CN201571253U - High-layer circuit board - Google Patents
High-layer circuit board Download PDFInfo
- Publication number
- CN201571253U CN201571253U CN2009201751426U CN200920175142U CN201571253U CN 201571253 U CN201571253 U CN 201571253U CN 2009201751426 U CN2009201751426 U CN 2009201751426U CN 200920175142 U CN200920175142 U CN 200920175142U CN 201571253 U CN201571253 U CN 201571253U
- Authority
- CN
- China
- Prior art keywords
- plies
- circuit base
- wiring board
- high number
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
A high-layer circuit board comprises two or more superimposed circuit substrates, at least one insulating film and at least one conductive block, wherein each circuit substrate comprises 10 to 18 layers of circuit base materials; at least one insulating film is equipped between two or more circuit substrates; and at least one conductive block penetrates at least one insulating film and is electrically connected with two or more circuit substrates.
Description
Technical field
The utility model is about a kind of wiring board, and particularly about a kind of high number of plies wiring board with circuit base material more than 20 layers or 20 layers.
Background technology
Consumption electronic products function now is more and more, volume is lighter, thin, short, little, the wiring density of its inner printed substrate and process technique also day by day complexity progress greatly, therefore interconnection density increases between the number of elements increase on the wiring board, the continuous density of layout, laminate, in addition, along with the application and the designer trends of composite signal integrated circuits are complicated, except considering the problem of circuit technological layer in the past, along with the differentiation of processing procedure, design cycle difficulty to be solved has also increased many.At the HF link plate of specific demand, in order to control its characteristic impedance, need certain thickness Copper Foil can bear its load, the thickness of wiring board also increases thereupon and forms slab worthy of the name, and these slabs have it to make difficulty.The traditional printing wiring board uses glass fibre film (Prepreg, be called for short PP), the double sided board of circuit will be made, the number of plies on demand, superimposed contraposition one step press forms the circuit base plate of sandwich construction, hole with conventional process again and electroplate etc., when the superimposed number of plies of these slabs is low, all can make with present industry technology and processing procedure ability, yet when the number of plies is high more, the processing procedure difficulty is just appeared in one's mind out, at first, superimposed contraposition gained tolerance increases with the superimposed number of plies, in addition, the harmomegathus of grafting material (as the glass fibre film) causes another error source of pressing than the wayward dystopy easily that causes after the pressing; Then may be after the pressing because of the number of plies is too high, the blocked up frictional force that causes of gross thickness is too high as if carrying out machine drilling, cause the easy broken needle of drill bit, the operating parameter adjustment of adding machine drilling (for example, the operating parameters such as feed speed, withdrawing speed and rotating speed that comprise drill point) and frictional force produced high heat at the vertical radiating effect of through hole, can increase and reduce owing to the design number of plies, the gross thickness of wiring board, therefore too much heat to hoard the resin retraction that also can cause through-hole wall excessive, and influence the planarization of inwall.In addition, the aspect ratio in thickness of slab and aperture is too high influences more that follow-up plating is difficult for or form the cavity or conductive layer thickness is crossed bad phenomenon such as thin; General high number of plies wiring board has the bus plane/ground plane design of multilayer on the circuit layout designs; therefore in the thickness of insulating layer design between layer and the layer; usually can be controlled at more than the thickness to a certain degree; therefore after the pressing if carry out laser drill; when selecting the design aperture too small, it is lower that aspect ratio will then be electroplated yields than the machine drilling height.Yet, also utilize Layer increasing method (Build-up Process) to make multi-layer sheet, but the main effect of Layer increasing method is to reduce the through hole area occupied, reach the high density requirement, but be only applicable to lower level number, purpose and be the thin plate of compact usefulness, for having between certain thickness laminated substrate, the aperture fine pitch and the number of plies, still have its difficulty, as bore mode and because the too high problem of bringing that electrically conducts of aspect ratio of boring up to high number of plies wiring board more than 20 layers.
Therefore, it is simple and easy and effectively improve the high number of plies wiring board of above-mentioned disappearance how to propose a kind of processing procedure, and real is important problem.
The utility model content
The utility model provides a kind of high number of plies wiring board, can improve above-mentioned disappearance, to satisfy the yields on the processing procedure.
The utility model proposes a kind of high number of plies wiring board, it comprises the circuit base material more than 20 layers or 20 layers, and high number of plies wiring board comprises circuit base plate superimposed more than two or two, and each circuit base plate comprises 10 layers～18 layers circuit base material; At least one insulation film is configured between the circuit base plate more than two or two; And at least one conducting block, run through at least one insulation film, and electrically connect the circuit base plate more than two or two.
In an embodiment of the present utility model, have a plurality ofly in each above-mentioned circuit base plate in conjunction with film, and combining film with these, pile up alternately these circuit base materials.
In an embodiment of the present utility model, have a plurality of conductive holes in each above-mentioned circuit base plate, and these circuit base materials are electrically connected to each other by conductive hole.。
In an embodiment of the present utility model, above-mentioned conductive hole comprises through hole or blind hole.
