CN209897357U

CN209897357U - PCB pressfitting structure

Info

Publication number: CN209897357U
Application number: CN201920721991.0U
Authority: CN
Inventors: 李继远; 郑新丰; 闾涛
Original assignee: Huizhou Xinlianxing Industrial Co Ltd
Current assignee: Huizhou Xinlianxing Industrial Co Ltd
Priority date: 2019-05-20
Filing date: 2019-05-20
Publication date: 2020-01-03
Anticipated expiration: 2029-05-20

Abstract

A PCB lamination structure comprises an upper copper foil layer, a lower copper foil layer, a plurality of inner layer plates and PP sheets, wherein the inner layer plates and the PP sheets are stacked, the inner layer plates are double-sided plates, the PP sheets are arranged between every two adjacent inner layer plates, and copper-free areas of adjacent circuit layers of different inner layer plates between every two adjacent inner layer plates are arranged in a staggered mode; and heat conducting plates are arranged on two sides of each three layers of inner layer plates. In the utility model, the main copper-free areas of the adjacent circuit layers of the different inner-layer boards between the two adjacent inner-layer boards are staggered, so that the thickness difference between the overlapping area of the copper-free areas and the overlapping area of the copper-containing areas is reduced, and the resin compression of the copper-free areas is improved; the heat conducting plate can accelerate heat transfer, thereby accelerating resin flow and filling capacity; therefore, the inner glue flow is uniform in the processing and production process of the PCB, the defect of glue deficiency is improved, and the rejection rate of the PCB is reduced.

Description

PCB pressfitting structure

Technical Field

The invention relates to a PCB laminating structure.

Background

The production and processing process of the PCB needs to realize lamination through prepreg hot melting, the inner layer in the lamination process is one of main factors causing scrapping of the PCB due to poor local glue shortage caused by nonuniform glue flowing of the prepreg, and the PCB with large blank area and asymmetric patterns is particularly easy to have glue shortage abnormity by adopting an inner layer plate of thick copper (2 OZ and above).

Disclosure of Invention

The invention aims to provide a PCB laminating structure capable of improving poor glue shortage.

A PCB lamination structure comprises an upper copper foil layer, a lower copper foil layer, a plurality of inner layer plates and PP sheets, wherein the inner layer plates and the PP sheets are stacked, the inner layer plates are double-sided plates, the PP sheets are arranged between every two adjacent inner layer plates, and copper-free areas of adjacent circuit layers of different inner layer plates between every two adjacent inner layer plates are arranged in a staggered mode; and heat conducting plates are arranged on two sides of each three layers of inner layer plates.

Further, the inner-layer plate is positioned through hot melting riveting.

Furthermore, the inner layer plate of the PCB laminating structure is 8-10 layers.

Further, the heat conducting plate is a steel plate.

Furthermore, the upper surface of the upper copper foil plate and the lower surface of the lower copper foil layer are both provided with pressure buffer layers.

Furthermore, the pressure buffer layer is formed by mixing and stacking new kraft paper and recycled kraft paper.

Further, the number of the kraft paper stacked layers is 20-25.

Further, the pressure buffer layer comprises 10 layers of new kraft paper.

Further, the pressure buffer layer comprises 15 layers of recycled kraft paper.

According to the invention, the main copper-free areas of the adjacent circuit layers of different inner-layer plates between two adjacent inner-layer plates are staggered, so that the thickness difference between the overlapping area of the copper-free areas and the overlapping area of the copper-containing areas is reduced, and the resin compression of the copper-free areas is improved; the heat conducting plate can accelerate heat transfer, thereby accelerating resin flow and filling capacity; therefore, the inner glue flow is uniform in the processing and production process of the PCB, the defect of glue deficiency is improved, and the rejection rate of the PCB is reduced.

Drawings

Fig. 1 is an exploded view of a PCB stitching structure in an embodiment.

Detailed Description

The following describes the connecting spring plate of the present invention in further detail with reference to the following embodiments and the accompanying drawings.

