CN1171517C

CN1171517C - Technology for making printed circuit board with additional layers

Info

Publication number: CN1171517C
Application number: CNB991219953A
Authority: CN
Inventors: 张有常
Original assignee: Individual
Current assignee: Individual
Priority date: 1999-10-25
Filing date: 1999-10-25
Publication date: 2004-10-13
Anticipated expiration: 2019-10-25
Also published as: CN1303230A

Abstract

The present invention relates to a method for manufacturing printed circuit board with additional layers, particularly to a method for manufacturing printed circuit boards which use screen board printing to form insulation layers and connecting holes. After a circuit layer of a base plate is formed, a corresponding screen is arranged on the surface of the circuit layer, the screen and the wire laying configuration of the circuit layer form a relation of a positive and a negative films, the screen is coated with insulation substance, and connecting holes for an insulation layer and a reserved position are separately formed in openings of the screen. In this way, a printed circuit board can add layers without using a high-temperature hot pressing mode or a cold pressing mode, the present invention avoids the defect that a common printed circuit board is made bent and deformed in the cooling process, the number of circuit layers or insulation layers can be increased without being limited according to the actual demand, and the manufacturing process can be simplified so as to reduce the cost.

Description

The manufacture method of printed circuit board with additional layers

Technical field

The present invention is the manufacture method of relevant a kind of printed circuit board with additional layers, refers to that especially a kind of screen printing technology that utilizes is to form the print circuit plates making method of each insulating barrier and connecting hole.

Background technology

Printed circuit board (PCB) is the transport vehicle that has a high density transmission line road for, can be connected between control element and the machinery equipment, not only makes things convenient for wires design, can make in a large number again and saves cost and circuit volume.The manufacture method of general commonly used printed circuit board (PCB), it mainly is under the heat operating environment, utilize hot pressing and the mode of colding pressing at substrate or its copper foil layer of surface of insulating layer pressing, with usefulness as the conducting wire.Only, the manufacture method of this kind printed circuit because its processing procedure need be applied under the hot environment, and hot pressing or technology such as cold pressing realize, and the shortcoming of the crooked perk distortion of circuit board takes place when variations in temperature easily; And for solving its stress problem, so need be the center with the substrate all generally, the line layer and the insulating barrier of the equal number of lower surface growth thereon, and also many restrictions to some extent on total number of plies be difficult in response to dynamical product design requirement in future.

For solving above-mentioned shortcoming and in response to the compact demand of market product, printed circuit board (PCB) also from before the single sided board progress design to multi-layer sheet, as employed 6 laminate to the 12 laminates design of employed 4 laminates of computer product or portable type computer, but along with the dynamical demand of product, the recruitment of its number of laminae still has its necessity.For this reason, industry develops and two kinds of printed circuit board with additional layers manufacture methods: a kind of RCC of being called technology (resin coated copper foil) is as United States Patent (USP) the 4th, 915, No. 797 " Continuous process for coating printed circuit grade copper foilwith a protective resin " discloses; Another kind then is called the Photo-Via technology, and as United States Patent (USP) the 5th, 837, No. 427 " Method for manufacturing build-up multi-layerprinted circuit board " discloses.

The manufacture method of printed circuit board with additional layers commonly used is shown in Figure 1A to Fig. 1 E; At first, on a substrate 10 two-sided, form first line layer 12 and line layer space 13 thereof according to the wiring layout drawing of actual needs, as Figure 1A with etching mode; Afterwards, in first line layer, 12 surfaces and line layer space 13, utilize a megohmite insulant to form first insulating barrier 14, owing to the difference in height of the line layer space 13 and first line layer 12, thus the surface and the non-flat forms of its first insulating barrier 14, shown in Figure 1B; On first insulating barrier 14, form conductive layer 16 again, shown in Fig. 1 C; Continue, according to a wiring layout drawing shape with etch needed second line layer 18 and circuit thereof and the layer space 19, shown in Fig. 1 D; At last, between each line layer and insulating barrier, get out a penetrable serial connection hole 128 (through-hole) of running through each interlayer again, and in serial connection hole 128, form connecting conductive layer 182 with conducting wire use as 12,18 of each line layers, so can finish four basic laminate printed circuit board (PCB)s, shown in Fig. 1 E.

