CN102869191A

CN102869191A - Manufacturing method of printed circuit board

Info

Publication number: CN102869191A
Application number: CN201110186036XA
Authority: CN
Inventors: 刘统发; 卫尉; 敖伦坡
Original assignee: SHANGHAI H-FAST ELECTRONIC Co Ltd
Current assignee: SHANGHAI H-FAST ELECTRONIC Co Ltd
Priority date: 2011-07-04
Filing date: 2011-07-04
Publication date: 2013-01-09

Abstract

Disclosed is a manufacturing method of a printed circuit board. The manufacturing method includes firstly providing a substrate in which an electronic element chip is arranged and then drilling blind holes on the substrate through laser corresponding to the position of the electronic element chip. The manufacturing method of the printed circuit board has the advantage of improving reliability.

Description

The manufacture method of printed circuit board (PCB)

Technical field

The present invention relates to a kind of manufacture method of printed circuit board (PCB), relate in particular to a kind of manufacture method with printed circuit board (PCB) of higher reliability.

Background technology

Along with the progressively development of electronic devices and components, its processing technology is had higher requirement.For example using at present in the manufacture method of embedding electronic devices more widely generally is first electronic element chip to be fixed in the core material, then upper and lower surface rubberizing film is by heat-pressure curing, and last drilling blind hole derivation electronic element chip electrode also passes through to electroplate, etch process forms circuit turn-on.

Existing drilling blind hole normally adopts the mode of machine drilling, yet this mode is being destroyed electronic element chip easily in varying degrees.Such as a kind of manufacturing technology of blind hole plate that patent of invention publication number CN101686603A discloses, adopt the power auger blind hole to 0.1 ± 0.05 millimeter place of electronic element chip internal layer, then form circuit turn-on by plating, etch process.Such manufacture craft has following shortcoming at least: mechanical drill need be drilled into electronic element chip internal layer certain depth, and used chemicals might react with chip in plating, etching process, causes performance bad, has increased the uncertainty of product quality; Machine drilling is owing to factors such as its machine tool structure and modes, and its borehole accuracy is difficult to control, and yield is difficult to improve; In the course of processing, need frequently MTD or more bit change, can waste resource and increase cost; Be difficult to process the less blind hole of diameter (for example diameter is less than 0.1 millimeter blind hole).

Summary of the invention

In view of the above problems, be necessary to provide a kind of manufacture method that promotes the printed circuit board (PCB) of reliability.

The present invention proposes a kind of manufacture method of printed circuit board (PCB), and it at first provides substrate, is provided with electronic element chip in the substrate; Then corresponding to the electronic element chip position, adopt laser drilling blind hole on substrate.

To adopt laser drilling blind hole on substrate among the preparation method of above-mentioned printed circuit board (PCB), it can avoid destroying electronic element chip, therefore the chemicals that adopts in electronic element chip and other steps is isolated fully, to guarantee the reliability of electronic element chip.

Description of drawings

Fig. 1 is the schematic diagram of substrate of the printed circuit board (PCB) of the embodiment of the invention.

Fig. 2 is the schematic diagram of the printed circuit board (PCB) of the embodiment of the invention.

Fig. 3 is the schematic diagram of printed circuit board (PCB) track of laser beam in manufacture process of the embodiment of the invention.

Fig. 4 is the schematic diagram of the micropore that forms in manufacture process of the printed circuit board (PCB) of the embodiment of the invention.

Embodiment

See also Fig. 1, the manufacture method of printed circuit board (PCB) of the present invention at first provides substrate 10.Be provided with electronic element chip 20 in the substrate 10.Specifically, the method for preparing substrate 10 is that epoxy plate 12 is provided first, and epoxy plate 12 has first surface 122, the second surface 124 relative with first surface 122 and runs through the through hole (not shown) of first surface 122 and second surface 124; Then at first surface 122 applyings the first glued membrane 14; Then electronic element chip 20 is inserted through hole; Again then at second surface 124 applyings the second glued membrane 16, so that electronic element chip 20 is fixed in the substrate 10.In more detail, the through hole of epoxy plate 12 can form by machine drilling or laser drill, and after forming through hole, for guaranteeing the cleaning of epoxy plate 12, can further clean epoxy plate 12 and oven dry.In addition, the first glued membrane 14 or the second glued membrane 16 can be made of the semi-solid preparation material, and its thickness can be 0.01～0.1 millimeter.

