KR101238238B1 - Thin ceramic pcb module and thermally conductive adhesive composition - Google Patents

Abstract

The present invention relates to a thin-film ceramic circuit board module and a thermally conductive adhesive composition, and more particularly, to a thin-film ceramic circuit board module and a thermally conductive adhesive composition having high heat and electrical conductivity and excellent heat dissipation.
The thin film ceramic circuit board module of the present invention includes a substrate layer made of a thin film ceramic having insulation; A pattern layer on which a conductive material is printed on the substrate layer to form a circuit; A heating element mounted on an upper portion of the substrate layer; A heat dissipation plate mounted under the substrate layer and dissipating heat generated by the heating element to the outside; It is made of a material having thermal and electrical conductivity, comprising a bonding composition for transferring the heat generated in the heating element to the heat sink by mutually bonding the lower portion of the substrate layer and the heat sink, the adhesive composition is epoxy resin 20 ~ 50% by weight, curing agent 1-20% by weight, flame retardant 5-20% by weight, plasticizer 1-10% by weight, filler 20-60% by weight, colorant 1-2% by weight, and functional additive less than 1% by weight It is characterized by consisting of a mixed composition.

Description

Thin Film Ceramic Circuit Board Module and Thermally Conductive Adhesive Composition {THIN CERAMIC PCB MODULE AND THERMALLY CONDUCTIVE ADHESIVE COMPOSITION}

The present invention relates to a thin-film ceramic circuit board module and a thermally conductive adhesive composition, and more particularly, to a thin-film ceramic circuit board module and a thermally conductive adhesive composition having high heat and electrical conductivity and excellent heat dissipation.

1 is a structural diagram of a conventional general circuit board module.

As shown in FIG. 1, a conventional general printed circuit board module includes a substrate layer 1, a heat sink 4, and an adhesive 5.

The substrate layer 1 is formed by stacking an upper copper plate 1a, an upper epoxy resin layer 1b, a lower copper plate 1c, and a lower epoxy resin layer 1d up and down, and an LED on the upper copper plate 1a. A heating element 3 such as the like is mounted.

The heat dissipation plate 4 is for dissipating heat generated from the heat generator 3 to the outside, and is coupled to the lower portion of the substrate layer 1 by the adhesive agent 5.

2 is a structural diagram of a conventional metal circuit board module.

As shown in FIG. 2, the conventional metal circuit board module includes a substrate layer 1, a heat sink 4, and an adhesive 5.

The substrate layer 1 is formed by laminating a copper plate 1e, a T-Preg (Thermal Prepreg, 1f), and an aluminum plate 1g up and down, and on the copper plate 1e, a heating element 3 such as an LED. ) Is mounted.

The heat dissipation plate 4 is for dissipating heat generated by the heat generator 3 to the outside and is coupled to the substrate layer 1 by the adhesive agent 5.

In the conventional circuit board module having a structure as shown in FIGS. 1 and 2, an insulating layer (1b, 1d) such as epoxy resin or T-Preg is disposed in the middle for insulating the upper and lower portions of the substrate layer (1). , 1f).

The insulating layers 1b, 1d, and 1f mainly consist of a polymer compound, for the purpose of ensuring electrical insulation between the upper part and the lower part of the substrate layer 1.

The material having good electrical insulation has a very low heat transfer coefficient, so that heat generated from the heating element 3 stacked on the substrate layer 1 is transferred to the lower portion of the substrate layer 1 and the heat sink 4. Decreases

In addition, the conventional circuit board is made of a complex multi-layer structure, the thickness thereof is also thick, which has the disadvantage that the heat transfer performance is reduced.

In addition, when attaching the heat sink 4 for heat radiation to the substrate layer 1, a thermal pad (TIM) is used as the adhesive 5.

In this case, the thermal pad used also has a low heat transfer coefficient, which is a factor for lowering the heat transfer performance of transferring heat generated from the heat generator 3 to the heat sink 4.

In order to solve the above problems, the present invention removes the insulating layer disposed in the middle of the substrate layer, and combines the substrate layer and the heat sink using an adhesive having excellent thermal and electrical conductivity, thereby converting the heat generated from the heating element into the heat sink. It is an object of the present invention to provide a thin film ceramic circuit board module and a thermally conductive adhesive composition which can improve the performance of transferring.

