CN202005063U - Copper clad plate - Google Patents
Copper clad plate Download PDFInfo
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- CN202005063U CN202005063U CN2011200335100U CN201120033510U CN202005063U CN 202005063 U CN202005063 U CN 202005063U CN 2011200335100 U CN2011200335100 U CN 2011200335100U CN 201120033510 U CN201120033510 U CN 201120033510U CN 202005063 U CN202005063 U CN 202005063U
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- clad plate
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- glass fabric
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Abstract
The utility model discloses a copper clad plate, which at least comprises one copper foil layer, an upper surface cover, a lower surface cover and core materials, wherein the upper surface cover and the lower surface cover are made of glass fiber cloth materials; the core materials are located between the upper surface cover and the lower surface cover; and the core materials are formed by overlaying glass fiber cloth semi-solidification sheets and glass fiber nonwoven-cloth semi-solidification sheets in any way. Due to the structure, the copper clad plate has superior comprehensive properties, so as to not only ensure good heat resistance property, electrical property and chemical reagents resistance property, but also have good stamping property, mechanical strength, dimensional stability and lower production cost. The copper clad plate has the advantages of higher adaptability to PCB machining process, lower loss for PCB machining equipment, lower machining cost, lower production energy consumption of raw materials and less pollution.
Description
Technical field
The utility model relates to the composite plate technical field, particularly relates to the copper-clad plate of a kind of PCB of being applied to.The utility model also relates to the composition structure of aforementioned copper-clad plate.
Background technology
Developing trend multifunction along with electronic product, the parts of electronic product are also constantly to aspect such as light, thin, short, little development, especially the high density integrated circuit broad application proposes the requirement of high performance, high reliability and high security to consumer electronic product; Industrial electronics product proposed technical performance is good, low-cost, the requirement of low energy consumption.Therefore--the base material copper-clad plate of----printed circuit board (Printed Circuit Board is called for short PCB) is faced with higher specification requirement to the core material of electronic product, severeer environment for use reaches higher environmental requirement.
Copper-clad plate (Copper Clad Laminate, be called for short CCL) be mainly used in the production printed circuit board, be with fibrous paper, glass fabric or glass fibre non-woven (being commonly called as glass felt) etc. as reinforcing material, soak with resin, single or double is coated with Copper Foil, a kind of product that forms through hot pressing.Existing copper-clad plate is owing to make the otherness of raw material and manufacturing structure, and each is variant for the technical performance of CCL base material.
According to the difference of copper-clad plate composition structure and reinforcing material thereof, existing copper-clad plate can be divided into following several big class, and each tool pluses and minuses:
1, paper-based copper-coated board: though the paper-based copper-coated board production technology is simple, production cost is lower, its a lot of performances can not satisfy a lot of specification requirements at the electronic product high performance.
2, special reinforcing material base copper-clad plate: the copper-clad plate of special enhancing base is the novel copper-clad plate of a class that grew up in recent years, but because its processing technology is higher, production cost is higher, only is applied in the electronic product of specific (special) requirements at present.
3, glass fibre fabricbase copper-clad plate: glass fibre fabricbase copper-clad plate (being the FR-4 copper-clad plate) is to use maximum kinds in the current C CL product, and it forms structure is lining with the glass fabric, is core material with the glass fabric.Copper-clad plate as shown in Figure 1 comprises copper foil layer 1,5, the upper layer 2 of glass fabric material, following surface layer 4, and with the glass fabric of three gluings as core material 3.The FR-4 copper-clad plate has good thermal endurance, electrical characteristic and technical performances such as excellent mechanical intensity, resistance to chemical reagents; But be not suitable for Sheet Metal Forming Technology in PCB produces, the dimensional stability of base material is relatively poor, and the thin plate warpage is big relatively, and its production cost is higher relatively.
4, compound basic copper-clad plate: compound base (Composite Epoxy Mterial) copper-clad plate, common in existing CCL product is the compound basic copper-clad plate of glass fabric/fibrous paper (hereinafter to be referred as " CEM-1 copper-clad plate "), the compound basic copper-clad plate of glass fabric/glass fibre non-woven (hereinafter to be referred as " CEM-3 copper-clad plate ").Wherein, the application of CEM-3 copper-clad plate is only second to the FR-4 copper-clad plate, and it forms structure is lining with the glass fabric, is core material with the glass fibre non-woven.Copper-clad plate as shown in Figure 2 comprises copper foil layer 1,5, the upper layer 2 of glass fabric material, following surface layer 4, and with the glass fibre non-woven of three gluings as core material 3.The CEM-3 copper-clad plate has good punching performance, machining property and good dimensional stability, and its production cost is far below the FR-4 copper-clad plate; But compare FR-4, its mechanical strength, heat resistance are relatively poor relatively, for high density integrated circuit having and high frequency, at a high speed, jumbo electric component all can't carry.
