CN202121865U - Copper foil base plate used for flexible printed circuit - Google Patents
Copper foil base plate used for flexible printed circuit Download PDFInfo
- Publication number
- CN202121865U CN202121865U CN2011202047409U CN201120204740U CN202121865U CN 202121865 U CN202121865 U CN 202121865U CN 2011202047409 U CN2011202047409 U CN 2011202047409U CN 201120204740 U CN201120204740 U CN 201120204740U CN 202121865 U CN202121865 U CN 202121865U
- Authority
- CN
- China
- Prior art keywords
- copper foil
- printed circuit
- flexible printed
- layer
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
A copper foil base plate used for a flexible printed circuit relates to the flexible printed circuit. The copper foil base plate includes a polyimide base layer and a copper foil. The copper foil is pasted on one surface of the polyimide base layer, and the other surface of the polyimide base layer is coated with a black shielding layer, and the thickness of the black shielding layer is 5 to 20 micrometers. The beneficial effects are that the black shielding layer is very thin (5 to 20 micrometers) but has an excellent shielding effect, thus playing an excellent shielding function to the circuit design of a circuit layer of the flexible printed circuit. A glue of excellent thermal conductivity is used in the black shielding layer to play the thermal conducting function, so the thermal radiation performance is improved. The copper foil base plate used for the flexible printed circuit is simple in technology, low in cost, and easy to popularize.
Description
Technical field
The utility model relates to flexible PCB, refers in particular to a kind of copper clad laminate that is used for flexible PCB.
Background technology
General printed circuit board (PCB) is because therefore the many electronic component of top carrying and must being fixedly mounted in the equipment, must have certain thickness and mechanical strength.Flexible PCB (being FPC) is the printed circuit board (PCB) of processing with flexible insulating substrate.It can bending, coiling etc., can not belong to the limitation of installing space with installing space flexible topology, thereby it is integrated to realize that the electronic devices and components assembling is connected with lead, has broken through the limitation of traditional interconnection technique.Also have characteristics in light weight, that volume is little, thermal diffusivity is good.
The application of flexible PCB constantly enlarges; The existing application widely in fields such as camera, minicom, household appliances and communications; At aspects such as notebook computer, LCD, digital camera, mobile phones, the application prospect of flexible PCB is very greatly very big especially.
Requirement to copper clad laminate in the flexible PCB is very high.Polyimide copper foil substrate with polyimide resin is made is also widely-used; Polyimide layer wherein is generally yellow or high light transmittance person; When causing being applied to flexible PCB thereafter; Make flexible PCB line layer line design all because of transparent exposure undoubtedly, for plagiarizing facility taking advantage of.Simultaneously, when making polyimide layer, change production procedure again, bring inconvenience if add other dark pigment.
Summary of the invention
The utility model is intended to overcome the above-mentioned deficiency of prior art, and a kind of copper clad laminate that is used for flexible PCB is provided.Its thin thickness, good to the screening effect of the line design of the line layer of flexible PCB, and manufacture craft is simple.
For this reason, the technical scheme of a kind of copper clad laminate that is used for flexible PCB of the utility model is following:
A kind of copper clad laminate that is used for flexible PCB of structure the utility model comprises insulated substrate and Copper Foil, and Copper Foil is adhered on the surface of insulated substrate, and, on another surface of insulated substrate, apply the black shielding layer.
Technique scheme is further set forth:
The thickness of said black shielding layer is 3～5 microns.
Insulated substrate is a polyimide layer, and polyimides is usually said polyimide resin.
A kind of copper clad laminate that is used for flexible PCB of the utility model is compared with prior art; Its beneficial effect is: one of which, and the screening effect of black shielding layer is good, and very thin; 3～5 microns, the line design of the line layer of flexible PCB had very good bridging effect.Its two, use the good glue of thermal conductivity in the black shielding layer, can play the effect of heat conduction, improve heat dispersion.Its three, technology is simple, cost of manufacture is low, is beneficial to popularization.
Description of drawings
Fig. 1 is the utility model sketch map.
Among the figure: 1, insulated substrate; 2, Copper Foil; 3, black shielding layer.
