenolic active ester is excessive, solidfied material will lead to It is low with the water absorption rate of laminate height, glass transition temperature.If the content of esters curing agent is very few, to cured product water absorption rate It is unobvious with the improvement result of glass transition temperature, if the content of esters curing agent is excessive, it will lead to cured product and layer The brittleness of pressing plate is larger, poor processability.
As the preferred technical solution of the present invention, the epoxy resin is halogen-free epoxy resin.
Preferably, the halogen-free epoxy resin is selected from bisphenol A type epoxy resin, bisphenol f type epoxy resin, o-cresol phenolic aldehyde Epoxy resin, bisphenol A-type novolac epoxy resin, three phenolic novolac epoxy resins, dicyclopentadiene novolac epoxy resin, biphenyl type One of novolac epoxy resin, alkyl benzene-type novolac epoxy resin or naphthol type novolac epoxy resin or at least two group It closes.
Preferably, the halogen-free epoxy resin has Formula II structure:
Wherein, X1、X2And X3It is each independentlyR9Selected from hydrogen atom, replace or Unsubstituted C1-C5Straight chained alkyl or substituted or unsubstituted C3-C5One of branched alkyl；
Y1And Y2It is each independently selected from singly-bound ,-CH2-、 One of, R10Selected from hydrogen original Sub, substituted or unsubstituted C1-C5Straight chained alkyl or substituted or unsubstituted C3-C5One of branched alkyl；
M is the integer of 1-10；Such as it can be 1,2,3,4,5,6,7,8,9 or 10.
In the present invention, the C1-C5Straight chained alkyl refers to former containing 1-5 (such as 1,2,3,4 or 5) carbon The straight chained alkyl of son；Such as it can be methyl, ethyl, propyl, butyl or amyl.
The C3-C5Branched alkyl refers to the branched alkyl containing 3-5 (such as 3,4 or 5) carbon atoms；Such as It can be isopropyl, isobutyl group, tert-butyl or isopentyl etc..
Halogen-free epoxy resin degree of functionality with higher and good dielectric properties with Formula II structure, facilitate into one Step improves the glass transition temperature of cured product, reduces dielectric loss and water absorption rate.
As the preferred technical solution of the present invention, the dicyclopentadiene phenolic active ester has formula III structure:
Wherein, X is phenyl ring or naphthalene nucleus, and it is 0.25-1.25 (example that j, which is 0 or 1, and k is 0 or 1, and n indicates average repeat unit number Such as 0.25,0.5,0.75,1 or 1.25).
As the preferred technical solution of the present invention, the compositions of thermosetting resin further includes fire retardant.
Preferably, the fire retardant is phosphonium flame retardant.
Preferably, it is with the total weight number of the epoxy resin, dicyclopentadiene phenolic active ester and esters curing agent 100 parts of meters, the additive amount of the phosphonium flame retardant is 1-50 parts, such as can be 1 part, 2 parts, 5 parts, 8 parts, 10 parts, 12 parts, 15 Part, 18 parts, 20 parts, 22 parts, 25 parts, 28 parts, 30 parts, 35 parts, 40 parts, 45 parts or 50 parts etc.；Further preferably 1-30 parts.
Preferably, the phosphonium flame retardant is selected from three (2,6- 3,5-dimethylphenyl) phosphines, 10- (2,5- dihydroxy phenyl) -9, Miscellaneous -10- phosphine phenanthrene -10- the oxide of 10- dihydro-9-oxy, 2,6- bis- (2,6- 3,5-dimethylphenyl) phosphino- benzene, 10- phenyl -9,10- two Hydrogen -9- oxa- -10- phosphine phenanthrene -10- oxide, phenoxy phosphazene compound, phosphate, polyphosphate, phosphonate ester or polyphosphonates One of or at least two combination.
As the preferred technical solution of the present invention, the compositions of thermosetting resin further includes curing accelerator, makes resin Composition solidifies and accelerates the curing rate of resin combination.
Preferably, it is with the total weight number of the epoxy resin, dicyclopentadiene phenolic active ester and esters curing agent 100 parts of meters, the additive amount of the curing accelerator are 0.05-1 parts；Such as can be 0.05 part, 0.1 part, 0.2 part, 0.3 part, 0.4 part, 0.5 part, 0.6 part, 0.7 part, 0.8 part, 0.9 part or 1 part etc..
Preferably, the curing accelerator is selected from glyoxaline compound, triphenylphosphine, dimethylamino naphthyridine, boron trifluoride One of mono aminoethane or zinc octoate or at least two combination.
Preferably, the glyoxaline compound be selected from 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- phenylimidazole or One of 2- undecyl imidazole or at least two combination.
Preferably, the compositions of thermosetting resin further includes filler, to further decrease cured product and laminate Thermal expansion coefficient (CTE) and water absorption rate improve thermal conductivity.
Preferably, it is with the total weight number of the epoxy resin, dicyclopentadiene phenolic active ester and esters curing agent 100 parts of meters, the additive amount of the filler is 1-150 parts, such as can be 1 part, 2 parts, 5 parts, 8 parts, 10 parts, 15 parts, 20 parts, 25 Part, 30 parts, 35 parts, 40 parts, 45 parts, 50 parts, 60 parts, 70 parts, 80 parts, 90 parts, 100 parts, 110 parts, 120 parts, 130 parts, 140 parts Or 150 parts etc.；Further preferably 1-100 parts.
Preferably, the filler is organic filler and/or inorganic filler.
Preferably, the inorganic filler be selected from silica, aluminium hydroxide, aluminium oxide, talcum powder, aluminium nitride, boron nitride, One of silicon carbide, barium sulfate, barium titanate, strontium titanates, calcium carbonate, calcium silicates, mica, glass fiber powder or at least two Combination.
