CN102205675A - High thermal conductivity and high heat-resistant copper-clad lamination of CEM-3 grade for LED - Google Patents
High thermal conductivity and high heat-resistant copper-clad lamination of CEM-3 grade for LED Download PDFInfo
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- CN102205675A CN102205675A CN201110076878XA CN201110076878A CN102205675A CN 102205675 A CN102205675 A CN 102205675A CN 201110076878X A CN201110076878X A CN 201110076878XA CN 201110076878 A CN201110076878 A CN 201110076878A CN 102205675 A CN102205675 A CN 102205675A
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Abstract
The invention relates to a high thermal conductivity and high heat-resistant copper-clad lamination of CEM-3 grade for LED. The copper-clad lamination of CEM-3 grade is prepared by the following steps: 1) confecting glue: confecting a liquid glue and mixing uniformly; 2) gluing: facing layer: gluing glass fiber clothes and drying the glued glass fiber clothes by a vertical gluing machine to obtain prepregs; interlayer: gluing glass fiber mats and drying the glued glass fiber mats by the vertical gluing machine to obtain prepregs; 3) compacting: superposing two facing layers on one or more glass fiber mats, covering the both sides of the composite of facing layers and glass fiber mats with copper foil, and compacting the composite in a vacuum press. According to the invention, the copper-clad lamination of CEM-3 grade is prepared by adding a lot of micron-sized heat conduction fillers into bromine-containing epoxy resin, adopting phenolic curing agent and using adjusting and compacting method, with high thermal conductivity, capable of solving the problem of large and rapid heat dissipation of LED lamps.
Description
Technical field
The present invention relates to a kind of LED with the high heat-resisting CEM-3 copper-clad plate of high heat conduction.
Background technology
The LED(semiconductor light-emitting-diode) electricity-saving lamp is with high brightness white light-emitting diode light emitting source, light efficiency height, little power consumption, and the life-span is long, and safety and environmental protection is a solid cold light source of new generation, is suitable for family, the market, hospitals etc. throw light on various public places for a long time.Along with being showing improvement or progress day by day of LED application technology development, application more and more widely, its power consumption and caloric value be improve thereupon also, the especially significantly harsh especially challenge of the caloric value of Ti Gaoing.Because the fundamental characteristics of LED element is, if temperature rises, luminous efficiency will descend, so how substrate effectively discharges a large amount of exothermic technologies that produce heats, promptly possessing high-termal conductivity just becomes key.
Along with the arrival in PCB leadless process epoch, the lead-free solder fusing point will be increased to 217 ℃ by original 183 ℃ simultaneously, and solder temperature improves greatly, and the substrate that just requires to use as LED will have better hear resistance to satisfy the needs of leadless process.
Chinese patent CN 101848604A discloses a kind of preparation method of CEM-3 copper clad plate with high heat conductivity, to carry out according to following method and technology: one. core material---with epoxy resin/phenolic resins is main curing agent in preparation, add coupling agent, filler and curing accelerator, be modulated into the core material resin liquid with butanone, with above-mentioned core material glue impregnated glass fiber paper, be semi-cured state, make core material; Two. the preparation lining---with epoxy resin/phenolic resin curing system, it is dissolved, add filler, be modulated into the lining resin liquid, be used to flood glass cloth and curing, make lining with butanone with butanone; The 3rd, batching and laminated into type.This invention also has good thermal conductivity and high CTI, higher hear resistance and good PCB processes except that having key propertys such as insulating properties that the compound basic copper-clad plate of general universal CEM-3 had, electric property, mechanical performance.
Summary of the invention
Technical problem to be solved by this invention is to provide a kind of high heat conduction high-fire resistance that has, and can be applicable to the LED heat radiating material of leadless process.