Embodiment
Below, in conjunction with accompanying drawing, introduce the embodiment of the utility model.
As shown in Figure 1, a kind of copper clad laminate that is used for flexible PCB of the utility model comprises insulated substrate 1 and Copper Foil 2, and Copper Foil 2 is adhered on the surface of insulated substrate 1, and, on another surface of insulated substrate 1, apply black shielding layer 3.
The thickness of said black shielding layer 3 is 3～5 microns.
Said black shielding layer 3 is the mixed layer of resin and carbon black, adds carbon black powders in the resin, is coated on another surface of insulated substrate 1, solidifies to get final product.Resin is epoxy resin, oleic series resin, silicon rubber series plastics, gather ring xylenes series plastics or bimaleimide resin etc., also two or three mixed type among them.
Insulated substrate is a polyimide layer, and polyimides is usually said polyimide resin.
Copper Foil 2 is electrolytic copper foil or rolled copper foil, and in the practical application, the thickness of Copper Foil 2 is 8～20 microns.
The above only is the preferred embodiment of the utility model, is not the technical scope of the utility model is done any restriction.The technical staff of the industry; Under the inspiration of present technique scheme; Can make some distortion and revise, every technical spirit according to the utility model all still belongs in the scope of the utility model technical scheme above any modification, equivalent variations and modification that embodiment did.
Claims (2)
1. copper clad laminate that is used for flexible PCB, it is characterized in that: comprise insulated substrate and Copper Foil, Copper Foil is adhered on the surface of insulated substrate, and, on another surface of insulated substrate, apply the black shielding layer.
2. a kind of copper clad laminate that is used for flexible PCB according to claim 1 is characterized in that: the thickness of said black shielding layer is 3～5 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202047409U CN202121865U (en) | 2011-06-17 | 2011-06-17 | Copper foil base plate used for flexible printed circuit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011202047409U CN202121865U (en) | 2011-06-17 | 2011-06-17 | Copper foil base plate used for flexible printed circuit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202121865U true CN202121865U (en) | 2012-01-18 |
Family
ID=45462899
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011202047409U Expired - Fee Related CN202121865U (en) | 2011-06-17 | 2011-06-17 | Copper foil base plate used for flexible printed circuit |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202121865U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104575691A (en) * | 2014-12-31 | 2015-04-29 | 东莞市蓝姆材料科技有限公司 | Shielding composite copper foil and pair twist data transmission line applying same |
| CN105392272A (en) * | 2015-10-16 | 2016-03-09 | 京东方科技集团股份有限公司 | Flexible circuit board, chip-on-film, binding method and display device using the flexible circuit board and the chip-on-film |
| CN110352732A (en) * | 2019-08-21 | 2019-10-22 | 厦门通秴科技股份有限公司 | A kind of dragon fruit promotees flower increasing of quality and production LED light spectrum formula and its device and application |
-
2011
- 2011-06-17 CN CN2011202047409U patent/CN202121865U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104575691A (en) * | 2014-12-31 | 2015-04-29 | 东莞市蓝姆材料科技有限公司 | Shielding composite copper foil and pair twist data transmission line applying same |
| CN105392272A (en) * | 2015-10-16 | 2016-03-09 | 京东方科技集团股份有限公司 | Flexible circuit board, chip-on-film, binding method and display device using the flexible circuit board and the chip-on-film |
| WO2017063490A1 (en) * | 2015-10-16 | 2017-04-20 | 京东方科技集团股份有限公司 | Flexible circuit board, chip-on-film, binding method by using same, and display device |
| US10299384B2 (en) | 2015-10-16 | 2019-05-21 | Boe Technology Group Co., Ltd. | Flexible printed circuit, chip on film, and bonding method and display device using the same |
| CN110352732A (en) * | 2019-08-21 | 2019-10-22 | 厦门通秴科技股份有限公司 | A kind of dragon fruit promotees flower increasing of quality and production LED light spectrum formula and its device and application |
| CN110352732B (en) * | 2019-08-21 | 2021-06-29 | 厦门通秴科技股份有限公司 | Dragon fruit flower-promoting, yield-increasing and quality-increasing LED spectrum formula, device and application thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120118 Termination date: 20200617 |