Aspect reinforcing material production, the production of glass fabric through fusing, wire drawing, weave cotton cloth, operations such as heat treatment, surface treatment, drying, its industrial cost of other reinforcing material is bigger relatively, energy consumption is big, it is heavy to pollute, the environmental protection cost is higher; The production of glass fibre non-woven is passed through slurrying, is copied operations such as paper, gluing, drying, and its industrial cost is lower comparatively speaking, and energy consumption is less, pollution is lighter, and the environmental protection cost is lower.Two kinds of each tool qualities of material.
Therefore, those skilled in the art be devoted to develop a kind of comprehensive technical performance good, possess excellent mechanical intensity and dimensional stability again, production cost, energy consumption and the lower-cost copper-clad plate of environmental protection simultaneously.
The utility model content
The technical problems to be solved in the utility model is in order to overcome the defective of each tool quality of various copper-clad plates in the prior art, a kind of copper-clad plate of high comprehensive performance to be provided.
The utility model solves above-mentioned technical problem by following technical proposals:
A kind of copper-clad plate comprises a copper foil layer at least, and described copper-clad plate also comprises a upper layer of glass fabric material, a following surface layer, reaches at described upper layer and described core material between the surface layer down; Described core material is the folded formation of joining of glass fabric prepreg and glass fibre non-woven prepreg.
Preferably, described folded joining is described glass fabric prepreg and the alternately folded folder of described glass fibre non-woven prepreg.
Preferably, described copper-clad plate comprises two copper foil layers, lays respectively at described upper layer, the described outside of surface layer down.
Preferably, described copper foil layer is by all thickness that needs.
Positive progressive effect of the present utility model is:
Copper-clad plate of the present utility model is because said structure and processing method have good comprehensive technical performance.Copper-clad plate of the present utility model had both guaranteed good heat-resistant, electric property and drug-resistant performance, possessed good punching performance, mechanical strength and dimensional stability again; Production cost is all low than FR-4 copper-clad plate and CEM-3 copper-clad plate; Copper-clad plate of the present utility model is stronger to the adaptability of PCB processing technology, and littler to the loss of PCB process equipment, processing cost is lower; Raw-material energy consumption is lower, pollutes still less, and the environmental protection cost is lower, meets our times low-carbon (LC), high environmental protection requirement.
Compare with existing FR-4 copper-clad plate, copper-clad plate of the present utility model possesses identical with it hot property and heat resistance, possesses excellent electric characteristics and resistance to chemical reagents, and its mechanical strength is near the FR-4 copper-clad plate; Also possess good PBC processing technology adaptability, in the manufacture process of downstream PCB, technological process applicabilities such as its punching press, boring are better, and the loss situation of processing component is better than existing FR-4 copper-clad plate, reduced processing cost well; Greatly reduce raw-material production cost and energy consumption simultaneously.
Compare with existing CEM-3 copper-clad plate, employing is folded folder as core material by glass fabric and glass fibre non-woven, copper-clad plate base material of the present utility model has promptly possessed the good punch process identical with the CEM-3 copper-clad plate, the dimensional stability and the machining property of base material, have the excellent mechanical intensity and the thermal endurance that are better than the CEM-3 copper-clad plate again, can carry more, heavier electric elements, and make more larger size panel face; Because the minimizing of resin content is used, the production cost of base material is lower than CEM-3 copper-clad plate, and the environmental protection cost is also lower.