A PCB lamination structure comprises an upper copper foil layer 1, a lower copper foil layer 5, a plurality of inner layer plates 3 and PP sheets 2, wherein the inner layer plates are arranged between the upper copper foil layer and the lower copper foil layer in a stacked mode, the inner layer plates are positioned through hot melting riveting, the inner layer plates 3 are double-sided plates, the number of the inner layer plates in the implementation is 8-10, the PP sheets 2 are arranged between every two adjacent inner layer plates, and copper-free areas of adjacent circuit layers of different inner layer plates between every two adjacent inner layer plates 3 are arranged in a staggered mode; the heat conducting plates 4 are arranged on two sides of each three layers of inner layer plates, metal plates with good heat conducting performance can be used as the heat conducting plates 4, and the heat conducting plates 4 are steel plates in the implementation. The upper surface of going up copper foil layer 1 and the lower surface of lower copper foil layer 5 all is equipped with pressure buffer layer 6, pressure buffer layer 6 adopts new kraft paper and the mixed kraft paper of reuse to stack and forms, and the number of piles of kraft paper is preferred 20-25, and pressure buffer layer comprises 10 layers new kraft paper and 15 layers of kraft paper of reuse in this implementation.

The following describes a processing procedure of the PCB stitching structure, including the following steps: preparing materials, and carrying out hot melting riveting positioning on the inner-layer plate; secondly, arranging and stacking the PCB according to the PCB laminating structure; (III) performing a program pressing, wherein the pressing point temperature of the pressing program is 70-90 ℃, the heating rate is 1.9-2.3 ℃/min, and the main pressure is 400-.

Watch 1

	1	2	3	4	5	6	7	8	9	10
											Temperature (. degree.C.)	140	160	180	200	210	210	180	160	140	140
Time (min)	10	10	10	10	10	85	10	10	10	5
											Pressure (PSI)	100	250	350	450	450	450	450	150	150	150

In the pressing process, as the main copper-free areas of the adjacent circuit layers of the different inner-layer plates between the two adjacent inner-layer plates are staggered, the thickness difference between the overlapping area of the copper-free areas and the overlapping area of the copper-containing areas is reduced, so that the resin compression of the copper-free areas is improved; the heat conducting plate can accelerate heat transfer, thereby accelerating resin flow and filling capacity; in the process of program pressing, the heating rate is increased, and the pressure is increased at a proper temperature to ensure that the resin is filled more fully; therefore, the internal glue flow can be uniform, the poor glue shortage can be improved, and the rejection rate of the PCB can be reduced.

In the description of the present invention, it is to be understood that terms such as "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like, which indicate orientations or positional relationships, are used based on the orientations or positional relationships shown in the drawings only for the convenience of describing the present invention and for the simplicity of description, and do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.

While the invention has been described in conjunction with the specific embodiments set forth above, it is evident that many alternatives, modifications, and variations will be apparent to those skilled in the art in light of the foregoing description. Accordingly, it is intended to embrace all such alternatives, modifications, and variations that fall within the spirit and scope of the appended claims.

Claims

1. A PCB laminating structure comprises an upper copper foil layer (1), a lower copper foil layer (5) which are stacked, and a plurality of inner layer plates (3) and PP sheets (2) which are arranged between the upper copper foil layer and the lower copper foil layer, wherein the inner layer plates (3) are double-sided plates, the PP sheets (2) are arranged between every two adjacent inner layer plates, and copper-free areas of adjacent circuit layers of different inner layer plates between every two adjacent inner layer plates (3) are staggered; the method is characterized in that: and heat conducting plates (4) are arranged on two sides of each three layers of inner layer plates.

2. A PCB stitching structure according to claim 1, wherein the inner layer board (3) is positioned by hot melt staking.

3. The PCB stitching structure of claim 1, wherein the inner layer panel of the PCB stitching structure has 8-10 layers.

4. A PCB stitching structure according to claim 3, wherein the thermally conductive plate (4) is a steel plate.

5. A PCB stitching structure according to claim 3, wherein the upper surface of the upper copper foil layer (1) and the lower surface of the lower copper foil layer (5) are provided with a pressure buffer layer (6).

6. The PCB lamination structure according to claim 5, wherein the pressure buffer layer (6) is formed by mixing and stacking new kraft paper and recycled kraft paper.

7. The PCB stitching structure of claim 6, wherein the kraft paper is stacked in 20-25 layers.

8. The PCB stitching structure of claim 6, wherein the pressure buffer layer comprises 10 layers of virgin kraft paper.

9. The PCB stitching structure of claim 6, wherein the pressure buffer layer comprises 15 layers of recycled kraft paper.