CN104845047A - Production method of aluminum-base copper-clad laminate high-heat-conductivity electric-insulation dielectric adhesive film - Google Patents
Production method of aluminum-base copper-clad laminate high-heat-conductivity electric-insulation dielectric adhesive film Download PDFInfo
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Abstract
The invention provides a production method of an aluminum-base copper-clad laminate high-heat-conductivity electric-insulation dielectric adhesive film, which comprises the following steps: 1. synthesizing a polysiloxane epoxy resin from 1,2-epoxy-4-vinylcyclohexane and hydrogen-terminated silicone oil by using a platinum as a catalyst; 2. adding AlN powder into a coupling agent dilute solution, stirring uniformly, and drying to obtain modified AlN powder; 3. uniformly mixing an epoxy reactive diluent AGE, the polysiloxane epoxy resin, the modified AlN powder, a curing agent and an accelerator to obtain an adhesive liquid; and 4. carrying out extrusion calendering forming on the adhesive liquid by an extrusion calender to finally obtain the aluminum-base copper-clad laminate high-heat-conductivity electric-insulation dielectric adhesive film. The thickness of the produced adhesive film is 100 mu m, the heat conductivity coefficient is not less than 2.6 W/m.K, and the breakdown voltage is not less than 9kV. Thus, the adhesive film satisfies the national regulation requirements and has wide application prospects.
Description
Technical field
The invention belongs to aluminum-based copper-clad plate packaged material technical field, be specifically related to a kind of production method of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane.
Background technology
Copper-clad plate is the extremely important base mateiral of printed circuit board, and it is all complete electronic sets, comprises the indispensable important electronic materials of all electronic products such as Aeronautics and Astronautics, remote sensing, remote measurement, remote control, communication, computer, Industry Control, household electrical appliance.Along with the develop rapidly of electronic industry, the volume of electronic product is more and more less, and power density is increasing, how to seek to dispel the heat and the best approach of structure design, just becomes the challenge that of current electronic industry design is huge.Aluminium base is one of effective means solving heat dissipation problem beyond doubt.It has become the main flow substrate that large power supply, military electronic and high frequency micro-electronic device use.
Aluminium base is also the needs that surface mounting technology (SMT) develops; In circuit design, thermodiffusion is very effectively processed; Reduce product operating temperature, improve product power density and reliability, extend product work-ing life; Reduce small product size, reduce hardware and assembly cost; Replace frangible ceramic substrate, obtain the advantages such as better mechanical resisting power, become one of whole world high-technology field most with prospects, it aluminium base surface is directly made insulation layer or claims dielectric layer, make circuit layer at dielectric layer surface again, wire can directly be bonded on circuit layer by LED module.
2010, China's copper-clad plate output accounts for 65% of Gross World Product, wherein aluminium base 3,500,000 square metres, the aluminium base of import top grade reaches 1,000,000 square metres, according to the prediction of copper-clad plate association, 12 ends, China's aluminium base output is more than 1,500 ten thousand square metres, compared with same kind of products at abroad, very large gap is also there is in the high thermal conductivity aluminium-based copper-clad laminate of China in quality.This is because the dielectric insulating film of the high thermal conductivity aluminium-based copper-clad laminate of China's production nearly all will from external import.China's aluminium base is also only only limitted to low side field in the application of LED industry at present.As developed the dielectric insulating film of autonomous property right, the aluminium base of China will face the risk losing market.
Dielectric glued membrane is exactly the core of high thermal conductivity aluminium-based copper-clad laminate, dielectric glued membrane is generally primarily of epoxy resin, solidifying agent, promotor, thinner, the composition such as filler and dispersion agent, make the method that high thermal conductivity aluminium-based copper coated foil plate insulation layer adopts usually and have casting method, scrape roller method, silk screen process etc., because high thermal conductive resin system is compared with resin system in the past, its solids content is large, viscosity is large, and require that there is good snappiness, can serialization gluing, good glass transformation temperature is had after solidification, thermal conductivity, voltage breakdown and stripping strength, table body resistivity and dielectric properties low, resistance toly dip solderabilityly to wait feature well.This brings huge challenge just to the composition of dielectric glued membrane and making.
