CN110394970A - A kind of silicon oxygen glass-fiber-fabric copper-clad laminate production method - Google Patents
A kind of silicon oxygen glass-fiber-fabric copper-clad laminate production method Download PDFInfo
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- CN110394970A CN110394970A CN201910701338.2A CN201910701338A CN110394970A CN 110394970 A CN110394970 A CN 110394970A CN 201910701338 A CN201910701338 A CN 201910701338A CN 110394970 A CN110394970 A CN 110394970A
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- Prior art keywords
- adhesive sheet
- copper
- fiber
- copper foil
- fabric
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000004744 fabric Substances 0.000 title claims abstract description 34
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 18
- 239000000853 adhesive Substances 0.000 claims abstract description 24
- 230000001070 adhesive effect Effects 0.000 claims abstract description 24
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims abstract description 24
- 238000004026 adhesive bonding Methods 0.000 claims abstract description 19
- 239000000839 emulsion Substances 0.000 claims abstract description 16
- 239000004810 polytetrafluoroethylene Substances 0.000 claims abstract description 11
- 239000011347 resin Substances 0.000 claims abstract description 8
- 229920005989 resin Polymers 0.000 claims abstract description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000007787 solid Substances 0.000 claims abstract description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 21
- 239000011889 copper foil Substances 0.000 claims description 18
- -1 polytetrafluoroethylene Polymers 0.000 claims description 5
- 238000004321 preservation Methods 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 2
- 238000005520 cutting process Methods 0.000 claims description 2
- 239000003292 glue Substances 0.000 claims description 2
- 239000010959 steel Substances 0.000 claims description 2
- 239000012779 reinforcing material Substances 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 5
- 239000004816 latex Substances 0.000 abstract description 5
- 229920000126 latex Polymers 0.000 abstract description 5
- 238000005452 bending Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 12
- 239000011521 glass Substances 0.000 description 8
- 229910052802 copper Inorganic materials 0.000 description 3
- 239000010949 copper Substances 0.000 description 3
- 230000002411 adverse Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- JEIPFZHSYJVQDO-UHFFFAOYSA-N iron(III) oxide Inorganic materials O=[Fe]O[Fe]=O JEIPFZHSYJVQDO-UHFFFAOYSA-N 0.000 description 1
- 238000002386 leaching Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- BFKJFAAPBSQJPD-UHFFFAOYSA-N tetrafluoroethene Chemical compound FC(F)=C(F)F BFKJFAAPBSQJPD-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
- B29B15/00—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00
- B29B15/08—Pretreatment of the material to be shaped, not covered by groups B29B7/00 - B29B13/00 of reinforcements or fillers
- B29B15/10—Coating or impregnating independently of the moulding or shaping step
- B29B15/12—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length
- B29B15/122—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length with a matrix in liquid form, e.g. as melt, solution or latex
- B29B15/125—Coating or impregnating independently of the moulding or shaping step of reinforcements of indefinite length with a matrix in liquid form, e.g. as melt, solution or latex by dipping
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C35/00—Heating, cooling or curing, e.g. crosslinking or vulcanising; Apparatus therefor
- B29C35/02—Heating or curing, e.g. crosslinking or vulcanizing during moulding, e.g. in a mould
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/02—Combined thermoforming and manufacture of the preform
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C51/00—Shaping by thermoforming, i.e. shaping sheets or sheet like preforms after heating, e.g. shaping sheets in matched moulds or by deep-drawing; Apparatus therefor
- B29C51/26—Component parts, details or accessories; Auxiliary operations
- B29C51/46—Measuring, controlling or regulating
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Oral & Maxillofacial Surgery (AREA)
- Thermal Sciences (AREA)
- Laminated Bodies (AREA)
Abstract
The present invention relates to copper-clad laminate technical fields, in particular a kind of silicon oxygen glass-fiber-fabric copper-clad laminate production method, including High silica glass cloth is impregnated ptfe emulsion by vertical gluing machine, latex solids content 55%~65%, oven for gluing machine temperature is from bottom to top successively are as follows: 70~80 DEG C, 100~120 DEG C, 170~180 DEG C, 240~250 DEG C, 340~350 DEG C, 360~380 DEG C, 2~3 ms/min of speed, adhesive sheet impregnates ptfe emulsion 5~8 times repeatedly, the resin content 70%~85% of adhesive sheet, adhesive sheet is cut into slabbing, the present invention is using high silicon oxygen glass-fiber-fabric as reinforcing material, PTFE emulsion is repeatedly impregnated by vertical gluing machine, and adhesive sheet is made, the adhesive sheet is used alone, or and PTFE film Collocation uses, and suppresses high speed circuit copper-clad plate, using the plate dielectric constant of the invention made is low, bending strength is high, thermal expansion coefficient is small, is more suitable for making high speed circuit multi-layer board, has preferable practical effect, be worth of widely use.
