CN101951737A - Manufacture method of multilayered circuit board - Google Patents
Manufacture method of multilayered circuit board Download PDFInfo
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- CN101951737A CN101951737A CN 201010290018 CN201010290018A CN101951737A CN 101951737 A CN101951737 A CN 101951737A CN 201010290018 CN201010290018 CN 201010290018 CN 201010290018 A CN201010290018 A CN 201010290018A CN 101951737 A CN101951737 A CN 101951737A
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- board substrate
- perforation
- circuit board
- copper foil
- foil layer
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Abstract
The invention relates to a manufacture method of a multilayered circuit board, which mainly comprises the steps of: providing a circuit board substrate, wherein the circuit board substrate is provided with a planar copper foil layer respectively on the upper surface and the lower surface of a compound board body; forming a perforation hole on a preset position of the circuit board substrate for filling conductive glue in the perforation hole in a printing manner; heating for drying to ensure that the conductive glue is cured into a conductor connected to the upper copper foil layer and the lower copper foil layer; continuing to form wiring diagrams on the upper copper foil layer and the lower copper foil layer of the circuit board substrate in an image transferring manner; electrically connecting the upper wiring diagram and the lower wiring diagram with the conductor in the perforation hole; and then forming an insulating layer on the surfaces of the wiring diagrams in the circuit board substrate to manufacture the multilayered circuit board. Therefore, the technical scheme, in which the through hole is firstly arranged, the conductive glue is printed, and then the wiring diagrams are formed on the copper foil layers, ensures the conductor quality for connecting the upper wiring diagram and the lower wiring diagram.
Description
Technical field
The present invention relates to a kind of manufacture method of circuit board, refer to a kind of multiple field method of manufacturing circuit board especially with multilayer line figure.
Background technology
In the multiple field circuit board of existing multilayer line figure, be that the electric conductor that need be embedded in the insulating barrier gives conducting between the levels line map.Existing manufacture method with multiple field circuit board of multilayer line figure, general production method, and the production method of publication number CN101304639 number disclosed printed circuit board (PCB) as the disclosed multilayer board of Chinese publication number CN1717159A, wherein:
The production method of the disclosed multilayer board of publication number CN1717159A is to comprise: the internal substrate and the resin material pressing of etching formation line map increase layer, etching forms line map on the outermost layer substrate again, be connected in the position that needs to connect connection on the multilayer board of above-mentioned gained and bore through hole, with the multilayer board ground and cleaned after the boring and before carrying out, after the anti-welding printing in back, row cleans again, provide a printing model to be covered on the multilayer board, make passing through hole for injecting glue and aiming at corresponding through hole on the described printing model, again aqueous conductivity copper glue is injected in the through hole by respectively passing through hole for injecting glue, continuously make the adhesive curing of conductivity copper connect lead between each layer circuit board through heating.
The production method of the disclosed a kind of printed circuit board (PCB) of publication number CN101304639A is to comprise: will carry out internal layer circuit figure to the flexible inner layer plate and make, bore via and lamination treatment, again etching there is the plate pressing that changes of the internal substrate of line map and resin material to increase layer to make multilager base plate, after described multilager base plate being carried out the engagement windows and surface treatment of CNC unlatching flexible board, carry out hard and soft flaggy again and press combination, bore the via of rigid plate, and on the outer surface of described multilager base plate circuit etching figure to make multilayer board, place on the multilayer board in addition to pass through the printing model that glue uses, make the hole for injecting glue of passing through on the printing model aim at corresponding through hole on the multilayer board, again conductivity copper glue is injected corresponding through hole by respectively passing through hole for injecting glue, continuous make the adhesive curing of conductivity copper connect lead between each layer circuit board through heating.
