CN103857183A - Combined type flexible printed circuit board structure - Google Patents
Combined type flexible printed circuit board structure Download PDFInfo
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- CN103857183A CN103857183A CN201210516797.1A CN201210516797A CN103857183A CN 103857183 A CN103857183 A CN 103857183A CN 201210516797 A CN201210516797 A CN 201210516797A CN 103857183 A CN103857183 A CN 103857183A
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Abstract
The invention discloses a combined type flexible printed circuit board structure which comprises a flexible printed circuit board, a first combination board and a second combination board. The flexible printed circuit board comprises a top surface and a bottom surface, wherein the top surface and the bottom surface are opposite to each other; the top surface is provided with a first circuit layer; the bottom surface is provided with a second circuit layer; a first cover film is formed in the top surface, and the first circuit layer is covered with the first cover film; a second first cover film is formed in the bottom surface, and the second circuit layer is covered with the second first cover film; the surface of the first cover film and the surface of the second cover film are provided with a first combination area and a second combination area respectively, wherein the area of the first combination area and the area of the second combination area are smaller than that of the flexible printed circuit board, and the first combination area and the second combination area are opposite to each other; the first combination board and the second combination board area are respectively composed of a bonding layer, a polyimide layer and a copper layer and are formed in the first combination area and the second combination through the bonding layers respectively. Since the combined type flexible printed circuit board structure is formed by laminating the non-adhesive double-layer boards and the flexible board through the bonding layers, the combined type flexible printed circuit board structure not only has the reliability of the non-adhesive double-layer boards and the flexibility of the flexible board but also has the advantages of high size stability, heat resistance, high reliability, high-density thinning and the like.
Description
Technical field
The present invention relates to a kind of combined type flexible printed wiring board, espespecially a kind of glue-free by polylith be the combined type flexible printed circuit board structure that soft board forms.
Background technology
Printed circuit board (PCB) is material indispensable in electronic product, and grows up along with consumption electronic products demand, also grows with each passing day for the demand of printed circuit board (PCB).Due to flexible printed wiring board have flexibility and can three-dimensional space distribution etc. characteristic, emphasize that at technicalization electronic product development compact, flexibility drives under gesture, computer and ancillary equipment thereof, communication product and consumption electronic products etc. are at present widely used.The kind of flexible printed wiring board mainly contains following several, and single sided board, double sided board, multi-layer sheet and Rigid Flex are wherein extensive to have the utilization rate of Rigid Flex of the supportive of class hardboard and the flexibility of soft board simultaneously again.
But in prior art, thermal endurance and the dimensional stability of the hard portion in Rigid Flex structure are neither good.Therefore, the utmost point need be developed one and have hardboard reliability and soft board flexibility simultaneously concurrently, can have again high dimensional stability, thermal endurance, high-reliability, highdensity flexible printed wiring board.
Summary of the invention
In order to overcome above-mentioned defect, the invention provides a kind of combined type flexible printed circuit board structure, combined type flexible printed circuit board structure of the present invention be by glue-free be that doubling plate and soft board are made by following layer pressing, it not only possesses glue-free is the reliability of doubling plate the flexibility that has soft board, has more the excellent specific properties such as high dimensional stability, thermal endurance, high-reliability, highdensity graph thinning.
The present invention for the technical scheme that solves its technical problem and adopt is:
A kind of combined type flexible printed circuit board structure, comprise flexible circuit board, the first board and the second board, wherein, described flexible circuit board has relative end face and bottom surface, the end face of described flexible circuit board has the first line layer and bottom surface has the second line layer, also be provided with the first coverlay and the second coverlay, described the first coverlay is formed at the end face of described flexible circuit board and covers described the first line layer, described the second coverlay is formed at the bottom surface of described flexible circuit board and covers described the second line layer, wherein, described the first coverlay surface has the first land that area is less than described flexible circuit board, described the second coverlay surface has the second land that area is less than described flexible circuit board, and described the first land is relative with described the second land, described the first board is successively by the first following layer, the first polyimide layer and the first bronze medal layer form, described the first board is formed on described the first land by described the first following layer, described the second board is successively by the second following layer, the second polyimide layer and the second bronze medal layer form, described the second board is formed on described the second land by described the second following layer.
