CN103717013B - A kind of manufacture method of printed circuit board - Google Patents
A kind of manufacture method of printed circuit board Download PDFInfo
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- CN103717013B CN103717013B CN201210377923.XA CN201210377923A CN103717013B CN 103717013 B CN103717013 B CN 103717013B CN 201210377923 A CN201210377923 A CN 201210377923A CN 103717013 B CN103717013 B CN 103717013B
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- printed circuit
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Abstract
The manufacture method of a kind of printed circuit board, uses the method for one step press to realize the making of multi-layered high density interconnected printed wiring board；First make first, second daughter board, then some first, second daughter boards are superimposed together, by heating, pressurization, make some first, second daughter boards be bonded together, form multilamellar, a multistage printed circuit board；Completed the making of printed circuit board again by common process such as machine drilling, hole metallization, plating on this multilayer printed circuit board.The present invention effectively controls material harmomegathus in manufacturing process, deformation, thus it is effectively improved the aligning accuracy between Kong Yukong, hole and figure, safe distance between the Kong Yukong of conventional method, hole and figure is narrowed down to 8mil from 20mil, is effectively improved the wiring density of printed circuit board；And, in the case of can putting into not increasing PCB plant equipment, the yields of high density interconnected printed circuit board is significantly increased, shortens the fabrication cycle of product.
Description
Technical field
The present invention relates to the manufacture method of printed circuit board, specifically refer to a kind of based on one step press technique
And the manufacture method of the printed circuit board of interlayer interconnection is realized by conductive materials consent.
Background technology
Moore's Law is pointed out: the upper open ended transistor size of IC, about will increase every 18 months
One times, performance also will promote one times；Follow this law electronic product the most just towards high speed, many
Functionalization, miniaturization and lightweight development, the development of corresponding IC encapsulation also must be along with electronic product
And the orientation direction multiway number of IC design, wire granular, miniaturization, slimming and high heat radiation
Changing development, printing printed wiring board (PCB) as the motherboard carried used by base plate for packaging also must court
Light, thin, little, high density, high-performance direction is developed.
Commonly use lamination method at present to make multi-layered high density interconnected printing printed wiring board.Lamination
Method generally refers on the basis of conventional printed printed wiring board manufacturing method, is come real by order pressing
Existing preparation method of sandwich plate.Specifically refer to the two-sided or multilayered printed track produced in the conventional way
Road plate is as central layer, and by process for pressing outside its one or both sides, it is multilayer board that order increases layer
Process.The printing printed wiring board that this method makes, comes generally by boring, electroplating technology
Realize the interconnection of interlayer.
Along with the development of printed wiring board manufacturing technology, lamination method has some obvious shortcomings.First,
Owing to needs gradually order increases layer, cause fabrication cycle the longest, it is impossible to meet that client quickly delivers goods wants
Ask；On the other hand, some unit scrapped on the make it are inevitably present, again owing to being order
Increase layer, cause the material of follow-up all increasing layers all to become and scrap unit, waste material, add into
This；Additionally, when making high level, high density printed wiring board, lamination method needs to carry out repeatedly pressing,
Just having higher requirement the heat resistance of material, the material cost of making is increased by much, fall
The low competitiveness of product.In addition, the interconnection of any interlayer of printed wiring board to be realized, often
Needing after secondary increasing layer to carry out to electroplate process for filling hole, this technique sets except needing high special of use cost
Outside with electroplating additive, in addition it is also necessary to special control, it is unfavorable for large-scale production.By the problems referred to above
Understand, use traditional lamination method to make multilamellar, high-order, the printing printed wiring of any interlayer interconnection
Plate, its technique, material, cost and fabrication cycle aspect have bigger limitation.
Due to the defect of above-mentioned printed wiring board manufacturing method, in multistage interconnection printing road plate demand
Ever-increasing now, each well-known printed wiring board manufacturing enterprise have developed one after another by once pressing
Close technique and realize the printed wiring board processing technology of multistage increasing layer.Wherein, most typical process route
It is ALIVH (the Any Layer Interstitial Via Hole) technique of PANASONIC.