By aforesaid multilayer seal line circuit plate producing process as can be known, all form line map at its multilayer circuit plate substrate in advance, bore through hole again, and utilize the printing model to cover to place the multilayer circuit plate substrate, conductivity copper glue is injected through hole and forms the lead that connects between each layer circuit board.Only the multilayer circuit plate substrate is after forming line map, its surface is to form concavo-convex surface, after so laminar printing model covers and places the multilayer circuit board substrate surface, with scraper when printing model surface horizontal sliding conductivity copper glue injects the wire mark step of through hole of multilayer circuit plate substrate, scraper is subject to the convex-concave surface of multilayer circuit plate substrate and influences the injection rate of conductivity copper glue in the through hole of multilayer circuit plate substrate, and the adhesive curing of generation conductivity copper is formed on the lead quality defect between each layer line map.
Summary of the invention
Technical problem to be solved by this invention is: existing multilayer circuit plate substrate forms line map earlier, re-use the through hole that the electrical copper glue of printing model military order injects the multilayer circuit plate substrate, easily produce the lead quality defect that conductivity copper glue forms between each layer line map.
For achieving the above object, the technical solution used in the present invention is:
A kind of manufacture method of multiple field circuit board is characterized in that, may further comprise the steps:
One board substrate is provided, and described board substrate mainly is in compound each pressing of plate body upper and lower surface one plane copper foil layer to be arranged, and described compound plate body is made of plural insulating barrier and the line map be located between the adjacent insulating barrier;
Precalculated position at board substrate forms perforation;
With printing means filled conductive glue in the perforation of board substrate, give heating, drying again, conducting resinl is cured as connects the conductor of copper foil layer up and down;
Make board substrate copper foil layer formation line map up and down, the conductor electric connection in the line map of described upper and lower layer and the perforation with image transfer means;
Have the line map surface at board substrate and form an insulating barrier.
Wherein, in the step of filled conductive glue, conducting resinl is to select conductivity copper glue for use, and is filled in the perforation of board substrate by the printing model with hole for injecting glue in the perforation of printing means at board substrate.
Wherein, before the step of filled conductive glue, further comprising the surface treatment step of a board substrate in the perforation of printing means at board substrate, is that site of perforation to board substrate imposes to grind and modifies, and is cleaned and drying again.
Wherein, in the perforation of printing means, before the step of filled conductive glue, further comprise the surface treatment step of a board substrate, the site of perforation of board substrate is cleaned and drying at board substrate.
Wherein, it is characterized in that, before described image transfer means make board substrate that copper foil layer forms the step of line map up and down, comprise that further the electric conductor on the board substrate imposes the surface-treated step, be the electric conductor residue that forms in board substrate copper foil layer surface to be given worn, cleaned again and dry.
The attainable beneficial effect of the present invention is: the manufacture method of this multiple field circuit board is mainly before the copper foil layer of board substrate forms line map, the shaping of advanced eleven punch 11, and insert conducting resinl and form to connect the conductor of copper foil layer up and down, afterwards, carry out the step of copper foil layer formation line map again, so, can be when conducting resinl be filled in the perforation of board substrate with the screen painting means, order printing model can be flat on the smooth copper foil layer surface of board substrate, and then pass through each hole for injecting glue at scraper horizontal sliding conducting resinl and inject corresponding perforation, can guarantee the injection rate of conducting resinl in each perforation, and reach the good filling effect that enriches, reduce the conductor defective in the multiple field circuit board, make the multiple field circuit board possess good product quality.
Description of drawings
Fig. 1 is the excellent embodiment flow chart that selects of the manufacture method of multiple field circuit board of the present invention.
Embodiment
Below cooperate graphic and the preferred embodiments of the present invention, further setting forth the present invention is to reach the technological means that predetermined goal of the invention is taked.
