CN107787131A - A kind of preparation method of multilayer copper base - Google Patents
A kind of preparation method of multilayer copper base Download PDFInfo
- Publication number
- CN107787131A CN107787131A CN201610799645.5A CN201610799645A CN107787131A CN 107787131 A CN107787131 A CN 107787131A CN 201610799645 A CN201610799645 A CN 201610799645A CN 107787131 A CN107787131 A CN 107787131A
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- China
- Prior art keywords
- copper base
- copper
- pressing
- glue
- height
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The present invention relates to the manufacturing technology field of circuit board, more particularly to a kind of preparation method of multilayer copper base.The preparation method process of the multilayer copper base of the present invention is relatively simple, leads glue production using height, reduces the production cost of enterprise, and the tin face of the multilayer copper base of production works well, and nothing falls the bad phenomenons such as oil, foaming, layering.
Description
Technical field
The present invention relates to the manufacturing technology field of circuit board, more particularly to a kind of preparation method of multilayer copper base.
Background technology
With the rapid development of electronic technology, electronic product is increasingly intended to multifunction, miniaturization.This promotes conduct
The printed circuit board of electronic component installation foundation develops to multiple stratification, lamination, densification direction.At present, to meet automobile
The heat sinking function of cell circuit board, automobile batteries wiring board are all multilayer circuit board substantially.At present, existing automobile batteries circuit
Plate preparation section is relatively complicated, and more ink is applied in manufacturing process, and enterprise's production cost is higher, also, the automobile produced
There is the bad phenomenons such as oil, foaming, layering in cell circuit board
The content of the invention
For deficiency of the prior art, it is an object of the invention to provide a kind of preparation method of multilayer copper base.
In order to solve the above-mentioned technical problem, present invention is disclosed a kind of preparation method of multilayer copper base, it includes
Following steps：
Make red copper core：Red copper plate is processed into the red copper core of required size with plate shearing machine, in the upper processing of red copper core
Drill out required through hole；
Make height and lead glue：The dimensioned that big panel height is led to glue red copper core of covering needed for is blocking；
Make height and lead glue frame frame：Height is led into glue frame model is processed according to the structure of red copper core；
Make preliminary copper base：Copper plate is embedded in height and leads glue frame frame, glue covering is led in two sides using height again, and outermost layer is used
Copper pool is adjacent to height and leads glue, forms preliminary copper base；
Press for the first time：Toward preliminary copper base injection glue, and preliminary copper base is pressed with press equipment, glue is in red copper
The positive and negative water conservancy diversion of core forms pressing copper base for the first time；
Second of pressing：The etching of first time force fit plate two sides copper foil is clean, and on two sides, covering height leads glue and its most again
Outer layer covers copper foil, and presses the laminate structure with press equipment, forms second of pressing copper base；
Copper base drills：Second of pressing copper base is placed in rig, rig drills out via hole and is used to connect
Electronic component and high thermolysis；
Electroplate copper base：Second of pressing copper base for completing drilling is placed in electroplating device and electroplated, copper facing will
Through-hole surfaces cover copper conduction；
Copper base dry film：Second of pressing copper base for completing plating copper vias is placed in dry film equipment, to completing to electroplate
Second of pressing copper base of copper vias carries out outer layer dry film process；
Graphic plating copper base：Second of pressing copper base for completing outer layer dry film is placed in graphic plating equipment, figure
Electroplating device carries out graphic plating to second of pressing copper base for completing outer layer dry film；
Silk-screen copper base：Second of pressing copper base for completing graphic plating is placed in screen printing device, screen printing device is to complete
Coating is carried out into second of surface for pressing copper base of graphic plating；
Copper base gong plate：Second of pressing copper base for completing silk-screen is placed in gong board device, gong board device is to completing silk
Second of pressing copper base of print carries out gong plate processing；
Copper base detects：Second of pressing copper base for completing gong plate is placed in detection device, detection device detection is completed
Second of pressing copper of gong plate；
Copper base sinks tin：Normal second of pressing copper base of detection is placed in heavy tin equipment, sinks tin equipment to second
The exposed copper part for pressing copper base carries out tin plating processing；
Copper base is packed：According to the demand of client, second of pressing copper base for completing heavy tin is surface-treated, shape
Into multilayer copper base.
According to an embodiment of the present invention, above-mentioned first time pressing glue used leads glue for height.
According to an embodiment of the present invention, above-mentioned second of height used leads glue and leads glue for High TG height.
Compared with prior art, the preparation method process of multilayer copper base of the invention is relatively simple, and glue life is led using height
Production, the production cost of enterprise is reduced, the tin face of the multilayer copper base of production works well, and oil, foaming, layering etc. are bad existing without falling
As.
Embodiment
Multiple embodiments of the present invention will be disclosed below, as clearly stated, details in many practices will with
Illustrate in the lump in lower narration.It should be appreciated, however, that the details in these practices is not applied to limit the present invention.
On its " first " used herein, " second " etc., the meaning of order or cis-position is not especially censured, also non-use
To limit the present invention, it is just for the sake of difference with the component of constructed term description or operation.
Present invention is disclosed a kind of preparation method of multilayer copper base, it comprises the following steps：
Make red copper core：Red copper plate is processed into the red copper core of required size with plate shearing machine, in the upper processing of red copper core
Drill out required through hole；
Make height and lead glue：The dimensioned that big panel height is led to glue red copper core of covering needed for is blocking；
Make height and lead glue frame frame：Height is led into glue frame model is processed according to the structure of red copper core；
Make preliminary copper base：Copper plate is embedded in height and leads glue frame frame, glue covering is led in two sides using height again, and outermost layer is used
Copper pool is adjacent to height and leads glue, forms preliminary copper base；
Press for the first time：Toward preliminary copper base injection glue, and preliminary copper base is pressed with press equipment, glue is in red copper
The positive and negative water conservancy diversion of core forms pressing copper base for the first time；
Second of pressing：The etching of first time force fit plate two sides copper foil is clean, and on two sides, covering height leads glue and its most again
Outer layer covers copper foil, and presses the laminate structure with press equipment, forms second of pressing copper base；
Copper base drills：Second of pressing copper base is placed in rig, rig drills out via hole and is used to connect
Electronic component and high thermolysis；
Electroplate copper base：Second of pressing copper base for completing drilling is placed in electroplating device and electroplated, copper facing will
Through-hole surfaces cover copper conduction；
Copper base dry film：Second of pressing copper base for completing plating copper vias is placed in dry film equipment, to completing to electroplate
Second of pressing copper base of copper vias carries out outer layer dry film process；
Graphic plating copper base：Second of pressing copper base for completing outer layer dry film is placed in graphic plating equipment, figure
Electroplating device carries out graphic plating to second of pressing copper base for completing outer layer dry film；
Silk-screen copper base：Second of pressing copper base for completing graphic plating is placed in screen printing device, screen printing device is to complete
Coating is carried out into second of surface for pressing copper base of graphic plating；
Copper base gong plate：Second of pressing copper base for completing silk-screen is placed in gong board device, gong board device is to completing silk
Second of pressing copper base of print carries out gong plate processing；
Copper base detects：Second of pressing copper base for completing gong plate is placed in detection device, detection device detection is completed
Second of pressing copper of gong plate；
Copper base sinks tin：Normal second of pressing copper base of detection is placed in heavy tin equipment, sinks tin equipment to second
The exposed copper part for pressing copper base carries out tin plating processing；
Copper base is packed：According to the demand of client, second of pressing copper base for completing heavy tin is surface-treated, shape
Into multilayer copper base.
According to an embodiment of the present invention, above-mentioned first time pressing glue used leads glue for height.
According to an embodiment of the present invention, above-mentioned second of height used leads glue and leads glue for High TG height.
In one or more embodiments of the present invention, the preparation method process of multilayer copper base of the invention is relatively simple,
Glue production is led using height, reduces the production cost of enterprise, the tin face of the multilayer copper base of production works well, without fall oil, foaming,
The bad phenomenons such as layering.
To sum up, in one or more embodiments of the invention, above only embodiments of the present invention, are not used to limit
The system present invention.To those skilled in the art, the present invention can have various modifications and variations.It is all the present invention spirit and
Interior made any modification, equivalent substitution and improvements of principle etc., all should be included within scope of the presently claimed invention.
Claims (3)
1. a kind of preparation method of multilayer copper base, it is characterised in that comprise the following steps：
Make red copper core：By the red copper core of red copper plate size needed for plate shearing machine is processed into, drilled out in the upper processing of red copper core
Required through hole；
Make height and lead glue：The dimensioned that big panel height is led to glue red copper core of covering needed for is blocking；
Make height and lead glue frame frame：Height is led into glue frame model is processed according to the structure of red copper core；
Make preliminary copper base：Copper plate is embedded in height and leads glue frame frame, glue covering is led in two sides using height again, and outermost layer is moored with copper
It is adjacent to height and leads glue, forms preliminary copper base；
Press for the first time：Toward preliminary copper base injection glue, and preliminary copper base is pressed with press equipment, glue is in red copper core
Positive and negative water conservancy diversion forms pressing copper base for the first time；
Second of pressing：The etching of first time force fit plate two sides copper foil is clean, and on two sides, covering height leads glue and its outermost layer again
Copper foil is covered, and the laminate structure is pressed with press equipment, forms second of pressing copper base；
Copper base drills：Second of pressing copper base is placed in rig, rig drills out via hole and is used to connect electronics
Element and high thermolysis；
Electroplate copper base：Second of pressing copper base for completing drilling is placed in electroplating device and electroplated, copper facing is by through hole
Cover copper conduction in surface；
Copper base dry film：Second of pressing copper base for completing plating copper vias is placed in dry film equipment, led to completing electro-coppering
Second of pressing copper base in hole carries out outer layer dry film process；
Graphic plating copper base：Second of pressing copper base for completing outer layer dry film is placed in graphic plating equipment, graphic plating
Equipment carries out graphic plating to second of pressing copper base for completing outer layer dry film；
Silk-screen copper base：Second of pressing copper base for completing graphic plating is placed in screen printing device, screen printing device is to completing to scheme
The surface of second of pressing copper base of shape plating carries out coating；
Copper base gong plate：Second of pressing copper base for completing silk-screen is placed in gong board device, gong board device is to completing silk-screen
Second of pressing copper base carries out gong plate processing；
Copper base detects：Second of pressing copper base for completing gong plate is placed in detection device, gong plate is completed in detection device detection
Second pressing copper；
Copper base sinks tin：Normal second of pressing copper base of detection is placed in heavy tin equipment, tin equipment of sinking presses to second
The exposed copper part of copper base carries out tin plating processing；
Copper base is packed：According to the demand of client, second of pressing copper base for completing heavy tin is surface-treated, formed more
Layer copper base.
2. the preparation method of multilayer copper base according to claim 1, it is characterised in that first time pressing glue used
Glue is led for height.
3. the preparation method of multilayer copper base according to claim 1, it is characterised in that second of height used leads glue and be
High TG height leads glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610799645.5A CN107787131A (en) | 2016-08-31 | 2016-08-31 | A kind of preparation method of multilayer copper base |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610799645.5A CN107787131A (en) | 2016-08-31 | 2016-08-31 | A kind of preparation method of multilayer copper base |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107787131A true CN107787131A (en) | 2018-03-09 |
Family
ID=61451933
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610799645.5A Withdrawn CN107787131A (en) | 2016-08-31 | 2016-08-31 | A kind of preparation method of multilayer copper base |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107787131A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191582A (en) * | 2019-04-30 | 2019-08-30 | 东莞联桥电子有限公司 | A kind of production technology of single layer mirror-surface aluminum base board |
| CN113423188A (en) * | 2021-06-04 | 2021-09-21 | 金禄电子科技股份有限公司 | Circuit board gold immersion processing method and equipment |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101374388A (en) * | 2008-03-28 | 2009-02-25 | 苏陟 | Method for preparing fine line flexible circuit board with high peeling strength |
| CN202276542U (en) * | 2011-10-13 | 2012-06-13 | 昆山雅森电子材料科技有限公司 | Composition heat conducting copper foil base plate |
| CN103402324A (en) * | 2013-08-02 | 2013-11-20 | 高德（无锡）电子有限公司 | Production process for improving blind routing depth accuracy |
| CN104519682A (en) * | 2014-12-11 | 2015-04-15 | 广州兴森快捷电路科技有限公司 | Semi-flexible circuit board and preparation method thereof |
| CN105517359A (en) * | 2016-01-25 | 2016-04-20 | 东莞联桥电子有限公司 | Manufacturing process for increasing utilization rate of copper substrate |
-
2016
- 2016-08-31 CN CN201610799645.5A patent/CN107787131A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101374388A (en) * | 2008-03-28 | 2009-02-25 | 苏陟 | Method for preparing fine line flexible circuit board with high peeling strength |
| CN202276542U (en) * | 2011-10-13 | 2012-06-13 | 昆山雅森电子材料科技有限公司 | Composition heat conducting copper foil base plate |
| CN103402324A (en) * | 2013-08-02 | 2013-11-20 | 高德（无锡）电子有限公司 | Production process for improving blind routing depth accuracy |
| CN104519682A (en) * | 2014-12-11 | 2015-04-15 | 广州兴森快捷电路科技有限公司 | Semi-flexible circuit board and preparation method thereof |
| CN105517359A (en) * | 2016-01-25 | 2016-04-20 | 东莞联桥电子有限公司 | Manufacturing process for increasing utilization rate of copper substrate |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110191582A (en) * | 2019-04-30 | 2019-08-30 | 东莞联桥电子有限公司 | A kind of production technology of single layer mirror-surface aluminum base board |
| CN110191582B (en) * | 2019-04-30 | 2021-09-07 | 东莞联桥电子有限公司 | Production process of single-layer mirror aluminum substrate |
| CN113423188A (en) * | 2021-06-04 | 2021-09-21 | 金禄电子科技股份有限公司 | Circuit board gold immersion processing method and equipment |
| CN113423188B (en) * | 2021-06-04 | 2023-03-14 | 金禄电子科技股份有限公司 | Circuit board gold immersion processing method and equipment |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180309 |
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| WW01 | Invention patent application withdrawn after publication |