Preferably, the organic filler be selected from one of polytetrafluorethylepowder powder, polyphenylene sulfide or polyether sulfone powder or At least two combination.
In the present invention, the filler is most preferably silica, such as can be fused silica, crystal type titanium dioxide Silicon, spherical silica or hollow silicon dioxide etc.；In partial size angle value be 1-15 μm, such as can be 1 μm, 2 μm, 3 μm, 5 μm, 6 μm, 8 μm, 10 μm, 12 μm, 13 μm or 15 μm etc.；Further preferably 1-10 μm.The filler of particle diameter distribution within the above range There is preferably dispersibility in compositions of thermosetting resin.
Second aspect, the present invention provide a kind of resin adhesive liquid, and the resin adhesive liquid is to provide first aspect present invention Compositions of thermosetting resin is dissolved or dispersed in solvent and obtains.
The third aspect, the present invention provide a kind of prepreg, including reinforcing material, and described by being attached to after impregnation drying The compositions of thermosetting resin that first aspect present invention on reinforcing material provides.
In the present invention, prepreg can be prepared with the following method:
Compositions of thermosetting resin is dissolved in solvent, resin adhesive liquid is formed, being then impregnated with the resin adhesive liquid enhances Material obtains prepreg after dry.
Wherein, the solvent is preferably butanone (MEK), and the solid content of the glue is preferably 60-70%, the strengthening material Material is preferably glass cloth, and glue impregnation amount is preferably 200-230g/m2, the temperature of the drying is preferably 155 DEG C, and the time is preferred For 5-10min.
Fourth aspect, the present invention provide a kind of laminate, including one or at least two overlapping third aspect present invention The prepreg of offer.
5th aspect, the present invention provides a kind of metal-clad laminate, including one or the present invention of at least two overlappings The metal foil of prepreg and the one or both sides being overlying on the outside of the prepreg that the third aspect provides.
The metal-clad laminate be by first by one or at least two Prepreg Lays, then again prepreg most The one or both sides in outside paste metal foil, and the method for finally heated cure under pressure is prepared.
The operation of the heating pressurization can be carried out by laminating machine, and lamination must meet claimed below: the heating being 1. laminated Rate should usually be controlled at 80-120 DEG C of material temperature in 1.5-2.5 DEG C/min；2. the pressure setting being laminated, outer layer material temperature is in 120- 150 DEG C apply full pressure, and full pressure pressure is 350psi or so；3. solidify, material temperature is controlled at 180-220 DEG C, and keep the temperature 60- 120min。
The metal foil can be copper foil, nickel foil, aluminium foil or SUS foil (stainless steel foil) etc..
Compared with prior art, the invention has the following advantages:
The present invention uses the esters curing agent with Formulas I structure to cooperate with cured epoxy tree with dicyclopentadiene phenolic active ester Rouge does not generate secondary hydroxyl isopolarity group in the curing process, and contains a large amount of hydrophobic groupings in cured product, is guaranteeing admittedly While changing product has good dielectric properties, its glass transition temperature can be significantly improved, and reduce its water absorption rate, so that Cured product dielectric constant and dielectric loss factor are more stable.The laminate being prepared using the compositions of thermosetting resin Glass transition temperature be 164-194 DEG C, thermal expansion coefficient 2.2%-2.7%, water absorption rate 0.20%-0.34%, be situated between Electric constant (1GHz) is 3.50-3.78, and dielectric loss factor (1GHz) is 0.0068-0.0088, and dielectric constant is after humidity 3.61-3.95, it is moist after dielectric loss factor be 0.0077-0.0104,288 DEG C of layering cream time ﹥ 120s, peel strength is 1.36-1.49N/mm drop impact slight crack area is 185-327mm2, difficult to burn reaches V-0 grade, with good heat-resisting Property, moisture-proof, dielectric properties, anti-flammability, processability and chemical resistance.
Specific embodiment
Below by specific embodiment to further illustrate the technical scheme of the present invention.Those skilled in the art should be bright , the described embodiments are merely helpful in understanding the present invention, should not be regarded as a specific limitation of the invention.
The source of material involved in the embodiment of the present invention and comparative example/the preparation method is as follows:
(A) halogen-free epoxy resin
(A-1) dicyclopentadiene novolac epoxy resin HP-7200H (big Japanese ink trade name)；
(A-2) biphenyl type novolac epoxy resin NC-3000 (the Japanization pharmacist name of an article)；
(A-3) HP-9900 containing naphthalene epoxy resins (big Japanese ink trade name).
(B) dicyclopentadiene phenolic active ester
(B-1) dicyclopentadiene phenolic active ester HPC-8000-65T (big Japanese ink trade name)；
(B-2) dicyclopentadiene phenolic active ester HPC-8150-62T (big Japanese ink trade name)；
(B-3) dicyclopentadiene phenolic active ester SHC-5100TM65 (South Korea's SHIN-A trade name).
(C) curing agent
(C-1a) with the esters curing agent of Formulas I structure, structure are as follows:
Wherein average repeat unit n is 1.25；
Preparation method is as follows:
In the flask for being equipped with thermometer, dropping funel, blender put into 2mol (568.78g) bisphenol-A and 1500g tetrahydrofuran, is passed through nitrogen, and stirring is to being completely dissolved.Then, investment 1mol (203.02g) paraphthaloyl chloride stirring Then dissolution controls system temperature at 20 DEG C hereinafter, being slowly added dropwise and (being greater than 0.5 hour) 2mol (202.38g) triethylamine (triethylamine/tetrahydrofuran solution dropwise addition for being configured to 20%).Then, continue to be stirred to react 2~3 hours at 20 DEG C or less.It connects , 2mol (381.25g) 2- naphthoyl chloride is put into, system temperature is controlled at 15 DEG C hereinafter, 2mol is then slowly added dropwise (202.38g) triethylamine (triethylamine/tetrahydrofuran solution dropwise addition for being configured to 20%), continues to be stirred to react 2 at 15 DEG C or less ~5 hours.It stands after the reaction was completed, is filtered to remove triethylamine hydrochloride solid, carries out vacuum distillation concentration in solution, then again Methanol is added, resin product is precipitated, filtering, being washed with water to the pH value of final water layer is 7, and again with methanol washing is then so dry that produce Object.The ester equivalent of prepared active ester resin is 252g/eq according to feed ratio.
(C-1b) with the esters curing agent of Formulas I structure, structure are as follows:
Wherein average repeat unit n is 1.25；
Preparation method is as follows:
In the flask for being equipped with thermometer, dropping funel, blender put into 2mol (568.78g) bisphenol-A and 1500g tetrahydrofuran, is passed through nitrogen, and stirring is to being completely dissolved.Then, investment 1mol (203.02g) paraphthaloyl chloride stirring Then dissolution controls system temperature at 20 DEG C hereinafter, being slowly added dropwise and (being greater than 0.5 hour) 2mol (202.38g) triethylamine (triethylamine/tetrahydrofuran solution dropwise addition for being configured to 20%).Then, continue to be stirred to react 2~3 hours at 20 DEG C or less.It connects , 2mol (281.14g) chlorobenzoyl chloride is put into, system temperature is controlled at 15 DEG C hereinafter, 2mol is then slowly added dropwise (202.38g) triethylamine (triethylamine/tetrahydrofuran solution dropwise addition for being configured to 20%), continues to be stirred to react 2 at 15 DEG C or less ~5 hours.It stands after the reaction was completed, is filtered to remove triethylamine hydrochloride solid, carries out vacuum distillation concentration in solution, then again Methanol is added, resin product is precipitated, filtering, being washed with water to the pH value of final water layer is 7, and again with methanol washing is then so dry that produce Object.The ester equivalent of prepared active ester resin is 226g/eq according to feed ratio.
(C-1c) with the esters curing agent of Formulas I structure, structure are as follows:
Wherein average repeat unit n is 1.25；
Preparation method is as follows:
In the flask for being equipped with thermometer, dropping funel, blender put into 2mol (512.66g) tetramethyl Bisphenol F and 1500g tetrahydrofuran, is passed through nitrogen, and stirring is to being completely dissolved.Then, investment 1mol (203.02g) paraphthaloyl chloride stirring Then dissolution controls system temperature at 20 DEG C hereinafter, being slowly added dropwise and (being greater than 0.5 hour) 2mol (202.38g) triethylamine (triethylamine/tetrahydrofuran solution dropwise addition for being configured to 20%).Then, continue to be stirred to react 2~3 hours at 20 DEG C or less.It connects , 2mol (157g) chloroacetic chloride is put into, system temperature is controlled at 15 DEG C hereinafter, 2mol (202.38g) three is then slowly added dropwise Ethamine (triethylamine/tetrahydrofuran solution dropwise addition for being configured to 20%), continues to be stirred to react 2~5 hours at 15 DEG C or less.Reaction It stands after the completion, is filtered to remove triethylamine hydrochloride solid, carries out vacuum distillation concentration in solution, then add methanol precipitation Resin product, filtering, being washed with water to the pH value of final water layer is 7, again with methanol washing, then dry product.Prepared The ester equivalent of active ester resin is 181g/eq according to feed ratio.
(C-2) a kind of esters curing agent V-575 (Japanese UNITIKA trade name), structure is as follows:
Wherein average repeat unit n is 1.25；
(C-3) bisphenol A cyanate ester prepolymer CE01PS (Yangzhou apocalypse trade name)；
(C-4) dicyclopentadiene type benzoxazine LZ 8260N70 (HUNTSMAN trade name).
(D) fire retardant
(D-1) phosphorus-containing phenolic aldehyde XZ92741 (U.S.'s DOW trade name)；
(D-2) phenoxy phosphazene compound SPB-100 (Mitsubishi trade name).
(E) curing accelerator
4-dimethylaminopyridine (the wide flourish commodity chemical name of Japan).
(F) filler
(F-1) ball-type silicon powder (average grain diameter is 1-10 μm, 99% or more purity)；
(F-2) aluminium oxide (average grain diameter is 1-10 μm, 99% or more purity).
Embodiment 1-16
Embodiment 1-16 provides compositions of thermosetting resin glue, the prepreg using it and copper-clad plate, and preparation method is such as Under:
(1) preparation of compositions of thermosetting resin glue:
