CN108059926A - A kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate - Google Patents
A kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate Download PDFInfo
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/20—Oxides; Hydroxides
- C08K3/22—Oxides; Hydroxides of metals
- C08K2003/2227—Oxides; Hydroxides of metals of aluminium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/011—Nanostructured additives
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- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
- C09J2301/408—Additional features of adhesives in the form of films or foils characterized by the presence of essential components additives as essential feature of the adhesive layer
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Abstract
The present invention relates to a kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate, the preparation method is prepared including glue, and the glue prepared adds in inorganic nano glue, is then immersed with glass fabric, and in semi-solid preparation, high heat conduction bonding sheet is made.Coupling agent is added in glue formula of the present invention to be surface-treated aluminium oxide, aluminium oxide is combined with resin Geng Neng Xinmi City, preferable heat transfer path can be formed, aluminium oxide can be largely added in emulsifying device emulsification glue, the thermal conductivity factor of bonding sheet can be provided, thermal conductivity factor is more stable, has captured the technical barrier that glass cloth bonding sheet thermal conductivity factor is difficult to 1.5 watts.
Description
Technical field
The present invention relates to composite plate technical field, more particularly to a kind of thermal conductivity factor for improving bonding sheet, thermal conductivity factor
The preparation method of the special high heat conduction bonding sheet of more stable aluminum-based copper-clad plate.
Background technology
With the developing trend multifunction of electronic product, the parts of electronic product are also constantly to light, thin, short, small etc.
Aspect develops, the especially extensive use of high density integrated circuit technology, and high performance, highly reliable is proposed to consumer electronic product
The requirement of property and high security；Good technical performance, low cost, the requirement of low energy consumption are proposed to industrial electronic product.Therefore
The base material copper-clad plate of core material --- --- printed circuit board (Printed Circuit Board, abbreviation PCB) of electronic product
It is faced with higher technology requirement, severeer use environment and higher environmental requirement.
Copper-clad plate (Copper Clad Laminate, abbreviation CCL) is with fiber mainly for the production of printed circuit board
Paper, glass fabric or glass fibre non-woven (being commonly called as glass felt) etc. are used as reinforcing material, soak with resin, single or double covers
With copper foil, a kind of product formed through hot pressing.Existing copper-clad plate is due to manufacture raw material and the otherness of manufacture structure, CCL
The technical performance of base material is different.
Following a few major classes can be divided by forming structure and its difference of reinforcing material, existing copper-clad plate according to copper-clad plate,
And respectively have advantage and disadvantage：
1st, paper-based copper-coated board：Although paper-based copper-coated board simple production process, production cost are relatively low, its many performance cannot
Meet much for the technology requirement of electronic product high performance.
2nd, special reinforcing material base copper-clad plate：Special enhancing base copper-clad plate, which is that the one kind to grow up in recent years is new, covers copper
Plate, but since its processing technology is higher, production cost is higher, is only applied at present in the electronic product of particular/special requirement.
3rd, glass fabric base copper-clad plate：Glass fabric base copper-clad plate (i.e. FR-4 copper-clad plates) is in current CCL products
Using a most kinds, composition structure is using glass fabric as fabric, using glass fabric as core material.FR-4 copper-clad plates
With the technical performances such as good heat resistance, electrical characteristic and good mechanical strength, resistance to chemical reagents；But in PCB productions
Be not suitable for Sheet Metal Forming Technology, the dimensional stability of base material is poor, and thin plate warpage is relatively large, and production cost is relatively high.
4th, composite-based copper clad plate：Composite base (Composite Epoxy Mterial) copper-clad plate, in existing CCL products
Common is glass fabric/fibrous paper composite-based copper clad plate (hereinafter referred to as " CEM-1 copper-clad plates "), glass fabric/glass fibers
Tie up non-woven fabric compounded base copper-clad plate (hereinafter referred to as " CEM-3 copper-clad plates ").Wherein, the application of CEM-3 copper-clad plates is only second to FR-4
Copper-clad plate, composition structure is using glass fabric as fabric, using glass fibre non-woven as core material.CEM-3 copper-clad plates have good
Good punching performance, machining property and good dimensional stability, production cost are far below FR-4 copper-clad plates；But
Compared to FR-4, mechanical strength, heat resistance are relatively poor, for high density integrated circuit and high frequency, high speed, the electrical member of large capacity
Part can not carry.