In prior art, Rigid Flex is in order to have preferably reliability, and its board mostly uses epoxy resin/glass layer and copper lamination to close and forms.And the first board of the present invention and the second board are that glue-free that use is combined by copper layer and polyimide layer is doubling plate, reduce integral thickness.In addition,, compared to the hard plate with epoxy resin/glass layer or circuit board, polyimide layer used in the present invention has better thermal endurance, soldering resistance and higher dimensional stability.
The present invention for the further technical scheme that solves its technical problem and adopt is:
Say further, the structure of described flexible circuit board of the present invention can be as follows: described flexible circuit board has body layer, described body layer has relative first surface and second surface, described the first line layer is formed on described first surface, and described the second line layer is formed on described second surface.
Say further, the structure of described flexible circuit board of the present invention also can be as follows: described flexible circuit board has body layer, described body layer has relative first surface and second surface, on described first surface, be formed with the first adhesion layer, described the first line layer is formed on described first surface by described the first adhesion layer, on described second surface, be formed with the second adhesion layer, described the second line layer is formed on described second surface by described the second adhesion layer.
Preferably, described body layer is polyimide layer.
Preferably, the thickness of described body layer is 12.5 to 25 microns.The better material of described the first line layer and the second line layer is copper, and preferred thickness is respectively 9 to 35 microns.
Preferably, the thickness of described flexible circuit board is 30 to 95 microns, and better is 30.5 to 95 microns.
Preferably, the thickness of described the first coverlay is 16 to 50 microns; The thickness of described the second coverlay is 16 to 50 microns.The better material of described the first coverlay and the second coverlay is polyimides.
Preferably, the gross thickness of described combined type flexible printed circuit board structure is 92 to 195 microns, and better is 94.5 to 194.5 microns.
Preferably, the thickness of described the first board is 30 to 50 microns, and wherein, the thickness of described the first following layer, the first polyimide layer and the first bronze medal layer is respectively 15 to 25 microns, 8 to 12 microns and 9 to 12.5 microns.
Preferably, the thickness of described the second board is 30 to 50 microns, and wherein, the thickness of described the second following layer, the second polyimide layer and the second bronze medal layer is respectively 15 to 25 microns, 8 to 12 microns and 9 to 12.5 microns.
Preferably, be using cathode copper or calendering copper as the copper layer in this first board and the second board.
The better material of described the first following layer and described the second following layer is thermosetting resin.
The thickness of described the first board and described the second board is more preferred from 32 to 49.5 microns.
In addition, be preferably, the thickness of described the first board is identical with the thickness of described the second board.
The invention has the beneficial effects as follows: combined type flexible printed circuit board structure of the present invention be by glue-free be that doubling plate and soft board are made by following layer pressing, it not only possesses glue-free is the reliability of doubling plate the flexibility that has soft board, has more the excellent specific properties such as high dimensional stability, thermal endurance, high-reliability, highdensity graph thinning.
Brief description of the drawings
Fig. 1 is the combined type flexible printed circuit board structure schematic diagram of embodiments of the invention 1;
Fig. 2 is the combined type flexible printed circuit board structure schematic diagram of embodiments of the invention 2.
Embodiment
Below, by specific instantiation explanation embodiments of the present invention, those of ordinary skill in the art can understand advantage of the present invention and effect easily by content disclosed in the present specification.The present invention also can be implemented by other different modes, under not departing from disclosed category, can carry out different modifications and change.
Embodiment 1: as shown in Figure 1, it is the combined type flexible printed circuit board structure 100 of the present embodiment, comprise: flexible circuit board 120, comprise: there is the body layer 121 of relative first surface 121a and second surface 121b, and on this first surface 121a and second surface 121b, there is the first line layer 122 and the second line layer 122 '; Comprise: the end face 120a that is formed at this flexible circuit board 120 is upper, and be covered in the first coverlay 123 of the first line layer 122; Also comprise: be formed on the bottom surface 120b of this flexible circuit board 120, to be covered in the second coverlay 123 ' of this second line layer 122 ', wherein, this first coverlay 123 has respectively area with the second coverlay 123 ' surface and is less than this flexible circuit board 120 and relative the first land 1A1 and the second land 1A2, for the first board 110 and the second board 110 ' are set, wherein, the first board 110 comprises the first following layer 113, the first polyimide layer 112 and the first bronze medal layer 111 be sequentially located on the 1A1 of this first land; This second board 110 ' is to comprise the second following layer 113 ', the second polyimide layer 112 ' and the second bronze medal layer 111 ' be sequentially located on the 1A2 of this second land.
In the present embodiment, be to make respectively flexible circuit board, the first board and the second board, then the following layer of this first and second board is binded to flexible circuit board.