In an embodiment of the present utility model, the material of above-mentioned at least one insulation film is a thermosetting resin.
In an embodiment of the present utility model, the material of above-mentioned at least one insulation film is a glass epoxy resin.
In an embodiment of the present utility model, above-mentioned at least one conducting block is the taper projection.
In an embodiment of the present utility model, two above-mentioned circuit base plates have the first relative joint sheet and second joint sheet respectively, and at least one conducting block is electrically connected between first joint sheet and second joint sheet.
In an embodiment of the present utility model, above-mentioned at least one conducting block is the tapered annular projection.
In an embodiment of the present utility model, above-mentioned at least one conducting block comprises a plurality of projections, is arranged in a circulus.
Advantage of the present utility model is, by circuit base plate superimposed more than two or two is completed earlier, is combined into high number of plies wiring board, so that the number of plies of high number of plies wiring board is more than 20 layers or 20 layers, satisfies the yields on the processing procedure.Therefore, high number of plies wiring board of the present utility model can because of the error of superimposed contraposition and the number of plies be too not high, the blocked up bad that causes boring and electroplate of gross thickness.Simultaneously, traditional high number of plies wiring board influences because of the aspect ratio in thickness of slab and aperture is too high that follow-up plating is difficult for or forms bad phenomenon such as cavity, can be improved, and is real in can be for the utility model of utilizing on the industry.
For above-mentioned feature and advantage of the present utility model can be become apparent, embodiment cited below particularly, and conjunction with figs. is described in detail below.
Description of drawings
Figure 1A and Fig. 1 C are the schematic diagrames of making flow process of the circuit base plate of the utility model one embodiment.
Fig. 2 A and Fig. 2 C are the schematic diagrames of making flow process of the high number of plies wiring board of the utility model one embodiment.
Fig. 3 is that tapered annular projection of the present utility model is configured in the schematic diagram on the circuit base plate.
Fig. 4 is that a plurality of projection of the present utility model is configured in the schematic diagram on the circuit base plate.
The main element symbol description
L1～L5: circuit base material
100: circuit base plate
102: conductive hole
104: electric conducting material
P: bonding film
110: the insulation film
112,116: circuit base plate
114: conducting block
114a: tapered annular projection
114b: projection
200: high number of plies wiring board
B1: first joint sheet
B2: second joint sheet
Embodiment
Figure 1A and Fig. 1 C illustrate the schematic diagram of making flow process of the circuit base plate of the utility model one embodiment.Please refer to Figure 1A～Fig. 1 C, with a plurality of superimposed contrapositions of circuit base material L1～L5 of having finished configuration, and one step press is to form the circuit base plate 100 of sandwich construction.Afterwards, holing and electroplating process, to finish the conductive hole 102 of each circuit base material of interlayer conduction L1～L5, for example is the through hole of plated conductive material 104 again.Specifically, circuit base plate 100 is the multi-layer sheet of the low number of plies, for example has 10 layers～18 layers circuit base material, and Figure 1A only illustrates a part of circuit base material L1～L5, all the other omissions.Basically, the number of plies of circuit base plate 100 is high more, thickness is thick more, the processing procedure ability of board requires to improve relatively, if the number of plies surpasses more than 20 layers, under the consideration of and aligning accuracy difference not good in yields, be not suitable for making, (decide), with the error that reduces superimposed contraposition and avoid that the number of plies is too high, the blocked up bad that causes boring and plating of gross thickness according to the processing procedure ability so the utility model is controlled at the number of plies of circuit base plate 100 in certain scope earlier with existing process work bench.
In above-mentioned circuit base plate 100, circuit base material L1～L5 between layer and the layer piles up alternately with a plurality of bonding film P, in conjunction with film P for example is glass epoxy resin, circuit with the relative both sides of bonding film P that are electrically insulated, but each circuit base material L1～L5 can be electrically connected to each other by the conductive hole 102 of interlayer conduction, to transmit signal.The electric conducting material of conductive hole 102 does not limit with plating mode and forms, and also can fill elargol, copper cream or carbon containing conducting resinl increases structural strength.In addition, the utility model does not limit the circuit base plate 100 of making the low number of plies in the mode of superimposed contraposition, also can adopt Layer increasing method to make, it adopts the blind hole (Blind Hole) of interlayer conduction and buried via hole (Buried Hole) to electrically connect each circuit base material L1～L5, can economize lower through-hole taking up room on the plate face, make limited outer area can be as far as possible in order to wiring and soldering part.Kind of a process technique applied in the commercial production surplus the development of Layer increasing method multi-layer sheet had ten so far, as SLC, FRL, DYCOstrate, Z-Link, ALIVH, HDI ... etc., different processing procedures adopts different material and substrate, therefore on hole creating technology, also have nothing in common with each other, can be divided into multiclass methods such as sensitization pore-forming, laser drill, plasma pit and chemical pit haply, be not described in detail in this.
Wait to finish after the making flow process of low number of plies circuit base plate, follow-uply will introduce the making flow process that circuit base plate superimposed more than two or two 112,116 is combined into high number of plies wiring board 200.