In terms of reinforcing material production, the production of glass fabric by fusing, wire drawing, woven fabric, heat treatment, surface at
The processes such as reason, dry, relatively other its industrial cost of reinforcing material are larger, and energy consumption is big, pollution weight, and environmentally friendly cost is higher；Glass
The production of fabric nonwoven cloth is by the processes such as slurrying, copy paper, gluing, drying, and in contrast its industrial cost is relatively low, energy consumption compared with
It is small, pollution it is lighter, environmentally friendly cost is relatively low.Two kinds of materials respectively have quality.
Therefore, those skilled in the art be directed to developing a kind of comprehensive technical performance it is excellent, but also with good machinery
Intensity and dimensional stability, while production cost, energy consumption and the lower-cost copper-clad plate of environmental protection.
High-heat-conductionaluminum aluminum base copper clad board substantially adds in heat conduction oxygen with pressing insulating layer bonding sheet in epoxy resin glue
Change aluminium and stir evenly leaching with 1080 glass fabrics in the bonding sheet heat conduction that made by baking oven baking semi-solid preparation, this kind is made
Coefficient only has 0.7~1 watt, and thermal conductivity factor is more common for.
The content of the invention
It is an object of the invention in order to solve the defects of thermal conductivity factor of existing bonding sheet pressing into aluminum-based copper-clad plate is low
And a kind of thermal conductivity factor for improving bonding sheet is provided, the system of the special high heat conduction bonding sheet of the more stable aluminum-based copper-clad plate of thermal conductivity factor
Preparation Method.
To achieve these goals, the present invention uses following technical scheme：
A kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate, the preparation method comprise the following steps：
1) prepared by glue：Weigh epoxy resin, dicyandiamide, 2-methylimidazole, dimethylformamide, aluminium oxide, KH-560 couplings
Agent, carbon nanotubes, phenol-formaldehyde resin modified and formaldehyde catching agent；In reaction kettle dimethylformamide dissolving dicyandiamide and 2- miaows
Azoles, add in epoxy resin stirring 4 it is small when, add KH-560 coupling agents stirring 2 it is small when after stir while adding in aluminium oxide
With phenol-formaldehyde resin modified and formaldehyde catching agent, aluminium oxide launched continue stirring 5 it is small when, finally with emulsifying device emulsification glue most
Glue is made eventually；
2) inorganic nano glue is added in the glue that step 1) prepares, is then immersed with 106 glass fabrics in glue,
170~190 DEG C of baking ovens toast 5~8 minutes semi-solid preparations, and 200~270g/m is made2High heat conduction bonding sheet.
In the technical program, addition coupling agent is surface-treated aluminium oxide in glue formula, so effectively divides
Aluminium oxide is dissipated, aluminium oxide is more preferable with resin-bonded, forms good passage of heat；
Glue is emulsified with emulsification dispersion system equipment so that the aluminium oxide in glue is more uniformly dispersed, and can add
The injected volume of big aluminium oxide, forms stable passage of heat, improves material thermal conductivity.
It being glued with slim 106 glass fabric, this kind of glass fabric thickness is a half with respect to 1080 glass fabrics,
Reduce the thermal resistance of heat transfer process.
Preferably, each raw material of glue is respectively in terms of parts by weight：100-125 parts of epoxy resin, 2-3 parts of dicyandiamides,
0.05-0.1 parts of 2-methylimidazoles, 30-50 parts of dimethylformamides, 300-350 parts of aluminium oxide, 3-5 parts of KH-560 coupling agents,
0.3-1 parts of carbon nanotubes, 10-15 parts of phenol-formaldehyde resin modifieds and 2-6 parts of formaldehyde catching agents.
