CN202276542U - Composition heat conducting copper foil base plate - Google Patents
Composition heat conducting copper foil base plate Download PDFInfo
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- CN202276542U CN202276542U CN 201120387707 CN201120387707U CN202276542U CN 202276542 U CN202276542 U CN 202276542U CN 201120387707 CN201120387707 CN 201120387707 CN 201120387707 U CN201120387707 U CN 201120387707U CN 202276542 U CN202276542 U CN 202276542U
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- heat conduction
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- copper foil
- heat conducting
- adhesion layer
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Abstract
The utility model discloses a composition heat conducting copper foil base plate, which comprises a copper foil layer, an insulation polymer layer and a heat conducting adhesive layer. The heat conducting adhesive layer is a polyimide glue layer with evenly dispersed radiating powder. The insulation polymer layer is fixedly clamped between the copper foil layer and the heat conducting adhesive layer. Due to the fact that the heat conducting adhesive layer in the composition heat conducting copper foil base plate contains heat conducting powder and polyimide resin has good heat resistance and is favorable for workability, the insulation polymer layer has insulation and voltage impact resisting effects, therefore the whole thickness of products is thin, and the composition heat conducting copper foil base plate has flexibility, is wide in applicability and high in heat conducting efficiency, simultaneously improves insulation performance of the products, and is applicable to high power and radiating-requiring different electronic products.
Description
Technical field
The utility model relates to a kind of combined type heat conduction copper clad laminate, is fit to be applied on the electronic products such as LED.
Background technology
Along with the consciousness enhancing of global environmental protection, carbon reduction has become current trend.The LED industry is one of industry that attracts most attention in recent years.Development so far, that the LED product has had is energy-conservation, power saving, high efficiency, the response time is fast, life cycle long and mercurous do not have an advantage such as environmental benefit.Yet usually the input power of LED high power products is only had an appointment and 20% can be converted into light, and remaining 80% electric energy all converts heat energy into.
Generally speaking, if the heat energy that is produced when LED is luminous will make LED knot surface temperature too high, and then influence product life cycle, luminous efficiency and stability can't remittance abroad.Therefore; Heat energy when need be with LED luminous is gone out to heat conduction, reduces heat energy and reduces temperature, improves its luminous efficiency, increases product quality and usability.
The Heat Conduction Material of traditional epoxy resin is owing to need to solve insulation characterisitic problem (puncture voltage; Breakdown Voltage), be used for the heat-conducting glue thickness that binds copper foil layer and need accomplish that 60 to 120um can reach insulating requirements, so the gross thickness of product can be very big, heat-conducting effect is not satisfactory.Because its glass transition temperature (Tg) of epoxy resin kind is not high, in the processing procedure of flexible circuit board, must face high temperature process usually simultaneously; The epoxy resin thermal stability relatively poor (being that glass transition temperature Tg is lower) of wherein playing the part of the solid role; Be unfavorable for the processability on some high temperature process.
The utility model content
In order to overcome above-mentioned defective, the utility model provides combined type heat conduction copper clad laminate, and this combined type heat conduction copper clad laminate has that product thickness is thin, high thermal conductivity coefficient and breakdown voltage resistant advantages of higher, can be applicable on the high-power different electronic product.
The utility model for the technical scheme that solves its technical problem and adopt is:
A kind of combined type heat conduction copper clad laminate; Comprise copper foil layer, insulating polymer layer and heat conduction adhesion layer; Said heat conduction adhesion layer is for evenly being dispersed with the polyimides glue layer of heat radiation powder, and said insulating polymer layer geometrical clamp places between said copper foil layer and the said heat conduction adhesion layer.
The utility model has also further adopted following technical proposals in order to solve its technical problem:
By weight percentage, the heat radiation powder in the said heat conduction adhesion layer accounts for 30% to 90% of said heat conduction adhesion layer solid content.
The average grain diameter of said heat radiation powder is 2 to 10 microns, and said heat radiation powder can be at least a in carborundum (SiC), boron nitride (BN), aluminium oxide (Al2O3) and the aluminium nitride (AlN).
Said heat conduction adhesion layer also comprises additives such as curing agent, nano-filled material and pigment, and these additives can be optimized heat conduction adhesion layer physical property.
Optional at least a in the group that the TPI resin is formed of the polyimide resin of said heat conduction adhesion layer.
The polyimide resin of said heat conduction adhesion layer can be by diamine monomer and dicarboxylic anhydride monomer and add DAPS and DAP at least a combined polymerization form.Wherein, use DAPS can improve the glass transition temperature of polyimide resin, and, can adjust its n value and control its molecular weight size along with the demand of glass transition temperature; And use the DAPS addition in polyimide resin, along with the adding proportion amount increases, material can be more soft, causes coefficient of elasticity to reduce with hot strength and reduce.Wherein, Use DAP to make an addition in the polyimide resin; Can participate in the synthetic of polyamic acid, actually exist on the high polymer main chain, utilize DAP to contain nitrogen hetero-cycles group functionalized meeting and form the then intensity that charge-transfer complex (charge-transfer complex) promotes Cu and PI with Cu.The polyimide resin of said heat conduction adhesion layer mainly is to utilize diamine monomer and dicarboxylic anhydride monomer to be dissolved in the organic polar solvent and under operating condition appropriate reaction temperature according to proper proportion to carry out its polymerization reaction; Add 2 simultaneously; The 6-diamino-pyridine (2,6-Diaminopyridine; Be called for short DAP) and amino silicones (DAPS; Diaminopolysiloxane) carry out combined polymerization, reaction temperature is not higher than 30 ℃ during polymerization, and then acquires polyamic acid (Polyamic acid; Be called for short PAA), its solid content is about 15%～45%; The PAA glue solution is added the heat conduction powder evenly mix, carry out standing and defoaming again, coat on the heat conduction substrate structure.Wherein the organic polar solvent of required use can be used N in the polymerization reaction; N dimethylacetylamide (DMAc), N, N diethyl acetamide (DMF), dimethyl sulfoxide (DMSO) dimethyl sulfo group (DMSO), N-methyl-2-Pyrrolizidine ketone (NMP) or the composite in proportion solvent of aforementioned these solvents.
The inventor of the utility model finds through the insulating polymer layer of adjustment the utility model and the thickness of heat conduction adhesion layer, can make the combined type heat conduction copper clad laminate of the utility model have high heat conduction efficiency and high breakdown voltage resistant characteristic.The characteristic that has high heat conduction for the combined type heat conduction copper clad laminate of keeping the utility model is to be applied to high-power heat conduction products such as LED; And can effectively control cost; The thickness of said insulating polymer layer is preferably 3 to 8 microns, and the thickness of said heat conduction adhesion layer is preferably 12 to 25 microns.
Said copper foil layer is a kind of in electrolysis (ED) Copper Foil and calendering (RA) Copper Foil, circuit layer on this copper foil layer.The thickness of said copper foil layer is 12.5 to 70 microns.
Therefore the material of said insulating polymer layer is a polyimide resin, can be Thermocurable polyimide, uses this insulating polymer layer and the anti-electrical breakdown and the mechanical strength of the combined type heat conduction copper clad laminate that is shaped all have tangible lifting.
The combined type heat conduction copper clad laminate of the utility model also comprises the metal level of 0.3 to 3 micron thick, and said heat conduction adhesion layer is interposed between said insulating polymer layer and the said metal level.This metal level can be metal material substrates such as aluminium base, copper base or iron substrate.
The manufacture method of the combined type heat conduction copper clad laminate of the utility model can be following:
Insulating polymer is coated on the surface of copper foil layer, and dries insulating polymer,, obtain a single face copper clad laminate to form the insulating polymer layer; Re-use rubbing method and the heat conduction adhesion layer is formed on the surface of this insulating polymer layer, be interposed between this heat conduction adhesion layer and the copper foil layer to make this insulating polymer layer, and make this heat conduction adhesion layer be in the semi-harden state of half polymerization; And solidify this heat conduction adhesion layer, to form high-thermal conductive metal base plate.
In the manufacture method of the combined type heat conduction copper clad laminate of the utility model; Before solidifying this heat conduction adhesion layer; Can comprise the step that metal level is conformed to the outer surface of this heat conduction adhesion layer, so that this heat conduction adhesion layer is interposed between this insulating polymer layer and the metal level.
The beneficial effect of the utility model is: the utility model comprises copper foil layer, insulating polymer layer and heat conduction adhesion layer; Said heat conduction adhesion layer is for evenly being dispersed with the polyimides glue layer of heat radiation powder; Because the heat conduction adhesion layer contains the heat conduction powder and polyimides glue has preferable thermal endurance and is beneficial to processability; The insulating polymer layer has insulation reactance voltage breakdown effects, therefore can make the thinning of product integral thickness and have flexibility, and applicability is extensive, heat transfer efficiency is high; And increase the insulation property of product simultaneously, can be applicable to high power and need on the different electronic products of heat radiation.
Description of drawings
Fig. 1 is the utility model embodiment 1 said combined type heat conduction copper clad laminate structural representation;
Fig. 2 is the utility model embodiment 2 said combined type heat conduction copper clad laminate structural representations.
Embodiment
Embodiment 1: a kind of combined type heat conduction copper clad laminate; Constitute by copper foil layer 1, insulating polymer layer 2 and heat conduction adhesion layer 3; Said heat conduction adhesion layer is for evenly being dispersed with the polyimides glue layer of heat radiation powder 5, and said insulating polymer layer geometrical clamp places between said copper foil layer and the said heat conduction adhesion layer.
The employed Copper Foil of present embodiment copper foil layer can be a kind of in electrolytic copper foil (ED Copper Foil) and the rolled copper foil (RA Copper Foil), and generally speaking, the thickness of copper foil layer 1 is 12.5 to 70 microns, and is preferably 35 microns.
The material of insulating polymer layer 2 can be polyimides, and is preferably not halogen-containing Thermocurable polyimide material, is more preferred to have from stickiness and not halogen-containing Thermocurable polyimide material.The thickness of said insulating polymer layer is preferably 3 to 8 microns.
Be formed in the heat conduction adhesion layer 3 of this insulating polymer laminar surface and contain the heat conduction powder, promote heat-conducting effect through the conductive powder physical efficiency, so the combined type heat conduction copper clad laminate of the utility model has good heat-conducting effect.Generally speaking, the average grain diameter of the heat conduction powder that the utility model uses is 2 to 10 microns, and to keep the good tackness of heat conduction adhesion layer, the thickness of heat conduction adhesion layer is 12 to 25 microns.。
Heat conduction adhesion layer 3 prescription of the combined type heat conduction copper clad laminate of present embodiment mainly be by diamine monomer 1,3 '-two (3-amino-benzene oxygen) benzene (APB-133) (0.2kmol) are dissolved in after DMAc stirs half an hour; Add the solution that contains DAP and DAPS again and continued stirring reaction one hour; Continue to add again dicarboxylic anhydride monomer 4,4 '-bibenzene tetracarboxylic dianhydride (BTDA) (0.1kmol) with 4,4 '-(0.1kmol) stirring reaction is after eight hours for adjacent phenoxy group dicarboxylic acid anhydride (ODPA), TPI glue is synthesized in copolymerization; Add the heat conduction powder again and continued to stir two hours, further become polyimides glue with thermal conductivity.
The heat conduction powder is optional forms at least a of group from carborundum (SiC), boron nitride (BN), aluminium oxide (Al2O3) and aluminium nitride (AlN).By weight percentage, in this heat conduction adhesion layer, the heat conduction powder accounts for 30% to 90% of this heat conduction adhesion layer solid content.
In addition, heat conduction adhesion layer 3 is external except comprising thermoplastic polyimide resin and conductive powder, can also comprise that additives such as curing agent, nano-filled material, pigment increase the optimization of its physical property.
The manufacture method of the combined type heat conduction copper clad laminate of present embodiment is following: insulating polymer is coated on the surface of copper foil layer, and dries to form the insulating polymer layer, obtain a single face copper clad laminate; Use coating or transfer printing the heat conduction adhesion layer to be formed on the surface of this insulating polymer layer, be interposed between this heat conduction adhesion layer and this copper foil layer to make this insulating polymer layer, and make this heat conduction adhesion layer be in the semi-harden state of half polymerization; And solidify this heat conduction adhesion layer, to form combined type heat conduction copper clad laminate.
Embodiment 2: a kind of combined type heat conduction copper clad laminate; Constitute by copper foil layer 1, insulating polymer layer 2, heat conduction adhesion layer 3 and metal level 4; Said heat conduction adhesion layer is for evenly being dispersed with the polyimides glue layer of heat radiation powder 5; Said insulating polymer layer geometrical clamp places between said copper foil layer and the said heat conduction adhesion layer, and said heat conduction adhesion layer is interposed between said insulating polymer layer and the said metal level.
The employed Copper Foil of present embodiment copper foil layer can be a kind of in electrolytic copper foil (ED Copper Foil) and the rolled copper foil (RA Copper Foil), and generally speaking, the thickness of copper foil layer 1 is 12.5 to 70 microns, and is preferably 35 microns.
The material of insulating polymer layer 2 can be polyimides, and is preferably not halogen-containing Thermocurable polyimide material, is more preferred to have from stickiness and not halogen-containing Thermocurable polyimide material.The thickness of said insulating polymer layer is preferably 3 to 8 microns.
Be formed in the heat conduction adhesion layer 3 of this insulating polymer laminar surface and contain the heat conduction powder, promote heat-conducting effect through the conductive powder physical efficiency, so the combined type heat conduction copper clad laminate of the utility model has good heat-conducting effect.Generally speaking, the average grain diameter of the heat conduction powder that the utility model uses is 2 to 10 microns, and to keep the good tackness of heat conduction adhesion layer, the thickness of heat conduction adhesion layer is 12 to 25 microns.
Heat conduction adhesion layer 3 prescription of the combined type heat conduction copper clad laminate of present embodiment mainly is by diamine monomer 1, and two (4-amino-benzene oxygen) benzene (TPE-R) of 3-(0.2kmol) are dissolved in after DMAc stirs half an hour; Add the solution that contains DAP and DAPS again and continued stirring reaction one hour; Continue to add again dicarboxylic anhydride monomer 4,4 '-bisphenol-A dianhydride (BPADA) (0.1kmol) with 4,4 '-adjacent phenoxy group dicarboxylic acid anhydride (4,4 '-Oxydiphthalic anhydride; ODPA) (0.1kmol) stirring reaction synthetic TPI glue of copolymerization after eight hours; Add the heat conduction powder again and continued to stir two hours, further become polyimides glue with thermal conductivity.
The heat conduction powder is optional from carborundum (SiC), boron nitride (BN), aluminium oxide (Al
2O
3) and aluminium nitride (AlN) form at least a of group.By weight percentage, in this heat conduction adhesion layer, the heat conduction powder accounts for 30% to 90% of this heat conduction adhesion layer solid content.
In addition, the heat conduction adhesion layer is external except comprising thermoplastic polyimide resin and conductive powder, can also comprise that additives such as curing agent, nano-filled material, pigment increase the optimization of its physical property.
The heat conduction adhesion layer can fit on various metals or other base materials.In this instantiation, metal level 4 can conform to the outer surface of heat conduction adhesion layer to carry out the pressing hot curing, and this metal level 4 can be for example metal material substrates such as aluminium base, copper base and iron substrate.
The manufacture method of the combined type heat conduction copper clad laminate of the utility model is following: insulating polymer is coated on the surface of copper foil layer, and dries to form the insulating polymer layer, obtain a single face copper clad laminate; Use coating or transfer printing the heat conduction adhesion layer to be formed on the surface of this insulating polymer layer, be interposed between this heat conduction adhesion layer and this copper foil layer to make this insulating polymer layer, and make this heat conduction adhesion layer be in the semi-harden state of half polymerization; Before this heat conduction adhesion layer of full solidification, metal level is conformed to the outer surface of this heat conduction adhesion layer, be interposed between this insulating polymer layer and this metal level to make this heat conduction adhesion layer, solidify this heat conduction adhesion layer, to form combined type heat conduction copper clad laminate.
The heat conduction analysis test:
Combined type heat conduction copper clad laminate is carried out the heat conduction analysis test: use thermal conductivity coefficient appearance (Hot Disk) to carry out the heat conduction analysis test; Cover the combined type heat conduction copper clad laminate sample of two full solidification after etching copper foil layers at the transducer upper and lower surface; And insert and put sample and transducer with two steel plates respectively at these two sample lateral surfaces; And by the heat conductivility of sensor measurement sample, the test that will do the sample of the utility model is as experimental group.The adhesion layer heat conductivility of testing general heat-conducting substrate with same method is embedded in the coefficient of heat conduction result who records in the table one as comparative example.
Table one
Can know by table one; The combined type heat conduction copper clad laminate of the utility model thickness through the heat conduction adhesion layer in design is 12 to 25 microns; And the thickness of collocation insulating polymer layer is 3 to 8 microns; Thereby can reach the effect of high-heat conductive efficency through the thickness that reduces integral product, and can further reach the effect of super-high heat-conductive through the kind of adjustment heat conduction powder and the ratio of content.In addition, owing to increased one deck insulating polymer layer, make the combined type heat conduction copper clad laminate of the utility model also can reach high breakdown voltage resistant effect.
Above-mentioned specification and embodiment are merely the principle and the effect thereof of exemplary illustration the utility model, are not to be the restriction to the utility model, and any creation that falls in the utility model claim scope all belongs to the scope that the utility model is protected.
Claims (6)
1. combined type heat conduction copper clad laminate; It is characterized in that: comprise copper foil layer (1), insulating polymer layer (2) and heat conduction adhesion layer (3); Said heat conduction adhesion layer is for evenly being dispersed with the polyimides glue layer of heat radiation powder (5), and said insulating polymer layer geometrical clamp places between said copper foil layer and the said heat conduction adhesion layer.
2. combined type heat conduction copper clad laminate according to claim 1 is characterized in that: the average grain diameter of said heat radiation powder is 2 to 10 microns.
3. combined type heat conduction copper clad laminate according to claim 1 is characterized in that: the thickness of said copper foil layer is 12.5 to 70 microns, and the thickness of said insulating polymer layer is 3 to 8 microns, and the thickness of said heat conduction adhesion layer is 12 to 25 microns.
4. combined type heat conduction copper clad laminate according to claim 1 is characterized in that: said copper foil layer is a kind of in electrolytic copper foil and the rolled copper foil.
5. combined type heat conduction copper clad laminate according to claim 1 is characterized in that: said insulating polymer layer is a polyimide resin layer.
6. combined type heat conduction copper clad laminate according to claim 1 is characterized in that: also comprise the metal level of 0.3 to 3 micron thick, said heat conduction adhesion layer is interposed between said insulating polymer layer and the said metal level.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120387707 CN202276542U (en) | 2011-10-13 | 2011-10-13 | Composition heat conducting copper foil base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201120387707 CN202276542U (en) | 2011-10-13 | 2011-10-13 | Composition heat conducting copper foil base plate |
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| CN202276542U true CN202276542U (en) | 2012-06-13 |
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| CN 201120387707 Expired - Lifetime CN202276542U (en) | 2011-10-13 | 2011-10-13 | Composition heat conducting copper foil base plate |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050616A (en) * | 2011-10-13 | 2013-04-17 | 昆山雅森电子材料科技有限公司 | Compound heat-conducting copper foil substrate |
| CN103144377A (en) * | 2013-03-15 | 2013-06-12 | 松扬电子材料(昆山)有限公司 | Composite electromagnetic-shielding copper clad laminate with heat conduction effect and manufacture method thereof |
| CN103547066A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Heat-dissipating aluminum-based circuit board |
| CN106531902A (en) * | 2016-11-16 | 2017-03-22 | 广州宏庆电子有限公司 | Extremely-thin flexible heat-radiation film and method for manufacturing the same |
| CN107787131A (en) * | 2016-08-31 | 2018-03-09 | 博罗康佳精密科技有限公司 | A kind of preparation method of multilayer copper base |
-
2011
- 2011-10-13 CN CN 201120387707 patent/CN202276542U/en not_active Expired - Lifetime
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103050616A (en) * | 2011-10-13 | 2013-04-17 | 昆山雅森电子材料科技有限公司 | Compound heat-conducting copper foil substrate |
| CN103050616B (en) * | 2011-10-13 | 2015-10-28 | 昆山雅森电子材料科技有限公司 | Composition heat conducting copper foil base plate |
| CN103547066A (en) * | 2012-07-17 | 2014-01-29 | 昆山雅森电子材料科技有限公司 | Heat-dissipating aluminum-based circuit board |
| CN103144377A (en) * | 2013-03-15 | 2013-06-12 | 松扬电子材料(昆山)有限公司 | Composite electromagnetic-shielding copper clad laminate with heat conduction effect and manufacture method thereof |
| CN107787131A (en) * | 2016-08-31 | 2018-03-09 | 博罗康佳精密科技有限公司 | A kind of preparation method of multilayer copper base |
| CN106531902A (en) * | 2016-11-16 | 2017-03-22 | 广州宏庆电子有限公司 | Extremely-thin flexible heat-radiation film and method for manufacturing the same |
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| Date | Code | Title | Description |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120613 |
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| CX01 | Expiry of patent term |