Description
Technical field
The present invention relates to copper-clad laminate technical field, specially a kind of silicon oxygen glass-fiber-fabric copper-clad laminate producer
Method.
Background technique
Copper-clad laminate be by electronic glass-fiber cloth or other reinforcing materials leaching with resin, on one side or it is two-sided coated with copper foil simultaneously
Manufactured a kind of board-like material through hot pressing, referred to as copper-clad plate, the printed circuit board of various different forms, different function, all
It is selectively to be processed, etched in copper-clad plate, drilled and the processes such as copper facing, different printed circuits is made, to printing
Circuit board mainly plays interconnection, insulation and support, transmission speed, energy loss and characteristic resistance to signal in circuit
It is anti-etc. to have a great impact, therefore, the performance of printed circuit board, quality, the processability in manufacture, manufacture level, manufacturing cost
And long-term reliability and stability depends greatly on copper-clad plate, previous Copper Clad Laminates Based On Polytetrafluoroethylene be all with
E glass-fiber-fabric does reinforcing material, and since the dielectric constant of E glass is higher, when doing low-k plate, the content of glass cannot
It is too big, and resin content is then relatively high, and the thermal expansion coefficient of plate is caused to become larger, and brings adverse effect to route processing, and
And polytetrafluoroethylfiberglass fiberglass-cloth copper-clad laminate will be in process of production once gluing process by pyroprocess twice,
It is once lamination process, especially glues process, glass-fiber-fabric will repeatedly pass through high temperature oven, and it is very big to the loss of strength of E glass,
Therefore, the demand to a kind of silicon oxygen glass-fiber-fabric copper-clad laminate production method is growing.
High silicon oxygen cloth dioxide-containing silica is high, and dielectric constant is small, high temperature resistant, under dielectric constant same case, with high silicon
The content that oxygen cloth does the plate of reinforcing material its glass-fiber-fabric, which is higher than, does containing for glass-fiber-fabric in the plate of reinforcing material with E type glass-fiber-fabric
Amount, this is conducive to the raising of panel stiffness and the improvement of dimensional stability, and and high silicon oxygen cloth heat-resisting quantity is good, repeatedly gluing pair
Its intensity effect is smaller, and the mechanical strength of final plate is preferable, therefore, proposes that a kind of silicon oxygen glass-fiber-fabric covers copper regarding to the issue above
Foil laminate production method.
Summary of the invention
The purpose of the present invention is to provide a kind of silicon oxygen glass-fiber-fabric copper-clad laminate production methods, to solve previous gather
Tetrafluoroethene copper-clad plate is all to do reinforcing material with E glass-fiber-fabric, since the dielectric constant of E glass is higher, is doing low-k
The content of glass cannot be too big when plate, and resin content is then relatively high, and the thermal expansion coefficient of plate is caused to become larger, and gives route
Processing brings adverse effect, and polytetrafluoroethylfiberglass fiberglass-cloth copper-clad laminate in process of production will be by high temperature mistake twice
Journey is once gluing process, is once lamination process, especially gluing process, and glass-fiber-fabric will repeatedly pass through high temperature oven, to E
The very big problem of the loss of strength of glass.
To achieve the above object, the invention provides the following technical scheme:
A kind of silicon oxygen glass-fiber-fabric copper-clad laminate production method, includes the following steps；
Step 1: High silica glass cloth is impregnated into ptfe emulsion, latex solids content by vertical gluing machine
55%~65%, oven for gluing machine temperature is from bottom to top successively are as follows: 70~80 DEG C, 100~120 DEG C, 170~180 DEG C, 240~
250 DEG C, 340~350 DEG C, 360~380 DEG C, 2~3 ms/min of speed；
Step 2: adhesive sheet impregnates ptfe emulsion 5~8 times repeatedly, and the resin content 70% of adhesive sheet~
85%, adhesive sheet is cut into the sheet of certain size；
Step 3: according to the thickness of product and dielectric properties requirement, a certain amount of adhesive sheet is taken with polytetrafluoroethylene film
With use, upper and lower surface covers copper foil, is placed between mirror steel plate, is pushed into hot press and suppresses, and 380~400 DEG C of press temperature, protects
Temperature 5~8 hours, 5~50kg/cm2 of unit pressure；After heat preservation, cool down, plate, cutting edge is taken to get product.
Preferably, copper foil with a thickness of 18~105 μm, the type of copper foil be electrolytic copper foil, rolled copper foil, reversion copper foil,
Low profile copper foil etc..
