CN206452609U - It is a kind of to be used to improve the wiring board of the local starved of thick copper coin - Google Patents
It is a kind of to be used to improve the wiring board of the local starved of thick copper coin Download PDFInfo
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- CN206452609U CN206452609U CN201720169746.4U CN201720169746U CN206452609U CN 206452609 U CN206452609 U CN 206452609U CN 201720169746 U CN201720169746 U CN 201720169746U CN 206452609 U CN206452609 U CN 206452609U
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- wiring board
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- improve
- copper coin
- thick copper
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Abstract
It is a kind of to be used to improve the wiring board of the local starved of thick copper coin, including wiring board body and anti-solder ink layer；Described wiring board body arranges first line flaggy, the first semi-solid preparation layer, the second pcb layer, the second layer of prepreg and tertiary circuit flaggy typesetting pressing to form successively from the bottom to top；The second described pcb layer is provided with white space；The quantity of described white space is identical with the quantity of wiring board unit, and the position of white space and the position of wiring board unit are corresponding；Described multiple white spaces dislocation arrangement.The colloid that the utility model compensate for white space is not enough, improve the phenomenon of starved in pressing rear board, avoid the problems such as layering of wiring board copper sheet, corrugation and plate bursting after pressing, improve the yield of one step press, the rework rate in bonding processes is reduced, production efficiency and quality yield is improved and reduces product safety hidden danger, reduce the waste of raw material, production cost is reduced, is increased economic efficiency.
Description
Technical field
The utility model belongs to wiring board production and processing technical field, and in particular to one kind locally lacks for improving thick copper coin
The wiring board of glue.
Background technology
With developing rapidly for electronics industry, the fast lifting of circuit board industry is promoted.At present, in the market router is big
Many to be designed using four-sheet structure, internal layer is respectively bus plane and ground plane, and this design can reduce signal and return ground resistance, to letter
Number increase function of shielding, improves antijamming capability, and can increase wiring board hardness.But component need to be welded manually at communication serial port
Connect, if covering copper below component at communication serial port, copper sheet can be caused to be layered because flatiron temperature is higher in welding, foaming etc.
Risk, the copper sheet below such serial ports therefore, can be emptied, form the etched-off area of a closing, such as Fig. 1 intentionally in design
It is shown.When internal layer is than thick copper coin that relatively thin and copper thickness is 0.6 more than mil, occurs and draw in assist side production bonding processes
Dummy section starved phenomenon, causes the problems such as copper sheet layering, corrugation, plate bursting, has a strong impact on product safety and performance.Therefore, how
Improve thick copper coin starved phenomenon in existing wiring board production process, improve the quality of pressing rear board, as wiring board life
Produce enterprise's urgent problem to be solved.
The content of the invention
In view of this, the technical problems to be solved in the utility model is that a kind of improvement practical, that defective products rate is low is thick
The wiring board of copper coin part starved.
In order to solve the above-mentioned technical problem, the utility model is realized using following scheme：One kind is used to improve thick copper coin office
The wiring board of portion's starved, including the wiring board body being made up of multiple wiring board units and it is respectively coated assist side body upper end
The anti-solder ink layer of face and lower surface；Described wiring board body is from the bottom to top successively according to first line flaggy, the first half solid
Change layer, the second pcb layer, the second layer of prepreg and tertiary circuit flaggy typesetting pressing to form；The second described wiring board
Layer is provided with multiple white spaces emptied after layers of copper；The quantity of described white space is identical with the quantity of wiring board unit,
And the position of white space is corresponding with the position of wiring board unit；Described multiple white spaces dislocation arrangement.
Preferably, the outside of described white space is located at one of the wiring board unit of white space corresponding thereto
On edges of boards.
Preferably, the ratio range control of the gross area of the area of described white space and wiring board unit 1/5~
Between 1/2.
Preferably, described white space is arranged on the upper surface and lower surface of the second pcb layer.
Preferably, the upper surface of the second described pcb layer is identical with the thickness of the layers of copper of lower surface, and the thickness of layers of copper
Degree control is in 0.6mil~4.2mil.
Preferably, the quantity of described wiring board unit is two or more.
Preferably, described first line flaggy and tertiary circuit flaggy are copper plate layer.
Preferably, the first described semi-solid preparation layer and the second layer of prepreg use the layer of prepreg of same model.
Preferably, assist side body upper surface is applied identical with the thickness of the anti-solder ink layer of lower surface.
Preferably, the edges of boards of wiring board body are provided with positioning hole.
