CN105704930B - The manufacturing method of buried resistance board - Google Patents
The manufacturing method of buried resistance board Download PDFInfo
- Publication number
- CN105704930B CN105704930B CN201610202280.3A CN201610202280A CN105704930B CN 105704930 B CN105704930 B CN 105704930B CN 201610202280 A CN201610202280 A CN 201610202280A CN 105704930 B CN105704930 B CN 105704930B
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- China
- Prior art keywords
- buried
- copper
- manufacturing
- plate
- hole
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
- H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
- H05K1/185—Components encapsulated in the insulating substrate of the printed circuit or incorporated in internal layers of a multilayer circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10007—Types of components
- H05K2201/10022—Non-printed resistor
Abstract
The present invention discloses a kind of manufacturing method of buried resistance board comprising following steps: (1) sawing sheet, provides the plate of not a cupric and halogen；(2) NC drills, and bores punching machine brill plate and location hole is made；(3) internal layer circuit completes sheet frame figure and target；(4) it visually inspects, checks plate without residual copper；(5) punch die rushes buried resistor position；(6) internal layer cleans, the plate powder that cleaning punching generates；(7) paste lower film, with soldering iron or fuse machine jigsaw gap digit prepreg is fixed on core material develop it is whole；(8) resistance, is put into made position by buried resistor, and smooth, nothing puts more, puts without leakage, without rubbish；(9) film is sticked, covering one upper film when typesetting；(10) it presses, up and down each copper foil pressing；(11) it drills, drills out blind hole and through-hole；(12) it is electroplated, electroplating ventilating hole copper thickness 25um, blind hole copper thickness 15um is electroplated.
Description
Technical field
The present invention relates to a kind of manufacturing methods of buried resistance board.
Background technique
The title of circuit board has: wiring board, pcb board, aluminum substrate, high frequency plate, thick copper sheet, impedance plate, PCB, ultra-thin route
Plate, ultrathin circuit board, printing (copper lithographic technique) circuit board etc..Circuit board makes circuit miniaturization, intuitiveization, for fixed circuit
Batch production and optimization electrical appliance layout play an important role.Circuit board can be described as printed wiring board or printed circuit board, English
Entitled (Printed Circuit Board) PCB.
Circuit board is divided into single sided board, the three big classification of dual platen and multilayer circuit board if dividing by the number of plies.It is first
Single sided board, on most basic PCB, part is concentrated wherein on one side, and conducting wire then concentrates on another side.Because conducting wire only occurs
One side wherein, so this PCB is just claimed to be called one-sided circuit board.Single sided board usually makes simply, low cost, but a disadvantage is that
It can not be applied on too complicated product.Dual platen is the extension of single sided board, when single layer wiring cannot meet the need of electronic product
It is necessary to using dual platen when wanting.It is two-sided have cover copper and have cabling, and the line between two layers can be connected by via hole
Road is allowed to form required network connection.Multi-layer board refers to conductive pattern layer and insulation material therebetween with three layers or more
Material is laminated with being separated by, and the printed board that conductive pattern interconnects as required therebetween.Multilayer circuit board be electronic information technology to
At high speed, the product that multi-functional, large capacity, small size, slimming, lightweight direction are developed.
Without buried resistance board in available circuit plate, in view of the above drawbacks, it is really necessary to design a kind of manufacturer of buried resistance board
Method.
Summary of the invention
Technical problem to be solved by the present invention lies in: a kind of manufacturing method of buried resistance board is provided.
In order to solve the above technical problems, the technical scheme is that
A kind of manufacturing method of buried resistance board comprising following steps:
(1) sawing sheet provides the plate of not a cupric and halogen；
(2) NC drills, and bores punching machine brill plate and location hole is made；
(3) internal layer circuit completes sheet frame figure and target；
(4) it visually inspects, checks plate without residual copper；
(5) punch die rushes buried resistor position；
(6) internal layer cleans, the plate powder that cleaning punching generates；
(7) paste lower film, with soldering iron or fuse machine jigsaw gap digit prepreg is fixed on core material develop it is whole；
(8) resistance, is put into made position by buried resistor, and smooth, nothing puts more, puts without leakage, without rubbish；；
(9) film is sticked, covering one upper film when typesetting；
(10) it presses, up and down each copper foil pressing；
(11) it drills, drills out blind hole and through-hole；
(12) it is electroplated, electroplating ventilating hole copper thickness 25um, blind hole copper thickness 15um is electroplated；
(13) outer-layer circuit completes the arrangement of outer-layer circuit
(14) it visually inspects, checks bad without holes, residual copper, short circuit, notch；
(15) welding resistance, welding resistance high temperature stop heating, continue to divulge information, being down to 80 DEG C or less to furnace temperature can take out after the completion；
(16) silk-screen, silk-screen high temperature stop heating, continue to divulge information, being down to 80 DEG C or less to furnace temperature can take out after the completion；
(17) second time electroplating only plates pad, does not do heavy copper, bond pad surface electro-coppering thickness >=30um；
(18) turmeric, welding resistance is without obviously falling off after turmeric；
(19) manufacture of buried resistance board is completed in periphery molding.