In the present embodiment, the material of the body layer of flexible circuit board of the present invention is polyimide film (AEM Corp.; Model DL-1212E), be copper through the material of etched the first line layer and the second line layer, first and second coverlay is polyimide film (AEM Corp.; Model AHICX015), its thickness is as shown in table 1.The following layer of the first board and the second board is epoxy resin (AEM Corp.; Model AHEBXX25), polyimide layer is to use polyimide film (AEM Corp.; Model 2NUSR1318), its thickness is as shown in table 1.
Embodiment 2: as shown in Figure 2, it is the combined type flexible printed circuit board structure 200 of the present embodiment, comprise: flexible circuit board 220, it comprises: the body layer 221 with relative first surface 221a and second surface 221b, and on this first surface 221a and second surface 221b, there is the first line layer 222 and the second line layer 222 ', wherein, between body layer 221 and the first line layer 222, there is the first adhesion layer 224, between body layer 221 and the second line layer 222 ', have the second adhesion layer 224 '; Comprise: the end face 220a that is formed at this flexible printed wiring board 20 is upper, and be covered in the first coverlay 223 of the first line layer 222; Comprise: be formed on the bottom surface 220b of this flexible printed wiring board 220, to cover the second coverlay 223 ' of this second line layer 222 ', wherein, this first coverlay 223 has respectively area with the second coverlay 223 ' surface and is less than this flexible circuit board 220 and relative the first land 2A1 and the second land 2A2, for the first board 210 and the second board 210 ' are set, wherein, the first board 210 comprises the first following layer 213, the first polyimide layer 212 and the first bronze medal layer 211 be sequentially located on the 2A1 of this first land; And second board 210 ', be to comprise the second following layer 213 ', the second polyimide layer 212 ' and the second bronze medal layer 211 ' be sequentially located on the 2A2 of this second land.
The preparation method of the combined type flexible printed circuit board structure of the present embodiment adopts the method for making identical with embodiment 1, difference is only that the flexible circuit board of the present embodiment use is for there being glue formula three ply board, its first line layer and the second line layer are to be pressed in body layer by first and second adhesion layer, wherein, this first material that integrates the second adhesion layer is as epoxy resin (AEM Corp.; Model C CL-007).
Comparative example: in this comparative example, the flexible circuit board using is identical with embodiment 1, and its thickness is as shown in table 1.Difference is, the first board and the second board are by being made up of epoxy resin/glass fibre and one side copper layer, and thickness is the FR4 plate of 0.05 mm, and are combined with middle flexible circuit board by following layer, wherein, the material of following layer is polypropylene film (Lian Mao company; Model IF-FB), its thickness is as shown in table 1.
Table 1
Test case: prepare combined type flexible printed circuit board structure sample of the present invention according to data shown in the method for embodiment and table 1, and this sample is carried out to mechanical property and electrical characteristics test, test event comprises chemical proofing test, soldering resistance test and dimensional stability test, and by outcome record in table 2.
One, chemical proofing test
According to the method for IPC-TM-650 2.3.2 institute specification, sample is cut into width 1cm, length is the test piece of 10cm, and test piece is imbedded to butanone (methyl ethyl ketone completely, MEK) in solvent, soak 30 minutes, test piece is taken out and first rinsed with clear water from solvent, observe test piece and whether produce foaming, delamination, peel off or the swelling phenomenon such as variable color.
Two, soldering resistance test
According to the method for IPC-TM-650 2.4.13 institute specification, sample is cut into the test piece of big or small 5cm × 5cm, and after 1 hour, immerse the plumbous liquid of constant temperature high temperature tin of temperature as described in Table 2 with DEG C baking of 135 ° of C ± 10, each test piece is immersed the plumbous liquid of constant temperature high temperature tin and is floated tin 10 seconds.After submergence tin stove, whether change by visualization sample substrate outward appearance.Assess with the following method:
Zero: changing does not appear in outward appearance completely
×: outward appearance produces Qi Pao ﹑ decorative pattern or melting
Three, dimensional stability test
According to the method for 2. 2. 4 specifications of IPC-TM-650, the Copper Foil with polyimide film is cut into the sample of 27 cm × 29 cm, the distance of four corners Yi Juge limit 1.25cm on sample charges and attacks out the hole that four diameters are 0.889 cm, etch away subsequently Copper Foil, measure operating direction (the machine direction between each same side cavities with Quadratic Finite Element measuring instrument again, MD) with the distance of horizontal direction (transverse direction, TD).Then, sample, in 150 DEG C of bakings 30 minutes, is placed after 24 hours, then measured the distance of the MD direction TD direction between each same side cavities, by the distance (each distance is in the distance between the center of two relative openings of all directions) of the MD before and after baking and TD direction, calculate change in size.