Compared with prior art, the utility model is provided with multiple white spaces, and white space on the second pcb layer
Dislocation arrangement, changes traditional line pattern structure so that can after the prepreg fusing of other positions in bonding processes
White space is flowed into, the colloid that compensate for white space is not enough, improve the phenomenon of starved in pressing rear board, it is to avoid pressing
Rear wiring board copper sheet layering, corrugation and the problems such as plate bursting, improve the yield of one step press, reduce doing over again in bonding processes
Rate, improves production efficiency and quality yield and reduces product safety hidden danger, reduce the waste of raw material, reduce production cost, carry
High economic benefit.
Brief description of the drawings
Fig. 1 be existing wiring board in wiring board unit composing structure schematic diagram.
Fig. 2 is structural representation of the present utility model.
Fig. 3 is the structural representation of the second pcb layer of the present utility model.
Fig. 4 is the composing structure schematic diagram of the wiring board unit of the second pcb layer of the present utility model.
Wherein：1 wiring board body；11 first line flaggies；12 first semi-solid preparations layer；13 second pcb layers；14 second
Layer of prepreg；15 tertiary circuit flaggies；131 white spaces；2 anti-solder inks layer；3 positioning holes.
Embodiment
In order to allow those skilled in the art to more fully understand the technical solution of the utility model, below in conjunction with the accompanying drawings to this
Utility model is further elaborated.
As shown in Figures 1 to 4, it is a kind of to be used to improve the wiring board of the local starved of thick copper coin, including by multiple wiring board lists
The wiring board body 1 of member composition and the anti-solder ink layer 2 for being respectively coated the upper surface of assist side body 1 and lower surface.Described
Wiring board body is made up of multiple wiring board unit jigsaw, and the quantity of wiring board body is set according to the size of wiring board unit,
The quantity of wiring board unit is in two or more.Described wiring board body 1 by first line flaggy 11, the first semi-solid preparation layer 12,
Second pcb layer 13, the second layer of prepreg 14 and the typesetting of tertiary circuit flaggy 15 pressing moreover, wherein, from bottom to up according to
It is secondary according to first line flaggy 11, the 12, second pcb layer 13 of the first semi-solid preparation layer, the second layer of prepreg 14 and the 3rd line
The typographical sequences of road flaggy 15 carry out typesetting, pressing and are made into wiring board body.
In order to improve the quality of wiring board, described first line flaggy 11 and tertiary circuit flaggy 15 is copper plate layer,
Signal can be reduced and return ground resistance, function of shielding is increased to signal, antijamming capability is improved, and PCB hardness can be increased.In addition, institute
The the first semi-solid preparation layer 12 stated and the second layer of prepreg 16 use the layer of prepreg of same model so that in bonding processes,
In high temperature environments, it can form gummosis after layer of prepreg fusing and flow on the sandwich circuit flaggy and move, it is to avoid wiring board pressure
The problems such as local starved occur after conjunction, improves the quality of circuit.
In order to avoid wiring board layer occurs partially in process of production, the quality of wiring board is improved, in described wiring board sheet
The edges of boards of body 1 are provided with positioning hole 3, are realized and are produced and processed before pressing after the contraposition of typesetting and circuit board pressing by positioning hole
During contraposition between wiring board and production equipment, improve production efficiency and yields.
The second described pcb layer 13 is provided with multiple white spaces 131 emptied after layers of copper；Described white space
131 quantity is identical with the quantity of wiring board unit so that the position of each white space 131 and wiring board unit
Position is corresponding.A white space is equipped with each wiring board unit.In order to avoid going out current situation after circuit board pressing
Portion's starved phenomenon, the described dislocation arrangement of multiple white spaces 131 so that in bonding processes, the glue stream after prepreg fusing
It can flow in white space 131, the colloid that compensate for white space is not enough, improve showing for starved in pressing rear board
As.The outside of described white space 131 is located on an edges of boards of the wiring board unit of white space corresponding thereto, changes
The circuit composing structure of traditional wiring board is become.Wherein, total face of the area of described white space 131 and wiring board unit
Long-pending ratio range is controlled between 1/5~1/2.
Described white space 131 is arranged on the upper surface and lower surface of the second pcb layer 13.The second described circuit
The upper surface of flaggy 13 is identical with the thickness of the layers of copper of lower surface, and layers of copper thickness control in 0.6mil~4.2mil.It is existing
Wiring board occur that starved phenomenon occurs in the white space for emptying layers of copper in production bonding processes, it is wrong according to white space
Position arrangement so that the glue stream between wiring board can be equalized, it is to avoid copper sheet layering, corrugation, plate bursting etc. occur after pressing
Problem, improves the safety and performance of wiring board.