As shown in Figure 1, the concrete implementation step of the manufacture method of multiple field circuit board of the present invention is to comprise:
One board substrate is provided, described board substrate mainly is in compound each pressing of plate body upper and lower surface one plane copper foil layer to be arranged, described compound plate body is made of plural insulating barrier and the line map that is located between the adjacent insulating barrier, at each pressing copper foil layer of compound plate body upper and lower surface;
Precalculated position at board substrate forms perforation, is to use machining machine and tools such as drilling machine or laser processing facility to form perforation in the board substrate precalculated position;
With printing means filled conductive glue in the perforation of board substrate, give heating, drying again, conducting resinl is cured as connects the conductor of copper foil layer up and down, described conducting resinl can be selected conductivity copper glue for use, and be filled in the perforation of board substrate with the screen painting means, described screen painting means can be used the printing model, the printing model is provided with hole for injecting glue, the printing model is flat on the board substrate surface, make perforation accordingly on each hole for injecting glue alignment circuit plate substrate, utilize scraper horizontal sliding conducting resinl to inject corresponding perforation again by each hole for injecting glue, afterwards through heating, conducting resinl is solidified to form connects the conductor of copper foil layer up and down, in this step, because of copper foil layer is plane thin slice, and the smooth plate body surface that is covered on, the printing model covers that to put on board substrate also be formation state, thus can make scraper fill up perforation at the surperficial horizontal sliding conducting resinl of printing model, and reach good filling effect;
Make board substrate copper foil layer formation line map up and down with image transfer means, the line map of described upper and lower layer and the interior conductor electric connection of perforation, when the compound plate body of line map is arranged in if described board substrate uses, conductor also can electrically connect the corresponding line map of compound plate body internal layer according to design, and described image transfer means can be the chemical etching mode;
The surface that has line map at board substrate forms an insulating barrier, and described insulating barrier can be coatings such as anti-welding lacquer and forms in precalculated position, board substrate surface with mode of printing.
Described with the perforation of printing means at board substrate in before the step of filled conductive glue, the surface treatment step that still can further comprise a board substrate, the site of perforation of board substrate is cleaned and drying, with clear de-smear ... wait residue.
Before described image transfer means make board substrate that copper foil layer forms the step of line map up and down, still can comprise further that the electric conductor on the board substrate imposes the surface-treated step, wherein be the electric conductor residue that forms in board substrate copper foil layer surface to be given worn, cleaned again and dry.
The manufacture method of multiple field circuit board of the present invention mainly is that the copper foil layer of board substrate is before forming line map, the shaping of advanced eleven punch 11 and insert conducting resinl and form after the conductor that connects copper foil layer up and down, carry out the step of copper foil layer formation line map again, so, can be when conducting resinl be filled in the perforation of board substrate with the screen painting means, order printing model can be flat on the smooth copper foil layer surface of board substrate, and then pass through each hole for injecting glue at scraper horizontal sliding conducting resinl and inject corresponding perforation, can guarantee the injection rate of conducting resinl in each perforation, and reach the good filling effect that enriches, reduce the conductor defective in the multiple field circuit board.
More than explanation is just illustrative for the purpose of the present invention; and nonrestrictive, those of ordinary skills understand, under the situation of the spirit and scope that do not break away from claim and limited; can make many modifications, variation or equivalence, but all will fall within protection scope of the present invention.
Claims (5)
1. the manufacture method of a multiple field circuit board is characterized in that, may further comprise the steps:
One board substrate is provided, and described board substrate mainly is in compound each pressing of plate body upper and lower surface one plane copper foil layer to be arranged, and described compound plate body is made of plural insulating barrier and the line map be located between the adjacent insulating barrier;
Precalculated position at board substrate forms perforation;
With printing means filled conductive glue in the perforation of board substrate, give heating, drying again, conducting resinl is cured as connects the conductor of copper foil layer up and down;
Make board substrate copper foil layer formation line map up and down, the conductor electric connection in the line map of described upper and lower layer and the perforation with image transfer means;
Have the line map surface at board substrate and form an insulating barrier.
2. the manufacture method of multiple field circuit board according to claim 1, it is characterized in that, in with the perforation of printing means in the step of filled conductive glue at board substrate, conducting resinl is to select conductivity copper glue for use, and is filled in the perforation of board substrate by the printing model with hole for injecting glue.
