CN100459824C - High-layer circuit board and its manufacturing method - Google Patents
High-layer circuit board and its manufacturing method Download PDFInfo
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- CN100459824C CN100459824C CNB2005100297964A CN200510029796A CN100459824C CN 100459824 C CN100459824 C CN 100459824C CN B2005100297964 A CNB2005100297964 A CN B2005100297964A CN 200510029796 A CN200510029796 A CN 200510029796A CN 100459824 C CN100459824 C CN 100459824C
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Abstract
The invention relates to a kind of multilayer circuit board and its manufacturing method. It includes multilayer base material and drilled holes distributing on it, which are mutually folding. Every base material includes a copper foil with certain highness. The number of drilled holes increases from lower-layer base material to upper-layer one. The drilled holes become several interconnected holes after base materials fold. The deepness of interconnected holes distributes in V shape from the edge of circuit board to the center of the board. That is to say, the interconnected hole of the board edge is shallowest and the one of board center is deepest. The multi-layer base material can be divided into above two boards, which are combined after manufactured, in order to solve the problem of manufacturing to produce multi-layer circuit board.
Description
Technical field
The invention relates to a kind of high-layer circuit board and preparation method thereof, especially a kind of have the number of plies of certain thickness, fine pitch (pitch) up to high-layer circuit board more than 18 layers and preparation method thereof.
Background technology
Under the trend development more and more in the consumption electronic products function, that volume is more and more compact, its internal printed circuit board (Printed Circuit Board; PCB) on circuit design and process technique also day by day complexity progress greatly, for increasing in response to component on circuit board density, the continuous density of fine rule layout, interconnection density increases between laminate, in addition, along with the application and the designer trends of composite signal integrated circuits are complicated, except considering the problem of circuit engineering aspect in the past, differentiation with its advanced process, design cycle difficulty to be solved has also increased many, high frequency at specific demand, the high speed plate, in order to control its characteristic impedance, need certain thickness Copper Foil can bear its load, circuit board thickness also increases thereupon and forms slab worthy of the name, and these slabs have it to make difficulty.The traditional printing circuit board uses the glass fibre film, the double sided board of circuit will be made, the number of plies on demand, superimposed contraposition one step press forms the circuit substrate of sandwich construction, it is right because conventional process is to carry out pressing again through superimposed contraposition, boring and plating etc., when the superimposed number of plies of these slabs is low, all can make with present industry technology and processing procedure ability, right when the number of plies is high more, the processing procedure difficulty is just floating to be showed to come, at first, superimposed contraposition gained tolerance increases with the superimposed number of plies, in addition, the harmomegathus of pressing material (as the glass fibre film) causes another error source of pressing than the wayward dystopy easily that causes after the pressing; If carry out machine drilling and then may cause the easy broken needle of drill bit because of the number of plies is too high, the blocked up frictional force that causes of gross thickness is too high, the aspect ratio in thickness of slab and aperture is too high in addition influences more that follow-up plating is difficult for or bad phenomenon such as formation dog bone after the pressing; Then the aperture is too small if carry out laser drill after the pressing, and it is lower that aspect ratio will then be electroplated yield than the machine drilling height; Also have the technology of a kind of Layer increasing method by name (Build Up Process) to develop rapidly, it utilizes the idea of traditional multi-layer sheet pressing one by one (Sequential Laminated), outside plate based on the core substrate of double-deck or four laminates, increase insulating barrier and conductor layer one by one, on insulating barrier, make conductor line, give up machine drill formula aperture (more than the 10mil), bury little guide hole as increasing the interconnected of interlayer and change adopt " non-machine drill formula " blind, and blind hole that between the part level, is communicated with (BlindHole) and buried via hole (Buried Hole), can economize lower through-hole taking up room on the plate face, make limited outer area can be as far as possible in order to wiring and soldering part, kind of a process technique applied in the commercial production surplus the development of Layer increasing method multi-layer sheet had ten so far, as SLC, FRL, DYCOstrate, Z-Link, ALIVH, HDI etc., different processing procedures adopts different material and substrate, therefore on hole creating technology, also have nothing in common with each other, can be divided into the sensitization pore-forming haply, laser drill, multiclass methods such as plasma pit and chemical pit.Yet, the main effect of Layer increasing method is to reduce the through hole area occupied, reach the high density requirement, but be only applicable to lower level number, purpose and be the thin plate of compact usefulness, for having between certain thickness laminated substrate, the aperture fine pitch and the number of plies up to high-layer circuit board more than 18 layers, still have its difficulty, as bore mode and because the too high problem of bringing that electrically conducts of aspect ratio of boring.