A kind of LED is with the high heat-resisting CEM-3 copper-clad plate of high heat conduction, by following method preparation and get:
1) joins glue:, and mix by following parts by weight of component preparation glue;
The difunctional brominated epoxy resin 110～120 of epoxide equivalent 400～450;
The long-chain macromolecule epoxy resin 12～16 of epoxide equivalent 900～1000;
Curing agent 10～30;
High conductive powder 250～350;
10% silane coupler KH560 solution 20～40;
Methylimidazole or diphenyl-imidazole 0.03～0.05;
Solvent 80～120; Described solvent is selected from one of following or more than one any combination: acetone, butanone, 1-Methoxy-2-propyl acetate;
2) gluing:
Overlay coating: with the glass fabric gluing, make prepreg in the vertical gluing machine oven dry, gluing speed is 17～22 m/min, and the control parameter: gelation time is 100～130S, and resin content is 15～20%, fluidity 20%～30%;
Sandwich of layers: with the glass mat gluing, make prepreg in the vertical gluing machine oven dry, gluing speed is 8～12 m/min, and the control parameter: resin content is 22～30%, and fluidity is 0.5～1mm;
3) compacting: put up surface layer and an above glass mat is formed by stacking with two, the two-sided again Copper Foil that is covered with, in vacuum press, suppress, the compacting parameter is controlled at: vacuum: 0～0.01Mpa, pressure: 450～550PSI, heating rate: 2～3 ℃/min, temperature of heat plate: 120～230 degree, press time 120～180min.
Preferably, described high conductive powder is a micron order heat conduction inserts.
Again preferably, described high conductive powder is selected the aluminium oxide of average grain diameter 4～6um for use.
Preferably, described difunctional brominated epoxy resin epoxide equivalent is 430 gram/equivalents.
Preferably, described long-chain macromolecule epoxy resin epoxide equivalent is 935 gram/equivalents.
Preferably, described curing agent adopts the phenolic resin curative of hydroxyl equivalent 120 gram/equivalents.
Preferably, described curing agent adopts DADPS.
Preferably, described solvent is made up of following components by part by weight: 1-Methoxy-2-propyl acetate 60～90, butanone 20～30.The prepreg surface smoother of selecting for use the bi-component solvent to make to make, no bubble, raising prepreg apparent.
Preferably, by following parts by weight of component preparation glue:
Difunctional brominated epoxy resin 112.5;
Long-chain macromolecule epoxy resin 14.3;
Phenolic curing agent 27.6;
High conductive powder 320;
10% KH560 solution 32;
Methylimidazole 0.04;
1-Methoxy-2-propyl acetate 80;
Butanone 25.
The present invention adds a large amount of micron-sized heat conduction inserts in brominated epoxy resin, and adopts phenolic curing agent, comes compression moulding by adjusting drawing method.CEM-3 plate after hot-forming has high thermal conductivity, and thermal conductivity factor reaches more than the 1.5W/ MK, can well solve a large amount of quick heat radiatings of LED illuminating lamp; Have splendid hear resistance simultaneously, T260〉5min, anti-immersed solder performance is promoted to 300 ℃ of present following 120S by 260 ℃ of traditional following 180S, can satisfy client's leadless process production and processing demand.
The specific embodiment
The invention will be further described below in conjunction with embodiment, but protection scope of the present invention is not limited to this.
Unless stated otherwise, the glue component that the present invention relates to all can obtain by commercial sources.
Embodiment 1 LED is with the preparation of the high heat-resisting CEM-3 copper-clad plate of high heat conduction
1) modulation of insulating barrier glue prescription
The glue component is counted according to weight quota:
Epoxide equivalent is the difunctional brominated epoxy resin 112.5 of 430 gram/equivalents;
Epoxide equivalent is the long-chain macromolecule epoxy resin 14.3 of 935 gram/equivalents;
Phenolic curing agent 46.3;
The high conductive powder 320 of the aluminium oxide of average grain diameter 4～6um;
10% KH560 solution 32;
Methylimidazole 0.04;
1-Methoxy-2-propyl acetate 80;
Butanone 25;
Each component is fully mixed 8h;
Glue gel time 255S.
2) gluing:
Overlay coating:
With the glass fabric gluing, make prepreg in the vertical gluing machine oven dry, gluing speed is 20m/min; The control parameter: gelation time is 125S, and resin content is 16.8%, fluidity 28%;
Sandwich of layers: with the glass mat gluing, make prepreg in the vertical gluing machine oven dry, gluing speed is 12m/min, and the control parameter: resin content is 26.5%, and fluidity is 0.8mm.