For the circuit in protection circuit plate, cabling insulating properties is improved, prevents occurring in circuit oxidation and welding process
Mistake so that profile is more attractive in appearance, the upper surface of assist side body 1 and lower surface have been coated with one layer of anti-solder ink layer 2, coating
The upper surface of assist side body 1 is identical with the thickness of the anti-solder ink layer of lower surface, improves the quality and performance of wiring board.
Above-described embodiment is only wherein specific implementation of the present utility model, and it describes more specific and detailed, but simultaneously
Therefore the limitation to the utility model the scope of the claims can not be interpreted as.It should be pointed out that for the ordinary skill of this area
For personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are apparent
Alternative forms belong to protection domain of the present utility model.
Claims (10)
1. a kind of be used to improve the wiring board of the local starved of thick copper coin, including the wiring board body being made up of multiple wiring board units
（1）Be respectively coated assist side body（1）The anti-solder ink layer of upper surface and lower surface（2）；Characterized in that, described line
Road plate body（1）From the bottom to top successively according to first line flaggy（11）, the first semi-solid preparation layer（12）, the second pcb layer
（13）, the second layer of prepreg（14）And tertiary circuit flaggy（15）Typesetting pressing is formed；The second described pcb layer
（13）It is provided with multiple white spaces emptied after layers of copper（131）；Described white space（131）Quantity and wiring board unit
Quantity it is identical, and white space（131）Position it is corresponding with the position of wiring board unit；Described multiple white spaces
（131）Dislocation arrangement.
2. according to claim 1 be used to improve the wiring board of the local starved of thick copper coin, it is characterised in that described blank
Region（131）Outside be located on an edges of boards of the wiring board unit of white space corresponding thereto.
3. according to claim 2 be used to improve the wiring board of the local starved of thick copper coin, it is characterised in that described blank
Region（131）Area and wiring board unit the gross area ratio range control between 1/5~1/2.
4. according to claim 3 be used to improve the wiring board of the local starved of thick copper coin, it is characterised in that described blank
Region（131）It is arranged on the second pcb layer（13）Upper surface and lower surface.
5. according to claim 4 be used to improve the wiring board of the local starved of thick copper coin, it is characterised in that described second
Pcb layer（13）Upper surface it is identical with the thickness of the layers of copper of lower surface, and layers of copper thickness control 0.6mil~
4.2mil。
6. according to claim 5 be used to improve the wiring board of the local starved of thick copper coin, it is characterised in that described circuit
The quantity of Slab element is two or more.
7. according to claim 6 be used to improve the wiring board of the local starved of thick copper coin, it is characterised in that described first
Pcb layer（11）With tertiary circuit flaggy（15）It is copper plate layer.
8. according to claim 7 be used to improve the wiring board of the local starved of thick copper coin, it is characterised in that described first
Semi-solid preparation layer（12）With the second layer of prepreg（16）Using the layer of prepreg of same model.
9. according to claim 8 be used to improve the wiring board of the local starved of thick copper coin, it is characterised in that applies assist side
Body（1）Upper surface is identical with the thickness of the anti-solder ink layer 2 of lower surface.
10. according to claim 9 be used to improve the wiring board of the local starved of thick copper coin, it is characterised in that wiring board sheet
Body（1）Edges of boards be provided with positioning hole（3）.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720169746.4U CN206452609U (en) | 2017-02-24 | 2017-02-24 | It is a kind of to be used to improve the wiring board of the local starved of thick copper coin |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720169746.4U CN206452609U (en) | 2017-02-24 | 2017-02-24 | It is a kind of to be used to improve the wiring board of the local starved of thick copper coin |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206452609U true CN206452609U (en) | 2017-08-29 |
Family
ID=59666395
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720169746.4U Active CN206452609U (en) | 2017-02-24 | 2017-02-24 | It is a kind of to be used to improve the wiring board of the local starved of thick copper coin |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206452609U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108008288A (en) * | 2017-12-29 | 2018-05-08 | 大连崇达电路有限公司 | A kind of multilayer circuit board is without copper area automatic identification early warning system |
-
2017
- 2017-02-24 CN CN201720169746.4U patent/CN206452609U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108008288A (en) * | 2017-12-29 | 2018-05-08 | 大连崇达电路有限公司 | A kind of multilayer circuit board is without copper area automatic identification early warning system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20210225 Address after: 226000 Haimen Economic and Technological Development Zone, Nantong City, Jiangsu Province, No. 999 Guangzhou Road Patentee after: Nantong Shenghong Technology Co.,Ltd. Address before: Xinqiao village Xingcheng science and Technology Park, Danshui Town, Huiyang District, Huizhou City, Guangdong Province Patentee before: VICTORY GIANT TECHNOLOGY (HUIZHOU) Co.,Ltd. |
|
| TR01 | Transfer of patent right |