Therefore, the above-mentioned shortcoming of inventor's thoughts is concentrated on studies and is cooperated the utilization of scientific principle, proposes a kind of reasonable in design and extensively and effectively improve the present invention of above-mentioned shortcoming.
Summary of the invention
The invention provides a kind of high-layer circuit board and preparation method thereof, can produce the following spacing of laminated substrate, 0.65mm with a predetermined thickness Copper Foil, the high-layer circuit board of the 18 above numbers of plies, especially when the impedance of circuit board consideration characteristics, increase high-layer circuit board of thickness of slab and flaggy and preparation method thereof.
The invention provides a kind of high-layer circuit board and preparation method thereof, is to utilize multi-layer substrate is divided into low number of plies multi-layer sheet more than two, and sectional making makes up again, makes bottleneck so as to breaking through, and raising is made yield, reduced cost, and advances to improve the product city to account for rate.
The invention provides a kind of high-layer circuit board, it comprises superimposed multi-layer substrate and a plurality of boring mutually.Each base material has the Copper Foil of a predetermined thickness, and these borings are to be distributed in these base materials with varying number, and is increased progressively toward the upper strata base material by lower floor's base material; And these borings are to form a plurality of intercommunicating pores by the superimposed back of these base materials, the hole depth of these intercommunicating pores be by circuit board plate edge to the V-shaped distribution of the plate heart, promptly the hole depth of plate edge intercommunicating pore is the most shallow, and the hole depth of plate heart intercommunicating pore is the darkest.
The invention provides a kind of manufacture method of high-layer circuit board, it comprises the following step: many base materials of (i) purchasing, and wherein, these base materials are to have predetermined thickness and be preset with a plurality of borings, these borings are to be distributed in these base materials with varying number; (ii) these base materials of pressing in batches form drilling hole amount and are increased progressively toward the upper strata base material by lower floor's base material; And (iii) superimposed aforementioned base material in batches, and a plurality of intercommunicating pores of these boring formation of contraposition, to the V-shaped distribution of the plate heart, promptly the hole depth of plate edge intercommunicating pore is the most shallow by circuit board plate edge for its hole depth, and the hole depth of plate heart intercommunicating pore is the darkest.
In order to make your juror can further understand feature of the present invention and technology contents, see also following relevant detailed description of the present invention, yet described content only provides reference and explanation usefulness, is not to be used for the present invention is limited.
Description of drawings
Figure 1 shows that the cross-sectional schematic of high-layer circuit board provided by the present invention;
Figure 2 shows that the schematic flow sheet of the manufacture method of high-layer circuit board provided by the present invention;
Fig. 3 A is depicted as the making schematic diagram of high-layer circuit board provided by the present invention; And
Fig. 3 B is depicted as another making schematic diagram of high-layer circuit board provided by the present invention.