In order to achieve the above object, the thin film ceramic circuit board module of the present invention includes a substrate layer made of thin film ceramic having insulation; A pattern layer on which a conductive material is printed on the substrate layer to form a circuit; A heating element mounted on an upper portion of the substrate layer; A heat dissipation plate mounted under the substrate layer and dissipating heat generated by the heating element to the outside; It is made of a material having thermal and electrical conductivity, comprising a bonding composition for transferring the heat generated in the heating element to the heat sink by mutually bonding the lower portion of the substrate layer and the heat sink, the adhesive composition is epoxy resin 20 ~ 50% by weight, curing agent 1-20% by weight, flame retardant 5-20% by weight, plasticizer 1-10% by weight, filler 20-60% by weight, colorant 1-2% by weight, and functional additive less than 1% by weight It is characterized by consisting of a mixed composition.

In addition, in order to achieve the above object, the thermally conductive adhesive composition of the present invention, in the thermally conductive adhesive composition to transfer the heat generated in any one or more of the configuration to another configuration while bonding two or more configurations, epoxy resin 20 ~ 50% by weight, curing agent 1-20% by weight, flame retardant 5-20% by weight, plasticizer 1-10% by weight, filler 20-60% by weight, colorant 1-2% by weight, and functional additive less than 1% by weight It is characterized by consisting of a mixed composition.

The epoxy resin is selected from the group consisting of bisphenol A type epoxy resin (DGEBA Type Epoxy) resin, bisphenol F type epoxy resin (DGEBF Type Epoxy) resin, brominated epoxy resin and cycloaliyphatic epoxy resin. Or a mixture of two or more species.

The curing agent may be a modified cycloaliphatic amine, modified aliphatic amine, aromatic amine, tertiary amines, polyamide, and dicyanamide. Or a mixture of two or more selected from the group consisting of (Dicyandiamide).

It further comprises a curing accelerator, wherein the curing accelerator is made of any one or more of secondary, tertiary amine, Lewis acid accelerator, imidazole and modified amidazole accelerator.

The flame retardant is composed of one or two or more selected from the group consisting of aluminum hydroxide, phosphorus flame retardant, halogen flame retardant and bromine flame retardant.

The plasticizer is composed of one or two or more selected from the group consisting of dimer acid-modified epoxy resins.

The filler is composed of one or two or more kinds selected from the group consisting of calcium carbonate, silica and silica.

The colorant comprises one or a mixture of two or more selected from the group consisting of powdered inorganic pigments (Inorganic Pigment) and powdered organic pigments (Organic Pigment).

The functional additive is one or two or more selected from the group consisting of ethyl alcohol, silicone oil, octyl alcohol, cyclonucleoside, ethylene glycol, hydroxy benzophenone, hydroxyphenyl benzotriazole, aryl ester, oxanilide Consists of a mixture.

According to the thin film ceramic circuit board module and the thermally conductive adhesive composition of the present invention as described above has the following effects.

Since the substrate layer is made of a thin ceramic layer, there is no separate insulating layer disposed in the middle, and the thickness thereof is thin so that the thermal conductivity to the heat sink is excellent.

In addition, since the substrate layer is made of a thin ceramic layer, and is insulated by itself without a separate insulating layer, it is safe even by electricity applied to the heating element.

In addition, since the adhesive composition combining the substrate layer and the heat sink is made of a material having excellent thermal and electrical conductivity, the heat generated from the heating element is transferred to the heat sink is excellent.

In addition, the thermally conductive adhesive composition of the present invention improves thermal conductivity and adhesion, and at the same time, imparts flame retardancy, thereby increasing light efficiency of the lighting device, extending life, and preventing fire.

1 is a structural diagram of a conventional general circuit board module,
2 is a structural diagram of a conventional metal circuit board module,
3 is a structural diagram of a thin film ceramic circuit board module according to an embodiment of the present invention;
Figure 4 is a table comparing the characteristics of the circuit board module and the conventional circuit board module according to an embodiment of the present invention.

3 is a structural diagram of a thin film ceramic circuit board module according to an exemplary embodiment of the present invention.