Preferably, the formaldehyde catching agent has following formula：R-NH2, wherein, R is selected from-OH ,-CH2-CH2-SO3H ,-CH2
(COOH) and-CH (COOH) (CH2CH2CONH2One or more of).
In the technical program, the carbonyl of free aldehyde is 45 in the primary amine group and phenol-formaldehyde resin modified in formaldehyde catching agent
Nucleophilic addition generation RNHCH can occur under the conditions of~60 DEG C2OH, the structural stability is very poor, can be given birth to rapid dehydration
Into RNH=CH2, and condensation reaction occurs from each other, form polymeric crosslinker.The reaction on the one hand can be in reduction system
The content of free aldehyde, on the other hand can generate network-like polymeric crosslinker, System Modification toughening can be improved it and be led
Hot property and caking property.
Preferably, the phenol-formaldehyde resin modified is cashew nut oil modified alkyd resin or modification of flax oil phenolic resin.
Preferably, the phenol-formaldehyde resin modified is prepared with the following method：Phenol and p-methyl benzenesulfonic acid are pressed 1:
0.12~1: 0.5 mass ratio is mixed evenly, and is slowly added to change by the 62%~72% of phenol quality under quick stirring
Property object, be warming up to 135~145 DEG C, after reacting 2~4h, stop heating and is simultaneously cooled to room temperature under stiring, obtain modifier-phenol
Reactant；By modifier-phenol reactant object heating stirring, added according to the 92%~95% of modifier-phenol reactant amount of substance
Formaldehyde according to 3%~5% addition ammonium hydroxide of modifier-phenol reactant amount of substance after stirring evenly, is slowly warming up to 100~115
DEG C, it when yellow muddiness occurs in reactant, is cooled down, starts vacuum dehydration when 48~52 DEG C or so, when resin liquid becomes
During into amber transparent, stop dehydration, add in absolute ethyl alcohol and stirring dissolving, be cooled to room temperature discharging, obtain phenol-formaldehyde resin modified；It is described
Modifier is linseed oil or cashew nut shell oil.
Preferably, the inorganic nano glue is inorganic nano zinc oxide glue, inorganic nano titanium nitride glue or nothing
Machine nano silicon nitride zinc glue.
Beneficial effects of the present invention：The bonding sheet of the present invention is used to prepare aluminum-based copper-clad plate, it both ensure that good resistance to
Hot property, electric property and resistance to chemical reagents energy, but also with good punching performance, mechanical strength and dimensional stability；It is produced into
This is low compared with FR-4 copper-clad plates and CEM-3 copper-clad plates；It is stronger to the adaptability of PCB processing technologys, the loss to PCB process equipments
Smaller, processing cost are lower；The energy consumption of raw material is relatively low, and pollution is less, and environmentally friendly cost is lower, and it is low to meet our times
The requirement of carbon, high-environmental.
It adds in coupling agent in glue formula to be surface-treated aluminium oxide, aluminium oxide is combined with resin Geng Neng Xinmi City, energy
Preferable heat transfer path is formed, aluminium oxide can be largely added in emulsifying device emulsification glue, the heat conduction system of bonding sheet can be provided
Number, thermal conductivity factor is more stable, has captured the technical barrier that glass cloth bonding sheet thermal conductivity factor is difficult to 1.5 watts.
Specific embodiment
Below by specific embodiment, the technical solutions of the present invention will be further described.
In the present invention, if not refering in particular to, all devices and raw material is commercially available or the industry is common are following
Method in embodiment is this field conventional method unless otherwise instructed.
Formaldehyde catching agent has following formula：R-NH2, wherein, R is selected from-OH ,-CH2-CH2-SO3H ,-CH2(COOH) and-CH
(COOH)(CH2CH2CONH2One or more of).
Phenol-formaldehyde resin modified is cashew nut oil modified alkyd resin or modification of flax oil phenolic resin.
