CN204069481U - A kind of battery protection wiring board with overcoat and solder mask structure - Google Patents
A kind of battery protection wiring board with overcoat and solder mask structure Download PDFInfo
- Publication number
- CN204069481U CN204069481U CN201420398465.2U CN201420398465U CN204069481U CN 204069481 U CN204069481 U CN 204069481U CN 201420398465 U CN201420398465 U CN 201420398465U CN 204069481 U CN204069481 U CN 204069481U
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- overcoat
- solder mask
- copper foil
- foil layer
- flexible board
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Abstract
The utility model discloses a kind of battery protection wiring board with overcoat and solder mask structure, comprises flexible board substrate, and is located at the copper foil layer of flexible board substrate both sides, copper foil layer is also provided with overcoat; Flexible board substrate, copper foil layer are consistent with the width of overcoat; This overcoat is the overcoat being spliced setting by the coverlay of same thickness and solder mask level and formed, and the thickness range of overcoat is 0.5mil-1mil.The utility model is by improving the cover layer in existing FPC structure; by the overcoat that coverlay+solder mask combines; meet the performance requirement of battery protecting plate, protect at the region coverlay that need bend, and need the region solder mask of high density distribution prototype part to protect.Its thickness range is set to 0.5mil-1mil, good stability simultaneously, has good protective capacities.Plan plot of the present utility model is ingenious, and structure is simple, is easy to realize, has good practicality.
Description
Technical field
The utility model belongs to wiring board techniques field, is specifically related to a kind of battery protection wiring board with overcoat and solder mask structure.
Background technology
In electron trade, printed circuit board (PCB) can be divided into PCB(Printed Circuit Board substantially) and FPC(Flexible Printed Circuit), i.e. hard printed circuit board and flexible printed circuit board.
Wherein, FPC flexible printed circuit board, also known as Flexible Printed Circuit, flex circuit application, be called for short soft board or FPC, have the advantages that distribution density is high, lightweight, thickness is thin, and it has following features: 1, can free bend, folding, winding, arbitrarily can to move and flexible at three dimensions; 2, perfect heat-dissipating, can utilize FPC reduced volume; 3, realize lightweight, miniaturization, slimming, thus reach the feature such as component arrangement and wire connecting integration, be therefore widely used on a lot of product such as mobile phone, notebook computer, PDA, digital camera, LCM.
At present, the structure of existing PCB is solder mask+substrate+solder mask, or solder mask 300+CU(copper as shown in Figure 1, Copper Foil) layer 200+ substrate 100(FR4 substrate, hard substrate)+CU layer 200+ solder mask structure 300.Existing FPC be integrated with Copper Foil and solid pressing by flexible insulation film after conductor through processing, see Fig. 2, its structure of also Jiu Shi Said is CV(coverlayer, coverlay) layer 30+CU layer 20+ substrate 10(PI substrate, soft substrate plate)+CU layer 20+ CV layer 30, but CV wherein windows and limits common FPC cannot form high density distribution prototype part as PCB.Solder mask is windowed and can be met high density and to distribute the requirement of the prototype parts such as various IC, electric capacity, resistance, but solder mask is windowed and can not resistance toly be bent.And in many instances, battery protecting plate not only needs high density distribution prototype part but also needs good bending performance, and there is no this type of battery protecting plate at present.
Utility model content
Therefore; for above-mentioned problem, the utility model proposes a kind of battery protection wiring board with overcoat and solder mask structure, the outermost layer of existing FPC structure is improved; original CV layer is changed into the overcoat that CV+ solder mask is formed, thus solve the deficiency of prior art.
In order to solve the problems of the technologies described above, the technical scheme that the utility model adopts is, a kind of battery protection wiring board with overcoat and solder mask structure, comprise flexible board substrate, and be located at the copper foil layer of flexible board substrate both sides, copper foil layer is also provided with overcoat, and flexible board substrate, copper foil layer are consistent with the width of overcoat; This overcoat is the overcoat being spliced setting by the coverlay of same thickness and solder mask level and formed, and the thickness range of overcoat is 0.5mil-1mil.
Further, the side of described coverlay and the side of solder mask are bonded by adhesive, and form the overcoat being plane up and down.
Further, in order to make its character fix, all by the fixing bonding of adhesive between described flexible board substrate, copper foil layer and overcoat.Certainly, other chemical technologies or physical technology also can be adopted to make flexible board substrate, copper foil layer and overcoat secure bond.
Wherein, the thickness range of flexible board substrate is 0.5mil-1mil, and the thickness range of copper foil layer is 0.5mil-1mil.
Further, described flexible board substrate is the glass fiber reinforced polyester film that polyimides, polyester, polyamide, polytetrafluoroethylene or epoxy strengthen.
The utility model is by improving the cover layer in existing FPC structure; by the overcoat that coverlay+solder mask combines; meet the performance requirement of battery protecting plate, protect at the region coverlay that need bend, and need the region solder mask of high density distribution prototype part to protect.Its thickness range is set to 0.5mil-1mil, good stability simultaneously, has good protective capacities.Plan plot of the present utility model is ingenious, and structure is simple, is easy to realize, has good practicality.