China is the production and consumption big country of aluminium base, but cannot the monopolization of breaks through foreign because not having dielectric membrane technique.High thermal conductivity aluminum matrix plate dielectric insulating film is met by exploitation and processability, each one-tenth that we not only will study heat conductive insulating deielectric-coating is grouped into, more will from polysiloxane-modified the starting with of thermal isolation deielectric-coating component epoxy, 100 microns of dielectric insulating films are prepared by research extrusion calendaring equipment, the external dielectric glued membrane that all adopts at present produces aluminium base, it is on aluminium base, apply high-heat-conductivity glue stick that the aluminium base of my China is produced, then thereon that Copper Foil hot pressing is shapingly to make by hand, production cycle is long, production efficiency is low, Copper Foil easily folds, yield rate is low, seriously constrain the fast development of China's aluminium base industry.
External is secret to aluminium base dielectric membrane technique completely, domestic state-run 704 institute of factory Liu Yang and all people such as prosperous in Shengyi Science and Technology Co., Ltd, Guangdong hole have carried out the research more than ten years of this respect, but dielectric glued membrane film-forming properties is bad, heat-drawn wire, thermal conductivity and stripping strength are still on the low side, and the adaptive phase of dielectric glued membrane is shorter simultaneously.The demand of domestic high thermal conductivity aluminium-based copper-clad laminate can not be met, this dielectric glued membrane is mainly from U.S. Bei Gesi (Bergquist), Laird, NEC chemistry (DENKA) and Taiwan import, and glued membrane price reaches 300 yuan/m
2.This just substantially increases the cost of aluminium base, therefore the aluminium base industry that research and development have an independent intellectual property right is correlated with high added value subsidiary material, be conducive to the complete and benign development of China's electronic industry chain, promote the production domesticization of China's opto-electronic device high-performance package material.
The gordian technique of restriction high heat conductive insulating medium glued membrane is epoxy resin modification, glued membrane moiety and dielectric insulating film machine-shaping device and technique.
The epoxy resin manufacturer of China and R&D institution a lot, but for industrialized special epoxy resin, no matter from kind aspect also with quality aspect, all also have very large difference with external, so just limit resin in high added value, particularly the widespread use of electronics aspect.All there is the low conversion rate of synthetic prepolymer synthesis, the irrational distribution of prepolymer molecular weight and molecular weight, the shortcomings such as reaction is unstable, so improve Synthesis conversion, the distribution of prepolymer molecular weight and molecular weight is rationally the key of the modification of exploitation special epoxy resin and epoxy resin.
Prepare the high heat conductive insulating medium glued membrane met for aluminium base, should from epoxy resin, solidifying agent, the kind of auxiliary agent and consumption aspect carry out screening and optimizing, and study each material for the impact of glue film performance as density, hardness, tensile strength, screen resilience, stripping strength, high-frequency dielectric constant, volume resistance, the resistance to aspect such as dip solderability.
Summary of the invention
Technical problem to be solved by this invention is for above-mentioned the deficiencies in the prior art, provides a kind of production method of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane.The made glued membrane of the present invention is not adding any solvent, under there is no the condition of toughness properties-correcting agent yet, still there is excellent flexility, and glued membrane density, hardness, tensile strength, screen resilience, stripping strength, high-frequency dielectric constant, volume resistance, the resistance to performance such as dip solderability all meet national standard requirement, are with a wide range of applications.