Phenol-formaldehyde resin modified is prepared with the following method：Phenol and p-methyl benzenesulfonic acid are pressed to 1: 0.12~1: 0.5 matter
Amount ratio is mixed evenly, and modifier is slowly added to by the 62%~72% of phenol quality under quick stirring, it is warming up to 135~
145 DEG C, after reacting 2~4h, stop heating and being cooled to room temperature under stiring, obtain modifier-phenol reactant object；By modifier-
Phenol reactant object heating stirring, according to modifier-phenol reactant amount of substance 92%~95% add in formaldehyde, after stirring evenly by
Ammonium hydroxide is added according to the 3%~5% of modifier-phenol reactant amount of substance, is slowly warming up to 100~115 DEG C, when Huang occurs in reactant
It during color muddiness, is cooled down, starts vacuum dehydration when 48~52 DEG C or so, when resin liquid becomes amber transparent, stopped
Dehydration adds in absolute ethyl alcohol and stirring dissolving, is cooled to room temperature discharging, obtains phenol-formaldehyde resin modified；The modifier for linseed oil or
Cashew nut shell oil.
Inorganic nano glue is inorganic nano zinc oxide glue, inorganic nano titanium nitride glue or inorganic nano zinc nitride glue
Liquid.
Embodiment 1
A kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate, the preparation method comprise the following steps：
1) prepared by glue：Weigh epoxy resin, dicyandiamide, 2-methylimidazole, dimethylformamide, aluminium oxide, KH-560 couplings
Agent, carbon nanotubes, phenol-formaldehyde resin modified and formaldehyde catching agent；In reaction kettle dimethylformamide dissolving dicyandiamide and 2- miaows
Azoles, add in epoxy resin stirring 4 it is small when, add KH-560 coupling agents stirring 2 it is small when after stir while add in aluminium oxide,
Carbon nanotubes, with phenol-formaldehyde resin modified and formaldehyde catching agent, aluminium oxide has launched continue stir 5 it is small when, finally use emulsifying device
Emulsification glue is finally made glue；
2) inorganic nano glue is added in the glue that step 1) prepares, is then immersed with 106 glass fabrics in glue,
170 DEG C of baking ovens toast 5 minutes semi-solid preparations, and 200~270g/m is made2High heat conduction bonding sheet.
Each raw material of glue in terms of parts by weight be respectively：100 parts of epoxy resin, 2 parts of dicyandiamides, 0.05 part of 2- methyl miaow
Azoles, 30 parts of dimethylformamides, 0.3 part of carbon nanotubes, 300 parts of aluminium oxide, 3 parts of KH-560 coupling agents, 10 parts of modified phenolic resins
Fat and 2 parts of formaldehyde catching agents.
By the bonding sheet for aluminum-based copper-clad plate, the results of property for testing copper-clad plate is that peel strength is 1.67N/mm, layer
Between bonding force be 0.71-0.81N/mm, glass transition temperature Tg (DMA) be 195 DEG C, the temperature of thermal weight loss temperature Td5%loss
It spends for 407 DEG C.
Embodiment 2
A kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate, the preparation method comprise the following steps：
1) prepared by glue：Weigh epoxy resin, dicyandiamide, 2-methylimidazole, dimethylformamide, aluminium oxide, KH-560 couplings
Agent, carbon nanotubes, phenol-formaldehyde resin modified and formaldehyde catching agent；In reaction kettle dimethylformamide dissolving dicyandiamide and 2- miaows
Azoles, add in epoxy resin stirring 4 it is small when, add KH-560 coupling agents stirring 2 it is small when after stir while add in aluminium oxide,
Carbon nanotubes, with phenol-formaldehyde resin modified and formaldehyde catching agent, aluminium oxide has launched continue stir 5 it is small when, finally use emulsifying device
Emulsification glue is finally made glue；
2) inorganic nano glue is added in the glue that step 1) prepares, is then immersed with 106 glass fabrics in glue,
180 DEG C of baking ovens toast 6 minutes semi-solid preparations, and 200~270g/m is made2High heat conduction bonding sheet.