Description of reference numerals:
High-layer circuit board of the present invention
L1～L18 base material
P1～P17 engages sheet material
A01～A33 intercommunicating pore
L101～L133, L202～L232 boring
Embodiment
See also shown in Figure 1ly, the invention provides a kind of high-layer circuit board with a predetermined thickness Copper Foil, the following spacing of 0.65mm (can be 0.65-0.01mm), 18 above numbers of plies.Spacing is meant the distance between the boring on the circuit board, or the distance between its corresponding chip tin ball, its permissible error scope is littler, the demand of processing procedure accuracy and processing procedure ability is high more, and the required copper thickness of high-frequency high-speed plate is than the general circuit plate hight, in case the pressing number of plies is too high, not only contraposition is difficult for, boring has its difficulty, and the problem especially that electrically conducts is with high-layer circuit board provided by the invention, be to utilize multi-layer substrate is divided into low number of plies multi-layer sheet more than two, the number of plies is decided on the processing procedure ability of thickness of slab and board, and sectional making makes up again, makes bottleneck to improve yield so as to breaking through.High-layer circuit board shown in Figure 1, it comprises mutually superimposed multi-layer substrate L01～L18 (present embodiment be example with 18 layers) and a plurality of boring.Each base material L01～L18 has the Copper Foil of a predetermined thickness, and these borings are to be distributed in these base materials L01～L18 with varying number, and is increased progressively toward upper strata base material L01 by the base material L18 of lower floor; And these borings are to form a plurality of intercommunicating pore A01～A33 by the superimposed back of these base materials L01～L18, the hole depth of these intercommunicating pores A01～A33 is to the V-shaped distribution of the plate heart by circuit board plate edge, the hole depth that is plate edge intercommunicating pore A01, A33 is the most shallow, and the hole depth of plate heart intercommunicating pore A16 is the darkest.
Fig. 2 is the schematic flow sheet of the manufacture method of high-layer circuit board provided by the present invention, present embodiment is based on 18 base materials, manufacture method is 18 the base material L01～L18 that purchase earlier, these base materials L01～L18 has predetermined thickness and is preset with a plurality of borings (step S10), the drilling hole amount that every base material possessed does not wait, but make according to a pre-defined rule and can form hole depth after the pressing and have a plurality of intercommunicating pores that V-arrangement distributes, every base material is to select all drilled hole or part boring, the base material of all drilled hole can be selected whole plating (step S21) or parcel plating (step S22) again again, the determination methods of the boring of its part and parcel plating see also Fig. 3 A and Fig. 3 B with as the back explanation, Fig. 3 A represents that base material L1 is pre-formed whole boring L101～L133, base material L2 is pre-formed whole boring L202～L232, as two base material L1 up and down, when L2 engages sheet material P1 connection (step S30) with one, both sides boring L101 on the base material L1, L133 all can become blind hole, if do not electrically conduct processing in advance, then two boring L101, L133 will lose its function, therefore, base material L1 can all electroplate or the filled conductive material with all boring L101～L133 (step S42 that electrically conduct, S52), or at both sides boring L101, L133 filled conductive material is with (the step S43 that electrically conducts, S53); And the joint sheet material P1 of gummed base material L1, L2 can behind gummed, hole action with electrically conduct processing.Fig. 3 B represents that base material L1 has been pre-formed both sides boring L101, L133, base material L2 then need not hole earlier, does the processing that electrically conducts (step S41, S51) at two boring L101, L133 in advance, and its reason is with aforementioned; And boring L102, the L132 of base material L1, L2, L202, L232 also can be together with engaging the sheet material P1 processing of holing and electrically conduct, by that analogy till in batches quantity in advance, or boring L102～L132, the L202～L232 of base material L1, L2 can be together with engaging sheet material P1 processings of holing and electrically conduct, by that analogy till in batches quantity in advance or with directly and next group glue together.
At last, batch with batch between glue together to engage sheet material again, after the boring and the processing that electrically conducts, these borings can form a plurality of intercommunicating pore A01～A33 (step S60) that hole depth does not wait, the hole depth of these intercommunicating pores A01～A33 be by circuit board plate edge to the V-shaped distribution of the plate heart, promptly the hole depth of plate edge intercommunicating pore A01, A33 is the most shallow, and the hole depth of plate heart intercommunicating pore A16 is the darkest, wherein, plate heart intercommunicating pore A16 can be blind hole or through hole.