For solving the problems of the technologies described above, the technical solution used in the present invention is: a kind of production method of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane, and it is characterized in that, the method comprises the following steps:
Step one, employing 1,2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil are raw material, employing platinum complex is catalyzer, 1, the mol ratio of 2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil is (3 ~ 5): 1, and catalyst levels is 0.01% ~ 0.02% of 1,2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil total mass, temperature of reaction is react 6h ~ 10h under the condition of 80 DEG C ~ 90 DEG C, obtains polysiloxane epoxy resin;
Step 2, by coupling agent and dehydrated alcohol in mass ratio 1: (80 ~ 120) mix, obtain coupling agent diluent, then AlN powder is joined in coupling agent diluent, put into loft drier after stirring dry, until dehydrated alcohol volatilizees completely, obtain Modification on Al N powder; The mass ratio of described AlN powder and coupling agent diluent is 1: (0.8 ~ 1.2);
Step 3, by Modification on Al N powder described in polysiloxane epoxy resin described in epoxy active diluent AGE, step one and step 2 in mass ratio 1: 2: (6 ~ 8) mix, then add solidifying agent and promotor, after mixing, obtain glue; The add-on of described solidifying agent is 6% ~ 8% of polysiloxane epoxy resin quality, and the add-on of described promotor is 0.3% ~ 0.8% of polysiloxane epoxy resin quality;
Step 4, to adopt extrusion calendaring machine to carry out extrusion calendaring to glue described in step 3 shaping, and finally obtaining thickness is 100 μm, and thermal conductivity is not less than 2.6W/mK, and voltage breakdown is not less than the aluminum-based copper-clad plate high heat conductive insulating medium glued membrane of 9kV.
The production method of above-mentioned a kind of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane, it is characterized in that, the colourity of the epoxy resin of polysiloxane described in step one is not more than 2Gardner, viscosity is 8000cps ~ 15000cps, epoxy equivalent (weight) is 400g/eq ~ 500g/eqg/eq, and number-average molecular weight is 520 ~ 580.
The production method of above-mentioned a kind of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane, it is characterized in that, described in step one 1, the mol ratio of 2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil is 4: 1, described catalyst levels is 1,2-epoxy-4-vinyl cyclohexane and 0.018% of end hydrogen silicone oil total mass, the temperature of described reaction is 85 DEG C, and the time of described reaction is 8h.
The production method of above-mentioned a kind of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane, it is characterized in that, the median size of the powder of AlN described in step 2 is 5 μm.
The production method of above-mentioned a kind of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane, it is characterized in that, coupling agent described in step 2 is silane coupling A-187
The production method of above-mentioned a kind of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane, it is characterized in that, solidifying agent described in step 3 is Dyhard RU 100, and described promotor is imidazoles.
The production method of above-mentioned a kind of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane, it is characterized in that, the add-on of solidifying agent described in step 3 is 7% of polysiloxane epoxy resin quality, and the add-on of described promotor is 0.5% of polysiloxane epoxy resin quality.
The present invention compared with prior art has the following advantages:
1, the present invention is by the adjustment of each component of high heat conductive insulating medium glue and extrusion calendaring moulding process, thus prepares the high heat conductive insulating deielectric-coating of thickness about 100 μm, excellent performance.Meet the high heat conductive insulating medium glued membrane produced, make it can apply the aluminium base of LED illumination, large power supply, military electronic and high frequency micro-electronic device aspect, solve the heat dissipation problem of electron device, thus reduce product operating temperature, improve product power density and reliability, extend product work-ing life; Reduce small product size, reduce hardware and assembly cost; Replace frangible ceramic substrate, obtain the advantages such as better mechanical resisting power;
2, the present invention adopts the shaping environmental pollution overcoming traditional molding methods solvent evaporates and cause of extrusion calendaring;
3, the present invention can improve the voltage breakdown of high-heat-conductionaluminum aluminum base copper clad board, resistance to dip solderability and thermal conductivity etc.;
4, the present invention's extrusion calendaring molding device used is existing installation, and moulding process is simple, and product stability easily ensures.