In these additional layers printed circuit manufacture methods, though can under the situation that does not need high temperature, make, to avoid first kind of common method to be out of shape the perk phenomenon, still regardless of being for RCC technology or Photo-Via or having its problem because of the caused product of difference variation.

As in the RCC technology, its employed material material itself must have adhesive properties, so cost expenditure is expensive, it must use laser devices to carry out drilling program, its equipment cost is also very expensive.

Or as in the Photo-Via manufacture method, the insulating barrier material that it was suitable for adhesive force also very expensive, copper foil layer itself is good and cause internal wiring broken string phenomenon easily, need repeatedly that processing procedure such as using exposure etching technique is loaded down with trivial details, the patent right gold expenditure of great number, and effectively solve the smooth product accuracy problem that causes of air spots because of first insulating barrier.In addition, please consult shown in Fig. 1 C again, because the smooth relation of air spots of first insulating barrier 14, so that causing the oblique angle of first line layer 12 and the distance h of conductive layer 16 is less than the front of first line layer 12 and the distance H of conductive layer 16, and that the arm of angle position (h) of first line layer 12 is easy to is chipping, and this is the generation main cause of micro-short circuit.

Content of the present invention

How at the making shortcoming of above-mentioned printed circuit board (PCB) commonly used, the solution that proposes a kind of novelty is design focal point of the present invention.So

Main purpose of the present invention, be to provide a kind of manufacture method of printed circuit board with additional layers, utilize screen printing technology to form each insulating barrier, so promptly do not have first kind and commonly used make insulating barrier with high temperature, hot pressing and the mode of colding pressing, so can solve easily because of the caused product flexural deformation of variations in temperature perk sorry, and accommodation space and the equipment cost that can save use equipment.

Secondary objective of the present invention, be to provide a kind of manufacture method of printed circuit board with additional layers, utilize screen printing technology to form each insulating barrier, can be simpler and easy compared to RCC technology or Photo-Via technology processing procedure, and its insulating barrier material can be selected multiple general insulation material for use, with the expenditure that significantly reduces cost.

Another purpose of the present invention, be to provide a kind of manufacture method of printed circuit board with additional layers, under the situation that need not high temperature, hot pressing and cold pressing forming line layer or insulating barrier, so on the number of plies of its line layer and insulating barrier and unrestrictedly, so can be in good time in response to the dynamical demand of future products.

Another purpose of the present invention, be to provide a kind of manufacture method of printed circuit board with additional layers, before making insulating barrier, fill and lead up in advance the line layer space to the same height of line layer, solve the shortcoming of insulating barrier uneven surface by this, so the generation of the matter of regret of the micro-short circuit of not only can preventing, again can be in response to compact product design requirement.

Another purpose of the present invention, be to provide a kind of manufacture method of printed circuit board with additional layers, before not being plated on surface of insulating layer, sprays earlier the Copper Foil of line layer copper powder on the solid insulating barrier of Shang Weigan, so can increasing the adhesive bonding power between laminate, and the line layer that does not have a Photo-Via technology be easy to come off open circuit sorry.

Another purpose of the present invention is to provide a kind of manufacture method of printed circuit board with additional layers, and visual practical application needs and selects to produce single face multi-layer sheet, double-sided multi-layer plate, even number multi-layer sheet or odd number multi-layer sheet.

Purpose of the present invention can realize by following mode, the manufacture method of printed circuit board with additional layers of the present invention is characterized in that key step includes: a. has been present in conductive materials on the substrate surface according to wiring layout drawing shape to one and has been etched with and sets out first line layer and line layer space thereof; B. a tulle with configuration perforate figure is placed in the first line layer surface, and utilize the screen painting coating technique that first megohmite insulant is coated on this tulle, and make its perforate by tulle be filled in this line layer space to the first line layer equal height; C. second megohmite insulant is formed on the flat surface in first line layer and line layer space to become one first insulating barrier; The surface of d. using a metal sulfate to be plated on first insulating barrier causes it to become a copper foil layer; E. according to wiring layout drawing shape this copper foil layer is carried out etching, to form second line layer and line layer space thereof; And f. repeating step b is to step e to the required a plurality of line layers and the insulating barrier number of plies.