Wherein, the number of plies in batches is to decide according to the processing procedure ability of the thickness of every base material and board, basic principle is to grasp the making of low layer circuit board, be pressed into high-layer circuit board by criticizing to add up, because the joint sheet material between the base material is if adopt the processing procedure of the pressing again of holing earlier in twos, then same boring may be through the processing procedure of repeatedly holing, the glue amount of its joint may be repeated to destroy and the present gum amount is not enough, cause the mechanical strength deficiency, if adopt to electroplate the situation that the electroplate liquid infiltration causes short circuit may take place, can adopt the mode of filled conductive material this moment, these electric conducting materials can be elargol, copper slurry (as the copper sulphate slurry), copper cream (as copper sulphate cream), carbon containing conducting resinl or the like, mechanical strength can be increased, and short-circuit conditions can be avoided; In addition, sheet is a thermoset macromolecule material, as glass fibre film etc., because also the processing procedure ability with the sheet pressing is relevant for the gross thickness of high-layer circuit board, be to be controlled at the pressing step that the low number of plies is implemented, can reach each base material contraposition demand more accurately, improve yield (especially under the too small situation of spacing).Certainly, under the very high situation of required precision, can implement one by one, continuously pressing and boring, by repeating the high-layer circuit board that above-mentioned action can obtain to have high-precision processing procedure ability and contraposition standard.
Be described in further detail the step of these base materials of pressing in batches again, each batch base material pressing with batch with batch pressing, its in proper order can for:
(i) provide one to engage the bottom surface that sheet material is glued at the superiors' base material;
(ii) the selection portion branch borehole carries out the filled conductive material, and wherein selecteed boring is to form blind hole in pressing step next time, the above-mentioned non-selected boring of contraposition, and in parallel running through with joint sheet material forms a plurality of intercommunicating pores and electrically conducts processing;
(iii) repeating step (i) is to (ii) till forming many batches of base materials;
(iv) provide a joint sheet material to be glued at the bottom surface of going up batch base material most;
(v) these intercommunicating pores of contraposition part in parallelly run through and electrically conduct processing with engaging sheet material; And
(vi) repeating step is (iv) to (vi) till high-layer circuit board is finished.
Or, its order can for:
(i) provide one to engage the bottom surface that sheet material is glued at the superiors' base material;
(ii) the selection portion branch borehole carries out the filled conductive material, and wherein selecteed boring is to form blind hole in pressing step next time;
(iii) repeating step (i) is to (ii) till forming many batches of base materials;
The (iv) above-mentioned non-selected boring of contraposition, in parallel running through with joint sheet material forms a plurality of intercommunicating pores and electrically conducts processing;
(v) provide a joint sheet material to be glued at the bottom surface of going up batch base material most;
(vi) at these intercommunicating pores of every batch of base material contraposition part, in parallel sheet material runs through and the processing that electrically conducts with engaging; And
(vii) repeating step is (iv) to (vii) till high-layer circuit board is finished.
By the foregoing description as can be known, high-layer circuit board provided by the present invention and manufacture method thereof, can reach following effect:
(1) is applicable to the making of high frequency, high speed circuit board.
(2) be applicable to that Copper Foil has predetermined thickness and the higher slab of the number of plies is made.
(3) multi-layer substrate is divided into low number of plies multi-layer sheet more than two, sectional making makes up again, and not only bit errors reduces, yield improves, and still can reduce cost, and further improves the product city and accounts for rate.
But the above only is a preferable possible embodiments of the present invention; non-so promptly arrest limit claim of the present invention; so the equivalent structure that all application specification of the present invention or accompanying drawing content are done changes, all in like manner be contained in claims protection range of the present invention, to ensure inventor's rights and interests.
Claims (25)
1. a high-layer circuit board is characterized in that, comprises:
Multi-layer substrate, superimposed mutually, and each base material has the Copper Foil of a predetermined thickness; And
A plurality of borings are distributed in these base materials with varying number, and are increased progressively toward the upper strata base material by lower floor's base material;
Wherein, these borings form a plurality of intercommunicating pores by the superimposed back of these base materials, the hole depth of these intercommunicating pores be by circuit board plate edge to the V-shaped distribution of the plate heart, promptly the hole depth of plate edge intercommunicating pore is the most shallow, and the hole depth of plate heart intercommunicating pore is the darkest.
2. high-layer circuit board as claimed in claim 1 is characterized in that: at least 18 layers of described base material quantity.
3. high-layer circuit board as claimed in claim 1 is characterized in that: described base material has the spacing of 0.65-0.01mm.
4. high-layer circuit board as claimed in claim 1 is characterized in that: described plate heart intercommunicating pore is blind hole or through hole.