Each raw material of glue in terms of parts by weight be respectively：118 parts of epoxy resin, 2.6 parts of dicyandiamides, 0.08 part of 2- methyl miaow
Azoles, 36 parts of dimethylformamides, 310 parts of aluminium oxide, 4.3 parts of KH-560 coupling agents, 0.5 part of carbon nanotubes, 12 parts of modified phenolics
Resin and 4 parts of formaldehyde catching agents.
The bonding sheet is used for aluminum-based copper-clad plate, the results of property for testing copper-clad plate is that peel strength is 2.2-2.5N/mm,
Interlayer adhesion is 0.67-0.72N/mm, and glass transition temperature Tg (DMA) is 257 DEG C, thermal weight loss temperature Td5%loss's
Temperature is 412 DEG C.
Embodiment 3
A kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate, the preparation method comprise the following steps：
1) prepared by glue：Weigh epoxy resin, dicyandiamide, 2-methylimidazole, dimethylformamide, aluminium oxide, KH-560 couplings
Agent, carbon nanotubes, phenol-formaldehyde resin modified and formaldehyde catching agent；In reaction kettle dimethylformamide dissolving dicyandiamide and 2- miaows
Azoles, add in epoxy resin stirring 4 it is small when, add KH-560 coupling agents stirring 2 it is small when after stir while add in aluminium oxide,
Carbon nanotubes, with phenol-formaldehyde resin modified and formaldehyde catching agent, aluminium oxide has launched continue stir 5 it is small when, finally use emulsifying device
Emulsification glue is finally made glue；
2) inorganic nano glue is added in the glue that step 1) prepares, is then immersed with 106 glass fabrics in glue,
190 DEG C of baking ovens toast 8 minutes semi-solid preparations, and 200~270g/m is made2High heat conduction bonding sheet.
Each raw material of glue in terms of parts by weight be respectively：125 parts of epoxy resin, 3 parts of dicyandiamides, 0.1 part of 2-methylimidazole,
50 parts of dimethylformamides, 350 parts of aluminium oxide, 5 parts of KH-560 coupling agents, 1 part of carbon nanotubes, 15 parts of phenol-formaldehyde resin modifieds and 6
Part formaldehyde catching agent.
The bonding sheet is used for aluminum-based copper-clad plate, the results of property for testing copper-clad plate is that peel strength is 2.1-2.5N/mm,
Interlayer adhesion is 0.61-0.82N/mm, and glass transition temperature Tg (DMA) is 237 DEG C, thermal weight loss temperature Td5%loss's
Temperature is 410 DEG C.
It adds in coupling agent in glue formula to be surface-treated aluminium oxide, aluminium oxide is combined with resin Geng Neng Xinmi City, energy
Preferable heat transfer path is formed, aluminium oxide can be largely added in emulsifying device emulsification glue, the heat conduction system of bonding sheet can be provided
Number, thermal conductivity factor is more stable, has captured the technical barrier that glass cloth bonding sheet thermal conductivity factor is difficult to 1.5 watts.
Claims (6)
1. a kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate, which is characterized in that the preparation method include with
Lower step：
1) prepared by glue：Weigh epoxy resin, dicyandiamide, 2-methylimidazole, dimethylformamide, aluminium oxide, KH-560 couplings
Agent, carbon nanotubes, phenol-formaldehyde resin modified and formaldehyde catching agent；In reaction kettle dimethylformamide dissolving dicyandiamide and 2- miaows
Azoles, add in epoxy resin stirring 4 it is small when, add KH-560 coupling agents stirring 2 it is small when after stir while add in aluminium oxide,
Carbon nanotubes, with phenol-formaldehyde resin modified and formaldehyde catching agent, aluminium oxide has launched continue stir 5 it is small when, finally use emulsifying device
Emulsification glue is finally made glue；
2) inorganic nano glue is added in the glue that step 1) prepares, is then immersed with 106 glass fabrics in glue,
170~190 DEG C of baking ovens toast 5~8 minutes semi-solid preparations, and 200~270g/m is made2High heat conduction bonding sheet.