Purpose of the present invention also can adopt following manner to realize, the manufacture method of printed circuit board with additional layers of the present invention,: a. has been present at the lip-deep conductive materials of plate one according to wiring layout drawing shape and has carried out etching to it is characterized in that key step is to include, and sets out first line layer and line layer space thereof with erosion; B. first tulle with configuration perforate figure is placed in the first line layer surface, and utilize the screen painting coating technique that first megohmite insulant is coated on this tulle, and make its perforate by tulle be filled in this line layer space to the first line layer equal height; C. second tulle that another is had the configuration figure is placed in the first line layer surface, and utilize the screen painting coating technique that second megohmite insulant is coated on this tulle, and make it on surface, line layer space, form first insulating barrier with ground floor connecting hole by the perforate of tulle; D. use a metal sulfate to be plated on and reach in the ground floor connecting hole on first insulating barrier to form a copper foil layer; E. according to wiring layout drawing shape copper foil layer being carried out etching, forming second line layer and line layer space thereof, and is to be present in copper foil layer in the ground floor connecting hole as the conducting wire between first line layer and second line layer; And f. repeating step b is to step e to the required a plurality of line layers and the insulating barrier number of plies.

Advantage of the present invention is not use under the high temperature hot pressing or the mode of colding pressing to reach the purpose that printed circuit board (PCB) increases layer, not only printed circuit board (PCB) is sorry what cool and occur bending and deformation often as none, visual again actual needs and unrestrictedly increase the line layer or the insulating barrier number of plies, and can simplify processing procedure significantly to reduce cost.

Now further understand and understanding for making architectural feature of the present invention and the effect reached had, only help with preferred embodiment figure and cooperate detailed explanation, illustrate as after:

Description of drawings

Figure 1A to 1E is printed circuit board with additional layers commonly used each step structure sectional view when making;

Fig. 2 A to 2I is a preferred embodiment of the present invention each step structure sectional view when making;

Fig. 3 is the another embodiment of the present invention structure sectional view;

Fig. 4 A to 4H is another embodiment of the present invention each step structure sectional view when making;

Fig. 5 is the another embodiment of the present invention structure sectional view.

Specific implementation

At first, seeing also shown in Fig. 2 A to Fig. 2 I, is to be a preferred embodiment of the present invention each step structure sectional view when making; Its key step is to include:

Step 1 is carried out etching according to designed wiring layout drawing shape (positive figure) to being present in a substrate 20 lip-deep conductive materials, sets out first line layer 22 and line layer space 23 thereof with erosion, shown in Fig. 2 A;

Step 2, one tulle 70 that presents inverse relationship with wiring layout drawing shape is put (negative film figure) in first line layer, 22 surfaces, and a megohmite insulant (as epoxy resin 24) is evenly coated the upper surface of a tulle 70, and cause this epoxy resin 24 to see through the perforate 72 of tulle 70 and line layer space 23 is filled and led up by the effect of a scraper 80, and to highly same with first line layer 22, place baking oven to be dried again, shown in Fig. 2 B;

Step 3 utilizes the screen painting mode to be coated with a megohmite insulant (as epoxy resin) again to form first insulating barrier 30, shown in Fig. 2 C on first line layer 22 and line layer space 23 flat surfaces; Since filled and led up in the line layer space 23 to first line layer, 22 sustained heights, so first insulating barrier 30 will have even curface, be beneficial to the accuracy of product, the matter of regret generation of the micro-short circuit of more can preventing;

Step 4, with a glass fiber powder with reinforcement support function and insulation buffer action,, be formed on the first solid insulating barrier 30 of Shang Weigan to form glass layer 32 as the glass fiber powder of 600 meshes, place baking oven with 30 oven dry of first insulating barrier, shown in Fig. 2 D again;

Step 5, repeating step 2 utilizes the screen painting mode to utilize the epoxy resin material to form second insulating barrier 40, just so glass layer 32 is sandwiched between two

insulating barriers

30,40, shown in Fig. 2 E on glass layer 32 surfaces once again;

Step 6 with a copper powder with adhesive attraction power between the enhancing laminate, after so the copper powder 42 of employed 300 to 350 meshes of embodiment is sprayed on the second solid insulating barrier 40 of Shang Weigan, places baking oven to dry, shown in Fig. 2 F again;

Step 7 uses containing metal sulfate (as copper sulfate) to be plated on this second insulating barrier 40, and together with this copper powder 42 to form a copper foil layer 50, shown in Fig. 2 G;

Step 8 is etched with this copper foil layer 50 according to designed wiring layout drawing shape (as the positive figure of step 1) and sets out second line layer 52, shown in Fig. 2 H; And

Step 9, set out connecting hole (via-hole) 522 by general bore mode cutter, and formation can connect the connecting conductive layer 524 of first line layer 22 and second line layer 52 in connecting hole 522, and the circuit doubling plate that so is printed on one side can be finished, shown in Fig. 2 I.

