TW201108882A - Thermal conductivity copper-clad substrate - Google Patents

Abstract

The present invention relates to thermal conductivity copper-clad substrate, wherein thermal conductivity of which is greater than 1.0 W/mK. The thermal conductivity copper-clad substrate having a layer of glass fiber fabric coated with epoxy resin to form a thermal conductivity insulated layer. The upper and lower surfaces of the thermal insulating layer are made by covering a coating of metal cooper-clad, wherein inorganic filler in the epoxy resin composition within the range of about 30 to 60% by weight.

Description

201108882 VI. Description of the Invention: [Technical Field of the Invention] The present invention relates to a kind of vine offering; ^ A/_ #thermal copper clad substrate, especially a thermally conductive copper clad substrate to which an inorganic filler is added. [Prior Art] Conventional light-emitting diodes (LE_ only generate a small amount of heat in the indicator light, mobile phone, (personal digital Φ assistant) PDA, and the versatile electronic product, so there is no special demand for the heat dissipation condition of the LED. With the light-emitting diode (LED) luminous efficiency is increasing year by year, it will emit large heat energy when used. If LED is used instead of incandescent lamp, fluorescent lamp, etc., it must have proper heat management to reduce thermal resistance. When the lamp is shipped, the temperature should be as low as 5〇~7〇. The low temperature state of the lED lamp can achieve a long time and the wavelength of the light. The front white LED light efficiency is close to 80 lm/ w, about 5 to 6 times that of incandescent lamps, so # led lamps have the advantages of environmental protection and high brightness, and the thermal management of lamps has become a key role in the commercialization of LEDs. The LED modules in the above LED lamps have various heats. Management metamorphosis 'such as heat sinks, fans, thermal grease, heat pipes and LED printed circuit boards. LED modules due to the traditional printed circuit board thermal conductivity of about 3.3 W / mk ~ 〇 4 w / mk can not load LED modules Heat, so the custom The LED module uses aluminum/copper metal substrate or ceramic plate with high thermal conductivity as the material of the printed circuit board. The thermal conductivity of the metal substrate is about 1.0~4.0 W/mk, but it is difficult to process. There are many disadvantages such as poor synchronization of printed circuit board (PCB) process and high cost of metal material 201108882. The thermal conductivity of ceramic substrate is W/mk', but its manufacturing cost and processing process are more difficult than metal substrate. Knowing the printing of LEDs ===providing - kind of guide (four) copper (four) board, providing printed electricity = (PCB) process processing

Yes, and the heat conduction, the substrate has a thermal conductivity capable of matching the machine's m board. A plate, #~μ The purpose of the description 'The present invention provides a kind of heat-conducting steel box substrate' contains metal copper (four) and a thermally conductive insulating layer, _ absolute, edge fiber cloth reinforcement (four) into, its epoxy tree _ package 1 = is composed of the lining epoxy tree, the desertified epoxy resin, the four-legged Wei-day, or the polymer A epoxy resin, and the molecular weight of the molecular gamma Axian For (4) ~ delete = between 'W hardening consists of dicyandiamide, diaminodiphenyl weide (10) s), bribe resin or anhydride, (c) catalyst is from 2_MI (2_methylimidazole), 2pz phenyl mouth rice嗤), 2E4MZ (2-ethyl, 4-methyl miso sitting) household ^, (d) Yi machine filling system is selected from at least two kinds of oxidized two or two (4) nitriding _ nitride butterfly - The composition of the wound is formed, and (e) the additive type flame retardant may be an additive type brominated flame retardant or an additive type phosphorus type flame retardant. In summary, the thermally conductive copper-clad box substrate of the present invention provides a thermal conductivity comparable to that of a metal substrate, but the manufacturing process and raw material cost are simpler and more cost-competitive than metal substrates, and the fabrication and materials can be significantly reduced compared to ceramic and metal substrates. Cost and process for simplifying PCB processing. 201108882 [Embodiment] Referring to the first to fifth figures, the first drawing is a flow chart of the production of the thermally conductive copper-clad>1 substrate of the present invention, and the second to fourth figures are the heat-transfer copper-clad treatment of the present invention. Schematic diagram of substrate manufacturing equipment. Material hot cover (four) substrate final product