Then, corresponding to electronic element chip 20 positions, adopt laser drilling blind hole 18 on substrate 10.Wherein, can be the electrode 22 of electronic element chip 20 or other corresponding to electronic element chip 20 positions and be used for the circuit that is connected with external circuit.Specifically in the present embodiment, the method for laser drilling blind hole on substrate 10 can comprise with light beam along projected path A (as shown in Figure 3) scanning to process successively a plurality of micropore B (as shown in Figure 4), until chisel and carve out whole blind hole 18.Specifically, substrate 10 can be fixed on the carbon dioxide laser equipment, set position and parameter, elder generation 3 holes of preboring, MTD and position, confirm qualified after again with light beam along projected path A (as shown in Figure 3) scanning, process successively a plurality of micropore B (as shown in Figure 4), until chisel and carve out whole blind hole 18.And the laser that adopts can be carbon dioxide laser or ultraviolet laser, preferably ultraviolet laser.In addition, adopting laser on substrate 10, before the drilling blind hole 18, after second surface 124 is fitted the second glued membrane 16, also can carry out lamination and make location hole at substrate 10 substrate 10; Wherein making location hole can adopt the X-ray to carry out.

After forming blind hole 18, can further carry out other operations to printed circuit board (PCB) 100, so that printed circuit board (PCB) 100 forms finished product.Such as also can carry out the power auger through hole, except steps such as glue, electroless copper plating, copper facing, outer graphics, visual examination, welding resistance, character, second time electroplating, turmeric, peripheral moulding, inspection and packing shipment, these steps can be similar with existing circuit board making process, do not giving unnecessary details herein.

To adopt laser drilling blind hole 18 on substrate 10 among the preparation method of above-mentioned printed circuit board (PCB) 100, it can avoid destroying electronic element chip 20, the chemicals that adopts in electronic element chip 20 and other steps is isolated fully, to guarantee the reliability of electronic element chip 20.And the energy that laser processing produces is low, and this " cold " processing mode can be reduced in the course of processing impact on electronic element chip 20 to greatest extent, thereby further promotes the reliability of printed circuit board (PCB) 100.In addition, adopt laser drilling blind hole 18, can form the blind hole of reduced size, and different size conversion line speed, therefore also can save the die sinking cost, shorten product development cycle, the competitiveness of improving product.

Claims

1. the manufacture method of a printed circuit board (PCB), it comprises:

Substrate is provided, is provided with electronic element chip in this substrate; And

Corresponding to this electronic element chip position, adopt laser at this substrate electronic original part position drilling blind hole.

2. the manufacture method of printed circuit board (PCB) as claimed in claim 1 is characterized in that: the method for laser drilling blind hole on this substrate comprises with light beam along projected path scanning to process successively a plurality of micropores.

3. the manufacture method of printed circuit board (PCB) as claimed in claim 1, it is characterized in that: this laser is carbon dioxide laser or ultraviolet laser.

4. the manufacture method of printed circuit board (PCB) as claimed in claim 1 is characterized in that: this laser ultraviolet laser.

5. the manufacture method of printed circuit board (PCB) as claimed in claim 1, it is characterized in that: the method for preparing this substrate comprises:

Epoxy plate is provided, and this epoxy plate has first surface, the second surface relative with this first surface and runs through the through hole of this first surface and this second surface;

At this first surface first glued membrane of fitting;

Electronic element chip is inserted this through hole; And

At this second surface second glued membrane of fitting.

6. the manufacture method of printed circuit board (PCB) as claimed in claim 5 is characterized in that: adopting laser before the drilling blind hole, also to comprise this substrate of lamination and make location hole at this substrate on this substrate.

7. the manufacture method of printed circuit board (PCB) as claimed in claim 6 is characterized in that: making location hole is to adopt the X-ray to carry out.

8. the manufacture method of printed circuit board (PCB) as claimed in claim 1, it is characterized in that: the thickness of this first glued membrane or this second glued membrane is 0.01～0.1 millimeter.