With MEK solvent by component (B) dicyclopentadiene phenolic active ester, (C) curing agent and (D-2) phenoxy phosphazene chemical combination Object SPB-100 is configured to the solution that solid content is 60%, 50% and 25% respectively, is added sequentially in 1000mL beaker, then according to Appropriate (E) curing accelerator 4- bis- is added in secondary addition (A) halogen-free epoxy resin, (D-1) phosphorus-containing phenolic aldehyde XZ92741 and (F) filler Methylamino pyridine adjusts gelation time (GT) to 200-300s, and it is 65% that MEK solvent, which is added, by solid content control, is continued 2h curing is stirred, compositions of thermosetting resin glue is obtained；
Wherein, the type and dosage (based on parts by weight) of each component are as shown in Table 1 and Table 2.
(2) preparation of prepreg:
It is ready to 6 2116 glass cloth (manufacturer: stopping Bell Co. in Taiwan), size: 320mm × 380mm, it first will be upper It states compositions of thermosetting resin glue to be coated on every glass cloth, make glue Sized glass cloth and is stained with resin on two surfaces, so Two surfaces are struck off and are removed part glue by the folder axis of roll-in by the glass cloth after infiltration afterwards, by glass cloth and removal solvent The sum of resin composition weight afterwards is controlled in 200-230g/m2, the glass cloth presoaked is obtained, puts it into 155 DEG C later 6-8min is toasted in baking oven, obtains prepreg.
(3) production of copper-clad plate:
Prepare 2 with a thickness of 35 μm, the electrolytic copper foil having a size of 410mm × 410mm (manufacturer: Suzhou Feitian), by 6 Zhang Shangshu prepreg gathers into folds, and keeps 4 angle alignments, and respectively cover the electrolysis being ready in the prepreg upper and lower surface folded Copper foil is put into laminating machine, and lamination is carried out as follows: the heating rate being 1. laminated should be controlled at 80-120 DEG C of material temperature 1.5-2.5℃/min；2. the pressure setting being laminated, outer layer material temperature applies full pressure at 120-150 DEG C, and full pressure pressure is 350psi； 3. solidify, material temperature is controlled at 200 DEG C, and keep the temperature 90min, obtain copper-clad plate.
Comparative example 1-3
Comparative example 1-3 the difference from example 2 is that, the type of component (C) curing agent is different, shown in table 3 specific as follows.
Comparative example 4-6
Comparative example 4-6 and the difference of embodiment 16 are that the type of component (C) curing agent is different, 3 institute of table specific as follows Show.
The performance of the copper-clad plate provided respectively above-described embodiment and comparative example is tested, and testing standard/method is as follows:
(a) glass transition temperature (Tg): according to differential scanning calorimetry (DSC), according to IPC-TM-6502.4.25 institute Defined DSC method is measured.
(b) thermal expansion coefficient (CTE)
It is measured according to the Z-direction CTE test method of IPC-TM-650 2.4.24 defined.
(c) water imbibition
100mm × 100mm sample is placed in the climatic chamber of 85 DEG C of temperature, humidity 85% after handling 168h, test The water absorption rate of sample after processing.
(d) dielectric constant, dielectric loss factor
According to the resonance method for using stripline runs, the dielectric loss under 1GHz is measured according to IPC-TM-650 2.5.5.5, is situated between The electrical loss factor.
(e) dielectric constant, dielectric loss factor (after moist)
Sample is placed in the climatic chamber of 85 DEG C of temperature, humidity 85% after handling 168h, according still further to IPC-TM-650 2.5.5.5 the dielectric loss under measurement 1GHz, dielectric loss factor.
(f) resistance to dip solderability
Layering cream time is observed according to IPC-TM-650 2.4.13.1.
(g) peel strength
According to the experiment condition of " after thermal stress " in IPC-TM-650 2.4.8 method, the removing for testing metallic cover layer is strong Degree.
(h) drop impact slight crack area
Tested using drop hammer impact testing machine, test method: height of the fall 1m, weight of dropping hammer are 0.75kg, and release is fallen Hammer, test plate torn surface product.Plate slight crack size can tentatively reflect the toughness superiority and inferiority of plate, it is, in general, that slight crack Area is smaller to show that plate toughness is better.
(i) difficult to burn
It is measured according to 94 vertical combustion of UL.
The performance for the copper-clad plate that the various embodiments described above and comparative example provide is as shown in following table 1-3:
Table 1
Table 2
Table 3
It was found from the performance data of table 1-3: embodiment 1-10 using 5-25 part with Formulas I structure esters curing agent and 10-35 parts of dicyclopentadiene phenolic 40-70 parts of halogen-free epoxy resins of active ester composite curing, obtained plate have high Tg, Low CTE, low water absorption, excellent dielectric properties, high-fire resistance and peel strength and excellent toughness, while being also able to achieve nothing Halogen is V-0 grades fire-retardant.
Esters curing agent and dicyclopentadiene phenolic active ester HPC-8000- with Formulas I structure are used in embodiment 11 75 parts of dicyclopentadiene novolac epoxy resin HP-7200H of 65T composite curing, plate have high Tg, low CTE, but due to bicyclic penta Diene novolac epoxy resin HP-7200H excessively leads to solidification not exclusively, and final plate water absorption rate is high, dielectric properties are poor and resistance to It is hot undesirable.