Description of drawings
Fig. 1 is the local section structural representation of existing FR-4 copper-clad plate;
Fig. 2 is the local section structural representation of existing C EM-3 copper-clad plate;
Fig. 3 is the local section structural representation of copper-clad plate one specific embodiment of the present utility model;
Fig. 4 is the local section structural representation of another specific embodiment of copper-clad plate of the present utility model;
Fig. 5 is the copper-clad plate of the present utility model local section structural representation of a specific embodiment again;
Fig. 6 is the local section structural representation of the another specific embodiment of copper-clad plate of the present utility model;
Fig. 7 is the local section structural representation of the another specific embodiment of copper-clad plate of the present utility model;
Fig. 8 is the local section structural representation of the another specific embodiment of copper-clad plate of the present utility model;
Fig. 9 is the local section structural representation of the another specific embodiment of copper-clad plate of the present utility model.
Embodiment
Provide embodiment of the present utility model below in conjunction with accompanying drawing, to describe the technical solution of the utility model and beneficial effect in detail.
Embodiment 1:
As shown in Figure 3, a kind of copper-clad plate of the present utility model comprises two copper foil layers 1,5, lays respectively at upper and lower outermost.This copper-clad plate also comprises the upper layer 2,4 of glass fabric material, surface layer, and the core material 3 between upper layer 2 and following surface layer 4 down.
Particularly, the thickness of copper foil layer 1,5 is between 3-150um.
In other embodiments, copper-clad plate also can include only a copper foil layer as required.
According to what of gel content, copper-clad plate of the present invention can have conventional 1.0mm, 1.2mm, the thickness of 1.5mm, 1.6mm in different embodiments, and other unconventional thickness.
To shown in Figure 9, in other various specific embodiments, core material 3 can be made of many glass fabric prepregs and many successively alternately folded folders of glass fibre non-woven prepreg referring to Fig. 4.
Specifically as shown in Figure 4, the structure of the copper-clad plate in the present embodiment and the foregoing description 1 is basic identical, institute's difference is, core material 3 is by two glass fabric prepregs 31,33, and folded both middle glass fibre non-woven prepregs 32 formations that are clipped in, thickness can reach 1.5mm to 1.6mm.
Specifically as shown in Figure 5, the structure of the copper-clad plate in the present embodiment and the foregoing description 1 is basic identical, institute's difference is, core material 3 is by two glass fabric prepregs 31,34, and folded both two middle glass fibre non-woven prepregs, 32,33 formations that are clipped in, thickness can reach 1.5mm to 1.6mm.
Specifically as shown in Figure 6, the structure of the copper-clad plate in the present embodiment and the foregoing description 1 is basic identical, institute's difference is, core material 3 is by two glass fibre non-woven prepregs 31,34, and folded both two middle glass fabric prepregs, 32,33 formations that are clipped in, thickness can reach 1.6mm to 2.0mm.
Specifically as shown in Figure 7, the structure of the copper-clad plate in the present embodiment and the foregoing description 1 is basic identical, institute's difference is, core material 3 is by three glass fibre non-woven prepregs 31,33,35, and folded two middle glass fabric prepregs of three, 32,34 formations that are clipped in, thickness can reach 2.0mm to 2.4mm.
Specifically as shown in Figure 8, the structure of the copper-clad plate in the present embodiment and the foregoing description 1 is basic identical, institute's difference is, core material 3 is by three glass fibre non-woven prepregs 31,34,37, and folded four middle glass fabric prepregs of three, 32,33,35,36 formations that are clipped in, thickness can reach 2.4mm to 3.0mm.
Specifically as shown in Figure 9, the structure of the copper-clad plate in the present embodiment and the foregoing description 1 is basic identical, institute's difference is, core material 3 is by four glass fibre non-woven prepregs 31,33,35,37, and folded three glass fabric prepregs, 32,34,36 formations that are clipped in the middle of four, thickness can reach 3.0mm to 3.4mm.
Above-mentioned execution mode of the present utility model has beneficial effect substantially the same manner as Example 1.
Embodiment 2:
The utility model also provides the processing method of above-mentioned arbitrary copper-clad plate, may further comprise the steps at least:
In different embodiments, the glass fabric prepreg, the glass fibre non-woven prepreg size as required that obtain can also be done cutting.
Wherein, the stoving temperature of glass fabric is 150 ℃-200 ℃, and the stoving temperature of glass fibre non-woven is 170 ℃-210 ℃.
The gluing parameter sees the following form:
| Glass fabric | Glass fibre non-woven | |
| Gel content | 42.5％-50％ | 45％-65％ |
| Gel time | 100s-120s | - |
| Fluidity | 18％-25％ | 5％-25％ |
Above-mentioned processing method of the present utility model also goes for processing the copper-clad plate that obtains among other embodiment.