3) compacting:
According to the product thickness requirement, put up face and required felt is formed by stacking, the two-sided again Copper Foil that is covered with, row compacting in vacuum press with 2.The compacting parameter:
Vacuum: 0.01Mpa;
Pressure: 530PSI;
Heating rate: 2 ℃/min;
Temperature of heat plate: 120～230 degree, press time 150min;
When wherein temperature of heat plate 230 was spent, corresponding also was high pressure 530PSI, the about 60min of operation this moment;
By sheet material outward appearance, interior material test passes, pack shipment more at last.
Embodiment 2
1) modulation of insulating barrier glue prescription
The glue component is counted according to weight quota:
Epoxide equivalent is the difunctional brominated epoxy resin 112.5 of 430 gram/equivalents;
Epoxide equivalent is the long-chain macromolecule epoxy resin 14.3 of 960 gram/equivalents;
Phenolic curing agent 50;
The high conductive powder 300 of the aluminium oxide of average grain diameter 4～6um;
10% KH560 solution 35;
Methylimidazole 0.04;
1-Methoxy-2-propyl acetate 70;
Butanone 25;
Each component is fully mixed 8h;
Glue gel time 255S.
2) gluing:
Overlay coating:
With the glass fabric gluing, make prepreg in the vertical gluing machine oven dry, gluing speed is 21m/min; The control parameter: gelation time is 125S, and resin content is 17.8%, fluidity 25%;
Sandwich of layers: with the glass mat gluing, make prepreg in the vertical gluing machine oven dry, gluing speed is 12m/min, and the control parameter: resin content is 27.5%, and fluidity is 0.6mm.
3) compacting:
According to the product thickness requirement, put up face and required felt is formed by stacking, the two-sided again Copper Foil that is covered with, row compacting in vacuum press with 2.The compacting parameter:
Vacuum: 0.005Mpa;
Pressure: 480PSI;
Heating rate: 2 ℃/min;
Temperature of heat plate: 120～230 degree, press time 170min;
When wherein temperature of heat plate 230 was spent, corresponding also was high pressure 480PSI, the about 60min of operation this moment;
By sheet material outward appearance, interior material test passes, pack shipment more at last.
Embodiment 3
1) modulation of insulating barrier glue prescription
The glue component is counted according to weight quota:
Epoxide equivalent is the difunctional brominated epoxy resin 112.5 of 440 gram/equivalents;
Epoxide equivalent is the long-chain macromolecule epoxy resin 14.3 of 960 gram/equivalents;
DADPS 13.3;
The high conductive powder 300 of the aluminium oxide of average grain diameter 4～6um;
10% KH560 solution 35;
Diphenyl-imidazole 0.04;
1-Methoxy-2-propyl acetate 70;
Acetone 25;
Each component is fully mixed 8h;
Glue gel time 255S.
2) gluing:
Overlay coating:
With the glass fabric gluing, make prepreg in the vertical gluing machine oven dry, gluing speed is 21m/min; The control parameter: gelation time is 125S, and resin content is 17.8%, fluidity 25%;
Sandwich of layers: with the glass mat gluing, make prepreg in the vertical gluing machine oven dry, gluing speed is 12m/min, and the control parameter: resin content is 27.5%, and fluidity is 0.6mm.
3) compacting:
According to the product thickness requirement, put up face and required felt is formed by stacking, the two-sided again Copper Foil that is covered with, row compacting in vacuum press with 2.The compacting parameter:
Vacuum: 0.005Mpa;
Pressure: 480PSI;
Heating rate: 2 ℃/min;
Temperature of heat plate: 120～230 degree, press time 170min;
When wherein temperature of heat plate 230 was spent, corresponding also was high pressure 480PSI, the about 60min of operation this moment;
By sheet material outward appearance, interior material test passes, pack shipment more at last.