As shown in FIG. 3, the thin film ceramic circuit board module of the present invention includes a substrate layer, a pattern layer, a heating element, a heat sink, and an adhesive composition.

The substrate layer 10 is made of a thin ceramic layer having an insulating property, the thickness is 30 ~ 600㎛.

The substrate layer 10 is manufactured using a tape casting method.

Tape casting ceramics molding process uses very fine ceramic powder in an appropriate ratio of aqueous or non-aqueous solvent, binder, plasticizer, dispersant, defoamer and surfactant. A method of forming a ceramic slurry by mixing and forming a desired thickness on a moving blade or a moving conveying film according to a desired thickness, comprising: tape casting, continuous tape casting, knife It is called by various names such as casting, doctor blade process, etc., and is one of important ceramic molding methods widely applied in various electronic ceramics manufacturing fields.

As described above, the substrate layer 10 may be manufactured using a tape casting method instead of a conventional rolling & press method, thereby mass-producing a thin film substrate.

In addition, since the substrate layer 10 of the present invention has a small thickness, the substrate layer 10 is excellent in heat transfer performance while being an insulator, and can efficiently transfer heat generated from the heat generator 30 to the heat sink 40.

That is, since the substrate layer 10 of the present invention is made of an insulator itself, it is not necessary to provide a separate insulating layer as in the prior art, and thus the thickness thereof can be made thin and the heat transfer performance can be improved.

The pattern layer 20 is formed by printing a conductive material on the substrate layer 10 to form a circuit.

The pattern layer 20 is made of a metal-based conductive material such as Ag, Au or Cu, and is printed on the substrate layer 10.

The heating element 30 is mounted on the substrate layer 10 and is made of a heating component such as an LED.

The heat sink 40 is made of a metal such as aluminum or magnesium, is mounted on the lower portion of the substrate layer 10, and radiates heat generated from the heating element 30 mounted on the upper portion of the substrate layer 10 to the outside. It plays a role.

The adhesive composition 50 couples the lower portion of the substrate layer 10 and the heat sink 40 to each other.

The adhesive composition 50 is made of a material having a thermal and electrical conductivity, that is, a heat transfer adhesive composition.

The adhesive composition 50 is applied to one surface of the heat sink 40, and then heats to bond the substrate layer 10 and the heat sink 40 to each other.

The adhesive composition 50, 20 to 50% by weight epoxy resin, 1 to 20% by weight hardener, 5 to 20% by weight flame retardant, 1 to 10% by weight plasticizer, 20 to 60% by weight filler, colorant 1 to 2 Weight percent, and less than 1 weight percent of a functional additive.

The epoxy resin is selected from the group consisting of bisphenol A type epoxy resin (DGEBA Type Epoxy) resin, bisphenol F type epoxy resin (DGEBF Type Epoxy) resin, brominated epoxy resin and cycloaliyphatic epoxy resin. Or a mixture of two or more species.

In order to maximize the specific effect, the epoxy resin can maximize workability, adhesion, and flame retardant effects through viscosity reduction without deteriorating coating properties.

The curing agent is a modified cycloaliphatic amine (Modified Cycloaliphatic Amine), modified aliphatic amine (Modified Aliphatic Amine), aromatic amine (Aromatic Amine), tertiary amines (Amine), polyamide (polyamide) and dicyanamide Or a mixture of two or more selected from the group consisting of (Dicyandiamide).

The hardener is to improve workability through controlling the curing rate while providing weather resistance and durability.

The adhesive composition 50 of the present invention may further include the curing accelerator, wherein the curing accelerator is composed of any one or more of secondary and tertiary amines, Lewis acid promoters, imidazoles, and modified amidazole accelerators. And to control the curing rate.

The flame retardant is composed of one or two or more selected from the group consisting of aluminum hydroxide, phosphorus flame retardant, halogen flame retardant and bromine flame retardant.

Such a flame retardant may cause problems such as a decrease in adhesive force and an electrical property deterioration due to excessive use of the heat generating effect of the heating element 30 such as an LED and a decrease in weather resistance, and thus an appropriate capacity should be used.

The plasticizer is composed of one or two or more selected from the group consisting of dimer acid-modified epoxy resins.