Table 2
Above-mentioned specification and embodiment are only illustrative principle of the present invention and effect thereof, but not for limiting the present invention.The scope of the present invention, should be as listed in claims.
Claims (10)
1. a combined type flexible printed circuit board structure, it is characterized in that: comprise flexible circuit board, the first board and the second board, wherein, described flexible circuit board has relative end face and bottom surface, the end face of described flexible circuit board has the first line layer and bottom surface has the second line layer, also be provided with the first coverlay and the second coverlay, described the first coverlay is formed at the end face of described flexible circuit board and covers described the first line layer, described the second coverlay is formed at the bottom surface of described flexible circuit board and covers described the second line layer, wherein, described the first coverlay surface has the first land that area is less than described flexible circuit board, described the second coverlay surface has the second land that area is less than described flexible circuit board, and described the first land is relative with described the second land, described the first board is successively by the first following layer, the first polyimide layer and the first bronze medal layer form, described the first board is formed on described the first land by described the first following layer, described the second board is successively by the second following layer, the second polyimide layer and the second bronze medal layer form, described the second board is formed on described the second land by described the second following layer.
2. combined type flexible printed circuit board structure as claimed in claim 1, it is characterized in that: described flexible circuit board has body layer, described body layer has relative first surface and second surface, described the first line layer is formed on described first surface, and described the second line layer is formed on described second surface.
3. combined type flexible printed circuit board structure as claimed in claim 1, it is characterized in that: described flexible circuit board has body layer, described body layer has relative first surface and second surface, on described first surface, be formed with the first adhesion layer, described the first line layer is formed on described first surface by described the first adhesion layer, on described second surface, be formed with the second adhesion layer, described the second line layer is formed on described second surface by described the second adhesion layer.
4. combined type flexible printed circuit board structure as claimed in claim 2 or claim 3, is characterized in that: described body layer is polyimide layer.
5. combined type flexible printed circuit board structure as claimed in claim 1, is characterized in that: the thickness of described flexible circuit board is 30 to 95 microns.
6. combined type flexible printed circuit board structure as claimed in claim 1, is characterized in that: the thickness of described the first coverlay is 16 to 50 microns; The thickness of described the second coverlay is 16 to 50 microns.
7. combined type flexible printed circuit board structure as claimed in claim 1, is characterized in that: the gross thickness of described combined type flexible printed circuit board structure is 92 to 195 microns.
8. combined type flexible printed circuit board structure as claimed in claim 1, it is characterized in that: the thickness of described the first board is 30 to 50 microns, wherein, the thickness of described the first following layer, the first polyimide layer and the first bronze medal layer is respectively 15 to 25 microns, 8 to 12 microns and 9 to 12.5 microns.
9. combined type flexible printed circuit board structure as claimed in claim 1, it is characterized in that: the thickness of described the second board is 30 to 50 microns, wherein, the thickness of described the second following layer, the second polyimide layer and the second bronze medal layer is respectively 15 to 25 microns, 8 to 12 microns and 9 to 12.5 microns.
10. combined type flexible printed circuit board structure as claimed in claim 1, is characterized in that: the thickness of described the first board is identical with the thickness of described the second board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN201210516797.1A CN103857183B (en) | 2012-12-05 | 2012-12-05 | Combined type flexible printed circuit board structure |
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| CN201210516797.1A CN103857183B (en) | 2012-12-05 | 2012-12-05 | Combined type flexible printed circuit board structure |
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| CN103857183B CN103857183B (en) | 2017-05-03 |
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| CN105763168A (en) * | 2016-02-22 | 2016-07-13 | 汉得利（常州）电子股份有限公司 | Piezoelectric resonator containing non-adhesive base material flexible circuit board |
| CN105985740A (en) * | 2015-01-13 | 2016-10-05 | 台虹科技股份有限公司 | Covering film with high dimensional stability and manufacturing method of flexible printed circuit board |
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| CN105985740A (en) * | 2015-01-13 | 2016-10-05 | 台虹科技股份有限公司 | Covering film with high dimensional stability and manufacturing method of flexible printed circuit board |
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