Esters curing agent and dicyclopentadiene phenolic active ester HPC- in embodiment 12 using 27 parts with Formulas I structure 8000-65T solidifies 38 parts of dicyclopentadiene novolac epoxy resin HP-7200H, and plate has high Tg, high-peeling strength, high heat resistance Property and good toughness lead to that plate water absorption rate is high, dielectric properties are poor but since curing agent excessive response is incomplete.
Esters curing agent and dicyclopentadiene phenolic active ester HPC- in embodiment 13 using 3 parts with Formulas I structure 8000-65T composite curing dicyclopentadiene novolac epoxy resin HP-7200H, since the esters curing agent with Formulas I structure adds Dosage is too low, and final plate Tg is relatively low and water absorption rate is high, and plate dielectric properties deteriorate serious after the moisture absorption.
Using 40 parts of dicyclopentadiene phenolic active ester HPC-8000-65T and with the esters of Formulas I structure in embodiment 14 Curing agent composite curing dicyclopentadiene novolac epoxy resin HP-7200H, due to dicyclopentadiene phenolic active ester HPC- 8000-65T adding too much, curing agent excessive response is incomplete, and final plate Tg is relatively low and water absorption rate is high, and plate is situated between after the moisture absorption Electrical property deteriorates serious.
Using 8 parts of dicyclopentadiene phenolic active ester HPC-8000-65T and with the esters of Formulas I structure in embodiment 15 Curing agent composite curing dicyclopentadiene novolac epoxy resin HP-7200H, plate have high Tg, low CTE, low water absorption and excellent Different dielectric properties, but the drop impact test slight crack area for being used to characterize toughness is excessive, and plate poor toughness is unfavorable for downstream PCB processing.
Esters curing agent and dicyclopentadiene phenolic active ester HPC-8000- with Formulas I structure are used in embodiment 16 65T composite curing dicyclopentadiene novolac epoxy resin HP-7200H, does not add filler, and the CTE and water absorption rate of plate are risen Height, but comparatively ideal level is remained at, while plate has high Tg, excellent dielectric properties, heat resistance and toughness.
As described above, being prepared compared with general Halogen laminate using compositions of thermosetting resin provided by the invention Laminate there is higher Tg, lower CTE, lower water absorption rate, superior dielectric properties and peel strength, heat-resisting Property, toughness, be suitable for high-speed applications field.In addition content of halogen of the present invention can reach difficult within the scope of JPCA Halogen standard requirements V-0 standard in combustion property test UL94, there is environmental protection.
Esters curing agent V-575 and dicyclopentadiene phenolic active ester HPC-8000-65T composite solid are used in comparative example 1 Change dicyclopentadiene novolac epoxy resin HP-7200H, plate has high Tg, low CTE, excellent heat resistance and toughness, but dielectric Performance is general, and the dielectric properties after water absorption rate is higher and the plate moisture absorption are poor.
Bisphenol A cyanate ester prepolymer CE01PS and dicyclopentadiene phenolic active ester HPC- is used in comparative example 2 8000T65 composite curing dicyclopentadiene novolac epoxy resin HP-7200H, plate have high Tg, low CTE, excellent dielectricity Energy and heat resistance, but the dielectric properties after water absorption rate height and the plate moisture absorption are poor.
Dicyclopentadiene type benzoxazine LZ 8260N70 and dicyclopentadiene phenolic active ester HPC- is used in comparative example 3 8000-65T composite curing dicyclopentadiene novolac epoxy resin HP-7200H, plate have low water absorption, excellent dielectric normal Several and heat resistance, but Tg is relatively low, CTE and dielectric loss are higher.
Esters curing agent V-575 and dicyclopentadiene phenolic active ester HPC-8000-65T composite solid are used in comparative example 4 Change dicyclopentadiene novolac epoxy resin HP-7200H, does not add filler, plate has high Tg and excellent dielectric properties, but inhales Dielectric properties after water rate height and the plate moisture absorption are poor, and heat resistance is also undesirable.
Bisphenol A cyanate ester prepolymer CE01PS and dicyclopentadiene phenolic active ester HPC- is used in comparative example 5 8000T65 composite curing dicyclopentadiene novolac epoxy resin HP-7200H, does not add filler, and plate has high Tg, lower CTE, but the dielectric properties after water absorption rate height and the plate moisture absorption are poor, and heat resistance is also undesirable.
Dicyclopentadiene type benzoxazine LZ 8260N70 and dicyclopentadiene phenolic active ester HPC- is used in comparative example 6 8000T65 composite curing dicyclopentadiene novolac epoxy resin HP-7200H, does not add filler, and plate has low water absorption and excellent Different dielectric constant, but plate Tg is relatively low, CTE and dielectric loss are higher.
The Applicant declares that the foregoing is merely a specific embodiment of the invention, but protection scope of the present invention not office It is limited to this, it should be clear to those skilled in the art, any to belong to those skilled in the art and take off in the present invention In the technical scope of dew, any changes or substitutions that can be easily thought of, and all of which fall within the scope of protection and disclosure of the present invention.