Since the plasticizer is mostly composed of an epoxy resin and a nonpolar substance, problems of coating film properties (adhesiveness, weather resistance, durability, thermal shock resistance, etc.) may occur when the amount is excessively used, and when the amount is used, the defoaming decreases. As a result, electric short phenomenon and thermal conductivity deterioration may occur.

The filler is composed of one or two or more selected from the group consisting of calcium carbonate, silica, and alumina (Al 2 O 3) powder.

The filler is made of a metal material having thermal and electrical conductivity, so that the heat generated from the heating element 30 is well conducted to the heat sink (40).

The filler is for imparting thermal conductivity, imparting necessary thixotropy, and reducing shrinkage during curing, and may cause problems such as deterioration in adhesive strength, high specific gravity, and viscosity increase when used in excess.

The colorant comprises one or a mixture of two or more selected from the group consisting of powdered organic pigments and powdered organic pigments.

These colorants are divided into powdered inorganic pigments and powdered organic pigments and mean that the average particle size is 1 to 50㎛ used to adjust the curable color.

The functional additive is one or two or more selected from the group consisting of ethyl alcohol, silicone oil, octyl alcohol, cyclonucleoside, ethylene glycol, hydroxy benzophenone, hydroxyphenyl benzotriazole, aryl ester, oxanilide Consists of a mixture.

Such functional additives are those that can maximize antifoaming properties, surface appearance and dispersion effects.

In the present invention, since the substrate layer 10 is made of 100% ceramic and has electrical insulation, the electrical safety, that is, the electrical insulation can be reliably ensured in the substrate layer 10.

Therefore, there is no problem in electrical safety even when the adhesive composition 50 having high electrical conductivity and high heat transfer performance is used.

Table 1 below shows the compounding ratio (wt%) of the components constituting the thermally conductive adhesive composition of the present invention in various preparation examples for the test.

The numerical value of components in each manufacture example is weight%.

Adhesive compositions of various formulations prepared according to the preparation examples shown in Table 1 above were applied to the bottom of the substrate layer 10 and cured to bond the substrate layer 10 and the heat sink 40 to each other.

And [Table 2] below shows the test results of the adhesive composition according to the preparation example of [Table 1].

<Test Item Specification>

● Viscosity: 10,000 ~ 100,000cps (25 ℃) (KS M 3331), O (good) when satisfied with specification, X (bad) by dissatisfaction

● Thixotropic index: 2.0 ~ 5.0 (25 ℃) (KS M 3331), O (good) when satisfied with the standard, X (bad) by dissatisfaction

● Sedimentation and shelf life: 120 ℃ × 4hr or 80 ℃ × 3day without sediment O (good), sediment occurrence X (defect)

● Anti-foaming: Visually confirm the cured product film surface, O (good) when bubble is not generated, X (defect) when bubble is generated

Thermal conductivity: 0.5 ~ 3.0 W / mk. (ASTM D 5470), O (good) if satisfied with the specification X (bad) if not satisfied

● Flame retardant: O (good) when V-O ~ V-1 (UL94) equivalent standard is satisfied, X (bad) when unsatisfactory

● Adhesion: O (good) when 5N / mm2 (KS M 3734) standard is satisfied, X (bad) when dissatisfied

Looking at the test results of the preparation example shown in Table 2, Preparation Examples 1 to 4 composition is an epoxy resin, a flame retardant, a plasticizer, a filler, a colorant, a functional additive and a component constituting the thermally conductive adhesive composition of the present invention. Proper formulation of the curing agent gave good results as shown in [Table 2].

However, in Preparation Examples 5 to 10, the blending ratio of the adhesive composition did not correspond to the ratio defined in the present invention, and at least one defect occurred according to the test items.

From these tests, it can be seen that the mixing ratio of the components constituting the thermoelectric adhesive composition of the present invention is not merely a numerical limitation but an excellent effect accordingly.

The present invention made of such a structure is made of heat transfer and insulation as follows.

When the heating element 30 is operated, heat generated from the heating element 30 is transferred to the heat dissipation plate 40 through the substrate layer 10 and the adhesive composition 50.

At this time, since the substrate layer 10 is thin and the adhesive composition 50 has excellent thermal and electrical conductivity, the heat generated from the heating element 30 is transferred through the filler of the adhesive composition 50. It is better transmitted to the heat sink 40 to be radiated to the outside.

