CN1347276A - Method for making multi-layer PCB composed of flexible and rigid layers - Google Patents
Method for making multi-layer PCB composed of flexible and rigid layers Download PDFInfo
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- CN1347276A CN1347276A CN 00129653 CN00129653A CN1347276A CN 1347276 A CN1347276 A CN 1347276A CN 00129653 CN00129653 CN 00129653 CN 00129653 A CN00129653 A CN 00129653A CN 1347276 A CN1347276 A CN 1347276A
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Abstract
A process for preparing the multi-layer PCB with flexible and rigid layers includes preparing internal circuit layers on both surfaces of a flexible board and connecting lines between both internal circuit layers, pressing external copper foils with adhesive layer onto them, drilling through holes at the connection points of circuit, metallizing, electroplating, preparing external circuit layers, and applying a weld-preef ink layer on external circuit. Its advantage is simple preparing process.
Description
The present invention is a kind of manufacture method of multi-layer PCB composed of flexible and rigid layers, refers to a kind of multilayer circuit board that can doubling especially, exempts cutting and at the fabrication schedule of trouble of the winding displacement protective mulch of soft board middle part.
General circuit board only has the circuit of single face, and because design of electronic circuits becomes increasingly complex, if with single face circuit production commonly used, then the area of circuit board can be very big, uses so can't adapt to complicated large scale circuit.
Thereby have circuit board to make multilayer circuit board into single face, and circuit design is become multilayer circuit, dwindle the area of circuit board, use to adapt to complicated circuit, it is extremely important just to seem.As palmtop computer, mobile phone ... Deng, because of its can doubling harvesting, must connect so be installed in the interior circuit board of two housings, and can bending; And circuit board commonly used is the outer circuit that clamps hard in the both sides of a flexible circuit board, makes the circuit board must be by the flexible circuit in centre position to reach bent purpose.
The product that the manufacture method of multilayer circuit board commonly used is made, shown in Figure 11 as Fig. 9 one, be the two-sided internal layer circuit a1 that makes respectively in soft board a both sides that has a two-sided Copper Foil in, and between the internal layer circuit a1 of both sides, has a winding displacement a2 of connection, and on the internal layer circuit a1 on soft board a two sides respectively pressing one have the insulation film b of reinforcing fiber, and insulation film b offers a rectangular opening b1, and when making insulation film b cover on the soft board a, the winding displacement a2 in the middle of the soft board a is exposed; The Copper Foil c of folded tool insulation material c1 is covered in the internal layer circuit a1 top that is positioned at soft board a again in the both sides of insulation film b, and has the rectangular opening c2 that the middle winding displacement a2 of soft board a is exposed on the Copper Foil c equally; On the tie point of the preinstalled circuit of Copper Foil c, drill through hole 6 afterwards, as shown in figure 10; Metallize and electroplate in through hole 6 then, make Copper Foil c and internal layer circuit a1 be connected conducting, go up in Copper Foil c again and make outer circuit, and apply one deck anti-solder ink f by the electrodeposited coating e of through hole 6; The surplus limit g cutting excision that the both sides of last will insulate again film 6 and Copper Foil c connect as shown in figure 11, is promptly finished the manufacturing of multilayer circuit board.Its major defect is:
Use that manufacture method commonly used makes can be to curved multilayer circuit board the time, on insulation film 6, must offer a rectangular opening 61 in advance, and must offer rectangular opening c2 earlier equally at Copper Foil c, and the g cutting of surplus limit must be excised after finishing, thereby the trouble that increase is made is with inconvenient, so increase manufacturing cost.
Moreover insulation film 6 and Copper Foil c are pressed together on the last contraposition of soft board a must be very accurate, can increase trouble and inconvenience in the manufacturing equally.
The winding displacement a2 of soft board a middle part must cover a protective layer f1 in addition more again, and has a paragraph poor between winding displacement a2 and the Copper Foil c, makes protective layer f1 be not easy to cover on the winding displacement, thereby increases the degree of difficulty on making.
At above-mentioned defective, the inventor creates technical scheme of the present invention through long term studies and experiment.
Main purpose of the present invention is to provide a kind of manufacture method of multi-layer PCB composed of flexible and rigid layers, manufacturing can doubling multilayer circuit board, directly pressing one bottom surface does not have the outer copper foil of the cementing layer of reinforcing fiber, thereby can exempt the trouble and inconvenience of surplus limit of cutting and location.
Another purpose of the present invention is to provide a kind of manufacture method of multi-layer PCB composed of flexible and rigid layers; manufacturing can doubling multilayer circuit board; directly pressing one bottom surface does not have the outer copper foil of reinforcing fiber cementing layer; and make outer circuit at outer copper foil; promptly simultaneously the Copper Foil of the top of the winding displacement in the middle of the soft board is removed, and the inconvenience and the trouble of exempting the winding displacement protective mulch of soft board middle part.