Claims (10)

1. a kind of compositions of thermosetting resin, which is characterized in that the compositions of thermosetting resin includes following component: asphalt mixtures modified by epoxy resin Rouge, dicyclopentadiene phenolic active ester and esters curing agent；
The esters curing agent has Formulas I structure:
Wherein, R1-R8It is each independently selected from hydrogen atom, C1-C10Aliphatic alkyl, C3-C10Alicyclic alkyl or C6-C10Fragrance One of race's alkyl, and it is not all hydrogen atom；
X is selected from-O- ,-S- ,-CH2Or-C (CH3)2One of；
Y is selected from C1-C10Aliphatic alkyl, C3-C10Alicyclic alkyl or C6-C10One of aromatic hydrocarbyl；
N is the integer of 1-10.
2. compositions of thermosetting resin according to claim 1, which is characterized in that with the epoxy resin, bicyclic penta 2 The total weight number of alkene phenolic active ester and esters curing agent is 100 parts of meters, and the compositions of thermosetting resin includes: 40-70 Part epoxy resin, 10-35 parts of dicyclopentadiene phenolic active esters and 5-25 parts of esters curing agent.
3. compositions of thermosetting resin according to claim 1 or 2, which is characterized in that the epoxy resin is Halogen ring Oxygen resin；
Preferably, the halogen-free epoxy resin is selected from bisphenol A type epoxy resin, bisphenol f type epoxy resin, o-cresol epoxy novolac Resin, bisphenol A-type novolac epoxy resin, three phenolic novolac epoxy resins, dicyclopentadiene novolac epoxy resin, biphenyl type phenolic aldehyde One of epoxy resin, alkyl benzene-type novolac epoxy resin or naphthol type novolac epoxy resin or at least two combination；
Preferably, the halogen-free epoxy resin has Formula II structure:
Wherein, X1、X2And X3It is each independentlyR9Selected from hydrogen atom, replaces or do not take The C in generation1-C5Straight chained alkyl or substituted or unsubstituted C3-C5One of branched alkyl, Y1And Y2It is each independently selected from list Key ,-CH2-、 One of, R10Selected from hydrogen atom, Substituted or unsubstituted C1-C5Straight chained alkyl or substituted or unsubstituted C3-C5One of branched alkyl, m are the whole of 1-10 Number.
4. compositions of thermosetting resin according to claim 1-3, which is characterized in that the dicyclopentadiene phenol Type active ester has formula III structure:
Wherein, X is phenyl ring or naphthalene nucleus, and j is 0 or 1, and k is 0 or 1, n 0.25-1.25；
Preferably, the compositions of thermosetting resin further includes fire retardant；
Preferably, the fire retardant is phosphonium flame retardant；
Preferably, with the total weight number of the epoxy resin, dicyclopentadiene phenolic active ester and esters curing agent for 100 parts Meter, the additive amount of the phosphonium flame retardant are 1-50 parts, further preferably 1-30 parts；
Preferably, the phosphonium flame retardant is selected from three (2,6- 3,5-dimethylphenyl) phosphines, 10- (2,5- dihydroxy phenyl) -9,10- bis- Hydrogen -9- oxa- -10- phosphine phenanthrene -10- oxide, 2,6- bis- (2,6- 3,5-dimethylphenyl) phosphino- benzene, 10- phenyl -9,10- dihydro -9- In oxa- -10- phosphine phenanthrene -10- oxide, phenoxy phosphazene compound, phosphate, polyphosphate, phosphonate ester or polyphosphonates It is a kind of or at least two combination.
5. compositions of thermosetting resin according to claim 1-4, which is characterized in that the thermosetting resin group Closing object further includes curing accelerator；
Preferably, with the total weight number of the epoxy resin, dicyclopentadiene phenolic active ester and esters curing agent for 100 parts Meter, the additive amount of the curing accelerator are 0.05-1 parts；
Preferably, the curing accelerator is selected from glyoxaline compound, triphenylphosphine, dimethylamino naphthyridine, boron trifluoride list second One of amine or zinc octoate or at least two combination；
Preferably, the glyoxaline compound is selected from 2-methylimidazole, 2-ethyl-4-methylimidazole, 2- phenylimidazole or 2- ten One of one alkyl imidazole or at least two combination；
Preferably, the compositions of thermosetting resin further includes filler；
Preferably, with the total weight number of the epoxy resin, dicyclopentadiene phenolic active ester and esters curing agent for 100 parts Meter, the additive amount of the filler are 1-150 parts, further preferably 1-100 parts；
Preferably, the filler is organic filler and/or inorganic filler；
Preferably, the inorganic filler is selected from silica, aluminium hydroxide, aluminium oxide, talcum powder, aluminium nitride, boron nitride, carbonization One of silicon, barium sulfate, barium titanate, strontium titanates, calcium carbonate, calcium silicates, mica, glass fiber powder or at least two group It closes；
Preferably, the organic filler is selected from one of polytetrafluorethylepowder powder, polyphenylene sulfide or polyether sulfone powder or at least Two kinds of combination；
Preferably, the filler is silica, and angle value is 1-15 μm, further preferably 1-10 μm in partial size.
6. a kind of resin adhesive liquid, which is characterized in that the resin adhesive liquid is by thermosetting property as described in any one in claim 1-5 Resin combination is dissolved or dispersed in solvent and obtains.
7. a kind of prepreg, which is characterized in that the prepreg includes reinforcing material, and described by being attached to after impregnation drying Compositions of thermosetting resin as described in any one in claim 1-5 on reinforcing material.
8. a kind of laminate, which is characterized in that the laminate includes the as claimed in claim 7 of one or at least two overlapping Prepreg.
9. a kind of metal-clad laminate, which is characterized in that the metal-clad laminate includes one or at least two overlapping Prepreg as claimed in claim 7 and the metal foil of one or both sides that is overlying on the outside of the prepreg.
10. a kind of printed circuit board, which is characterized in that the printed circuit board includes at least one as claimed in claim 7 Prepreg.
CN201811588483.6A 2018-12-25 2018-12-25 Thermosetting resin composition, and prepreg, laminated board and metal foil-clad laminated board using same Active CN109651763B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201811588483.6A CN109651763B (en) 2018-12-25 2018-12-25 Thermosetting resin composition, and prepreg, laminated board and metal foil-clad laminated board using same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201811588483.6A CN109651763B (en) 2018-12-25 2018-12-25 Thermosetting resin composition, and prepreg, laminated board and metal foil-clad laminated board using same