In addition, the substrate layer 10 is formed of a thin ceramic layer, and is insulated by itself without a separate insulating layer, and is safe even by electricity applied to the heating element 30.

That is, the electricity supplied to the heating element 30 is blocked by the substrate layer 10 and is not transmitted to the adhesive composition 50 and the heat sink 40. The circuit board module of the present invention is electrically safe. It has excellent heat dissipation effect.

4 is a table comparing characteristics of a circuit board module and a conventional circuit board module according to an exemplary embodiment of the present invention.

In FIG. 4, 'PCB' means the conventional circuit board shown in FIG. 1, and 'Metal PCB' means the conventional metal circuit board shown in FIG. 2.

As shown in FIG. 4, the present invention has excellent thermal conductivity because there is no insulation layer in the substrate layer 10, and the adhesive composition 50 has thermal and electrical conductivity as compared with conventional circuit boards. Since it is made of a material having a very high thermal conductivity, its thickness is also thin, the maximum operating temperature is excellent.

In addition, the present invention is improved thermal conductivity and adhesion than the conventional thermal conductive tape, and at the same time it is imparted flame retardant, it is possible to obtain the effect of increasing the light efficiency of LED lighting equipment, extending the life and preventing fire.

The thin film ceramic circuit board module and the thermally conductive adhesive composition of the present invention are not limited to the above-described embodiments, and may be variously modified and implemented within the allowable technical spirit of the present invention.

10: substrate layer, 20: pattern layer, 30: heating element, 40: heat sink, 50: adhesive composition,

Claims (10)

A substrate layer made of a thin film ceramic having insulation;
A pattern layer on which a conductive material is printed on the substrate layer to form a circuit;
A heating element mounted on an upper portion of the substrate layer;
A heat dissipation plate mounted under the substrate layer and dissipating heat generated by the heating element to the outside;
It is made of a material having a thermal and electrical conductivity, comprising a bonding composition for transferring the heat generated from the heating element to the heat sink by coupling the lower portion of the substrate layer and the heat sink,
The adhesive composition is,
20-50% by weight of epoxy resin, 1-20% by weight of hardener, 5-20% by weight of flame retardant, 1-10% by weight of plasticizer, 20-60% by weight of filler, 1-2% by weight of colorant, and less than 1 functional additive Thin-film ceramic circuit board module, characterized in that the composition consisting of weight percent of the mixture. delete The method of claim 1,
The epoxy resin,
One or two or more selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, brominated epoxy resin and cycloaliyphatic epoxy resin. Thin film ceramic circuit board module, characterized in that consisting of a mixture. The method of claim 1,
The curing agent,
With Modified Cycloaliphatic Amine, Modified Aliphatic Amine, Aromatic Amine, Tertiary Amines, Polyamide and Dicyandiamide Thin film ceramic circuit board module, characterized in that consisting of one or two or more mixtures selected from the group consisting of. The method of claim 1,
The adhesive composition further comprises a curing accelerator,
The curing accelerator,
A thin film ceramic circuit board module comprising any one or more of secondary and tertiary amines, Lewis acid promoters, imidazoles, and modified amidazole accelerators. The method of claim 1,
The flame retardant,
A thin film ceramic circuit board module comprising one or more mixtures selected from the group consisting of aluminum hydroxide, phosphorus-based flame retardants, halogen-based flame retardants and bromine-based flame retardants. The method of claim 1,
The plasticizer is,
A thin film ceramic circuit board module comprising one or two or more mixtures selected from the group consisting of dimer acid-modified epoxy resins. The method of claim 1,
The filler,
A thin film ceramic circuit board module comprising one or more mixtures selected from the group consisting of calcium carbonate, silica and alumina powders. The method of claim 1,
The colorant,
A thin film ceramic circuit board module comprising one or two or more kinds selected from the group consisting of powdered inorganic pigments (Inorganic Pigment) and powdered organic pigments (Organic Pigment). The method of claim 1,
The functional additive,
Ethyl alcohol, silicone oil, octyl alcohol, cyclonucleic acid, ethylene glycol, hydroxy benzophenone, hydroxyphenyl benzotriazole, aryl esters, oxanilides selected from the group consisting of one or two or more Thin-film ceramic circuit board module.

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