Claims (9)
1. a LED is with the high heat-resisting CEM-3 copper-clad plate of high heat conduction, it is characterized in that by following method preparation and gets:
1) joins glue:, and mix by following parts by weight of component preparation glue;
The difunctional brominated epoxy resin 110～120 of epoxide equivalent 400～450;
The long-chain macromolecule epoxy resin 12～16 of epoxide equivalent 900～1000;
Curing agent 10～30;
High conductive powder 250～350;
10% silane coupler KH560 solution 20～40;
Methylimidazole or diphenyl-imidazole 0.03～0.05;
Solvent 80～120; Described solvent is selected from one of following or more than one any combination: acetone, butanone, 1-Methoxy-2-propyl acetate;
2) gluing:
Overlay coating: with the glass fabric gluing, make prepreg in the vertical gluing machine oven dry, gluing speed is 17～22 m/min, and the control parameter: gelation time is 100～130S, and resin content is 15～20%, fluidity 20%～30%;
Sandwich of layers: with the glass mat gluing, make prepreg in the vertical gluing machine oven dry, gluing speed is 8～12 m/min, and the control parameter: resin content is 22～30%, and fluidity is 0.5～1mm;
3) compacting: put up surface layer and an above glass mat is formed by stacking with two, the two-sided again Copper Foil that is covered with, in vacuum press, suppress, the compacting parameter is controlled at: vacuum: 0～0.01Mpa, pressure: 450～550PSI, heating rate: 2～3 ℃/min, temperature of heat plate: 120～230 degree, press time 120～180min.
According to the described LED of claim 1 with the high heat-resisting CEM-3 copper-clad plate of high heat conduction, it is characterized in that: described high conductive powder is a micron order heat conduction inserts.
According to the described LED of claim 2 with the high heat-resisting CEM-3 copper-clad plate of high heat conduction, it is characterized in that: described high conductive powder is selected the aluminium oxide of average grain diameter 4～6um for use.
According to the described LED of claim 1 with the high heat-resisting CEM-3 copper-clad plate of high heat conduction, it is characterized in that: described difunctional brominated epoxy resin epoxide equivalent is 430 gram/equivalents.
According to the described LED of claim 1 with the high heat-resisting CEM-3 copper-clad plate of high heat conduction, it is characterized in that: described long-chain macromolecule epoxy resin epoxide equivalent is 935 gram/equivalents.
According to the described LED of claim 1 with the high heat-resisting CEM-3 copper-clad plate of high heat conduction, it is characterized in that: described curing agent adopts the phenolic resin curative of hydroxyl equivalent 120 gram/equivalents.
According to the described LED of claim 1 with the high heat-resisting CEM-3 copper-clad plate of high heat conduction, it is characterized in that: described curing agent adopts DADPS.
According to the described LED of claim 1 with the high heat-resisting CEM-3 copper-clad plate of high heat conduction, it is characterized in that: described solvent is made up of following components by part by weight: 1-Methoxy-2-propyl acetate 60～90, butanone 20～30.
According to the described LED of claim 1 with the high heat-resisting CEM-3 copper-clad plate of high heat conduction, it is characterized in that: by following parts by weight of component preparation glue:
Difunctional brominated epoxy resin 112.5;
Long-chain macromolecule epoxy resin 14.3;
Phenolic curing agent 27.6;
High conductive powder 320;
10% KH560 solution 32;
Methylimidazole 0.04;
1-Methoxy-2-propyl acetate 80;
Butanone 25.