The structure can be seen as shown in the fifth figure. First, an inorganic filler and an adhesive can be prepared. The inorganic filler is a heat-conductive filler, and its component y is selected from at least two types: adioxide (ai2〇3), cerium dioxide (Si〇2), nitriding or ratification. An inorganic filler composed of parts. Thereafter, the above inorganic filler may be ground to form a powdery inorganic filler. The powdery inorganic filler can be classified into at least a granule 依据i grade according to the particle size, so that the filling of each particle size grade has a recording size of (4), and in this embodiment, the inorganic granule of the particle size is used. Filler. The adhesive is made of a Wei resin, a hardener, a catalyst, and an additive flame retardant. The epoxy resin is composed of a phosphorus epoxy resin, a brominated epoxy resin, a tetrafunctional epoxy resin, or a polymer double-spectrum A epoxy resin, and the molecular weight of the polymer Wei A epoxy resin is formed. It can be 85〇~_ = composed of double test (DICY), coffee, secret resin or acid anhydride. "Additional Flame Retardant This additive type flame retardant can be an additive type fuel additive or a (four) type flame retardant." The catalyst system is made of 2 仏 r r (Trs^〇i) '2E4MZ ("^'4- T^^^ Please refer to the second figure below. After that, the adhesive is mixed with a chemical agent of 3〇~60 wt% and a concentration of 3〇~% by weight. Thereafter, the mixture is stirred at a high speed for 60 minutes via a stirrer 200 to form an oxygen resin paste, wherein the total weight percentage of the adhesive to the inorganic filler is less than or equal to 100 wt〇/〇. It can be seen that the weight percentage of the epoxy gel can be 20~40 wt〇/〇, and the weight percentage of the hardener can be 1〇~3〇=the weight percentage of the added flame retardant can be 0.01~0.05 Wt%, wherein总 The sum of the weight of the ring f resin glue, the hardener, the added flame retardant and the inorganic green filler is less than or equal to 100 wt%. In addition, the mixing process of the above inorganic filler and the adhesive can be added to a volatilization The sexual/troreal agent is turned into a dilute adhesive to accelerate the mixing of the inorganic filler with the adhesive. The composition may be composed of components such as acetone, and the volatile solvent is a conventional technique which is not explained here (step S103). The above epoxy resin may be transferred from the mixer 2 via the conveying device 210. The reinforcing material 111 can be a glass fiber cloth composed of glass fiber, and the weight thereof can be 210 g/m 2 , so the reinforcing material 111 can be wound into a cloth roll shape, and The reinforcing material 111 is transported from the retractor 400 to the immersion tank 3 via a transport mechanism 500 such as a roller to soak the epoxy resin. In this embodiment, After the immersion material ill is immersed, the epoxy resin glue is adhered to the fiber of the reinforcing material 111 and the surface of the reinforcing material 111. After the reinforcing material 111 is immersed, it can be transported to a baking state through the conveying mechanism. The dryer 600 is dried to form a semi-cured one of the thermally conductive insulating layers U 〇 a. Finally, the thermally conductive insulating layer u 〇 a can be wound into a roll by a recovery machine 7 201 201108882 (step S 〇 5) Ming - and refer to the second figure 'the above thermal conductive layer u〇a can be A cutting machine cuts into a proper size, and the heat-conductive insulating layer 110 after the cutting is fully placed. After that, the two metal _ layer 12G can be attached via the bonding machine (not shown). The upper surface of the thermal conductive insulating layer 11G, the metal copper plating layer 120 may be a metal copper pig layer composed of steel falling, and the specification of the copper box is 1 oz / square central suction (〇z / ft2). In an embodiment, the metal copper box layer (10) may be an -electrolyte layer, or may be bonded only to the upper surface of the sheet thermal conductive insulating layer 11 or by two pieces of metal copper. The layer 120 is attached to the lower surface of the thermal conductive insulating layer 11 of the sheet, and does not exceed the spirit of the present invention (step S107). Please refer to the fourth picture together. After the attachment is completed, it can be transferred to a press machine 900 to press the metal copper box layer 12 to the thermal conductive insulation 1 to form the thermally conductive coated mi substrate (10) (as shown in the fifth figure). It can be seen from experiments that the thermally conductive copper-clad substrate prepared by the present invention has a thermal conductivity value of up to 〜3, 〇W/mK, and thus has good thermal conductivity. (Step S109). The material of the above-mentioned heat-conducting copper-clad substrate and the manufacturing process of the above-mentioned device are the features of the present invention, but the above-mentioned mixer 200, conveying device 210''Aibu 30, retractor 400, conveying mechanism 500, baking The dryer 6, the recycling machine 700, the cutting machine 800, the laminating machine, and the kneading machine 900 are themselves known as a conventional device, and will not be described here. & The invention makes the copper-clad box, the board has the advantages of excellent thermal conductivity and easy processing of the PCB process by adding an appropriate weight percentage of the inorganic filler, and the weight ratio of the inorganic filler in the composition of the asphalt resin is 3G~60% , inorganic 201108882 filler weight ratio is too low will not be