Accompanying drawing explanation
Fig. 1 is the structural representation of PCB in prior art;
Fig. 2 is the structural representation of FPC in prior art;
Fig. 3 is the schematic diagram of the battery protection wiring board of embodiment 1 of the present utility model;
Fig. 4 is the schematic diagram of the battery protection wiring board of embodiment 2 of the present utility model.
Embodiment
Now with embodiment, the utility model is further illustrated by reference to the accompanying drawings.
The structure of general FPC is coverlay+substrate+coverlay, has the performances such as lightweight, thickness is thin, volume is little, free bend, but coverlay window limit common FPC cannot as PCB high density distribution prototype part; The structure of PCB is solder mask+substrate+solder mask, and solder mask is windowed and can be met high density and to distribute the requirement of the prototype parts such as various IC, electric capacity, resistance, but solder mask is windowed and can not resistance toly be bent.Current battery baffle not only needs high density distribution prototype part but also needs good bending performance.The utility model is just being to provide a kind of existing good bending performance, can realize again high density distribution prototype part.
embodiment 1
Concrete, see Fig. 3, a kind of battery protection wiring board with overcoat and solder mask structure, comprise flexible board substrate 1, and be located at the copper foil layer 2 of flexible board substrate 1 both sides, copper foil layer 2 is also provided with overcoat 3, and flexible board substrate 1, copper foil layer 2 are consistent with the width of overcoat 3; This overcoat 3 is the flat overcoats 3 being spliced setting by the coverlay 31 of same thickness and solder mask 32 level and formed, and the thickness range of coverlay 31 and solder mask 32 is 0.5mil-1mil.
Wherein, described flexible board substrate 1 is the glass fiber reinforced polyester film that polyimides, polyester, polyamide, polytetrafluoroethylene or epoxy strengthen.In addition, the thickness range of flexible board substrate 1 is 0.5mil-1mil, and the thickness range of copper foil layer 2 is 0.5mil-1mil.
embodiment 2
The present embodiment, except the feature of embodiment 1, also improves overcoat 3 further, and see Fig. 4, the side of described coverlay 31 and the side of solder mask 32 are bonded by adhesive 33, and forms the flat overcoat 3 being plane up and down.
Meanwhile, in order to make its character fix, all by the fixing bonding of the second adhesive 4 between described flexible board substrate 1, copper foil layer 2 and overcoat 3.Second adhesive 4 and adhesive 33 can be same substances, also can be different.Certainly, other chemical technologies or physical technology also can be adopted to make flexible board substrate 1, copper foil layer 2 and overcoat 3 secure bond.
Although specifically show in conjunction with preferred embodiment and describe the utility model; but those skilled in the art should be understood that; not departing from the spirit and scope of the present utility model that appended claims limits; can make a variety of changes the utility model in the form and details, be protection range of the present utility model.
Claims (5)
1. there is a battery protection wiring board for overcoat and solder mask structure, it is characterized in that: comprise flexible board substrate, and be located at the copper foil layer of flexible board substrate both sides, copper foil layer is also provided with overcoat; Flexible board substrate, copper foil layer are consistent with the width of overcoat; This overcoat is the overcoat being spliced setting by the coverlay of same thickness and solder mask level and formed, and the thickness range of overcoat is 0.5mil-1mil.
2. the battery protection wiring board with overcoat and solder mask structure according to claim 1, is characterized in that: the side of described coverlay and the side of solder mask are bonded by adhesive, and forms the overcoat being plane up and down.
3. the battery protection wiring board with overcoat and solder mask structure according to claim 1, is characterized in that: all by the fixing bonding of adhesive between described flexible board substrate, copper foil layer and overcoat.
4. the battery protection wiring board with overcoat and solder mask structure according to claim 1, is characterized in that: the thickness range of described flexible board substrate is 0.5mil-1mil, and the thickness range of copper foil layer is 0.5mil-1mil.
5. the battery protection wiring board with overcoat and solder mask structure according to claim 1, is characterized in that: described flexible board substrate is the glass fiber reinforced polyester film that polyimides, polyester, polyamide, polytetrafluoroethylene or epoxy strengthen.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420398465.2U CN204069481U (en) | 2014-07-18 | 2014-07-18 | A kind of battery protection wiring board with overcoat and solder mask structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201420398465.2U CN204069481U (en) | 2014-07-18 | 2014-07-18 | A kind of battery protection wiring board with overcoat and solder mask structure |
Publications (1)
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CN204069481U true CN204069481U (en) | 2014-12-31 |
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Family Applications (1)
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CN201420398465.2U Active CN204069481U (en) | 2014-07-18 | 2014-07-18 | A kind of battery protection wiring board with overcoat and solder mask structure |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106341942A (en) * | 2016-11-18 | 2017-01-18 | 东莞市五株电子科技有限公司 | Circuit board of quick-charging battery |
-
2014
- 2014-07-18 CN CN201420398465.2U patent/CN204069481U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106341942A (en) * | 2016-11-18 | 2017-01-18 | 东莞市五株电子科技有限公司 | Circuit board of quick-charging battery |
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