CN202475931U - Fingerprint sensor FPC (flexible printed circuit) - Google Patents

Fingerprint sensor FPC (flexible printed circuit) Download PDF

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Publication number
CN202475931U
CN202475931U CN2012200306329U CN201220030632U CN202475931U CN 202475931 U CN202475931 U CN 202475931U CN 2012200306329 U CN2012200306329 U CN 2012200306329U CN 201220030632 U CN201220030632 U CN 201220030632U CN 202475931 U CN202475931 U CN 202475931U
Authority
CN
China
Prior art keywords
fingerprint sensor
material plate
sensor fpc
printed circuit
fpc
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2012200306329U
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Chinese (zh)
Inventor
王军
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yangzhou Huameng Electronics Co Ltd
Original Assignee
Yangzhou Huameng Electronics Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yangzhou Huameng Electronics Co Ltd filed Critical Yangzhou Huameng Electronics Co Ltd
Priority to CN2012200306329U priority Critical patent/CN202475931U/en
Application granted granted Critical
Publication of CN202475931U publication Critical patent/CN202475931U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a fingerprint sensor FPC (flexible printed circuit) which comprises a base material plate, insulation plastic films, anisotropic conductive paste (ACP) and reinforcers. The insulation plastic films are arranged on the upper surface and the lower surface of the base material plate, the reinforcers are arranged on the upper surfaces of the insulation plastic films, and the anisotropic conductive paste is arranged on the base material plate and the upper surfaces and the lower surfaces of the insulation plastic films. The fingerprint sensor FPC has the advantages of simple structure, bending resistance, convenience in use, high sensitivity, long service life and the like.

Description

Fingerprint sensor FPC
Technical field
The utility model relates to a kind of flex circuit application and manufactures and designs, and is specifically related to manufacturing and designing of handset touch panel FPC.
Background technology
Flexible printed circuit board (Flexible Printed Circuit Board) is the printed circuit of processing with flexible insulating substrate, has the advantage that many rigid printed circuit boards do not possess.For example it can free bend, coiling, folding, can require to arrange arbitrarily according to space layout, and move arbitrarily and flexible, thereby reach integrated that the components and parts assembling is connected with lead at three dimensions.Utilize FPC can dwindle the volume of electronic product greatly, be suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC has obtained using widely on field such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.FPC---Flexible Printed Circuit flexible electric circuit board is claimed flexible circuit board again; With mylar or polyimides is base material, has height reliability, the printed circuit of excellent flexibility through being etched on the Copper Foil form that circuit processes a kind of.
FPC also has good thermal diffusivity and solderability and is easy to advantages such as load, integrated cost be lower, and the design that soft or hard combines has also remedied flexible parent metal not enough slightly on the element bearing capacity to a certain extent.
Flexible print circuit board has the branch of single face, two-sided and multi-layer sheet.The base material that is adopted is main with polyimide copper clad lamination.This kind material thermal resistance height, dimensional stability are good, form final products with the coverlay that has mechanical protection and good electrical insulation property concurrently through compacting.Top layer and inner conductor two-sided, multilayer printed wiring board are realized being electrically connected of ectonexine circuit through metallization.
Summary of the invention
The utility model has overcome the deficiency of prior art, and the fingerprint sensor FPC of a kind of cost savings, stable performance is provided.
The technical scheme that the utility model adopts is: a kind of fingerprint sensor FPC; Comprise backing material plate, ambroin film, aeolotropic conductive (ACP) and reinforcement; Said ambroin film is arranged on the upper and lower surface of backing material plate; Said reinforcement is arranged on above the ambroin film, and said backing material plate and ambroin film be the two-sided aeolotropic conductive that is provided with up and down.
As preferably, said backing material plate material is a polyimide copper clad lamination, selects high-purity, structure rolled copper foil material very uniformly for use, makes its crystal orientation be parallel to line alignment, has improved the toughness of product; Before circuit is made, pass through high-temperature heat treatment simultaneously, the Copper Foil flexural property is strengthened once more, also eliminated contraction and stress that PI produces because of the moisture absorption, thereby improved bending ability effectively.
As preferably, said ambroin film is mylar (PET), and the mylar advantage is:
I can be carried out hand weldering or low melting point welding,
II has high adhesive property,
But the flexible alternating bending that III is outstanding is folding,
IV has excellent in chemical moral character and processing characteristics,
The ratio of performance to price that V is best.
As preferably, said supporting material is a polyimides, can play effective booster action, to remedy the gentle excessively deficiency of FPC.
Said ACP glue conducting particles number is many and even, so electric conductivity is high.
Beneficial effect: the utility model fingerprint sensor FPC possesses simple structure, anti-bending, advantage such as easy to use, high sensitivity, long service life.
Description of drawings
Fig. 1 is the stacked graph of the utility model fingerprint sensor FPC.
Embodiment
Below in conjunction with accompanying drawing and embodiment the utility model is further specified:
As shown in Figure 1: a kind of fingerprint sensor FPC; Comprise backing material plate 1, ambroin film 2, aeolotropic conductive 3 and reinforcement 4; Said ambroin film 2 is arranged on the upper and lower surface of backing material plate 1; Said reinforcement 4 is arranged on above the ambroin film 2, said backing material plate 1 and the ambroin film two-sided aeolotropic conductive 3 that is provided with about in the of 2.
Said backing material plate 1 material is a polyimide copper clad lamination, and said ambroin film 2 materials are polyester resin film, and said reinforcement 4 materials are polyimides.
Should be pointed out that for those skilled in the art, under the prerequisite that does not break away from the utility model principle, can also make some improvement and retouching, these improvement and retouching also should be regarded as the protection range of the utility model.The all available prior art of each part not clear and definite in the present embodiment realizes.

Claims (4)

1. fingerprint sensor FPC; It is characterized in that: comprise backing material plate, ambroin film, aeolotropic conductive and reinforcement; Said ambroin film is arranged on the upper and lower surface of backing material plate; Said reinforcement is arranged on above the ambroin film, and said backing material plate and ambroin film be the two-sided aeolotropic conductive that is provided with up and down.
2. fingerprint sensor FPC according to claim 1 is characterized in that: said backing material plate material is a polyimide copper clad lamination.
3. fingerprint sensor FPC according to claim 1 is characterized in that: said ambroin film is a mylar.
4. fingerprint sensor FPC according to claim 1 is characterized in that: said supporting material is a polyimides.
CN2012200306329U 2012-01-31 2012-01-31 Fingerprint sensor FPC (flexible printed circuit) Expired - Fee Related CN202475931U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2012200306329U CN202475931U (en) 2012-01-31 2012-01-31 Fingerprint sensor FPC (flexible printed circuit)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2012200306329U CN202475931U (en) 2012-01-31 2012-01-31 Fingerprint sensor FPC (flexible printed circuit)

Publications (1)

Publication Number Publication Date
CN202475931U true CN202475931U (en) 2012-10-03

Family

ID=46924050

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2012200306329U Expired - Fee Related CN202475931U (en) 2012-01-31 2012-01-31 Fingerprint sensor FPC (flexible printed circuit)

Country Status (1)

Country Link
CN (1) CN202475931U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103857183A (en) * 2012-12-05 2014-06-11 昆山雅森电子材料科技有限公司 Combined type flexible printed circuit board structure

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103857183A (en) * 2012-12-05 2014-06-11 昆山雅森电子材料科技有限公司 Combined type flexible printed circuit board structure
CN103857183B (en) * 2012-12-05 2017-05-03 昆山雅森电子材料科技有限公司 Combined type flexible printed circuit board structure

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20121003

Termination date: 20150131

EXPY Termination of patent right or utility model