Compared with prior art, the beneficial effects of the present invention are:
The present invention is repeatedly to be impregnated PTFE emulsion by vertical gluing machine using high silicon oxygen glass-fiber-fabric as reinforcing material and be made
Adhesive sheet is used alone the adhesive sheet, or arranges in pairs or groups and use with PTFE film, suppresses high speed circuit copper-clad plate, is made using the present invention
The plate dielectric constant of work is low, bending strength is high, thermal expansion coefficient is small, is more suitable for making high speed circuit multi-layer board, this design
It is novel, there is preferable practical effect, should be widely promoted use.
Specific embodiment
Embodiment 1: the present invention provides a kind of technical solution:
1080 type High silica glass cloths are passed through vertical gluing machine by a kind of silicon oxygen glass-fiber-fabric copper-clad laminate production method
Impregnate ptfe emulsion, latex solids content 60%, oven for gluing machine temperature is from bottom to top successively are as follows: 70 DEG C, 100 DEG C,
170 DEG C, 240 DEG C, 340 DEG C, 370 DEG C, 2 ms/min of speed, adhesive sheet impregnates ptfe emulsion 8 times repeatedly, adhesive sheet tree
Rouge content 83% is cut into size: the sheet of 1020 × 1220mm, and 3 adhesive sheets are arranged in pairs or groups with 5 polytetrafluoroethylene films,
Upper and lower surface covers 18 μm of electrolytic copper foil, suppresses the microwave copper-clad plate of dielectric constant 2.20,390 DEG C of press temperature, keeps the temperature
7 hours, unit pressure 15kg/cm2, properties of product, dielectric constant@10GHz:2.20, dielectric loss@10GHz:0.0013, heat
The coefficient of expansion: CTE-X:23, CTE-Y:28, CTE-Z:240.
Embodiment 2: the present invention provides a kind of technical solution:
The high silicon oxygen cloth glass cloth of 1080 types is passed through vertical gluing by a kind of silicon oxygen glass-fiber-fabric copper-clad laminate production method
Machine impregnates ptfe emulsion, and latex solids content 60%, oven for gluing machine temperature is from bottom to top successively are as follows: 70 DEG C, 100
DEG C, 170 DEG C, 240 DEG C, 340 DEG C, 370 DEG C, 2 ms/min of speed, adhesive sheet impregnates ptfe emulsion 8 times repeatedly, bonding
Piece resin content 83%, is cut into size: the sheet of 1020 × 1220mm, 8 adhesive sheets, and upper and lower surface covers 18 μm
Electrolytic copper foil, suppress dielectric constant 2.55 microwave copper-clad plate, 390 DEG C of machine temperature, keep the temperature 7 hours, unit pressure 50kg/
Cm2, moral character energy, dielectric constant@10GHz:2.54, dielectric loss@10GHz:0.0025, the coefficient of expansion: CTE-X:15, CTE-
Y:17,CTE-Z:100。
Comparative example 1
1080 type E-glass cloth are impregnated into ptfe emulsion, latex solids content by vertical gluing machine
60%, oven for gluing machine temperature is from bottom to top successively are as follows: 70 DEG C, 100 DEG C, 170 DEG C, 240 DEG C, 340 DEG C, 370 DEG C, speed 2
M/min, adhesive sheet impregnates ptfe emulsion 5 times repeatedly, and adhesive sheet resin content 75% is cut into size:
The sheet of 1020 × 1220mm, 2 adhesive sheets are arranged in pairs or groups with 5 polytetrafluoroethylene films, and upper and lower surface covers 18 μm of electrolytic copper foil,
The microwave copper-clad plate of dielectric constant 2.20 is suppressed, 390 DEG C of press temperature, keeps the temperature 7 hours, unit pressure 50kg/cm2, product
Performance, dielectric constant@10GHz:2.21, dielectric loss@10GHz:0.0015, thermal expansion coefficient: CTE-X:30, CTE-Y:36,
CTE-Z:280。
Using high silicon oxygen glass-fiber-fabric as reinforcing material in above-mentioned method for producing, repeatedly impregnated by vertical gluing machine
Adhesive sheet is made in PTFE emulsion, the adhesive sheet is used alone, or arrange in pairs or groups and use with PTFE film, suppresses high speed circuit copper-clad plate.
Using the plate dielectric constant of the invention made is low, bending strength is high, thermal expansion coefficient is small, it is more suitable for production high speed
Circuit multi-layer board.
Used herein a specific example illustrates the principle and implementation of the invention, the explanation of above example
It is merely used to help understand method and its core concept of the invention.The above is only a preferred embodiment of the present invention, it answers
When pointing out due to the finiteness of literal expression, and objectively there is unlimited specific structure, for the common skill of the art
For art personnel, without departing from the principle of the present invention, several improvement, retouching or variation can also be made, can also incited somebody to action
Above-mentioned technical characteristic is combined in the right way；These improve retouching, variation or combination, or the not improved structure by invention
Think and technical solution directly applies to other occasions, is regarded as protection scope of the present invention.