Processing the effect of the helmet in the process of drilling, etc.; otherwise, the heat conduction effect of the invention can be passed through = good: drilling quality. Example 1 The inorganic filler in the epoxy resin is confirmed. The weight ratio of the inorganic filler in the oxyresin rubber is 5G/', °, and the weight ratio of the inorganic filler of the epoxy resin is _.°, the fourth ring of the embodiment Oxygen resin adhesive

翌 ( (4) over bake, in the copper test with the copper test project if the implementation of the U-type 1: implementation of the implementation of the substrate example, two cases of three cases of four M > ilsl thermal resistance (W / t) 0.3 0.54 0.88 1.62 2.11 Hyun A thermal conductivity value (W/mK) 0.3 0.8 1.5 3.0 4.0 νθ sign Hi-pot (KV) >3 >3 >3 >3 >3 槪PS ,H oz(lb/in) >6 7.7 7.5 6.8 6.4 PCB roughness (mil) <1.2 0.7 0.8 1.1 1.3 Machining head <1.5 0.95 1.05 1.18 1.35 The thermal conductivity test method in the above table is based on ASTM ΕΗόΙ modified

Try it. The thermal resistance test method is based on the ASTM D5470 modified test. The Hi-pot (High-pot test) test method is based on the IPC TM-650 2.5.7.25 test to test the ability of the thermal conductivity of the thermal insulation layer. PS (peel strength 'copper foil tear strength) test method according to the IPC TM-650 2.4.8 specification test 'testing the adhesion between the metal copper layer and the thermal insulation layer; testing the PCB processing of the thick chain and nails 201108882 head It is measured by the method of IPC-6012B 3.5.4. From the results in the above table, it can be seen that the heat-transfer coated steel substrate has better thermal conductivity than the conventional FR-4 _ substrate, and the influence of the coffee processing process is small. The following table is used for conducting thermal copper-plated substrates. Metal substrate and

---- --—— Test item Metal substrate ~ Ceramic substrate Example Example substrate thermal conductivity (W/mK^ 1~4 >24 ------1 1.5 3.0 Characteristics Hi-pot (KV) &gt ;3 >3 ------------ >3 ^___ PS,H oz(lb/in)_ 4~8 —:____ 7.5 6.8 Iron Holes Difficulty----- R PCB line etching is difficult. ^7 R Forced hole in the hole is difficult to make----- Easy substrate forming------- Difficult-to-easy-~~--- The above table is made of metal substrate篡柘 ΡΓβ ' T 丄, 丄 AT from i / 蜀岙 兴 网 充 于 于 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工 加工Drilling and forming are required in the drilling and forming process. The cost and process utilization are affected by the large surface area. The etching and plated copper process are due to metal and ceramics. Material and chemical and ^; night will produce unnecessary reaction and pollute the bath, all must be attached to the resistance 4: liquid tape to protect metal and ceramic change, labor and time, drilling hole 2? = resin plug The hole is drilled to form a hole After the hole is re-plated with steel, the comprehensive:: The block's thermally conductive copper-clad substrate has great advantages in PCB processing, and has the same thermal conductivity and low cost advantage as the metal substrate. *=* 201108882 The above embodiments are After the substrate of the technology is made into a PC B finished board, four 1W LEO lamps are assembled to form an LED light bar. The lamp is 33 cm long and 1 cm long, and four B lights are assembled equidistantly on the light bar. The power supply provides the same voltage l2vDC and electricity to 35 mA to make the LED light. After a small temperature balance, the illuminance meter in the black box -, a >, / / person '7VJ, ϊ ϊ LED one LED module The substrate used in the group is recorded as follows: Illuminance value (Lux) The traditional LED box substrate LED lamp burned out and the thermal conductive copper foil substrate could not be illuminated (Example 2) 480 box substrate (Example 3) 480 __Ceramic substrate 480 Metal iridium plate (aluminum metal plate) 480 In summary, the present invention has better thermal conductivity than the conventional copper-clad substrate. Finally, the thermal conductive insulating layer only needs to be pressed with the metal copper foil layer.

