CN201657480U - Mobile phone key module FPC - Google Patents
Mobile phone key module FPC Download PDFInfo
- Publication number
- CN201657480U CN201657480U CN2010201669570U CN201020166957U CN201657480U CN 201657480 U CN201657480 U CN 201657480U CN 2010201669570 U CN2010201669570 U CN 2010201669570U CN 201020166957 U CN201020166957 U CN 201020166957U CN 201657480 U CN201657480 U CN 201657480U
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- CN
- China
- Prior art keywords
- mobile phone
- key module
- phone key
- module fpc
- glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a mobile phone key module FPC. The mobile phone key module FPC comprises a substrate board, an insulation plastic film, a bonding layer, a reinforcing layer, a 3M adhesive and a plurality of spring plates, wherein the insulation plastic film is disposed on the substrate board; the bonding layer and 3M adhesive are respectively disposed below the substrate board; the reinforcing layer is arranged below the bonding layer; and the spring plates are disposed on the insulation plastic film. The mobile phone key module FPC has the advantages of simple structure, high bending resistance, convenient use, high sensitivity, long service life, and so on.
Description
Technical field
The utility model relates to a kind of flex circuit application and manufactures and designs, and is specifically related to a kind of mobile phone key module FPC.
Background technology
Flexible printed circuit board (Flexible Printed Circuit Board) is the printed circuit made from flexible insulating substrate, has the advantage that many rigid printed circuit boards do not possess.For example it can free bend, coiling, folding, can require to arrange arbitrarily according to space layout, and move arbitrarily and flexible, thereby reach integrated that the components and parts assembling is connected with lead at three dimensions.Utilize FPC can dwindle the volume of electronic product greatly, be suitable for the needs that electronic product develops to high density, miniaturization, highly reliable direction.Therefore, FPC has obtained using widely on field such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital camera or product.FPC---Flexible Printed Circuit flexible electric circuit board claims flexible circuit board again; With mylar or polyimides is base material, has height reliability, the printed circuit of excellent flexibility by being etched on the Copper Foil form that circuit makes a kind of.
FPC also has good thermal diffusivity and solderability and is easy to advantages such as load, integrated cost be lower, and the design of soft or hard combination has also remedied flexible parent metal not enough slightly on the element bearing capacity to a certain extent.
Flexible print circuit board has the branch of single face, two-sided and multi-layer sheet.The base material that is adopted is based on polyimide copper clad lamination.This kind material thermal resistance height, dimensional stability are good, form final products with the coverlay that has mechanical protection and good electrical insulation property concurrently by compacting.Top layer and inner conductor two-sided, multilayer printed wiring board are realized being electrically connected of ectonexine circuit by metallization.
Summary of the invention
The utility model has overcome the deficiencies in the prior art, and the mobile phone key module FPC of a kind of cost savings, stable performance and cost savings is provided.
The technical solution adopted in the utility model is: a kind of mobile phone key module FPC, comprise backing material plate, ambroin film, tack coat, reinforcement, 3M glue and shell fragment, described ambroin film be arranged on backing material plate above, described tack coat and 3M glue be separately positioned on backing material plate below, described reinforcement be arranged on tack coat below, be provided with several shell fragments above the described ambroin film.
As preferably, described backing material plate material is a polyimide copper clad lamination, selects high-purity, structure rolled copper foil material very uniformly for use, makes its crystal orientation be parallel to line alignment, has improved the toughness of product; Before circuit is made, pass through high-temperature heat treatment simultaneously, the Copper Foil flexural property is strengthened once more, also eliminated contraction and stress that PI produces because of the moisture absorption, thereby improved bending ability effectively.
As preferably, described bonding layer material adopts acrylic resin or modified epoxy, described 3M glue material is a 3M467 glue, not only salable isolated moisture and most solvent, uvioresistant and cold cycling for a long time, can on average disperse stressedly, the user is used more frivolous material and is not had material deformation, problems such as metal fatigue.
As preferably, described ambroin film is mylar (PET), and the mylar advantage is:
I can carry out hand weldering or low melting point welding,
II has high adhesive property,
But the outstanding flexible alternating bending of III folds,
IV has excellent in chemical moral character and processing characteristics,
The ratio of performance to price of V the best.