Certainly, be the design in response to each product function, before implementation step 9, but repeating step 2 is to step 8 to required line layer and the insulating barrier number of plies, the cutter that carries out step 9 is again established connecting hole 522 and connecting conductive layer 524 to connect each line layer, can produce the circuit multi-layer sheet that is printed on one side easily.

And, be to be positive if make the wiring layout drawing shape of

line layer

22,52, the tulle that then is applied to fill and lead up circuit void layer 24 is a negative film; Otherwise, be to be negative film if make the wiring layout drawing shape of

line layer

22,52, the tulle that then is applied to fill and lead up circuit void layer 24 is a positive.Can utilize screen painting method, pouring curtain rubbing method or one of them person of spraying process all can when again, it forms insulating barrier 30.

Moreover, see also shown in Figure 3ly, be to be the another embodiment of the present invention structure sectional view; As shown in the figure, in the making flow process of this embodiment, the positive and negative tulle characteristic of same utilization the foregoing description is to finish each

line layer

22,52 and insulating barrier 30, unique difference is simultaneously in two-sided each step of carrying out of substrate 20, and connecting hole is changed cutter be made as a serial connection hole (through-hole) 526, then can under different high temperature hot pressing and the situation of colding pressing, finish the circuitron multi-layer sheet easily.

Again, seeing also Fig. 4 A to 4H, is to be another embodiment of the present invention each step structure sectional view when making, and its key step is to include:

Step 1 is carried out etching according to designed wiring layout drawing shape (positive figure) to being present in a substrate 20 lip-deep conductive materials, sets out first line layer 22 and line layer space 23 thereof with erosion, shown in Fig. 4 A;

Step 2, one tulle 70 that presents inverse relationship with wiring layout drawing shape is put (negative film figure) in first line layer, 22 surfaces, and a megohmite insulant (as epoxy resin 24) is evenly coated the upper surface of a tulle 70, and cause this epoxy resin 24 to see through the perforate 72 of tulle 70 and line layer space 23 is filled and led up by the effect of a scraper 80, and to the same height of first line layer 22 and remove tulle 70, place baking oven to be dried again, shown in Fig. 4 B;

Step 3, one tulle 76 is placed first line layer 22 and line layer space 23 flat surfaces, being coated with a megohmite insulant (as epoxy resin) more evenly is applied on the tulle 76, cause the perforate 78 of this epoxy resin by tulle 76 to form first insulating barrier 30, then form ground floor connecting hole 60 (via-hole) in first insulating barrier 30 naturally, shown in Fig. 4 C;

Step 4 has the glass fiber powder of strengthening support function and insulation buffer action with one and is sprayed on the first solid insulating barrier 30 of Shang Weigan to form glass layer 32, places oven braking again, shown in Fig. 4 D;

Step 5, repeating step 3 places tulle 76 glass layer 32 surfaces once again, and utilizes epoxy resin to form second insulating barrier 40 that inside has second layer connecting hole 62, shown in Fig. 4 E;

Step 6 is sprayed on copper powder after solid second insulating barrier 40 surface of Shang Weigan goes up, and is placed in the baking oven and dries, shown in Fig. 4 F;

Step 7 is used copper-containing sulfuric acid salt to be plated on and is reached on this second insulating barrier 40 in ground floor connecting hole 60, the second layer connecting hole 62,,, reaches shown in Fig. 4 G to form a copper foil layer 50 together with copper powder 42

Step 8, according to designed wiring layout drawing shape (as the positive figure of step 1) this copper foil layer 50 is etched with and sets out second line layer 52, and can be connected conduction by the copper foil layer in ground floor connecting hole 60 and the second layer connecting hole 62 between first line layer 22 and second line layer 52, like this one easy printed circuit single-surface double-layer plate is promptly accused and is finished, shown in Fig. 4 H.