Publications (2)

Publication Number Publication Date
CN109651763A true CN109651763A (en) 2019-04-19
CN109651763B CN109651763B (en) 2020-10-27

Family

ID=66115092

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201811588483.6A Active CN109651763B (en) 2018-12-25 2018-12-25 Thermosetting resin composition, and prepreg, laminated board and metal foil-clad laminated board using same

Country Status (1)

Country Link
CN (1) CN109651763B (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110511360A (en) * 2019-08-30 2019-11-29 广东同宇新材料有限公司 A kind of active ester resin and its preparation method and application
CN114479012A (en) * 2020-10-27 2022-05-13 广东生益科技股份有限公司 Double-end cyano-group active ester, thermosetting resin composition, preparation method and application thereof
CN116852811A (en) * 2023-07-10 2023-10-10 江苏耀鸿电子有限公司 high-Tg epoxy resin copper-clad plate and preparation method thereof
WO2024090396A1 (en) * 2022-10-24 2024-05-02 太陽ホールディングス株式会社 Curable resin composition, multilayer structure, cured product and electronic component

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1297048B1 (en) * 2000-06-29 2006-01-11 Cytec Technology Corp. Low moisture absorption epoxy resin systems
US20100144977A1 (en) * 2008-11-20 2010-06-10 Designer Molecules, Inc. Curing agents for epoxy resins
CN105399927A (en) * 2015-12-15 2016-03-16 广东广山新材料有限公司 Epoxy resin curing agent and preparation method and application thereof
CN105440263A (en) * 2015-12-15 2016-03-30 广东广山新材料有限公司 Epoxy resin curing agent, and preparation method and use thereof
CN105542128A (en) * 2015-12-15 2016-05-04 广东广山新材料有限公司 Curing agent for epoxy resin as well as preparation method and application thereof
CN105566621A (en) * 2014-11-11 2016-05-11 江苏雅克科技股份有限公司 Composition and preparation method of low-dielectric phosphorus-containing polyester compound