3. the manufacture method of multiple field circuit board according to claim 1, it is characterized in that, in with the perforation of printing means before the step of filled conductive glue at board substrate, the surface treatment step that further comprises a board substrate, be that site of perforation to board substrate imposes to grind and modifies, cleaned again and drying.
4. the manufacture method of multiple field circuit board according to claim 2, it is characterized in that, in with the perforation of printing means before the step of filled conductive glue at board substrate, the surface treatment step that further comprises a board substrate is cleaned and drying the site of perforation of board substrate.
5. according to the manufacture method of each described multiple field circuit board in the claim 1 to 4, it is characterized in that, before described image transfer means make board substrate that copper foil layer forms the step of line map up and down, comprise that further the electric conductor on the board substrate imposes the surface-treated step, be the electric conductor residue that forms in board substrate copper foil layer surface to be given worn, cleaned again and dry.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010290018 CN101951737A (en) | 2010-09-25 | 2010-09-25 | Manufacture method of multilayered circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201010290018 CN101951737A (en) | 2010-09-25 | 2010-09-25 | Manufacture method of multilayered circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101951737A true CN101951737A (en) | 2011-01-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201010290018 Pending CN101951737A (en) | 2010-09-25 | 2010-09-25 | Manufacture method of multilayered circuit board |
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| CN (1) | CN101951737A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103717013A (en) * | 2012-09-29 | 2014-04-09 | 上海美维科技有限公司 | Manufacturing method for printed circuit board |
| CN107864575A (en) * | 2017-11-09 | 2018-03-30 | 建业科技电子（惠州）有限公司 | Without PIN positioning and processing methods |
| CN107878004A (en) * | 2017-11-10 | 2018-04-06 | 中国电子科技集团公司第四十研究所 | A kind of flexible microstrip circuit conducting resinl topical application frock and its painting method |
| WO2018082362A1 (en) * | 2016-11-03 | 2018-05-11 | 成都柔电云科科技有限公司 | Method for fabricating epidermal electrode |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1347276A (en) * | 2000-10-09 | 2002-05-01 | 耀华电子股份有限公司 | Method for making multi-layer PCB composed of flexible and rigid layers |
| CN1717159A (en) * | 2005-05-23 | 2006-01-04 | 松维线路板（深圳）有限公司 | Method forp roducing multilayer printed circuit board |
-
2010
- 2010-09-25 CN CN 201010290018 patent/CN101951737A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1347276A (en) * | 2000-10-09 | 2002-05-01 | 耀华电子股份有限公司 | Method for making multi-layer PCB composed of flexible and rigid layers |
| CN1717159A (en) * | 2005-05-23 | 2006-01-04 | 松维线路板（深圳）有限公司 | Method forp roducing multilayer printed circuit board |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103717013A (en) * | 2012-09-29 | 2014-04-09 | 上海美维科技有限公司 | Manufacturing method for printed circuit board |
| CN103717013B (en) * | 2012-09-29 | 2016-10-05 | 上海美维科技有限公司 | A kind of manufacture method of printed circuit board |
| WO2018082362A1 (en) * | 2016-11-03 | 2018-05-11 | 成都柔电云科科技有限公司 | Method for fabricating epidermal electrode |
| CN107864575A (en) * | 2017-11-09 | 2018-03-30 | 建业科技电子（惠州）有限公司 | Without PIN positioning and processing methods |
| CN107878004A (en) * | 2017-11-10 | 2018-04-06 | 中国电子科技集团公司第四十研究所 | A kind of flexible microstrip circuit conducting resinl topical application frock and its painting method |
| CN107878004B (en) * | 2017-11-10 | 2019-06-14 | 中国电子科技集团公司第四十一研究所 | A kind of flexibility microstrip circuit conducting resinl topical application tooling and its coating method |
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Application publication date: 20110119 |