5. the manufacture method of a high-layer circuit board is characterized in that, comprises the following step:
Many the base materials of purchasing, wherein, these base materials are to have predetermined thickness and be preset with a plurality of borings, these borings are to be distributed in these base materials with varying number;
These base materials of pressing form drilling hole amount and are increased progressively toward the upper strata base material by lower floor's base material in batches; And
These base materials of superimposed aforementioned pressing in batches, and a plurality of intercommunicating pores of these boring formation of contraposition, to the V-shaped distribution of the plate heart, promptly the hole depth of plate edge intercommunicating pore is the most shallow by circuit board plate edge for its hole depth, and the hole depth of plate heart intercommunicating pore is the darkest.
6. the manufacture method of high-layer circuit board as claimed in claim 5, it is characterized in that: the step of these base materials of purchasing further comprises:
Selecting all or part of boring to electroplate to make to be at every base material electrically conducts.
7. the manufacture method of high-layer circuit board as claimed in claim 5, it is characterized in that: the step of these base materials of purchasing further comprises:
In advance to every base material boring; And
Selecting all or part of boring filled conductive material to make to be in it at every base material electrically conducts.
8. the manufacture method of high-layer circuit board as claimed in claim 7, it is characterized in that: the step of filled conductive material further comprises:
The selection portion branch borehole is filled, and wherein selecteed boring forms blind hole in pressing step next time.
9. the manufacture method of high-layer circuit board as claimed in claim 5 is characterized in that: in these base material steps of pressing, each batch base material pressing step further comprises in batches:
Be glued between these base materials with a plurality of joint sheet materials; And
These borings of contraposition also run through at part boring and to form a plurality of intercommunicating pores.
10. the manufacture method of high-layer circuit board as claimed in claim 9 is characterized in that: in these base material steps of pressing, each batch base material pressing step further comprises in batches:
(i) provide one to engage the bottom surface that sheet material is glued at the superiors' base material;
(ii) the selection portion branch borehole carries out the filled conductive material, and wherein selecteed boring forms blind hole in pressing step next time, the above-mentioned non-selected boring of contraposition, and in parallel running through with joint sheet material forms a plurality of intercommunicating pores and electrically conducts processing; And
(iii) repeating step (i) is to (ii) till forming many batches of base materials.
11. the manufacture method of high-layer circuit board as claimed in claim 10 is characterized in that: electrically conduct be treated to electroplate or the filled conductive material in aforementioned intercommunicating pore.
12. the manufacture method of high-layer circuit board as claimed in claim 10 is characterized in that: joint sheet material is thermoset macromolecule material.
13. the manufacture method of high-layer circuit board as claimed in claim 11 is characterized in that: engaging sheet material is the glass fibre film.
14. the manufacture method of high-layer circuit board as claimed in claim 10 is characterized in that: superimposed aforementioned base material in batches further comprises:
(i) provide a joint sheet material to be glued at the bottom surface of going up batch base material most;
The (ii) intercommunicating pore of contraposition part in parallelly runs through and electrically conducts processing with engaging sheet material; And
(iii) repeating step (i) is to (ii) till high-layer circuit board is finished.
15. the manufacture method of high-layer circuit board as claimed in claim 14 is characterized in that: electrically conduct to be treated to and electroplate or the filled conductive material.
16. the manufacture method of high-layer circuit board as claimed in claim 14 is characterized in that: joint sheet material is thermoset macromolecule material.
17. the manufacture method of high-layer circuit board as claimed in claim 16 is characterized in that: engaging sheet material is the glass fibre film.
18. the manufacture method of high-layer circuit board as claimed in claim 9 is characterized in that: in these base material steps of pressing, each batch base material pressing step further comprises in batches:
(i) provide one to engage the bottom surface that sheet material is glued at the superiors' base material;
(ii) the selection portion branch borehole carries out the filled conductive material, and wherein selecteed boring forms blind hole in pressing step next time;
(iii) repeating step (i) is to (ii) till forming many batches of base materials; And
(iv) at every batch of above-mentioned non-selected boring of base material contraposition, in parallel running through with joint sheet material forms a plurality of intercommunicating pores and electrically conducts processing.
19. the manufacture method of high-layer circuit board as claimed in claim 18 is characterized in that: electrically conduct to be treated to and electroplate or the filled conductive material.