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1297048B1 (en) * 2000-06-29 2006-01-11 Cytec Technology Corp. Low moisture absorption epoxy resin systems
US20100144977A1 (en) * 2008-11-20 2010-06-10 Designer Molecules, Inc. Curing agents for epoxy resins
CN105566621A (en) * 2014-11-11 2016-05-11 江苏雅克科技股份有限公司 Composition and preparation method of low-dielectric phosphorus-containing polyester compound
CN105399927A (en) * 2015-12-15 2016-03-16 广东广山新材料有限公司 Epoxy resin curing agent and preparation method and application thereof
CN105440263A (en) * 2015-12-15 2016-03-30 广东广山新材料有限公司 Epoxy resin curing agent, and preparation method and use thereof
CN105542128A (en) * 2015-12-15 2016-05-04 广东广山新材料有限公司 Curing agent for epoxy resin as well as preparation method and application thereof

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110511360A (en) * 2019-08-30 2019-11-29 广东同宇新材料有限公司 A kind of active ester resin and its preparation method and application
CN110511360B (en) * 2019-08-30 2021-12-10 广东同宇新材料有限公司 Active ester resin and preparation method and application thereof
CN114479012A (en) * 2020-10-27 2022-05-13 广东生益科技股份有限公司 Double-end cyano-group active ester, thermosetting resin composition, preparation method and application thereof
CN114479012B (en) * 2020-10-27 2023-08-15 广东生益科技股份有限公司 Double-end cyano active ester, thermosetting resin composition, and preparation method and application thereof
WO2024090396A1 (en) * 2022-10-24 2024-05-02 太陽ホールディングス株式会社 Curable resin composition, multilayer structure, cured product and electronic component
CN116852811A (en) * 2023-07-10 2023-10-10 江苏耀鸿电子有限公司 high-Tg epoxy resin copper-clad plate and preparation method thereof
CN116852811B (en) * 2023-07-10 2024-01-02 江苏耀鸿电子有限公司 high-Tg epoxy resin copper-clad plate and preparation method thereof

Also Published As

Publication number Publication date
CN109651763B (en) 2020-10-27

Similar Documents

Publication Publication Date Title
US10336875B2 (en) Halogen-free resin composition and prepreg and laminate prepared therefrom
EP2770025B1 (en) Halogen-free low-dielectric resin composition, and prepreg and copper foil laminate made by using same
TWI527855B (en) A halogen-free resin composition, and a laminate for prepreg and printed circuit board using the same
EP3053963B1 (en) Halogen-free resin composition and uses thereof
JP6470400B2 (en) High CTI halogen-free epoxy resin composition for copper clad plate and method of using the same
EP3219758B1 (en) Thermosetting resin composition and prepreg and laminated board prepared therefrom
CN109851997A (en) A kind of compositions of thermosetting resin and prepreg, laminate and metal-clad laminate using it
CN109651763A (en) A kind of compositions of thermosetting resin and prepreg, laminate and metal-clad laminate using it
TWI646142B (en) Resin composition and copper foil substrate and printed circuit board using same
CN103980704B (en) Halogen-free resin composition, prepreg and laminate for high-frequency high-speed substrate
CN104109347B (en) A kind of halogen-free thermosetting resin composite, prepreg and laminate
EP3412722B1 (en) Halogen-free thermosetting resin composition, prepreg containing same, laminate, and printed circuit board
CN105131597B (en) A kind of halogen-free resin composition and use its prepreg and laminate for printed circuits
CN109608828A (en) A kind of compositions of thermosetting resin and prepreg, laminate and metal-clad laminate using it
CN105801814B (en) A kind of halogen-free thermosetting resin composite and use its prepreg and laminate for printed circuits
CN109535653B (en) Phosphorus-containing epoxy resin composition, and prepreg and laminated board prepared from same
CN108192281B (en) Halogen-free thermosetting resin composition, and prepreg, laminated board, metal foil-clad laminated board and printed circuit board using same
CN108047647B (en) Halogen-free thermosetting resin composition, and prepreg, laminated board, metal foil-clad laminated board and printed circuit board using same
CN114149657B (en) Epoxy resin composition with low dielectric loss and high CTI (comparative tracking index) and application thereof
CN114605779B (en) Thermosetting resin composition, prepreg comprising thermosetting resin composition, circuit substrate and printed circuit board
CN109694462A (en) A kind of compositions of thermosetting resin and prepreg, metal-clad laminate and printed circuit board using it
CN118255969A (en) Thermosetting resin composition and prepreg, laminated board and printed circuit board using thermosetting resin composition
CN105802127B (en) A kind of halogen-free thermosetting resin composite and use its prepreg and laminate for printed circuits
CN118256061A (en) Halogen-free thermosetting resin composition, laminated board and printed circuit board
CN113121957A (en) Halogen-free thermosetting resin composition, and prepreg, laminated board and printed circuit board using same

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant