CN102746798B - High-heat-conductivity semi-cured glue film and preparation method of high-heat-conductivity semi-cured glue film - Google Patents
High-heat-conductivity semi-cured glue film and preparation method of high-heat-conductivity semi-cured glue film Download PDFInfo
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Abstract
The invention discloses a high-heat-conductivity semi-cured glue film for manufacturing heat conduction type metal base plate in the field of copper clad laminates for printed circuits. The high-heat-conductivity semi-cured glue film comprises the following ingredients in parts by weight: 1 to 15 parts of epoxy resin, 1 to 15 parts of composite modified film forming resin, 60 to 90 parts of heat conduction fillers, 1 to 3 parts of curing agents and 0.001 to 0.01 parts of accelerants, wherein the composite modified film forming resin consists of phenoxy resin, end- epoxy polysiloxane and polyvinyl butyral. The high-heat-conductivity semi-cured glue film contains the composite modified film forming resin consisting of three kinds of resin including the phenoxy resin, the end-epoxy polysiloxane and the polyvinyl butyral, the adverse influence on a heat conducting film caused by using epoxy resin as main resin is avoided, high heat conductivity, high bonding force and high heat resistance performance are realized, and the high-heat-conductivity semi-cured glue film can be stored for more than three months without embrittlement in the normal state. Meanwhile, the invention also discloses a preparation method of the high-heat-conductivity semi-cured glue film.
Description
Technical field
The present invention relates to printed electronic circuit and use copper-clad laminate field, be specifically related to a kind of for making high heat conduction semicure glued membrane of metal substrate and preparation method thereof.
Background technology
In the past, metal matrix CCL is just mainly used on automobile equipower device, and market capacity is also little.In recent years, LED was as a kind of environmental protection and energy saving light source, and it attracts the whole world large producer of illumination all successively to add in LED light source and the market development in the bright prospects of lighting field development.Semiconductor lighting plan has all been released in U.S., day, Europe and tw Taiwan.The thermal conductivity aluminium-based development and application of covering Copper Foil version of height that causes thus LED employing also seems particularly important, and as the baseplate material-metal matrix CCL of LED heat-radiating substrate, its demand is than several years ago having increased by 3 ~ 4 times.Also having driven thus the important raw and processed materials as metal matrix CCL---the demand of the adhesive film between Copper Foil and metal sheet increases.
Along with electronic product is to future development light, thin, short, little, densification multifunction, the packing density of elements on circuit board and integrated level rain come higher, require also more and more urgent to the thermal diffusivity of substrate.On traditional circuit board structure, less owing to plugging electronic package quantity and consumed power thereon, the heat that electronic package produces can be by the copper foil layer heat radiation on circuit card, directly say that heat dispels the heat to air, utilize the convection current of air to carry out temperature control to electronic package, the electronic package power of current circuit card is high, quantity is many, incident problem is that consumed electric power increases, cause producing a large amount of heat in local power consumption components, and circuit card can not be gone out these heat loss timely, thereby whole aircraft reliability is declined, under this background, produce multiple solution.
Wherein a kind of heat dissipation for circuit board technology being widely known by the people is to utilize an insulating radiation tack coat and heat-dissipating metal sheet (as aluminium sheet, copper coin) to carry out pressing road plate under single or multiple lift printing, the heat of utilizing radiating effect that metal is good to be produced with runaway electron assembly, the metal aluminum substrate with high-cooling property, good mechanical processibility and high planarization is subject to market and praises highly.This insulating radiation layer, except providing metal substrate and copper-foil conducting electricity bonding, also must provide good insulating property, heat dispersion.The epoxy resin that this insulation layer can adopt common FR-4(woven fiber glass to strengthen) slim material, but because the thermal conductivity of FR-4 is not high, be only 0.25W/mK, thereby radiating effect is effective.This is because glass-fiber-fabric is heat conduction poor conductor, therefore, the thermal conductivity of copper-clad plate is had to larger impact, thereby it is on the low side to affect thermal conductivity.
The glued membrane that heat-conducting type metal matrix copper-clad laminate is used is developed in such background.High heat conduction semicure glued membrane is by providing bonding resin and the mineral filler of high heat conduction etc. to form, and therefore, we need to select suitable resin system and carry out the research of high thermal conductivity filler and resin system and filler compatibility and processing technology.When selecting resin and filler, to take into account heat conductivity, thermotolerance, breakdown voltage resistant property and the insulating reliability of considering to be made into substrate; Simultaneously, because glued membrane does not have support strongthener, epoxy resin is done to tear than being easier to after the glue film forming of main body, and place and exceed after a week than being easier to occur embrittlement after film forming, embrittlement degree is accelerated with the rising of temperature, therefore, also to consider the storage characteristics of glued membrane simultaneously, avoid increasing client's production risk.
Patent US 2006/0127686 A1 discloses the preparation method of the high heat conducting film of a kind of polyimide, but the required processing temperature of prepared high heat conducting film is up to more than 250 DEG C, and the high heat conducting film non-refractory of polyimide pressing repeatedly, otherwise meeting embrittlement, is not therefore suitable for preparation MULTILAYER COMPOSITE high thermal conductive substrate; High-heat-conductivity glue film described in patent CN 101974208 A is mainly made up of resins such as epoxy resin, phenoxy resin or nbr carboxyl terminal, biphenyl type resol, although have good thermal conductivity and resistance to immersed solder, its stripping strength and storage characteristics are all not satisfactory.
Summary of the invention
The object of the invention is to overcome the deficiencies in the prior art part and a kind of have good thermotolerance and excellent high thermal conductivity are provided, can store for a long time at normal temperatures the high heat conduction semicure glued membrane of not embrittlement simultaneously; Meanwhile, the present invention also provides the preparation method of described high heat conduction semicure glued membrane.
For achieving the above object, the technical scheme that the present invention takes is: a kind of high heat conduction semicure glued membrane, the component that comprises following weight part: epoxy resin 1-15 part, composite modified film-forming resin 1-15 part, heat conductive filler 60-90 part, solidifying agent 1-3 part, promotor 0.001-0.01 part; Described composite modified film-forming resin is made up of poly phenol oxygen resin, epoxy terminated polysiloxane and polyvinyl butyral acetal.
Described composite modified film-forming resin, is made up of poly phenol oxygen resin, epoxy terminated polysiloxane and three kinds of resins of polyvinyl butyral acetal, has overcome the negative impact that epoxy resin brings heat conducting film as main resin.Described composite modified film-forming resin, can not only jointly form with epoxy resin the external phase of resin system, and not affect under the stable on heating prerequisite of glued membrane, has improved film-forming properties (glued membrane outward appearance), cohesive force and the storage characteristics of glued membrane.
As the preferred implementation of high heat conduction semicure glued membrane of the present invention, in described composite modified film-forming resin, the weight ratio of poly phenol oxygen resin, epoxy terminated polysiloxane and polyvinyl butyral acetal is 5:1:1.In described composite modified film-forming resin, poly phenol oxygen resin amount is too many, and the cohesive force of glued membrane and thermotolerance can rise, but glued membrane outward appearance meeting variation; The add-on of epoxy terminated polysiloxane is too many, can make the shelf time of glued membrane extend, but can decline to the viscous force of Copper Foil or metal substrate; The add-on of polyvinyl butyral acetal is too many, and film-forming properties and the cohesiveness of glued membrane are better, and glued membrane is more smooth smooth full, but can affect its thermotolerance and second-order transition temperature.In the time that the weight ratio of poly phenol oxygen resin, epoxy terminated polysiloxane and polyvinyl butyral acetal is 5:1:1, prepared glued membrane has outstanding thermotolerance, snappiness, film-forming properties and cohesiveness after solidifying, and the normal temperature storage of glued membrane is also very good, and over-all properties is high.
As the preferred implementation of high heat conduction semicure glued membrane of the present invention, the weight-average molecular weight of described poly phenol oxygen resin is 25000-60000.
As the preferred implementation of high heat conduction semicure glued membrane of the present invention, the weight ratio of described epoxy resin and composite modified film-forming resin is 1:0.6 to 1:1.0.As the more preferably embodiment of high heat conduction semicure glued membrane of the present invention, the weight ratio of described epoxy resin and composite modified film-forming resin is 1:0.8.Modified resin consumption is too many, can affect the thermotolerance of glued membrane; Very little, glued membrane film-forming properties, cohesiveness, snappiness and storage characteristics are all bad for consumption.In the time that the weight ratio of epoxy resin and composite modified film-forming resin is 1:0.6 to 1:1.0, the over-all properties of gained glued membrane is better; In the time that the weight ratio of epoxy resin and composite modified film-forming resin is 1:0.8, over-all properties the best of gained glued membrane.
As the preferred implementation of high heat conduction semicure glued membrane of the present invention, described heat conductive filler is at least one in silicon-dioxide, zinc oxide, aluminum oxide, magnesium oxide, boron nitride, aluminium nitride and silicon carbide.
Meanwhile, the present invention also provides the preparation method of high heat conduction semicure glued membrane described above, comprises the following steps:
(1) take each component of described weight, then take appropriate solvent, each to solvent and all the other component is mixed, the mixed high-heat-conductivity glue film glue of making;
(2) the high-heat-conductivity glue film glue obtaining in step (1) is coated in carrier film, in the baking oven of 100-200 DEG C, dries 3-10 minute, then tear from carrier film, obtain high heat conduction semicure glued membrane.
The amount of described solvent is generally advisable taking solvent and the mixed solid content of described all the other raw materials as 80-85%, in practice, selects as required to add.Described solvent can adopt ketones solvent, varsol, alcoholic solvent, ether solvent, esters solvent or aprotic solvent etc.
As the preparation method's of high heat conduction semicure glued membrane of the present invention preferred implementation, the carrier film in described step (2) is polyester film or polyimide film.
As the preparation method's of high heat conduction semicure glued membrane of the present invention preferred implementation, the carrier film thickness in described step (2) is 30-100 μ m.
As the preparation method's of high heat conduction semicure glued membrane of the present invention preferred implementation, in described step (2), adopt spraying method, spread coating or slit die coating method that high-heat-conductivity glue film glue is coated in carrier film.While adopting spraying method, spread coating or slit die coating method that high-heat-conductivity glue film glue is coated in carrier film, after overbaking semicure, the thermotolerance of preparation-obtained glued membrane, cohesiveness and thermal conductivity maintain the leading position in product of the same race, simultaneously, its normal temperature storage is good, vacuumizes preservation can allow described glued membrane use validity to reach more than three months without low temperature.
High heat conduction semicure glued membrane of the present invention, main composite modified film-forming resin, heat conductive filler, solidifying agent and the promotor forming by epoxy resin, by poly phenol oxygen resin, epoxy terminated polysiloxane and polyvinyl butyral acetal forms, described composite modified film-forming resin has overcome the negative impact that epoxy resin brings heat conducting film as main resin, make described high heat conduction semicure glued membrane in having the premium propertiess such as high thermal conductivity, high cohesive force, high heat resistance, long-time (more than three months) store and not embrittlement under normal conditions.The preparation method of high heat conduction semicure glued membrane of the present invention, simple to operate, after baking semicure, the high heat conduction semicure glued membrane of gained, has good performance.
Embodiment
For the object, technical solutions and advantages of the present invention are better described, below in conjunction with specific embodiment, the invention will be further described.
Embodiment 1
A kind of high heat conduction semicure glued membrane of the present embodiment, adopts following methods to be prepared from:
(1) according to weighing scale, take respectively the raw material of following weight part: 100 parts of epoxy resin, 42.5 parts of poly phenol oxygen resins, 8.5 parts of epoxy terminated polysiloxane, 8.5 parts of polyvinyl butyral acetals, 675 parts, heat-conducting type aluminum oxide, 97 parts of the hexagonal boron nitrides that purity is 99%, 10 parts of curing agent dicyandiamides, 0.4 part of promotor 2-ethyl-4 Methylimidazole; Then taking pimelinketone as solvent adjustment system solid content is as 82%, mix and make high-heat-conductivity glue film glue;
(2) adopt spraying method that the high-heat-conductivity glue film liquid obtaining in step (1) is coated on the polyester film that thickness is 75um, in the air circulation oven of 150 DEG C, dry 5 minutes, then tear from polyurethane film, obtain high heat conduction semicure glued membrane.
In the present embodiment, the weight-average molecular weight of described poly phenol oxygen resin is 25000.
Embodiment 2
A kind of high heat conduction semicure glued membrane of the present embodiment, adopts following methods to be prepared from:
(1) according to weighing scale, take respectively the raw material of following weight part: 100 parts of epoxy resin, 57 parts of poly phenol oxygen resins, 11.5 parts of epoxy terminated polysiloxane, 11.5 parts of polyvinyl butyral acetals, 675 parts, heat-conducting type aluminum oxide, 97 parts of the hexagonal boron nitrides that purity is 99%, 20 parts of curing agent dicyandiamides, 0.6 part of promotor 2-ethyl-4 Methylimidazole; Then taking pimelinketone as solvent adjustment system solid content is as 82%, mix and make high-heat-conductivity glue film glue;
(2) adopt spread coating that the high-heat-conductivity glue film liquid obtaining in step (1) is coated on the polyester film that thickness is 35um, in the air circulation oven of 100 DEG C, dry 10 minutes, then tear from polyurethane film, obtain high heat conduction semicure glued membrane.
In the present embodiment, the weight-average molecular weight of described poly phenol oxygen resin is 30000.
Embodiment 3
A kind of high heat conduction semicure glued membrane of the present embodiment, adopts following methods to be prepared from:
(1) according to weighing scale, take respectively the raw material of following weight part: 100 parts of epoxy resin, 71.5 parts of poly phenol oxygen resins, 14.3 parts of epoxy terminated polysiloxane, 14.3 parts of polyvinyl butyral acetals, 675 parts, heat-conducting type aluminum oxide, 97 parts of the hexagonal boron nitrides that purity is 99%, 30 parts of curing agent dicyandiamides, 1 part of promotor 2-ethyl-4 Methylimidazole; Then taking pimelinketone as solvent adjustment system solid content is as 82%, mix and make high-heat-conductivity glue film glue;
(2) adopt slit die coating method that the high-heat-conductivity glue film liquid obtaining in step (1) is coated on the polyester film that thickness is 100um, in the air circulation oven of 200 DEG C, dry 3 minutes, then tear from polyurethane film, obtain high heat conduction semicure glued membrane.
In the present embodiment, the weight-average molecular weight of described poly phenol oxygen resin is 50000.
Embodiment 4
A kind of high heat conduction semicure glued membrane of the present embodiment, adopts following methods to be prepared from:
(1) according to weighing scale, take respectively the raw material of following weight part: 10 parts of epoxy resin, 7.15 parts of poly phenol oxygen resins, 1.43 parts of epoxy terminated polysiloxane, 1.43 parts of polyvinyl butyral acetals, 500 parts of silicon-dioxide, 100 parts, zinc oxide, 15 parts of solidifying agent hydrazides, 0.5 part of promotor trolamine; Then taking dimethylbenzene as solvent adjustment system solid content is as 80%, mix and make high-heat-conductivity glue film glue;
(2) adopt slit die coating method that the high-heat-conductivity glue film liquid obtaining in step (1) is coated on the polyester film that thickness is 60um, in the air circulation oven of 120 DEG C, dry 8 minutes, then tear from polyurethane film, obtain high heat conduction semicure glued membrane.
In the present embodiment, the weight-average molecular weight of described poly phenol oxygen resin is 60000.
Embodiment 5
A kind of high heat conduction semicure glued membrane of the present embodiment, adopts following methods to be prepared from:
(1) according to weighing scale, take respectively the raw material of following weight part: 150 parts of epoxy resin, 100 parts of poly phenol oxygen resins, 20 parts of epoxy terminated polysiloxane, 20 parts of polyvinyl butyral acetals, 900 parts, magnesium oxide, 25 parts, solidifying agent aminoresin, accelerant N, 0.8 part of N-dimethyl benzylamine; Then taking methyl alcohol as solvent adjustment system solid content is as 85%, mix and make high-heat-conductivity glue film glue;
(2) adopt spraying method that the high-heat-conductivity glue film liquid obtaining in step (1) is coated on the polyester film that thickness is 80um, in the air circulation oven of 180 DEG C, dry 6 minutes, then tear from polyurethane film, obtain high heat conduction semicure glued membrane.
In the present embodiment, the weight-average molecular weight of described poly phenol oxygen resin is 35000.
Embodiment 6
A kind of high heat conduction semicure glued membrane of the present embodiment, adopts following methods to be prepared from:
(1) according to weighing scale, take respectively the raw material of following weight part: 80 parts of epoxy resin, 50 parts of poly phenol oxygen resins, 10 parts of epoxy terminated polysiloxane, 10 parts of polyvinyl butyral acetals, 675 parts of aluminium nitride, 125 parts, silicon carbide, 18 parts of solidifying agent aromatic polyamines, 0.9 part of promotor 2-ethyl-4 Methylimidazole; Then taking vinyl acetic monomer as solvent adjustment system solid content is as 83%, mix and make high-heat-conductivity glue film glue;
(2) adopt spread coating that the high-heat-conductivity glue film liquid obtaining in step (1) is coated on the polyester film that thickness is 70um, in the air circulation oven of 150 DEG C, dry 5 minutes, then tear from polyurethane film, obtain high heat conduction semicure glued membrane.
In the present embodiment, the weight-average molecular weight of described poly phenol oxygen resin is 45000.
Embodiment 7 high heat conduction semi-curing glue film properties of the present invention is tested and compares
Comparative example 1
A kind of high-heat-conductivity glue film of this comparative example, adopts following preparation method to be prepared from:
(1) according to weighing scale, take respectively the raw material of following weight part: 100 parts of epoxy resin, 80 parts of poly phenol oxygen resins, 675 parts, heat-conducting type aluminum oxide, purity is 97 parts of 99% hexagonal boron nitrides, 10 parts of curing agent dicyandiamides, 0.4 part of promotor 2-ethyl-4 Methylimidazole; Then taking pimelinketone as solvent adjustment system solid content is as 82%, mix and make high-heat-conductivity glue film glue;
(2) adopt slit die coating method that the high-heat-conductivity glue film liquid obtaining in step (1) is coated on the polyester film that thickness is 75um, in the air circulation oven of 150 DEG C, dry 5 minutes, then tear from polyurethane film, obtain high heat conduction semicure glued membrane.
Comparative example 2
A kind of high-heat-conductivity glue film of this comparative example, adopts the method identical with comparative example 1 to be prepared from, and the difference of high-heat-conductivity glue film and comparative example 1 is described in this comparative example: 80 parts of poly phenol oxygen resins are replaced with to 80 parts of epoxy terminated polysiloxane, and all the other compositions are identical.
Comparative example 3
A kind of high-heat-conductivity glue film of this comparative example, adopts the method identical with comparative example 1 to be prepared from, and the difference of high-heat-conductivity glue film and comparative example 1 is described in this comparative example: 80 parts of poly phenol oxygen resins are replaced with to 80 parts of polyvinyl butyral acetals, and all the other compositions are identical.
Comparative example 4
A kind of high-heat-conductivity glue film of this comparative example, adopt the method identical with comparative example 1 to be prepared from, described in this comparative example, the difference of high-heat-conductivity glue film and comparative example 1 just: 80 parts of poly phenol oxygen resins are replaced with to 8.5 parts of 42.5 parts of poly phenol oxygen resins and epoxy terminated polysiloxane, and all the other compositions are identical.
Comparative example 5
A kind of high-heat-conductivity glue film of this comparative example, adopt the method identical with comparative example 1 to be prepared from, described in this comparative example, the difference of high-heat-conductivity glue film and comparative example 1 just: 80 parts of poly phenol oxygen resins are replaced with to 8.5 parts of 42.5 parts of poly phenol oxygen resins and polyvinyl butyral acetals, and all the other compositions are identical.
Comparative example 6
A kind of high-heat-conductivity glue film of this comparative example, adopt the method identical with comparative example 1 to be prepared from, described in this comparative example, the difference of high-heat-conductivity glue film and comparative example 1 just: 80 parts of poly phenol oxygen resins are replaced with to 8.5 parts of 8.5 parts of epoxy terminated polysiloxane and polyvinyl butyral acetals, and all the other compositions are identical.
Observe respectively the apparent situation of embodiment 1-6, above-mentioned comparative example 1-6 gained glued membrane; And respectively embodiment 1-6, comparative example 1-6 gained glued membrane are carried out to following processing: glued membrane is laid on anodic oxidation aluminium sheet, put again the electrolytic copper foil that a thickness is 35 μ m above, in addition, another glued membrane is laid in two polyester release films, then treat that by these two kinds die pressing product puts into vacuum hotpressing machine, carry out heating and pressurizing by the setting program of 130 DEG C/0.5h+175 DEG C/0.5h+200 DEG C/0.5h, solidifying pressure maximal pressure is about 50kgf/cm2, makes high thermal conductivity aluminum matrix plate.Then described high thermal conductivity aluminum matrix plate and completely curing heat conducting film are carried out to performance test, the results are shown in Table 1.
Table 1 aluminium base and the performance comparison of solidifying heat conducting film completely
| Project | Tg (℃) | Stripping strength (N/mm) | Thermal conductivity (W/mK) | Resistance to immersed solder (min) | Incendivity | Voltage breakdown (KV) | The normality storage time (day) |
| Testing method | DSC | A | ASTM 5470 | 288℃ | UL-94 | D-48/50+D-0.5/23 | ? |
| Comparative example 1 | 124 | 2.27 | 2.02 | 2.2 | V-0 | ≥3.0 | 7 |
| Comparative example 2 | 115 | 0.80 | 2.08 | 2.5 | V-0 | ≥3.0 | ＞100 |
| Comparative example 3 | 101 | 1.76 | 2.05 | 2 | V-0 | ≥3.0 | 7 |
| Comparative example 4 | 108 | 1.32 | 2.12 | 2.1 | V-0 | ≥3.0 | 7 |
| Comparative example 5 | 102 | 0.94 | 2.09 | 2.6 | V-0 | ≥3.0 | 7 |
| Comparative example 6 | 112 | 1.21 | 1.98 | 1.95 | V-0 | ≥3.0 | 7 |
| Embodiment 1 | 157 | 1.65 | 2.25 | ＞5 | V-0 | ≥3.0 | ＞100 |
| Embodiment 2 | 151 | 1.81 | 2.37 | ＞5 | V-0 | ≥3.0 | ＞100 |
| Embodiment 3 | 159 | 2.05 | 2.32 | ＞5 | V-0 | ≥3.0 | ＞100 |
| Embodiment 4 | 163 | 2.15 | 2.42 | ＞5 | V-0 | ≥3.0 | ＞100 |
| Embodiment 5 | 154 | 2.09 | 2.39 | ＞5 | V-0 | ≥3.0 | ＞100 |
| Embodiment 6 | 155 | 2.18 | 2.47 | ＞5 | V-0 | ≥3.0 | ＞100 |
Can be found out by table 1 result, high heat conduction semicure glued membrane of the present invention, owing to containing the composite modified film-forming resin being formed by poly phenol oxygen resin, epoxy terminated polysiloxane and three kinds of resins of polyvinyl butyral acetal simultaneously, its thermal conductivity, cohesive force, thermotolerance and storge quality, compared with high-heat-conductivity glue film described in comparative example 1-6, are significantly improved.
Last institute should be noted that; above embodiment is only in order to illustrate technical scheme of the present invention but not limiting the scope of the invention; although the present invention is explained in detail with reference to preferred embodiment; those of ordinary skill in the art is to be understood that; can modify or be equal to replacement technical scheme of the present invention, and not depart from essence and the scope of technical solution of the present invention.
Claims (2)
1. a high heat conduction semicure glued membrane, is characterized in that the component that comprises following weight part: epoxy resin 1-15 part, composite modified film-forming resin 1-15 part, heat conductive filler 60-90 part, solidifying agent 1-3 part, promotor 0.001-0.01 part;
Described composite modified film-forming resin is made up of poly phenol oxygen resin, epoxy terminated polysiloxane and polyvinyl butyral acetal; In described composite modified film-forming resin, the weight ratio of poly phenol oxygen resin, epoxy terminated polysiloxane and polyvinyl butyral acetal is 5:1:1;
The weight ratio of described epoxy resin and composite modified film-forming resin is 1:0.6-1.0.
2. high heat conduction semicure glued membrane as claimed in claim 1, is characterized in that, the weight-average molecular weight of described poly phenol oxygen resin is 25000-60000.
3. high heat conduction semicure glued membrane as claimed in claim 1, is characterized in that, the weight ratio of described epoxy resin and composite modified film-forming resin is 1:0.8.
4. high heat conduction semicure glued membrane as claimed in claim 1, is characterized in that, described heat conductive filler is at least one in silicon-dioxide, zinc oxide, aluminum oxide, magnesium oxide, boron nitride, aluminium nitride and silicon carbide.
5. a preparation method for high heat conduction semicure glued membrane as claimed in claim 1, is characterized in that, comprises the following steps:
(1) take each component of described weight, then take appropriate solvent, solvent is mixed with desolventizing outer each component, the mixed high-heat-conductivity glue film glue of making;
(2) the high-heat-conductivity glue film glue obtaining in step (1) is coated in carrier film, in the baking oven of 100-200 DEG C, dries 3-10 minute, then tear from carrier film, obtain high heat conduction semicure glued membrane.
6. the preparation method of high heat conduction semicure glued membrane as claimed in claim 5, is characterized in that, the carrier film in described step (2) is polyester film or polyimide film.
7. the preparation method of the high heat conduction semicure glued membrane as described in claim 5 or 6, is characterized in that, the carrier film thickness in described step (2) is 30-100 μ m.
8. the preparation method of high heat conduction semicure glued membrane as claimed in claim 5, is characterized in that, in described step (2), adopts spraying method, spread coating or slit die coating method that high-heat-conductivity glue film glue is coated in carrier film.
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| CN108995346A (en) * | 2018-08-17 | 2018-12-14 | 咸阳华电电子材料科技有限公司 | A kind of resin adhesive liquid and preparation method thereof and its application |
| CN113372688A (en) * | 2021-07-28 | 2021-09-10 | 海南必凯水性新材料有限公司 | Modified epoxy resin and preparation method thereof |
| CN114292427A (en) * | 2021-12-24 | 2022-04-08 | 纳电(深圳)材料科技有限公司 | Hot-pressing high-temperature-resistant prepreg PI (polyimide) and preparation method thereof |
| CN116313512B (en) * | 2023-05-19 | 2023-07-25 | 畅的新材料科技（上海）有限公司 | Preparation method of modified nickel slurry for MLCC |
| CN117025146A (en) * | 2023-08-09 | 2023-11-10 | 惠州市帕克威乐新材料有限公司 | Organic silicon modified heat conduction adhesive film and preparation method thereof |
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| 崔孟忠等."含环氧基聚硅氧烷的研究进展".《功能高分子学报》.1996,第9卷(第3期),第50-54页，"3 环氧树脂与聚硅氧烷的相互改性"部分. |
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