The object of the present invention is achieved like this: a kind of manufacture method of multi-layer PCB composed of flexible and rigid layers is characterized in that: it comprises the steps:
(1) make internal layer circuit:
Be the two-sided internal layer circuit of making respectively in soft board both sides, and between the internal layer circuit of both sides, have the winding displacement of connection with two-sided Copper Foil;
(2) pressing contains the outer copper foil of cementing layer:
The pressing bottom surface does not have the outer copper foil of the cementing layer of reinforcing fiber respectively in this soft board two sides;
(3) make through hole: on each tie point of the preinstalled circuit of this outer copper foil, make through hole;
(4) electroplating ventilating hole:
Afterwards in this through hole electroplating of going forward side by side that metallizes, the internal layer circuit that makes outer copper foil and soft board is connected conducting by the electrodeposited coating of through hole;
(5) make outer circuit:
Make outer circuit in outer copper foil again, and will be positioned at the Copper Foil removal of the winding displacement top in the middle of the soft board;
(6) apply anti-solder ink:
Apply one deck anti-solder ink in outer circuit at last, make multi-layer PCB composed of flexible and rigid layers of the present invention.
This step (two) is the pressing cementing layer: pressing does not have the cementing layer of reinforcing fiber respectively in this soft board two sides;
This step (three) is to make through hole on each tie point of the preinstalled circuit of this cementing layer;
For it laggard row metalization of this step (four) and plating, and on cementing layer, form outer copper foil, and make outer copper foil be connected conducting with the internal layer circuit of soft board by the electrodeposited coating of through hole.
This step (two) condenses into cementing layer for applying liquid gummed material: in the gummed material of this soft board coated on both sides one deck liquid state, become a cementing layer after making this gummed material condense into solid.
Major advantage of the present invention is: have the trouble that can exempt the surplus limit of cutting, offer open-work and location, so simplify fabrication schedule, reduce manufacturing cost, to improve market competitiveness.
Further specify below in conjunction with preferred embodiment and accompanying drawing.
Fig. 1 is the process flow diagram of manufacture method of the present invention.
Fig. 2 is half-finished perspective exploded view of method of the present invention.
Fig. 3 is half-finished cross-sectional schematic of method of the present invention.
Fig. 4 is the cross-sectional schematic of the product of method manufacturing of the present invention.
Fig. 5 is half-finished cross-sectional schematic of method embodiment 2 of the present invention.
Fig. 6 is half-finished cross-sectional schematic of method embodiment 2 of the present invention.
Fig. 7 is the cross-sectional schematic of the product of method embodiment 2 of the present invention.
Fig. 8 is half-finished cross-sectional schematic of method embodiment 3 of the present invention.
Fig. 9 is the perspective exploded view of the product made of the method used always.
Figure 10 is the cross-sectional schematic of the product made of the method used always.
Figure 11 is the schematic top plan view on the surplus limit of method cutting used always.
Consult Fig. 1 one Fig. 4, manufacture method of the present invention comprises the steps:
(1) make internal layer circuit:
Be in the two-sided internal layer circuit 11 of making respectively in soft board 1 both sides with two-sided Copper Foil, and between the internal layer circuit 11 of both sides, have the winding displacement 12 of connection;
(2) pressing outer copper foil:
Pressing contains the outer copper foil 2 of cementing layer 21 respectively in this soft board 1 two sides, and the bottom surface of this cementing layer 21 does not have reinforcing fiber, shown in Fig. 2,3;
(3) make through hole: system through hole 3 on each tie point of the preinstalled circuit of this outer copper foil 2;
(4) electroplating ventilating hole:
Afterwards in this through hole 3 electroplating of going forward side by side that metallizes, the internal layer circuit 11 that makes outer copper foil 2 and soft board 1 is connected conducting by the electrodeposited coating 4 of through hole 3, as shown in Figure 4;
(5) make outer circuit:
Make outer circuit 2a in outer copper foil 2 again, and will be positioned at the Copper Foil removal of winding displacement 12 tops in the middle of the soft board 1;
(6) apply anti-solder ink:
Apply one deck anti-solder ink 5 in outer circuit 2a at last, make multi-layer PCB composed of flexible and rigid layers of the present invention.The product of making as shown in Figure 4.
According to above-mentioned manufacture method, because this soft board 1 direct pressing do not have the outer copper foil 2 of the cementing layer 21 of reinforcing fiber, thereby can exempt the surplus limit of cutting, offer the trouble of open-work and location, so the simplification fabrication schedule, to reduce manufacturing cost, to improve market competitiveness.