Claims (2)
1. a kind of silicon oxygen glass-fiber-fabric copper-clad laminate production method, which comprises the following steps:
Step 1: High silica glass cloth is impregnated into ptfe emulsion, ptfe emulsion solid by vertical gluing machine
Content 55%~65%, oven for gluing machine temperature is from bottom to top successively are as follows: 70~80 DEG C, 100~120 DEG C, 170~180 DEG C,
240~250 DEG C, 340~350 DEG C, 360~380 DEG C, 2~3 ms/min of speed；
Step 2: adhesive sheet impregnates ptfe emulsion 5~8 times repeatedly, and the resin content 70%~85% of adhesive sheet will glue
Contact pin cuts into the sheet of certain size；
Step 3: according to the thickness of product and dielectric properties requirement, a certain amount of adhesive sheet and polytetrafluoroethylene film collocation are made
With, upper and lower surface covers copper foil, is placed between mirror steel plate, and it is pushed into hot press and suppresses, 380~400 DEG C of press temperature, heat preservation 5
~8 hours, 5~50kg/cm2 of unit pressure, after heat preservation, cools down, plate, cutting edge is taken to get product.
2. a kind of silicon oxygen glass-fiber-fabric copper-clad laminate production method according to claim 1, it is characterised in that: copper foil
With a thickness of 18~105 μm, the type of copper foil is electrolytic copper foil, rolled copper foil, reversion copper foil, low profile copper foil etc..
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910701338.2A CN110394970A (en) | 2019-07-31 | 2019-07-31 | A kind of silicon oxygen glass-fiber-fabric copper-clad laminate production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910701338.2A CN110394970A (en) | 2019-07-31 | 2019-07-31 | A kind of silicon oxygen glass-fiber-fabric copper-clad laminate production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110394970A true CN110394970A (en) | 2019-11-01 |
Family
ID=68326826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910701338.2A Pending CN110394970A (en) | 2019-07-31 | 2019-07-31 | A kind of silicon oxygen glass-fiber-fabric copper-clad laminate production method |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113665141A (en) * | 2021-10-20 | 2021-11-19 | 北京玻钢院复合材料有限公司 | High silica cloth reinforced polytetrafluoroethylene composite material, preparation method and application thereof |
| CN114161741A (en) * | 2021-12-06 | 2022-03-11 | 中国电子科技集团公司第四十六研究所 | Method for forming polytetrafluoroethylene impregnated sheet with high filler content |
| CN115257088A (en) * | 2022-08-04 | 2022-11-01 | 广东盈华电子材料有限公司 | Copper-clad plate manufacturing and processing method |
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| CN1586876A (en) * | 2004-08-10 | 2005-03-02 | 华南理工大学 | Process for preparing high performance copper-clad polytetrafluoroethylene plate |
| CN105904806A (en) * | 2016-05-04 | 2016-08-31 | 江苏富仕德科技发展有限公司 | Modified PTFE (polytetrafluoroethylene) fiberglass cloth for copper-clad plates and preparation method of fiberglass cloth |
| CN106957528A (en) * | 2017-02-04 | 2017-07-18 | 王飞 | A kind of thermoplastic resin-based fibrous composite of low dielectric and application thereof |
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2019
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| JPS5857921A (en) * | 1981-10-02 | 1983-04-06 | Mitsubishi Gas Chem Co Inc | Novel polyphenylene ether resin film |
| CN1586876A (en) * | 2004-08-10 | 2005-03-02 | 华南理工大学 | Process for preparing high performance copper-clad polytetrafluoroethylene plate |
| CN105904806A (en) * | 2016-05-04 | 2016-08-31 | 江苏富仕德科技发展有限公司 | Modified PTFE (polytetrafluoroethylene) fiberglass cloth for copper-clad plates and preparation method of fiberglass cloth |
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| 姜肇中等: "《玻璃纤维应用技术》", 31 January 2004, 中国石化出版社 * |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113665141A (en) * | 2021-10-20 | 2021-11-19 | 北京玻钢院复合材料有限公司 | High silica cloth reinforced polytetrafluoroethylene composite material, preparation method and application thereof |
| CN114161741A (en) * | 2021-12-06 | 2022-03-11 | 中国电子科技集团公司第四十六研究所 | Method for forming polytetrafluoroethylene impregnated sheet with high filler content |
| CN115257088A (en) * | 2022-08-04 | 2022-11-01 | 广东盈华电子材料有限公司 | Copper-clad plate manufacturing and processing method |
| CN115257088B (en) * | 2022-08-04 | 2023-08-18 | 广东盈华电子材料有限公司 | Copper-clad plate manufacturing and processing method |
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Application publication date: 20191101 |