It can be completed, compared with ceramic substrates and metal substrates, which can greatly reduce the manufacturing cost and simplify the PCB processing process. In the LED die and group applications, there are no high-cost and difficult processing materials such as ceramic substrates and metal substrates. This result also shows that the LED lamp heats up only when the current starts, the substrate can not quickly remove the heat emitted by the LED lamp, resulting in the LED lamp can not bear the instantaneous high / JDL and damage the morning, once the heat balance is reached, the illumination can be Reach the same level. The features and spirit of the present invention are intended to be more apparent from the detailed description of the preferred embodiments. On the contrary, the intention is to cover various modifications and equivalents within the scope of the patent application of the present application. BRIEF DESCRIPTION OF THE DRAWINGS The first drawing is a flow chart of the manufacturing of the thermally conductive copper-clad substrate of the present invention; the second to fourth figures are schematic views of the manufacturing apparatus of the thermally conductive copper-clad substrate of the present invention; and the fifth figure, A schematic cross-sectional view of a thermally conductive copper clad substrate of the present invention. [Description of main component symbols] Thermally conductive copper-clad substrate 1 〇〇 Thermally conductive insulation layer 110, 110a Reinforcing material 111 Metal copper foil layer 120 Mixer 200 Conveying equipment 210 Soaking tank 300 Retractor 400 Transmission mechanism 500 Dryer 600 Recycling machine 700 cutting machine 800 press machine 900

Claims (1)

201108882 VII. Patent application scope: 1. A thermally conductive copper-clad substrate comprising: a metal copper foil layer; and a thermally conductive insulating layer laminated on the metal copper foil layer comprising: a reinforcing material, which is made of glass And the epoxy resin is attached to the reinforcing material; wherein the epoxy resin comprises an inorganic filler, and the inorganic filler has a weight percentage of 30 to 60 wt%. 2. The thermally conductive copper clad substrate of claim 1, wherein the inorganic filler is a thermally conductive filler. 3. The thermally conductive copper-clad substrate according to claim 1, wherein the inorganic filler is at least one selected from the group consisting of aluminum oxide, cerium oxide, aluminum nitride or boron nitride. . 4. The thermally conductive copper clad substrate according to claim 1, wherein the inorganic filler is in the form of a powder. 5. The thermally conductive copper-clad substrate according to claim 1, wherein the epoxy resin further comprises an adhesive, the weight percentage of the adhesive is 30 to 50 wt%, and the adhesive and the inorganic filler are The sum of the weight percentages is less than or equal to 100 wt%. 6. The thermally conductive copper clad substrate according to claim 1, wherein the epoxy resin is composed of an epoxy resin, a hardener, an inorganic filler, a catalyst, and an additive flame retardant. 12 201108882 7. The thermally conductive copper-clad substrate according to claim 6, wherein the oxidized epoxy resin is made of enamel epoxy resin, odorized epoxy resin, tetrafunctional epoxy resin, or It is composed of a polymer bisphenol oxime epoxy resin. 8. The thermally conductive copper clad substrate according to claim 6, wherein the hardener is composed of dicyandiamide, diaminodiphenylsulfonic acid, phenolic resin or acid anhydride. 9. The thermally conductive copper-clad substrate according to claim 6, wherein the additive flame retardant is an added brominated flame retardant or an added phosphorus-based flame retardant. 10. The thermally conductive copper-clad substrate according to claim 6, wherein the catalyst is 2-MI (2-mercaptoimidazole), 2PZ (2-phenylimidazole), 2E4MZ (2-ethyl, 4) -Methylimidazole). 11. The thermally conductive copper clad substrate of claim 1, wherein the metallic copper foil layer is an electrolytic copper foil layer. 12. The thermally conductive copper-clad substrate according to claim 11, wherein the inorganic filler is selected from at least one component selected from the group consisting of aluminum oxide or cerium oxide or nitriding or nitriding shed. . 13. The thermal conductivity of the thermally conductive copper clad substrate as described in claim 1 is greater than 1.0 W/mK. 13