The Making programme seeing Fig. 1～Fig. 7, ALIVH technique is: bore the most on the insulating layer
Hole, in hole, conductive material becomes daughter board A0 beyond the Great Wall；The gold of pressing conduction on daughter board A0 the most again
Genus layer, as daughter board B0, carries out graphic making subsequently on daughter board B0, etches out by conductor fig；
Finally by above-mentioned daughter board A0 and daughter board B0 lamination in a certain order, use the side of one step press
Method forms multistage printing printed wiring board.
This technique first makes two-sided daughter board, the method then using one step press, is effectively shortened product
Fabrication cycle.And when in daughter board manufacturing process, generating unit is scrapped, can by change daughter board,
Again match, it is to avoid the generation that unit is scrapped, cost-saved, improve efficiency.
Along with the raising of printed wiring board density, said method is used to make high density printed wiring
Plate, there is also some problems: first, hole on the insulant do not have curing molding, pitch of holes
Can not be the least, otherwise in boring procedure, it is easily caused bore deformation and changes with relative position；Its
Secondary, along with the reduction of distance between borehole, daughter board A0 and the daughter board B0 para-position lamination before pressing is the most tired
Difficult, it is easy to cause the hole on daughter board A0 and the figure para-position deviation on daughter board B0, finally result in print
The inefficacy of wiring board processed electrical connection, forms waste product；When making high-density interconnection printing road model,
This is particularly problematic.
Summary of the invention
It is an object of the invention to provide a kind of effective and make multistage highdensity printing reliably
The method of printed wiring board, can use current material and equipment, and the method using one step press can have
Effect shortens fabrication cycle, economizes on resources, effectively solve simultaneously para-position in traditional manufacturing technique difficult,
The defects such as reliability is low, multistage making, the most high-order high-density interconnected printed wiring board has relatively
Big advantage and application prospect.
For reaching above-mentioned purpose, the technical scheme is that
The manufacture method of a kind of printed circuit board, it comprises the steps:
1) the first daughter board makes
1.1 insulating dielectric materials pasting one layer of band protecting film in a metal forming；
1.2 methods using laser drill, process laser on the insulating dielectric materials of band protecting film
Blind hole；
1.3 laser blind holes on insulating dielectric materials are filled conductive material；Then protection is removed
Film；
1.4 place a metal forming again on the insulating dielectric materials surface of populated conductive material, pass through
Heating, the method for pressurization, be bonded in the metal forming of insulating dielectric materials with its two sides
Together, conductive material then forms the conductive channel between double layer of metal paper tinsel；
1.5 shifted by figure, the methods of etching, according to the needs of Making programme, on two sides or
Wherein form the conductor fig of needs in one side metal forming, form the first daughter board；
2) the second daughter board makes
2.1 paste insulation Jie of one layer of band protecting film on the conductor fig surface of above-mentioned first daughter board formation
Material；
2.2 methods using laser drill, process laser on the insulating dielectric materials of band protecting film
Blind hole, then fills conductive material in blind hole, then removes protecting film, forms the
Two daughter boards；
3) according to Printed Circuit Board Design structure, some first, second daughter boards are superimposed together, logical
Cross heating, the method for pressurization, make some first, second daughter boards be bonded together, form one
Individual multilamellar, multistage printed circuit board, wherein the conductive channel of interlayer thus before fill lead
Electric material is formed；
4) after this multilayer printed circuit board has been laminated, can pass through machine drilling, hole metallization,
The common process that plating, figure transfer, green oil and final surface process completes printed circuit
The final making of plate.
Further, described conductive material be resistivity be less than 5 milliohms × centimetre conductive paste or lead
Plasma-based.This conductive material can be organic conductive thing, it is also possible to containing simple substance or alloying metal granule.