Copper-clad plate of the present invention is done test with the method for " UL467E polymeric material-industrial laminates, fiber winding pipe, vulcanised fibre and printed board material " and " IPC-4101B rigidity and multilayer printed board base material standard " prescribed by standard.
Through experimental test, it is as shown in the table that the technical performance of copper-clad plate of the present utility model detects data:
Through experimental test, the FR-4 copper-clad plate of copper-clad plate of the present utility model and prior art, CEM-3 copper-clad plate relatively, contrast three's machining property, as thermal endurance, mechanical rigid, punch process, boring processability and process equipment loss situation:
Thermal endurance: sample is cut into the square tiles of (50.8 ± 0.75) mm, single sided board is got 2, and each face of double sided board is respectively got 2.Place 125 ± 2 ℃ air circulating type baking oven to dry at least 6 hours on sample, taking-up is placed on and is cooled to room temperature in the drier then.Sample is taken out from drier again, in 10 minutes every sample is floated on the scolding tin surface, the scolding tin temperature remains on 288 ± 5.5 ℃, and visual observations is taken out immediately until the specimen surface layering of bubbling, and calculates and floats the tin time.5 groups of samples of parallel testing are got its arithmetic mean.
Mechanical rigid: after the complete etching of sample removed Copper Foil, be cut into wide rectangular of 25.4mm, placing spacing is on the support of 200mm, and the sample center adds puts the counterweight that indicated weight is 2Kg, measures its deformation modulus.5 samples of parallel testing are got its arithmetic mean.
Punch process: select 80 tons of punch presses for use,, check to have or not the sky edge to peel off and and hole situation 25 ℃ of multiple graphs scrap mould punchings of using pitch of holes less than 2mm.10 samples of parallel testing, the visual observations contrast.
The boring processability: select many drill bits automatic drilling machine for use, cut-off directly be 1.0mm without 5 pieces on the drill bit that uses, and is that three copper-clad plates of 1.6mm stack with thickness, bores 3000 holes, the observation hole wall have or not peel off, hole wall smoothness and bit wear situation.5 groups of samples of parallel testing are got its arithmetic mean.
Annotate: in the following table, symbol " zero " expression does not occur, and symbol " △ " expression occurs less, and symbol " * " expression occurs more.
Though more than described embodiment of the present utility model, it will be understood by those of skill in the art that these only illustrate.Protection range of the present utility model is limited by appended claims.Those skilled in the art can make numerous variations or modification to these execution modes under the prerequisite that does not deviate from principle of the present utility model and essence, but these changes and modification all fall in the protection range of the present utility model.
Claims (3)
1. a copper-clad plate comprises a copper foil layer at least, and described copper-clad plate also comprises a upper layer of glass fabric material, a following surface layer, reaches at described upper layer and described core material between the surface layer down; It is characterized in that: described core material is the folded formation of joining of glass fabric prepreg and glass fibre non-woven prepreg.
2. copper-clad plate as claimed in claim 1 is characterized in that: described folded joining is described glass fabric prepreg and the alternately folded folder of described glass fibre non-woven prepreg.
3. copper-clad plate as claimed in claim 1 or 2 is characterized in that: described copper-clad plate comprises two copper foil layers, lays respectively at described upper layer, the described outside of surface layer down, also comprises the described copper foil layer that comprises, is positioned at the described upper layer or the described outside of surface layer down.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200335100U CN202005063U (en) | 2011-01-30 | 2011-01-30 | Copper clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200335100U CN202005063U (en) | 2011-01-30 | 2011-01-30 | Copper clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202005063U true CN202005063U (en) | 2011-10-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011200335100U Expired - Lifetime CN202005063U (en) | 2011-01-30 | 2011-01-30 | Copper clad plate |
Country Status (1)
| Country | Link |
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| CN (1) | CN202005063U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567194A (en) * | 2017-10-31 | 2018-01-09 | 广东骏亚电子科技股份有限公司 | A kind of compression method of PCB copper-clad plates |
-
2011
- 2011-01-30 CN CN2011200335100U patent/CN202005063U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107567194A (en) * | 2017-10-31 | 2018-01-09 | 广东骏亚电子科技股份有限公司 | A kind of compression method of PCB copper-clad plates |
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| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20111005 |
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| CX01 | Expiry of patent term |