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| CN201110076878XA CN102205675A (en) | 2011-03-29 | 2011-03-29 | High thermal conductivity and high heat-resistant copper-clad lamination of CEM-3 grade for LED |
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Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102566537A (en) * | 2011-12-23 | 2012-07-11 | 广东生益科技股份有限公司 | Copper-clad plate glue water mixing control system |
| CN102633990A (en) * | 2012-04-05 | 2012-08-15 | 广东生益科技股份有限公司 | Epoxy resin composition, prepreg made of epoxy resin composition and copper-coated laminate made of epoxy resin composition |
| CN103129090A (en) * | 2013-01-30 | 2013-06-05 | 广东生益科技股份有限公司 | Preparation method of glass-film base copper-clad plate (CCL) and CCL obtained according to the same |
| CN104002538A (en) * | 2014-04-18 | 2014-08-27 | 南通诺德电子有限公司 | Making method for super-thick copper foil and high heat-conducting copper clad laminate |
| CN104210182A (en) * | 2014-08-14 | 2014-12-17 | 金安国纪科技股份有限公司 | High heat conduction copper-clad plate for LED backlight, glue solution, preparation method of copper-clad plate, and preparation method of glue solution |
| CN104210181A (en) * | 2014-08-14 | 2014-12-17 | 金安国纪科技股份有限公司 | High heat conduction copper-clad plate for LED lamps, and making method thereof |
| CN105269916A (en) * | 2015-10-12 | 2016-01-27 | 铜陵浩荣华科复合基板有限公司 | High thermal conductivity CEM-3 copper-clad plate making process |
| CN106218192A (en) * | 2016-07-27 | 2016-12-14 | 重庆德凯实业股份有限公司 | A kind of manufacture method of high heat-resisting CEM 3 copper-clad plate of LED halogen-free high-thermal-conductivity |
| CN108059926A (en) * | 2017-11-14 | 2018-05-22 | 浙江元集新材料科技股份有限公司 | A kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate |
| CN110370750A (en) * | 2019-07-03 | 2019-10-25 | 江西品升电子有限公司 | Highly heat-conductive copper-clad plate and preparation method |
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| JP2009179774A (en) * | 2008-02-01 | 2009-08-13 | Toray Ind Inc | Flame retardant adhesive composition, adhesive sheet using the same, cover lay film, and copper clad laminate |
| JP2010143988A (en) * | 2008-12-17 | 2010-07-01 | Toagosei Co Ltd | Adhesive composition and cover-lay film and flexible copper-clad laminate using the same |
| CN101456276A (en) * | 2009-01-08 | 2009-06-17 | 浙江华正电子集团有限公司 | Method for manufacturing copper clad laminated board adapted to leadless process |
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Cited By (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102566537A (en) * | 2011-12-23 | 2012-07-11 | 广东生益科技股份有限公司 | Copper-clad plate glue water mixing control system |
| CN102633990A (en) * | 2012-04-05 | 2012-08-15 | 广东生益科技股份有限公司 | Epoxy resin composition, prepreg made of epoxy resin composition and copper-coated laminate made of epoxy resin composition |
| CN103129090A (en) * | 2013-01-30 | 2013-06-05 | 广东生益科技股份有限公司 | Preparation method of glass-film base copper-clad plate (CCL) and CCL obtained according to the same |
| CN103129090B (en) * | 2013-01-30 | 2016-05-25 | 广东生益科技股份有限公司 | The preparation method of a kind of glass-film base copper-clad plate and prepared copper-clad plate thereof |
| CN104002538A (en) * | 2014-04-18 | 2014-08-27 | 南通诺德电子有限公司 | Making method for super-thick copper foil and high heat-conducting copper clad laminate |
| CN104210181B (en) * | 2014-08-14 | 2016-09-07 | 金安国纪科技股份有限公司 | LED highly heat-conductive copper-clad plate and preparation method thereof |
| CN104210182A (en) * | 2014-08-14 | 2014-12-17 | 金安国纪科技股份有限公司 | High heat conduction copper-clad plate for LED backlight, glue solution, preparation method of copper-clad plate, and preparation method of glue solution |
| CN104210181A (en) * | 2014-08-14 | 2014-12-17 | 金安国纪科技股份有限公司 | High heat conduction copper-clad plate for LED lamps, and making method thereof |
| CN105269916A (en) * | 2015-10-12 | 2016-01-27 | 铜陵浩荣华科复合基板有限公司 | High thermal conductivity CEM-3 copper-clad plate making process |
| CN106218192A (en) * | 2016-07-27 | 2016-12-14 | 重庆德凯实业股份有限公司 | A kind of manufacture method of high heat-resisting CEM 3 copper-clad plate of LED halogen-free high-thermal-conductivity |
| CN108059926A (en) * | 2017-11-14 | 2018-05-22 | 浙江元集新材料科技股份有限公司 | A kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate |
| CN110370750A (en) * | 2019-07-03 | 2019-10-25 | 江西品升电子有限公司 | Highly heat-conductive copper-clad plate and preparation method |
| CN110370750B (en) * | 2019-07-03 | 2022-01-28 | 江西品升电子有限公司 | High-thermal-conductivity copper-clad plate and preparation method thereof |
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Application publication date: 20111005 |