Compared with prior art, the present invention has the beneficial effect that: the present invention devises a kind of buried resistance board in a creative way
Manufacturing method is capable of the industrialization production of real buried resistance board, and production method is simple, low in cost, has good
Market application prospect.
The present invention further improves as follows:
Further, further include step (20) quality inspection after step (19), check and scratch, disk in dew copper, welding resistance, have in hole
Without copper item.
It further, further include the shipment of step (21) packaging, vacuum damp-proofing packaging after step (20).
Further, the size of plate is width 1041.4mm, long 1244.6mm in the step (1).
Further, further include baking step in the step (6), added after cleaning in baking oven with 100 DEG C and dried 20 minutes, filled
Divide drying plate face and hole wall moisture.
Further, in the step (8) resistance having a size of wide 1.15mm, length 2.8mm, a height of 0.45mm.
Further, defective region does mark and scraps processing after pressing in the step (10).
It further, include grinding between the step (11) and step (12), except glue, heavy copper process.
It further, further include baking step in the step (13), drying rate is slow, prevents blind hole residual moisture, prevents
Only blind hole edge dry film holes.
Further, baking process must be continuously finished in the step (15), must not be interrupted halfway.
Specific embodiment
Below with reference to embodiment, the present invention is further described.
A kind of manufacturing method of buried resistance board comprising following steps:
(1) sawing sheet provides the plate of not a cupric and halogen；
(2) NC drills, and bores punching machine brill plate and location hole is made；
(3) internal layer circuit completes sheet frame figure and target；
(4) it visually inspects, checks plate without residual copper；
(5) punch die rushes buried resistor position；
(6) internal layer cleans, the plate powder that cleaning punching generates；
(7) paste lower film, with soldering iron or fuse machine jigsaw gap digit prepreg is fixed on core material develop it is whole；
(8) resistance, is put into made position by buried resistor, and smooth, nothing puts more, puts without leakage, without rubbish；；
(9) film is sticked, covering one upper film when typesetting；
(10) it presses, up and down each copper foil pressing；
(11) it drills, drills out blind hole and through-hole；
(12) it is electroplated, electroplating ventilating hole copper thickness 25um, blind hole copper thickness 15um is electroplated；
(13) outer-layer circuit completes the arrangement of outer-layer circuit
(14) it visually inspects, checks bad without holes, residual copper, short circuit, notch；
(15) welding resistance, welding resistance high temperature stop heating, continue to divulge information, being down to 80 DEG C or less to furnace temperature can take out after the completion；
(16) silk-screen, silk-screen high temperature stop heating, continue to divulge information, being down to 80 DEG C or less to furnace temperature can take out after the completion；
(17) second time electroplating only plates pad, does not do heavy copper, bond pad surface electro-coppering thickness >=30um；
(18) turmeric, welding resistance is without obviously falling off after turmeric；
(19) manufacture of buried resistance board is completed in periphery molding；
(20) quality inspection, check scratch, dew copper, disk in welding resistance, whether there is or not copper items in hole.
(21) shipment, vacuum damp-proofing packaging are packed.
It is also had the feature that in further above-mentioned steps
The size of plate is width 1041.4mm, long 1244.6mm in the step (1).
Further include baking step in the step (6), is added after cleaning in baking oven with 100 DEG C and dry 20 minutes, sufficiently drying plate
Face and hole wall moisture.
Resistance is having a size of wide 1.15mm, length 2.8mm, a height of 0.45mm in the step (8).
Defective region does mark and scraps processing after pressing in the step (10).
It include grinding between the step (11) and step (12), except glue, heavy copper process.
It further include baking step in the step (13), drying rate is slow, prevents blind hole residual moisture, prevents blind hole edge
Dry film holes.
Baking process must be continuously finished in the step (15), must not be interrupted halfway.
The present invention is not limited to above-mentioned specific embodiment, those skilled in the art from the above idea,
Without creative labor, made various transformation are within the scope of the present invention.