Metallic particles includes, but are not limited to gold, silver, copper, ferrum, stannum, indium, bismuth simple substance, it is also possible to be it
In one or more compounds with the alloy inclusive NAND metal of other metals.
It addition, described laser blind hole is filled uses conventional common screen printing method, or use vacuum silk
Print.
The present invention has an advantage that compared with aforementioned ALIVH technology
1. the present invention can effectively control the material harmomegathus problem in manufacturing process.
In the second daughter board manufacturing process, the method, compared with ALIVH method, is first will be less than solidification
Insulating dielectric materials be attached in advance on the first daughter board, make the insulating dielectric materials that do not solidifies with
Daughter board forms an entirety, by the rigidity of daughter board, the intensity dielectric material to not having solidification
Material plays effect fixing, that support, decreases the insulating dielectric materials not solidified and was making
Harmomegathus in journey and deformation.
2. the present invention is effectively improved the aligning accuracy of printed circuit board layer and interlayer, thus improves wiring density.
Daughter board A0 (the i.e. first daughter board) in ALIVH method is the insulating dielectric materials not solidified,
Rigidity, mechanical strength are the most poor, under storage, transhipment, variations in temperature and External Force Acting
It is easy to problems such as deforming, in order to ensure the effectiveness that printed circuit board interlayer connects,
The when of Printed Circuit Board Design, it is necessary for expanding the safe distance of interlayer conductor fig, thus
Reduce the wiring density of printed circuit board；
Compared with ALIVH method, first, second daughter board formed in manufacturing process of the present invention is all
Having the rigid structural component having cured molding, its rigidity and dimensional stability are than ALIVH side
First, second daughter board in method is much higher, is reaching the effective of printed circuit board interlayer connection
On the premise of property, the safe distance of conductor fig can be reduced, thus improve printed circuit board
Wiring density.
The present invention can make the distance between laser blind hole and laser blind hole narrow down to 8mil, hence it is evident that
Improve the wiring density of printed wiring board.The common distance between ALIVH hole and hole is generally
20mil。
ALIVH method is first to hole on the insulating dielectric materials do not have curing molding, leads to the most again
Cross pin or other similar approach to carry out overlapping with other daughter boards para-position, general right of the method
Position precision at 0.15mm, even can only can only accomplish the scope of 0.2mm.
The insulating dielectric materials not having solidification is first pressed together on other daughter boards by the present invention, then by swashing
CCD (optics automatic decimal alignment system) on light rig identifies the contraposition reference point on daughter board,
Holing, such method, aligning accuracy can accomplish the scope of 0.015mm the most again.
3. the present invention can be on the premise of not increasing any equipment, it is achieved high-rise multistage high density track
The making of road plate.
Accompanying drawing explanation
Fig. 1～Fig. 7 is the schematic diagram using ALIVH method to make high density printed wiring board.
In figure, 10 is dielectric material, and 20 is the hole made on dielectric material, and 30 is at medium material
The conductive material inserted in the hole made on material, thus form daughter board A0,40 is to put on daughter board A
The conductive metal foil put.
Fig. 5 is daughter board B0 after figure transfer completes.
Fig. 6 is by the daughter board A01 of different figures, daughter board A02 and daughter board B01, B02, B03
Overlap schematic diagram in a certain order.
Fig. 7 be by the daughter board A01 of different figures, daughter board A02 and daughter board B01, daughter board B02,
B03 forms printed wiring board schematic diagram after overlapping post-heating, pressurization in a certain order.
Fig. 8～Figure 18 is the schematic diagram that the inventive method makes high density printed wiring board.
In figure, 1 is insulating dielectric materials, and 2 is metal forming,
In Fig. 83 are the holes made on insulating dielectric materials.
In Fig. 94 are the conductive materials inserted in the hole of making on insulating dielectric materials.
In Figure 10 5 are the metal formings placed on daughter board A.