Equally, repeating step 2 is to step 8 to required line layer and the insulating barrier number of plies, can form the single face multi-layer sheet, so the not only relative first kind of processing procedure commonly used of the present invention simplified, avoid laminate because of the easy diastrophic shortcoming of the temperature difference, and reach single face circuit board line layer and the unconfined effect of the insulation number of plies.And because ground floor connecting hole 60 and second layer connecting hole 62 are to be formed by tulle half tone coating nature, and need not as conventional borehole technology commonly used or the Laser drill machine of RCC, thus processing procedure not only can more be simplified, and the equipment expenditure that can save writing is arranged.

Seeing also Fig. 5 at last, is to be the another embodiment of the present invention structure sectional view; As shown in the figure,, use the making flow process of above-mentioned Fig. 4, can finish the circuitron multi-layer sheet easily as Fig. 3.

Only the above only is a preferred embodiment of the present invention, is not to be used for limiting scope of the invention process.So be that all equalizations of doing according to the described shape of the utility model claim, structure, feature and spirit change and modification, all should be included in the claim of the present invention.

Claims

1, a kind of manufacture method of printed circuit board with additional layers is characterized in that key step is to include:

A. be present at the lip-deep conductive materials of plate one according to wiring layout drawing shape and carried out etching, set out first line layer and line layer space thereof with erosion;

B. first tulle with configuration perforate figure is placed in the first line layer surface, and utilize the screen painting coating technique that first megohmite insulant is coated on this tulle, and make its perforate by tulle be filled in this line layer space to the first line layer equal height;

C. second tulle that another is had the configuration figure is placed in the first line layer surface, and utilize the screen painting coating technique that second megohmite insulant is coated on this tulle, and make it on surface, line layer space, form first insulating barrier with ground floor connecting hole by the perforate of tulle;

D. use a copper-containing sulfuric acid salt to be plated on and reach in the ground floor connecting hole on first insulating barrier to form a copper foil layer;

E. according to wiring layout drawing shape copper foil layer being carried out etching, forming second line layer and line layer space thereof, and is to be present in copper foil layer in the ground floor connecting hole as the conducting wire between first line layer and second line layer; And

F. repeating step b is to step e to the required a plurality of line layers and the insulating barrier number of plies.

2, manufacture method as claimed in claim 1 is characterized in that: wherein include a step after step c and before the steps d:

One copper powder is sprayed on the first solid surface of insulating layer of Shang Weigan equably, again first insulating barrier is dried; So after employed copper-containing sulfuric acid salt will be together with this copper powder to become this copper foil layer in the steps d.

3, manufacture method as claimed in claim 1 is characterized in that: among this step b among employed first megohmite insulant and the step c employed second megohmite insulant be an epoxy resin.

4, manufacture method as claimed in claim 1 is characterized in that: this line layer and insulating barrier are to be formed on the single surface of substrate, to form the printed circuit single sided board.

5, manufacture method as claimed in claim 1 is characterized in that: line layer and insulating barrier are to be formed on the double-deck up and down surface of substrate, to form the printed circuit double sided board.

6, manufacture method as claimed in claim 1 is characterized in that: employed wiring layout drawing shape is to be positive among the step a, and employed tulle configuration perforate figure then is a negative film among the step b.

7, manufacture method as claimed in claim 1 is characterized in that: employed wiring layout drawing shape is to be negative film among the step a, and employed tulle configuration perforate figure then is a positive among the step b.

8. the manufacture method of a printed circuit board with additional layers is characterized in that key step is to include:

D. not dried as yet when solid at first insulating barrier, form a glass layer in first surface of insulating layer; Again second tulle is placed in the glass fibre laminar surface once again, and utilize the screen painting coating technique that the 3rd megohmite insulant is coated on this tulle, and make it on the glass fibre laminar surface, form second insulating barrier with second layer connecting hole by the perforate of tulle;

E. use a copper-containing sulfuric acid salt to be plated on and reach in ground floor connecting hole and the second layer connecting hole on second insulating barrier to form a copper foil layer;

F. according to wiring layout drawing shape copper foil layer being carried out etching, forming second line layer and line layer space thereof, and is to be present in copper foil layer in ground floor connecting hole and the second layer connecting hole as the conducting wire between first line layer and second line layer; And

G. repeating step b is to step f to the required a plurality of line layers and the insulating barrier number of plies.