As preferably, described supporting material is a polyimide, can play effective booster action, to remedy the gentle excessively deficiency of flexible circuit board.
As preferably, described shell fragment material is the DOME shell fragment, the long service life of this shell fragment, resistance to wear height.
Beneficial effect: the utility model possesses simple structure, anti-bending, advantage such as easy to use, high sensitivity, long service life.
Description of drawings
Accompanying drawing is the stacked graph of the utility model mobile phone key module FPC.
Embodiment
Below in conjunction with the drawings and specific embodiments the utility model is further specified:
As shown in drawings: a kind of mobile phone key module FPC, comprise backing material plate 1, ambroin film 2, tack coat 3, reinforcement 4,3M glue 5 and shell fragment 6, described ambroin film 2 be arranged on backing material plate 1 above, described tack coat 3 and 3M glue 5 be separately positioned on backing material plate 1 below, described reinforcement 4 be arranged on tack coat 3 below, be provided with several shell fragments 6 above the described ambroin film 2.
Described backing material plate 1 material is a polyimide copper clad lamination, described ambroin film 2 materials are polyester resin film, described tack coat 3 materials adopt acrylic resin or modified epoxy, described reinforcement 4 materials are polyimide, described 3M glue 5 materials are 3M467 glue, and described shell fragment 6 materials are the DOME shell fragment.
Claims (7)
1. mobile phone key module FPC, it is characterized in that: it comprises backing material plate (1), ambroin film (2), tack coat (3), reinforcement (4), 3M glue (5) and shell fragment (6), described ambroin film (2) be arranged on backing material plate (1) above, described tack coat (3) and 3M glue (5) be separately positioned on backing material plate (1) below, described reinforcement (4) be arranged on tack coat (3) below, be provided with several shell fragments (6) above the described ambroin film (2).
2. mobile phone key module FPC according to claim 1 is characterized in that: described backing material plate (1) material is a polyimide copper clad lamination.
3. mobile phone key module FPC according to claim 1 is characterized in that: described ambroin film (2) material is a polyester resin film.
4. mobile phone key module FPC according to claim 1 is characterized in that: described tack coat (3) material adopts acrylic resin or modified epoxy.
5. mobile phone key module FPC according to claim 1 is characterized in that: described reinforcement (4) material is a polyimide.
6. mobile phone key module FPC according to claim 1 is characterized in that: described 3M glue (5) material is a 3M467 glue.
7. mobile phone key module FPC according to claim 1 is characterized in that: described shell fragment (6) material is the DOME shell fragment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201669570U CN201657480U (en) | 2010-04-21 | 2010-04-21 | Mobile phone key module FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201669570U CN201657480U (en) | 2010-04-21 | 2010-04-21 | Mobile phone key module FPC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201657480U true CN201657480U (en) | 2010-11-24 |
Family
ID=43122707
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201669570U Expired - Fee Related CN201657480U (en) | 2010-04-21 | 2010-04-21 | Mobile phone key module FPC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201657480U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102111469A (en) * | 2011-02-14 | 2011-06-29 | 惠州Tcl移动通信有限公司 | Side keypad module and mobile terminal |
| CN103927039A (en) * | 2013-06-19 | 2014-07-16 | 上海天马微电子有限公司 | Flexible printed circuit board, touch plate and display with touch function |
-
2010
- 2010-04-21 CN CN2010201669570U patent/CN201657480U/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102111469A (en) * | 2011-02-14 | 2011-06-29 | 惠州Tcl移动通信有限公司 | Side keypad module and mobile terminal |
| CN102111469B (en) * | 2011-02-14 | 2013-09-04 | 惠州Tcl移动通信有限公司 | Side keypad module and mobile terminal |
| CN103927039A (en) * | 2013-06-19 | 2014-07-16 | 上海天马微电子有限公司 | Flexible printed circuit board, touch plate and display with touch function |
| CN103927039B (en) * | 2013-06-19 | 2017-06-27 | 上海天马微电子有限公司 | Flexible PCB, touch pad and the display with touch function |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101124 Termination date: 20130421 |