Figure 11 is daughter board A after figure transfer completes.
Figure 12 is on the basis of daughter board A, again pressing dielectric material and boring.
Figure 13 is on the basis of daughter board A, again pressing dielectric material and boring after, insert in hole and lead
The daughter board B formed after electric material.
Figure 14 is by the daughter board A and daughter board B1 of different figures, daughter board B2 in a certain order
Overlapping schematic diagram.
Figure 15 is by the daughter board A and daughter board B1 of different figures, daughter board B2 in a certain order
Printed wiring board schematic diagram is formed after overlapping post-heating, pressurization.
Figure 16～Figure 18 is the schematic diagram using the inventive method to make high density printed wiring board.
Figure 19～Figure 28 is the schematic diagram of another embodiment of the inventive method.
Figure 29～Figure 31 is the printed wiring board signal of another high density interconnection that the inventive method makes
Figure.
Detailed description of the invention
Below in conjunction with accompanying drawing, the manufacture method of the present invention is illustrated further.
Embodiment 1
See Fig. 8～Figure 18, the manufacture method of printed circuit board of the present invention, the steps include:
1st step, as shown in Figure 8, in metal forming (Copper Foil) 2, one band protecting film of pressing is exhausted
Edge dielectric material 1.
2nd step, as it is shown in figure 9, form conducting on the insulating dielectric materials 1 of above-mentioned band protecting film
Hole 3, this hole typically uses Laser Processing, can make carbon dioxide laser, it is also possible to be UV laser.
3rd step, as shown in Figure 10, fills conductive material 4 in above-mentioned via, then removes
Protecting film；Conductive material is usually the cream containing metallic particles or slurry, but metallic particles includes not limiting
In copper, silver, ferrum etc.；The method that hole is filled can make the common screen printing method of routine, it is also possible to adopts
Use vacuum screen printing.
4th step, places a metal forming again on insulating dielectric materials 1 surface of populated conductive material 4
5, as shown in figure 11, then by heating, the method for pressurization, by insulating dielectric materials 1 and two sides
Metal forming (Copper Foil) 2,5 be bonded together.
5th step, as shown in figure 12, in the two sides metal forming (Copper Foil) 2,5 of the plate that pressing is formed
On carry out figure transfer, the conductor fig required for formation, obtain daughter board A.
6th step, as shown in Figure 13, Figure 14, pressing band protecting film again on the above-mentioned daughter board A
Insulating dielectric materials 6 and boring, fill conductive material 7, remove protecting film formation daughter board B, meanwhile,
Daughter board B2 or B3 of different graphic according to the design of printed wiring board, can be made respectively；
7th step, as shown in figure 15, presses the daughter board A and daughter board B1 of above-mentioned formation, daughter board B2
It is superimposed together according to certain order.
8th step, as shown in figure 16, use daughter board A that above-mentioned manufacture method makes and daughter board B1,
After daughter board B2 overlaps in a certain order, heating, the method for pressurization is used to make them be bonded in one
Act the printed wiring board 100 forming high density interconnection.
As shown in Figure 17, Figure 18, it is to use the inventive method to make the high density interconnection obtained
Printed wiring board 200.
Embodiment 2
Seeing Figure 19～Figure 28, it is another embodiment of the inventive method.
1st step, as shown in figure 19, in metal forming (Copper Foil) 2, one band protecting film of pressing is exhausted
Edge dielectric material 1.
2nd step, as shown in figure 20, is formed on the insulating dielectric materials 1 of above-mentioned band protecting film and leads
Through hole 3, this hole typically uses Laser Processing, can make carbon dioxide laser, it is also possible to be that UV swashs
Light.
3rd step, as shown in figure 21, fills conductive material 4 in above-mentioned via 3, then goes
Except protecting film；Conductive material is usually the cream containing metallic particles or slurry, but metallic particles includes not
It is limited to copper, silver, ferrum etc.；The method that hole is filled can make the common screen printing method of routine, it is also possible to
Use vacuum screen printing.