Moreover; because this soft board 1 is the outer copper foil 2 that direct pressing full wafer contains cementing layer 21; can directly cover the winding displacement 12 of soft board 1 middle part; thereby inconvenience and the trouble that can exempt extra protective mulch; the same fabrication schedule of simplifying; to reduce manufacturing cost, can improve market competitiveness.
Consult Fig. 5 and Fig. 7, manufacture method of the present invention can also be in soft board 1 two sides respectively pressing one do not have the cementing layer 21 of reinforcing fiber, as shown in Figure 5, system through hole 3 on each tie point of the preinstalled circuit of this cementing layer 21 again, metallize then and electroplate, make the surface of cementing layer 21 form an outer copper foil 2, and be connected conducting with the internal layer circuit 11 of soft board 1, as shown in Figure 6 by the electrodeposited coating 4 that forms in the through hole 3;
For another example with aforementioned, make outer circuit 2a and apply anti-solder ink 5 in this outer copper foil 2 afterwards, the product of its manufacturing as shown in Figure 7.
Consult Fig. 8, another kind of manufacture method of the present invention is in the gummed material 6 of soft board 1 coated on both sides one deck liquid state, becomes a cementing layer 21 after making this gummed material 6 condense into solid, as shown in Figure 8;
Step afterwards is as described in the embodiment 2, and system through hole 3 on this cementing layer 21 metallizes and electroplates, and forms outer copper foils 2 on cementing layer 21 surfaces, makes that the electrodeposited coating 4 of formation is connected conducting with soft board worker's internal layer circuit 11 through hole 3 in; Make outer circuit 2a and apply anti-solder ink 5 in this outer copper foil 2 at last, this for of the present invention other plant manufacture method, reached above-mentioned effect equally.
Combine the above, the disclosed manufacture method of the present invention is in the past not have, and can reach above-mentioned effect really, has novelty, creativeness and practicality.
Claims (3)
1, a kind of manufacture method of multi-layer PCB composed of flexible and rigid layers, it is characterized in that: it comprises the steps:
(1) make internal layer circuit:
Be the two-sided internal layer circuit of making respectively in soft board both sides, and between the internal layer circuit of both sides, have the winding displacement of connection with two-sided Copper Foil;
(2) pressing contains the outer copper foil of cementing layer:
The pressing bottom surface does not have the outer copper foil of the cementing layer of reinforcing fiber respectively in this soft board two sides;
(3) make through hole: on each tie point of the preinstalled circuit of this outer copper foil, make through hole;
(4) electroplating ventilating hole:
Afterwards in this through hole electroplating of going forward side by side that metallizes, the internal layer circuit that makes outer copper foil and soft board is connected conducting by the electrodeposited coating of through hole;
(5) make outer circuit:
Make outer circuit in outer copper foil again, and will be positioned at the Copper Foil removal of the winding displacement top in the middle of the soft board;
(6) apply anti-solder ink:
Apply one deck anti-solder ink in outer circuit at last, make multi-layer PCB composed of flexible and rigid layers of the present invention.
2, the manufacture method of multi-layer PCB composed of flexible and rigid layers as claimed in claim 1 is characterized in that: this step (two) is the pressing cementing layer: pressing does not have the cementing layer of reinforcing fiber respectively in this soft board two sides;
This step (three) is to make through hole on each tie point of the preinstalled circuit of this cementing layer;
For it laggard row metalization of this step (four) and plating, and on cementing layer, form outer copper foil, and make outer copper foil be connected conducting with the internal layer circuit of soft board by the electrodeposited coating of through hole.