2. a kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate according to claim 1, which is characterized in that
Each raw material of glue in terms of parts by weight be respectively：100-125 parts of epoxy resin, 2-3 parts of dicyandiamides, 0.05-0.1 parts of 2- methyl miaows
Azoles, 30-50 parts of dimethylformamides, 300-350 parts of aluminium oxide, 3-5 parts of KH-560 coupling agents, 0.3-1 parts of carbon nanotubes, 10-
15 parts of phenol-formaldehyde resin modifieds and 2-6 parts of formaldehyde catching agents.
3. a kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate according to claim 1 or 2, feature exist
In the formaldehyde catching agent has following formula：R-NH2, wherein, R is selected from-OH ,-CH2-CH2-SO3H ,-CH2(COOH) and-CH
(COOH)(CH2CH2CONH2One or more of).
4. a kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate according to claim 1 or 2, feature exist
In the phenol-formaldehyde resin modified is cashew nut oil modified alkyd resin or modification of flax oil phenolic resin.
5. a kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate according to claim 4, which is characterized in that
The phenol-formaldehyde resin modified is prepared with the following method：Phenol and p-methyl benzenesulfonic acid are pressed to 1: 0.12~1: 0.5 mass ratio
Example is mixed evenly, and is slowly added to modifier by the 62%~72% of phenol quality under quick stirring, is warming up to 135~145
DEG C, after reacting 2~4h, stop heating and being cooled to room temperature under stiring, obtain modifier-phenol reactant object；By modifier-phenol
Reactant heating stirring adds in formaldehyde, according to changing after stirring evenly according to the 92%~95% of modifier-phenol reactant amount of substance
Property object-phenol reactant amount of substance 3%~5% add in ammonium hydroxide, be slowly warming up to 100~115 DEG C, yellow occur muddy when reactant
It when turbid, is cooled down, starts vacuum dehydration when 48~52 DEG C or so, when resin liquid becomes amber transparent, stop dehydration,
Absolute ethyl alcohol and stirring dissolving is added in, discharging is cooled to room temperature, obtains phenol-formaldehyde resin modified；The modifier is linseed oil or cashew nut shell
Oil.
6. a kind of preparation method of the special high heat conduction bonding sheet of aluminum-based copper-clad plate according to claim 1, which is characterized in that
The inorganic nano glue is inorganic nano zinc oxide glue, inorganic nano titanium nitride glue or inorganic nano zinc nitride glue.
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Cited By (1)
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| CN111559139A (en) * | 2020-05-20 | 2020-08-21 | 山东金宝电子股份有限公司 | Preparation method of FR4 copper-clad plate with high relative tracking index and high thermal conductivity |
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| JPH05195490A (en) * | 1992-01-24 | 1993-08-03 | Dainippon Ink & Chem Inc | Glass fiber treating agent and glass paper |
| CN1752122A (en) * | 2005-09-29 | 2006-03-29 | 江苏大学 | Linseed oil modified phenol formaldehyde resin for friction material and its preparation method |
| CN102205675A (en) * | 2011-03-29 | 2011-10-05 | 浙江华正新材料股份有限公司 | High thermal conductivity and high heat-resistant copper-clad lamination of CEM-3 grade for LED |
| CN105838028A (en) * | 2016-03-25 | 2016-08-10 | 金安国纪科技（杭州）有限公司 | High-heat-conductive resin composition and preparation method thereof |
| CN106881925A (en) * | 2016-12-31 | 2017-06-23 | 南京新月材料科技有限公司 | A kind of copper-clad plate |
| CN107189338A (en) * | 2017-06-13 | 2017-09-22 | 长兴华悦耐火材料厂 | A kind of combined binder used for refractory material and preparation method thereof |
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| CN111559139A (en) * | 2020-05-20 | 2020-08-21 | 山东金宝电子股份有限公司 | Preparation method of FR4 copper-clad plate with high relative tracking index and high thermal conductivity |
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