The schematic diagram of the making flow process of the high number of plies wiring board of the utility model one embodiment shown in Fig. 2 A and Fig. 2 C.At first, at least one conducting block 114 of configuration on a circuit base plate 112.Conducting block 114 for example is the taper projection, and its material can be silver, tin, copper, gold or its alloy, and is configured on the first joint sheet B1 of circuit base plate 112.Then, in Fig. 2 B, form an insulation film 110 on the surface of circuit base plate 112.Insulation film 110 for example is the glass epoxy resin of semi-solid preparation attitude, its coating or be attached on the circuit base plate 112, and cover conducting block 114.The insulation film 110 of semi-solid preparation attitude can be pierced through in the top of conducting block 114.Afterwards, with 112, the 116 superimposed contrapositions of two circuit base plates, and the insulation film 110 be configured between two circuit base plates 112,116,114 of conducting blocks are electrically connected between the relative first joint sheet B1 and the second joint sheet B2.Certainly, the quantity of circuit base plate 112,116 also can be more than two, and present embodiment is an example with two circuit base plates only.
Present embodiment is electrically connected between adjacent two circuit base plates 112,116 by at least one conducting block 114, does not need to hole and electroplating process again.As for the shape and the size of conducting block 114, can adjust the circulus that it can be taper projection, stud bumps, tapered annular projection or is arranged in by a plurality of projections according to the demand of configuration.Please refer to Fig. 3, it illustrates tapered annular projection 114a and is configured on the circuit base plate, and it has a taper section (shown in dotted line), and one be looped around a conductive hole around, to become an annulus.In addition, please refer to Fig. 4, it illustrates a plurality of projection 114b and is configured on the circuit base plate 112, each projection 114 is independent separately, do not link to each other each other, but these projections 114b is arranged in a circulus, for example be circular or square, and be looped around a conductive hole 102 around.
Though the utility model with embodiment openly as above; right its is not in order to limit the utility model; have in the technical field under any and know the knowledgeable usually; in not breaking away from spirit and scope of the present utility model; when doing a little change and retouching, so protection range of the present utility model is as the criterion when looking claims person of defining.
Claims (10)
1. one kind high number of plies wiring board, the circuit base material that it comprises more than 20 layers or 20 layers is characterized in that, this high number of plies wiring board comprises:
Superimposed circuit base plate more than two or two, each circuit base plate comprises 10 layers～18 layers circuit base material;
At least one insulation film is configured between this circuit base plate more than two or two; And
At least one conducting block runs through this at least one insulation film, and electrically connects this circuit base plate more than two or two.
2. high number of plies wiring board according to claim 1 is characterized in that, has a plurality ofly in conjunction with film in each circuit base plate, piles up alternately and those circuit base materials combine film with those.
3. high number of plies wiring board according to claim 1 is characterized in that, have a plurality of conductive holes in each circuit base plate, and those circuit base materials is electrically connected to each other by those conductive holes.
4. high number of plies wiring board according to claim 3 is characterized in that those conductive holes comprise through hole or blind hole.
5. high number of plies wiring board according to claim 1 is characterized in that the material of this at least one insulation film is a thermosetting resin.
6. high number of plies wiring board according to claim 5 is characterized in that the material of this at least one insulation film is a glass epoxy resin.
7. high number of plies wiring board according to claim 1 is characterized in that this at least one conducting block is taper projection or stud bumps.
8. high number of plies wiring board according to claim 1 is characterized in that, these two circuit base plates have the first relative joint sheet and second joint sheet respectively, and this at least one conducting block is electrically connected between this first joint sheet and this second joint sheet.
9. high number of plies wiring board according to claim 1 is characterized in that this at least one conducting block is the tapered annular projection.
10. high number of plies wiring board according to claim 1 is characterized in that this at least one conducting block comprises a plurality of projections, is arranged in a circulus.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201751426U CN201571253U (en) | 2009-10-22 | 2009-10-22 | High-layer circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201751426U CN201571253U (en) | 2009-10-22 | 2009-10-22 | High-layer circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201571253U true CN201571253U (en) | 2010-09-01 |
Family
ID=42663551
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201751426U Expired - Lifetime CN201571253U (en) | 2009-10-22 | 2009-10-22 | High-layer circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201571253U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103796418A (en) * | 2012-10-31 | 2014-05-14 | 重庆方正高密电子有限公司 | Circuit board and manufacturing method thereof |
| US11800642B2 (en) | 2020-12-01 | 2023-10-24 | Tpk Advanced Solutions Inc. | Bonding pad structure for electronic device and manufacturing method thereof |
-
2009
- 2009-10-22 CN CN2009201751426U patent/CN201571253U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103796418A (en) * | 2012-10-31 | 2014-05-14 | 重庆方正高密电子有限公司 | Circuit board and manufacturing method thereof |
| CN103796418B (en) * | 2012-10-31 | 2016-12-21 | 重庆方正高密电子有限公司 | A kind of circuit board and the manufacture method of circuit board |
| US11800642B2 (en) | 2020-12-01 | 2023-10-24 | Tpk Advanced Solutions Inc. | Bonding pad structure for electronic device and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100901 |