5, the made glued membrane of the present invention is not adding any solvent, under there is no the condition of toughness properties-correcting agent yet, still there is excellent flexility, and glued membrane density, hardness, tensile strength, screen resilience, stripping strength, high-frequency dielectric constant, volume resistance, the resistance to performance such as dip solderability all meet national standard requirement, are with a wide range of applications.
Below in conjunction with embodiment, the present invention is described in further detail.
Embodiment
Embodiment 1
The production method of the present embodiment aluminum-based copper-clad plate high heat conductive insulating medium glued membrane comprises the following steps:
Step one, employing 1,2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil are raw material, employing platinum complex is catalyzer, 1, the mol ratio of 2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil is 4: 1, and the quality of catalyzer is 0.018% of 1,2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil total mass, temperature of reaction is react 8h under the condition of 85 DEG C, obtains polysiloxane epoxy resin;
Colourity≤the 2Gardner of the polysiloxane epoxy resin synthesized by the present embodiment, viscosity is 10000cps ~ 12000cps, and epoxy equivalent (weight) is 460g/eq ~ 480g/eq, and number-average molecular weight is 520 ~ 540;
Step 2, silane coupling A-187 and dehydrated alcohol to be mixed in mass ratio at 1: 100, obtain coupling agent diluent, then by median size be the AlN powder of 5 μm join stir in coupling agent diluent after to put into loft drier dry, until dehydrated alcohol volatilizees completely, obtain Modification on Al N powder; The mass ratio of described AlN powder and coupling agent diluent is 1: 1;
Step 3, Modification on Al N powder described in polysiloxane epoxy resin described in epoxy active diluent AGE, step one and step 2 to be mixed in mass ratio at 1: 2: 7, then adding Dyhard RU 100 is solidifying agent, adding imidazoles is promotor, the add-on of Dyhard RU 100 is 7% of polysiloxane epoxy resin quality, the add-on of imidazoles is 0.5% of polysiloxane epoxy resin quality, obtains glue after mixing;
Step 4, to adopt extrusion calendaring machine to carry out extrusion calendaring to glue described in step 3 shaping, finally obtains aluminum-based copper-clad plate high heat conductive insulating medium glued membrane.
The thickness of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane prepared by the present embodiment is 100 μm, and thermal conductivity is not less than 2.6W/mK, and voltage breakdown is not less than 9kV.
Embodiment 2
The production method of the present embodiment aluminum-based copper-clad plate high heat conductive insulating medium glued membrane comprises the following steps:
Step one, employing 1,2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil are raw material, employing platinum complex is catalyzer, 1, the mol ratio of 2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil is 3: 1, and the quality of catalyzer is 0.01% of 1,2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil total mass, temperature of reaction is react 10h under the condition of 80 DEG C, obtains polysiloxane epoxy resin;
Colourity≤the 2Gardner of the polysiloxane epoxy resin synthesized by the present embodiment, viscosity is 8000cps ~ 11000cps, and epoxy equivalent (weight) is 450g/eq ~ 470g/eq, and number-average molecular weight is 520 ~ 540;
Step 2, silane coupling A-187 and dehydrated alcohol to be mixed in mass ratio at 1: 80, obtain coupling agent diluent, then by median size be the AlN powder of 5 μm join stir in coupling agent diluent after to put into loft drier dry, until dehydrated alcohol volatilizees completely, obtain Modification on Al N powder; The mass ratio of described AlN powder and coupling agent diluent is 1: 0.8;
Step 3, Modification on Al N powder described in polysiloxane epoxy resin described in epoxy active diluent AGE, step one and step 2 to be mixed in mass ratio at 1: 2: 6, then adding Dyhard RU 100 is solidifying agent, adding imidazoles is promotor, the add-on of Dyhard RU 100 is 6% of polysiloxane epoxy resin quality, the add-on of imidazoles is 0.3% of polysiloxane epoxy resin quality, obtains glue after mixing;
Step 4, to adopt extrusion calendaring machine to carry out extrusion calendaring to glue described in step 3 shaping, finally obtains aluminum-based copper-clad plate high heat conductive insulating medium glued membrane.