20. the manufacture method of high-layer circuit board as claimed in claim 18 is characterized in that: joint sheet material is thermoset macromolecule material.
21. the manufacture method of high-layer circuit board as claimed in claim 20 is characterized in that: engaging sheet material is the glass fibre film.
22. the manufacture method of high-layer circuit board as claimed in claim 18 is characterized in that: superimposed aforementioned base material in batches further comprises:
(i) provide a joint sheet material to be glued at the bottom surface of going up batch base material most;
(ii) these intercommunicating pores of contraposition part in parallelly run through and electrically conduct processing with engaging sheet material; And
(iii) repeating step (i) is to (ii) till high-layer circuit board is finished.
23. the manufacture method of high-layer circuit board as claimed in claim 22 is characterized in that: electrically conduct to be treated to and electroplate or the filled conductive material.
24. the manufacture method of high-layer circuit board as claimed in claim 22 is characterized in that: joint sheet material is thermoset macromolecule material.
25. the manufacture method of high-layer circuit board as claimed in claim 24 is characterized in that: engaging sheet material is the glass fibre film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100297964A CN100459824C (en) | 2005-09-20 | 2005-09-20 | High-layer circuit board and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100297964A CN100459824C (en) | 2005-09-20 | 2005-09-20 | High-layer circuit board and its manufacturing method |
Publications (2)
| Publication Number | Publication Date |
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| CN1937886A CN1937886A (en) | 2007-03-28 |
| CN100459824C true CN100459824C (en) | 2009-02-04 |
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| CNB2005100297964A Expired - Fee Related CN100459824C (en) | 2005-09-20 | 2005-09-20 | High-layer circuit board and its manufacturing method |
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Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101965102B (en) * | 2010-09-17 | 2012-02-15 | 华映视讯（吴江）有限公司 | Circuit board module |
| CN103425893A (en) * | 2013-08-26 | 2013-12-04 | 浪潮电子信息产业股份有限公司 | Method for solving statistical analysis of impedance test data of PCB (Printed Circuit Board) |
| CN113015338B (en) * | 2021-02-26 | 2023-01-10 | 成都明天高新产业有限责任公司 | Circuit board with crossed blind holes and processing method thereof |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08307059A (en) * | 1995-05-01 | 1996-11-22 | Tomoji Watanabe | Production of multilayer printed wiring board |
| JP2000252633A (en) * | 1999-03-03 | 2000-09-14 | Ngk Spark Plug Co Ltd | Manufacture of multilayer wiring board |
| JP2001015912A (en) * | 1999-07-02 | 2001-01-19 | Ibiden Co Ltd | Multilayered printed wiring board and production thereof |
| JP2004031500A (en) * | 2002-06-24 | 2004-01-29 | Mitsubishi Materials Corp | Method for punching multi-layer printed wiring board |
| US20040061232A1 (en) * | 2002-09-27 | 2004-04-01 | Medtronic Minimed, Inc. | Multilayer substrate |
| CN1171517C (en) * | 1999-10-25 | 2004-10-13 | 张有常 | Technology for making printed circuit board with additional layers |
-
2005
- 2005-09-20 CN CNB2005100297964A patent/CN100459824C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH08307059A (en) * | 1995-05-01 | 1996-11-22 | Tomoji Watanabe | Production of multilayer printed wiring board |
| JP2000252633A (en) * | 1999-03-03 | 2000-09-14 | Ngk Spark Plug Co Ltd | Manufacture of multilayer wiring board |
| JP2001015912A (en) * | 1999-07-02 | 2001-01-19 | Ibiden Co Ltd | Multilayered printed wiring board and production thereof |
| CN1171517C (en) * | 1999-10-25 | 2004-10-13 | 张有常 | Technology for making printed circuit board with additional layers |
| JP2004031500A (en) * | 2002-06-24 | 2004-01-29 | Mitsubishi Materials Corp | Method for punching multi-layer printed wiring board |
| US20040061232A1 (en) * | 2002-09-27 | 2004-04-01 | Medtronic Minimed, Inc. | Multilayer substrate |
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| CN1937886A (en) | 2007-03-28 |
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