3, the manufacture method of multi-layer PCB composed of flexible and rigid layers as claimed in claim 1 or 2, it is characterized in that: this step (two) condenses into cementing layer for applying liquid gummed material: in the gummed material of this soft board coated on both sides one deck liquid state, become a cementing layer after making this gummed material condense into solid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001296531A CN1179614C (en) | 2000-10-09 | 2000-10-09 | Method for making multi-layer PCB composed of flexible and rigid layers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB001296531A CN1179614C (en) | 2000-10-09 | 2000-10-09 | Method for making multi-layer PCB composed of flexible and rigid layers |
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| CN1347276A true CN1347276A (en) | 2002-05-01 |
| CN1179614C CN1179614C (en) | 2004-12-08 |
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| CNB001296531A Expired - Lifetime CN1179614C (en) | 2000-10-09 | 2000-10-09 | Method for making multi-layer PCB composed of flexible and rigid layers |
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Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101198212B (en) * | 2006-12-04 | 2010-12-15 | 日本梅克特隆株式会社 | Multilayer soft printed wiring board and production method thereof |
| US7859106B2 (en) | 2005-11-29 | 2010-12-28 | Samsung Electro-Mechanics Co., Ltd. | Multilayer printed circuit board using paste bumps |
| CN101951728A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Production method for replacing flexible circuit board with rigid circuit board |
| CN101951737A (en) * | 2010-09-25 | 2011-01-19 | 东莞佶升电路板有限公司 | Manufacture method of multilayered circuit board |
| CN101631431B (en) * | 2008-07-18 | 2011-05-04 | 欣兴电子股份有限公司 | Soft-hard plate structure and manufacturing method thereof |
| CN102209442A (en) * | 2010-11-16 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Technology of producing soft-hard combination multilayer circuit board with copper foil covering method |
| CN102262841A (en) * | 2011-07-22 | 2011-11-30 | 友达光电（苏州）有限公司 | Display module |
| CN101605430B (en) * | 2009-07-16 | 2012-01-25 | 东莞康源电子有限公司 | Method for pressing layer gasket of rigid-flexible product |
| CN102054813B (en) * | 2009-10-30 | 2012-11-28 | 日月光半导体（上海）股份有限公司 | Encapsulation substrate unit bodies with plated through holes and manufacturing method thereof |
| WO2013097539A1 (en) * | 2011-12-31 | 2013-07-04 | 北大方正集团有限公司 | Printed circuit board and fabricating method thereof |
| CN105142337A (en) * | 2015-09-10 | 2015-12-09 | 深圳华麟电路技术有限公司 | Inner layer bonding pad later-windowed rigid-flexible printed circuit board and manufacturing method thereof |
| CN105408832A (en) * | 2013-08-15 | 2016-03-16 | 苹果公司 | Hinged portable electronic device with display circuitry located in base |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100442956C (en) * | 2005-03-25 | 2008-12-10 | 华通电脑股份有限公司 | Soft-hard composite circuit board manufacturing method |
-
2000
- 2000-10-09 CN CNB001296531A patent/CN1179614C/en not_active Expired - Lifetime
Cited By (15)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7859106B2 (en) | 2005-11-29 | 2010-12-28 | Samsung Electro-Mechanics Co., Ltd. | Multilayer printed circuit board using paste bumps |
| CN101198212B (en) * | 2006-12-04 | 2010-12-15 | 日本梅克特隆株式会社 | Multilayer soft printed wiring board and production method thereof |
| CN101631431B (en) * | 2008-07-18 | 2011-05-04 | 欣兴电子股份有限公司 | Soft-hard plate structure and manufacturing method thereof |
| CN101605430B (en) * | 2009-07-16 | 2012-01-25 | 东莞康源电子有限公司 | Method for pressing layer gasket of rigid-flexible product |
| CN102054813B (en) * | 2009-10-30 | 2012-11-28 | 日月光半导体（上海）股份有限公司 | Encapsulation substrate unit bodies with plated through holes and manufacturing method thereof |
| CN101951728A (en) * | 2010-09-10 | 2011-01-19 | 广东依顿电子科技股份有限公司 | Production method for replacing flexible circuit board with rigid circuit board |
| CN101951737A (en) * | 2010-09-25 | 2011-01-19 | 东莞佶升电路板有限公司 | Manufacture method of multilayered circuit board |
| CN102209442B (en) * | 2010-11-16 | 2012-11-14 | 博罗县精汇电子科技有限公司 | Technology of producing soft-hard combination multilayer circuit board with copper foil covering method |
| CN102209442A (en) * | 2010-11-16 | 2011-10-05 | 博罗县精汇电子科技有限公司 | Technology of producing soft-hard combination multilayer circuit board with copper foil covering method |
| CN102262841A (en) * | 2011-07-22 | 2011-11-30 | 友达光电（苏州）有限公司 | Display module |
| WO2013097539A1 (en) * | 2011-12-31 | 2013-07-04 | 北大方正集团有限公司 | Printed circuit board and fabricating method thereof |
| US9900978B2 (en) | 2011-12-31 | 2018-02-20 | Peking University Founder Group Co., Ltd. | Printed circuit boards and methods for manufacturing same |
| CN105408832A (en) * | 2013-08-15 | 2016-03-16 | 苹果公司 | Hinged portable electronic device with display circuitry located in base |
| CN105142337A (en) * | 2015-09-10 | 2015-12-09 | 深圳华麟电路技术有限公司 | Inner layer bonding pad later-windowed rigid-flexible printed circuit board and manufacturing method thereof |
| CN105142337B (en) * | 2015-09-10 | 2018-05-22 | 深圳华麟电路技术有限公司 | A kind of Rigid Flex to open a window after internal layer pad and preparation method thereof |
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| CN1179614C (en) | 2004-12-08 |
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