The thickness of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane prepared by the present embodiment is 100 μm, and thermal conductivity is not less than 2.6W/mK, and voltage breakdown is not less than 9kV.
Embodiment 3
The production method of the present embodiment aluminum-based copper-clad plate high heat conductive insulating medium glued membrane comprises the following steps:
Step one, employing 1,2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil are raw material, employing platinum complex is catalyzer, 1, the mol ratio of 2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil is 5: 1, and the quality of catalyzer is 0.02% of 1,2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil total mass, temperature of reaction is react 6h under the condition of 90 DEG C, obtains polysiloxane epoxy resin;
Colourity≤the 2Gardner of the polysiloxane epoxy resin synthesized by the present embodiment, viscosity is 12000cps ~ 15000cps, and epoxy equivalent (weight) is 470g/eq ~ 500g/eq, and number-average molecular weight is 550 ~ 580;
Step 2, silane coupling A-187 and dehydrated alcohol to be mixed in mass ratio at 1: 120, obtain coupling agent diluent, then by median size be the AlN powder of 5 μm join stir in coupling agent diluent after to put into loft drier dry, until dehydrated alcohol volatilizees completely, obtain Modification on Al N powder; The mass ratio of described AlN powder and coupling agent diluent is 1: 1.2;
Step 3, Modification on Al N powder described in polysiloxane epoxy resin described in epoxy active diluent AGE, step one and step 2 to be mixed in mass ratio at 1: 2: 8, then adding Dyhard RU 100 is solidifying agent, adding imidazoles is promotor, the add-on of Dyhard RU 100 is 8% of polysiloxane epoxy resin quality, the add-on of imidazoles is 0.8% of polysiloxane epoxy resin quality, obtains glue after mixing;
Step 4, to adopt extrusion calendaring machine to carry out extrusion calendaring to glue described in step 3 shaping, finally obtains aluminum-based copper-clad plate high heat conductive insulating medium glued membrane.
The thickness of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane prepared by the present embodiment is 100 μm, and thermal conductivity is not less than 2.6W/mK, and voltage breakdown is not less than 9kV.
Embodiment 4
The production method of the present embodiment aluminum-based copper-clad plate high heat conductive insulating medium glued membrane comprises the following steps:
Step one, employing 1,2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil are raw material, employing platinum complex is catalyzer, 1, the mol ratio of 2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil is 5: 1, and the quality of catalyzer is 0.015% of 1,2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil total mass, temperature of reaction is react 8h under the condition of 85 DEG C, obtains polysiloxane epoxy resin;
Colourity≤the 2Gardner of the polysiloxane epoxy resin synthesized by the present embodiment, viscosity is 11000cps ~ 14000cps, and epoxy equivalent (weight) is 450g/eq ~ 480g/eq, and number-average molecular weight is 540 ~ 560;
Step 2, silane coupling A-187 and dehydrated alcohol to be mixed in mass ratio at 1: 100, obtain coupling agent diluent, then by median size be the AlN powder of 5 μm join stir in coupling agent diluent after to put into loft drier dry, until dehydrated alcohol volatilizees completely, obtain Modification on Al N powder; The mass ratio of described AlN powder and coupling agent diluent is 1: 1;
Step 3, Modification on Al N powder described in polysiloxane epoxy resin described in epoxy active diluent AGE, step one and step 2 to be mixed in mass ratio at 1: 2: 7, then adding Dyhard RU 100 is solidifying agent, adding imidazoles is promotor, the add-on of Dyhard RU 100 is 7% of polysiloxane epoxy resin quality, the add-on of imidazoles is 0.5% of polysiloxane epoxy resin quality, obtains glue after mixing;
Step 4, to adopt extrusion calendaring machine to carry out extrusion calendaring to glue described in step 3 shaping, finally obtains aluminum-based copper-clad plate high heat conductive insulating medium glued membrane.