Claims (9)
1. a kind of manufacturing method of buried resistance board comprising following steps:
(1) sawing sheet provides the plate of not a cupric and halogen；
(2) NC drills, and bores punching machine brill plate and location hole is made；
(3) internal layer circuit completes sheet frame figure and target；
(4) it visually inspects, checks plate without residual copper；
(5) punch die rushes buried resistor position；
(6) internal layer cleans, the plate powder that cleaning punching generates；
(7) paste lower film, with soldering iron or fuse machine jigsaw gap digit prepreg is fixed on core material develop it is whole；
(8) resistance, is put into made position by buried resistor, and smooth, nothing puts more, puts without leakage, without rubbish；
(9) film is sticked, covering one upper film when typesetting；
(10) it presses, up and down each copper foil pressing；
(11) it drills, drills out blind hole and through-hole；
(12) it is electroplated, electroplating ventilating hole copper thickness 25um, blind hole copper thickness 15um is electroplated；
(13) outer-layer circuit completes the arrangement of outer-layer circuit
(14) it visually inspects, checks bad without holes, residual copper, short circuit, notch；
(15) welding resistance, welding resistance stop heating, continue to divulge information, being down to 80 DEG C or less to furnace temperature can take out after the completion；
(16) silk-screen, silk-screen stop heating, continue to divulge information, being down to 80 DEG C or less to furnace temperature can take out after the completion；
(17) second time electroplating only plates pad, does not do heavy copper, bond pad surface electro-coppering thickness >=30um；
(18) turmeric, welding resistance is without obviously falling off after turmeric；
(19) manufacture of buried resistance board is completed in periphery molding.
2. the manufacturing method of buried resistance board as described in claim 1, it is characterised in that: further include step after step (19)
(20) quality inspection, check scratch, dew copper, disk in welding resistance, whether there is or not copper items in hole.
3. the manufacturing method of buried resistance board as claimed in claim 2, it is characterised in that: further include step after step (20)
(21) shipment, vacuum damp-proofing packaging are packed.
4. the manufacturing method of buried resistance board as described in claim 1, it is characterised in that: the size of plate in the step (1)
For wide 1041.4mm, long 1244.6mm.
5. the manufacturing method of buried resistance board as described in claim 1, it is characterised in that: further include drying in the step (6)
Step is added with 100 DEG C in baking oven after cleaning and is dried 20 minutes, sufficiently dries plate face and hole wall moisture.
6. the manufacturing method of buried resistance board as described in claim 1, it is characterised in that: in the step (8) resistance having a size of
Wide 1.15mm, length 2.8mm, a height of 0.45mm.
7. the manufacturing method of buried resistance board as described in claim 1, it is characterised in that: bad after pressing in the step (10)
It does mark and scraps processing in region.
8. the manufacturing method of buried resistance board as described in claim 1, it is characterised in that: the step (11) and step (12) it
Between include grinding, except glue, heavy copper process.
9. the manufacturing method of buried resistance board as described in claim 1, it is characterised in that: further include drying in the step (13)
Step, drying rate is slow, prevents blind hole residual moisture, prevents blind hole edge dry film holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610202280.3A CN105704930B (en) | 2016-04-05 | 2016-04-05 | The manufacturing method of buried resistance board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610202280.3A CN105704930B (en) | 2016-04-05 | 2016-04-05 | The manufacturing method of buried resistance board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105704930A CN105704930A (en) | 2016-06-22 |
| CN105704930B true CN105704930B (en) | 2019-01-25 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610202280.3A Active CN105704930B (en) | 2016-04-05 | 2016-04-05 | The manufacturing method of buried resistance board |
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| CN (1) | CN105704930B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109696206B (en) * | 2018-06-26 | 2021-04-13 | 上海嘉捷通电路科技股份有限公司 | Self-made buried resistance plate and testing method thereof |
| CN111029067A (en) * | 2019-12-03 | 2020-04-17 | 欣强电子（清远）有限公司 | Preparation process of novel thermistor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101686603A (en) * | 2008-09-23 | 2010-03-31 | 上海山崎电路板有限公司 | Manufacturing technology of blind hole plate embedding electronic devices |
| CN102869191A (en) * | 2011-07-04 | 2013-01-09 | 上海贺鸿电子有限公司 | Manufacturing method of printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004034759A1 (en) * | 2002-10-08 | 2004-04-22 | Dai Nippon Printing Co., Ltd. | Wiring board incorporating components and process for producing the same |
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2016
- 2016-04-05 CN CN201610202280.3A patent/CN105704930B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101686603A (en) * | 2008-09-23 | 2010-03-31 | 上海山崎电路板有限公司 | Manufacturing technology of blind hole plate embedding electronic devices |
| CN102869191A (en) * | 2011-07-04 | 2013-01-09 | 上海贺鸿电子有限公司 | Manufacturing method of printed circuit board |
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| Publication number | Publication date |
|---|---|
| CN105704930A (en) | 2016-06-22 |
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