4th step, places a metal forming again on insulating dielectric materials 1 surface of populated conductive material 4
5, as shown in figure 22, then by heating, the method for pressurization, by insulating dielectric materials 1 and two sides
Metal forming (Copper Foil) 2,5 be bonded together.
5th step, as shown in figure 23, the one side metal forming (Copper Foil) 5 on the plate that pressing is formed
On carry out figure transfer, the conductor fig required for formation, obtain daughter board A.
6th step, as shown in Figure 24～Figure 26, pressing band protecting film again on the above-mentioned daughter board A
Insulating dielectric materials 6 and boring, filling conductive material 7, removal protecting film formation daughter board B, meanwhile,
Daughter board B1 or B2 of different graphic according to the design of printed wiring board, can be made respectively.
7th step, as shown in figure 27, by the daughter board A and daughter board B of above-mentioned formation, daughter board B1 according to
Certain order is superimposed together.
8th step, as shown in figure 28, use daughter board A that above-mentioned manufacture method makes and daughter board B,
After daughter board B1 overlaps in a certain order, heating, the method for pressurization is used to make them be bonded in one
Act the printed wiring board 300 forming high density interconnection.
As shown in Figure 29～Figure 31, it is the print using the inventive method to make the high density interconnection obtained
Wiring board 400,500 processed.
In sum, the present invention uses current material and equipment, and the method using one step press can have
Effect shortens fabrication cycle, economizes on resources, effectively solve simultaneously para-position in traditional manufacturing technique difficult,
The defects such as reliability is low.
The ultimate principle of the present invention, principal character and advantages of the present invention have more than been shown and described.This
Skilled person will appreciate that of industry, the present invention is not restricted to the described embodiments, above-described embodiment and
The principle that the present invention is simply described described in description, before without departing from spirit and scope of the invention
Putting the present invention and also have various changes and modifications, these changes and improvements both fall within claimed basis
In invention scope.
Claims (5)
1. the manufacture method of printed circuit board, it comprises the steps:
1) the first daughter board makes
1.1 insulating dielectric materials pasting one layer of band protecting film in a metal forming；
1.2 methods using laser drill, process laser on the insulating dielectric materials of band protecting film
Blind hole；
1.3 laser blind holes on insulating dielectric materials are filled conductive material, then removes protection
Film；
1.4 place a metal forming again on the insulating dielectric materials surface of populated conductive material, pass through
Heating, the method for pressurization, be bonded in the metal forming of insulating dielectric materials with its two sides
Together, conductive material then forms the conductive channel between double layer of metal paper tinsel；
1.5 shifted by figure, the methods of etching, according to the needs of Making programme, on two sides or
Wherein form the conductor fig of needs in one side metal forming, form the first daughter board；
2) the second daughter board makes
2.1 paste insulation Jie of one layer of band protecting film on the conductor fig surface of above-mentioned first daughter board formation
Material；
2.2 methods using laser drill, process laser on the insulating dielectric materials of band protecting film
Blind hole, then fills conductive material in blind hole, then removes protecting film, forms the
Two daughter boards；
3) according to Printed Circuit Board Design structure, some first, second daughter boards are superimposed together, logical
Cross heating, the method for pressurization, make some first, second daughter boards be bonded together, form one
Individual multilamellar, multistage printed circuit board, wherein the conductive channel of interlayer thus before fill lead
Electric material is formed；
4) after this multilayer printed circuit board has been laminated, can pass through machine drilling, hole metallization,
The common process that plating, figure transfer, green oil and final surface process completes printed circuit
The final making of plate.
2. the manufacture method of printed circuit board as claimed in claim 1, is characterized in that, described conduction
Material be resistivity be less than 5 milliohms × centimetre conductive paste or conductive paste.