The thickness of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane prepared by the present embodiment is 100 μm, and thermal conductivity is not less than 2.6W/mK, and voltage breakdown is not less than 9kV.
Test glued membrane prepared by embodiment 1 to 4 by national standard test request, test data is in table 1.
The experimental test data of the made glued membrane of table 1 embodiment of the present invention 1 to 4
As shown in Table 1, high heat conductive insulating medium glued membrane prepared by the present invention, its excellent performance, meets national regulation requirement, is with a wide range of applications.
The above is only preferred embodiment of the present invention, not imposes any restrictions the present invention.Every above embodiment is done according to invention technical spirit any simple modification, change and equivalence change, all still belong in the protection domain of technical solution of the present invention.
Claims (7)
1. a production method for aluminum-based copper-clad plate high heat conductive insulating medium glued membrane, it is characterized in that, the method comprises the following steps:
Step one, employing 1,2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil are reaction raw materials, employing platinum complex is catalyzer, 1, the mol ratio of 2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil is (3 ~ 5): 1, and catalyst levels is 0.01% ~ 0.02% of 1,2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil total mass, temperature of reaction is react 6h ~ 10h under the condition of 80 DEG C ~ 90 DEG C, obtains polysiloxane epoxy resin;
Step 2, by coupling agent and dehydrated alcohol in mass ratio 1: (80 ~ 120) mix, obtain coupling agent diluent, then AlN powder is joined in coupling agent diluent, put into loft drier after stirring dry, until dehydrated alcohol volatilizees completely, obtain Modification on Al N powder; The mass ratio of described AlN powder and coupling agent diluent is 1: (0.8 ~ 1.2);
Step 3, by Modification on Al N powder described in polysiloxane epoxy resin described in epoxy active diluent AGE, step one and step 2 in mass ratio 1: 2: (6 ~ 8) mix, then add solidifying agent and promotor, after mixing, obtain glue; The add-on of described solidifying agent is 6% ~ 8% of polysiloxane epoxy resin quality, and the add-on of described promotor is 0.3% ~ 0.8% of polysiloxane epoxy resin quality;
Step 4, to adopt extrusion calendaring machine to carry out extrusion calendaring to glue described in step 3 shaping, and finally obtaining thickness is 100 μm, and thermal conductivity is not less than 2.6W/mK, and voltage breakdown is not less than the aluminum-based copper-clad plate high heat conductive insulating medium glued membrane of 9kV.
2. the production method of a kind of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane according to claim 1, it is characterized in that, the colourity of the epoxy resin of polysiloxane described in step one is not more than 2Gardner, viscosity is 8000cps ~ 15000cps, epoxy equivalent (weight) is 400g/eq ~ 500g/eqg/eq, and number-average molecular weight is 520 ~ 580.
3. the production method of a kind of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane according to claim 1, it is characterized in that, described in step one 1, the mol ratio of 2-epoxy-4-vinyl cyclohexane and end hydrogen silicone oil is 4: 1, described catalyst levels is 1,2-epoxy-4-vinyl cyclohexane and 0.018% of end hydrogen silicone oil total mass, the temperature of described reaction is 85 DEG C, and the time of described reaction is 8h.
4. the production method of a kind of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane according to claim 1, it is characterized in that, the median size of the powder of AlN described in step 2 is 5 μm.
5. the production method of a kind of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane according to claim 1, it is characterized in that, coupling agent described in step 2 is silane coupling A-187.
6. the production method of a kind of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane according to claim 1, it is characterized in that, solidifying agent described in step 3 is Dyhard RU 100, and described promotor is imidazoles.
7. the production method of a kind of aluminum-based copper-clad plate high heat conductive insulating medium glued membrane according to claim 1, it is characterized in that, the add-on of solidifying agent described in step 3 is 7% of polysiloxane epoxy resin quality, and the add-on of described promotor is 0.5% of polysiloxane epoxy resin quality.
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