3. the manufacture method of printed circuit board as claimed in claim 1, is characterized in that, described laser
Blind hole is filled and is used conventional common screen printing method, or uses vacuum screen printing.
4. the manufacture method of printed circuit board as claimed in claim 1, is characterized in that, the second daughter board is
Use and first insulating dielectric materials is attached on the first daughter board, then use laser drilling process to complete
The making in hole and the filling of conductive material.
5. the manufacture method of printed circuit board as claimed in claim 1, is characterized in that, complete at daughter board
After, by the method being once laminated, each daughter board is bonded together, forms a multilamellar, many
The printed circuit board on rank.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210377923.XA CN103717013B (en) | 2012-09-29 | 2012-09-29 | A kind of manufacture method of printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210377923.XA CN103717013B (en) | 2012-09-29 | 2012-09-29 | A kind of manufacture method of printed circuit board |
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| CN103717013A CN103717013A (en) | 2014-04-09 |
| CN103717013B true CN103717013B (en) | 2016-10-05 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068490A (en) * | 2018-09-30 | 2018-12-21 | 东莞联桥电子有限公司 | A kind of HDI substrate processing technology |
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|---|---|---|---|---|
| CN104378931B (en) * | 2014-11-21 | 2017-11-28 | 江门崇达电路技术有限公司 | The preparation method of metallization counterbore in a kind of PCB |
| CN108684160B (en) * | 2018-06-04 | 2020-10-16 | 珠海崇达电路技术有限公司 | Manufacturing method of multi-step blind hole HDI plate |
| CN109816153B (en) * | 2018-12-29 | 2023-07-18 | 广州兴森快捷电路科技有限公司 | Method, device, control equipment and medium for generating process flow of split mother board |
| CN111741606B (en) * | 2020-05-22 | 2021-08-10 | 桂林恒泰电子科技有限公司 | Method for manufacturing printed circuit board |
| CN111836469A (en) * | 2020-06-08 | 2020-10-27 | 瑞声精密制造科技(常州)有限公司 | Circuit substrate preparation method and circuit substrate |
| CN111741604B (en) * | 2020-07-04 | 2021-05-18 | 吉安满坤科技股份有限公司 | Manufacturing method of automobile printed circuit board |
| CN116156756A (en) * | 2021-11-19 | 2023-05-23 | 深南电路股份有限公司 | Circuit board preparation method and circuit board |
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|---|---|---|---|---|
| CN101951737A (en) * | 2010-09-25 | 2011-01-19 | 东莞佶升电路板有限公司 | Manufacture method of multilayered circuit board |
| CN102497748A (en) * | 2011-12-07 | 2012-06-13 | 苏州日月明微电子科技有限公司 | Manufacturing method for multilayer printed circuit board |
| CN102595809A (en) * | 2012-03-14 | 2012-07-18 | 柏承科技(昆山)股份有限公司 | Method for manufacturing high-density interconnection printed circuit board |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200505304A (en) * | 2003-05-20 | 2005-02-01 | Matsushita Electric Ind Co Ltd | Multilayer circuit board and method for manufacturing the same |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101951737A (en) * | 2010-09-25 | 2011-01-19 | 东莞佶升电路板有限公司 | Manufacture method of multilayered circuit board |
| CN102497748A (en) * | 2011-12-07 | 2012-06-13 | 苏州日月明微电子科技有限公司 | Manufacturing method for multilayer printed circuit board |
| CN102595809A (en) * | 2012-03-14 | 2012-07-18 | 柏承科技(昆山)股份有限公司 | Method for manufacturing high-density interconnection printed circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109068490A (en) * | 2018-09-30 | 2018-12-21 | 东莞联桥电子有限公司 | A kind of HDI substrate processing technology |
| CN109068490B (en) * | 2018-09-30 | 2020-11-10 | 东莞联桥电子有限公司 | HDI substrate processing technology |
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| CN103717013A (en) | 2014-04-09 |
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