CN105763168B - It is a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board - Google Patents
It is a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board Download PDFInfo
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- CN105763168B CN105763168B CN201610096482.4A CN201610096482A CN105763168B CN 105763168 B CN105763168 B CN 105763168B CN 201610096482 A CN201610096482 A CN 201610096482A CN 105763168 B CN105763168 B CN 105763168B
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- 239000000463 material Substances 0.000 title claims abstract description 41
- 239000000919 ceramic Substances 0.000 claims abstract description 55
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 239000012774 insulation material Substances 0.000 claims abstract description 3
- 229920000642 polymer Polymers 0.000 claims abstract description 3
- 230000005611 electricity Effects 0.000 claims description 38
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 36
- 239000011889 copper foil Substances 0.000 claims description 36
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 15
- 229910052709 silver Inorganic materials 0.000 claims description 15
- 239000004332 silver Substances 0.000 claims description 15
- 229920006335 epoxy glue Polymers 0.000 claims description 13
- 230000002093 peripheral effect Effects 0.000 claims description 7
- 238000009826 distribution Methods 0.000 claims description 5
- 241000417436 Arcotheres Species 0.000 claims description 3
- 239000011435 rock Substances 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 16
- 238000003475 lamination Methods 0.000 abstract description 5
- 239000003292 glue Substances 0.000 description 14
- 230000005540 biological transmission Effects 0.000 description 12
- 238000010586 diagram Methods 0.000 description 7
- 239000004642 Polyimide Substances 0.000 description 5
- 101001045744 Sus scrofa Hepatocyte nuclear factor 1-beta Proteins 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 229920001721 polyimide Polymers 0.000 description 5
- 238000003825 pressing Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- 239000004411 aluminium Substances 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 230000007547 defect Effects 0.000 description 3
- 229920001971 elastomer Polymers 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 238000009413 insulation Methods 0.000 description 3
- 230000004224 protection Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910001030 Iron–nickel alloy Inorganic materials 0.000 description 2
- 229910000806 Latten Inorganic materials 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000005028 tinplate Substances 0.000 description 2
- 208000010392 Bone Fractures Diseases 0.000 description 1
- 206010017076 Fracture Diseases 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/15—Constructional features of resonators consisting of piezoelectric or electrostrictive material
- H03H9/17—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator
- H03H9/176—Constructional features of resonators consisting of piezoelectric or electrostrictive material having a single resonator consisting of ceramic material
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- General Electrical Machinery Utilizing Piezoelectricity, Electrostriction Or Magnetostriction (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention belongs to piezoelectric patches technical fields, more particularly to a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board, including the piezoelectric ceramic piece being laminated, flexible circuit board and substrate, flexible circuit board is by electrode layer, the base connecting with electrode layer is constituted, electrode layer and base are connected with the molded method lamination of no glue-line, upper caldding layer is also covered with outside electrode layer, piezoelectric ceramic piece is fitted and connected with electrode layer, electrode layer is equipped with the electric lines connecting with piezoelectric ceramic piece, substrate is fitted and connected with base, base, upper caldding layer is polymer insulation material, electrode layer is equipped with the electrode tip extended outward, corresponding base, upper caldding layer is equipped with the extended structure of cooperation electrode tip, it is good without gum base materials flexibility, it is easy to bend, transparency is good, substantially reduce the impedance value of product, resonance impedance value is lower.
Description
Technical field
The invention belongs to piezoelectric patches technical fields, and in particular to a kind of containing whether there is or not the piezoelectric resonators of gum base materials flexible circuit board
Device.
Background technique
The electrode lead-out mode of piezoelectric patches is generally divided into stitch in piezoelectric vibration device such as piezoelectric ceramic ultrasound sensor
And lead.Ceramic plate electrode generally uses silver electrode, is easy to weld, using common solder stick or lead-free soldering wire, 25W's or more
Electric iron is ok；Note also that welding temperature and time, temperature should be preferred at 350 degrees Celsius or less when welding, the time is general
It cannot be greater than 1 second, excessive temperature or too long weld interval be easy to cause " flying silver ", i.e. off-line also easily scorches potsherd, more
Thin potsherd more needs to pay attention to.Therefore process needs strict control.In addition to ceramic plate electrode, there are one be outside sheet metal or aluminium
Shell.Sheet metal generally has latten(-tin), iron-nickel alloy sheet, stainless steel substrates, tinplate sheet etc., and wherein latten(-tin) and iron-nickel alloy sheet are
It can directly weld, but be welded than ceramic plate electrode difficulty, stainless steel and tinplate sheet are needed with acid scaling powder.Aluminium
In shell can not bonding wire, need it is tin plating.Meanwhile welding process solder joint cannot be too big, has an impact to performance and subsequent assembly greatly very much.
Stitch also needs to be extracted with short lead.And solder joint may fall off in application process, and bonding wire has the risk of fracture, therefore relates to
And the electrode lead-out mode of stitch and lead, inconvenient, low efficiency are at high cost, it is difficult to control, and have pollution, be unfavorable for ring
It protects, reliability is not high.Therefore the flexible circuit board (FPCB) of built-in copper-foil conducting electricity need to be introduced, it will be pressed using epoxy glue water gluing technique
Electroceramics piece, flexible circuit board cemented surface, substrate connection, draw positive and negative anodes.Process without any welding, it is easy to operate, high-efficient,
It is pollution-free, be easily achieved industrial automation production, high reliablity.
Such method is the same face that the copper foil positive and negative electrode of FPCB is arranged in cemented surface, and FPCB substrate uses single side base
Material, the substrate selection of FPCB has gum base materials under normal circumstances, and substrate cross section structure is as shown in fig. 6, there is gum base materials cheap, easy
The problem of easy to control in production, thickness, but bending type is bad, hardness is high, brings has gum base materials that product can be sharply increased
Resonance impedance value causes in-fighting in the application larger, influences service life.
Summary of the invention
It is a kind of containing whether there is or not gum base materials flexible circuit board the technical problem to be solved by the present invention is in view of the foregoing drawbacks, provide
Piezo-electric resonator, no gum base materials flexibility is good, be easy to bend, transparency it is good, substantially reduce the impedance value of product, resonance impedance
It is worth lower.
It is as follows that the technical scheme adopted by the invention to solve the technical problem:
It is a kind of containing whether there is or not the piezo-electric resonator of gum base materials flexible circuit board, including the piezoelectric ceramic piece, soft being laminated
Wiring board and substrate, the flexible circuit board are made of electrode layer, the base connecting with electrode layer, the electrode layer and base
Layer is connected with the molded method lamination of no glue-line, is also covered with upper caldding layer, the piezoelectric ceramic piece and electrode outside electrode layer
Layer is fitted and connected, and electrode layer is equipped with the electric lines connecting with piezoelectric ceramic piece, and the substrate is fitted and connected with base, base
Layer, upper caldding layer are polymer insulation material, and the electrode layer is equipped with the electrode tip extended outward, corresponding base,
Upper caldding layer is equipped with the extended structure of cooperation electrode tip, is pressed together by way of hot pressing between electrode layer and base, intermediate
Without glue, the impedance value under the impedance value of product, especially hot environment (100 DEG C) is greatly reduced, lower 25 DEG C of room temperature by 170
Ω drops to 50 ohm, and 100 DEG C of high temperature drop to 50 Ω by 300 Ω, reduce the resonance impedance value of product, and in-fighting is small, extends
The service life of product, electrode layer and base are formed without gum base materials, and the energy transmission of piezoelectric ceramic piece vibration is to gold when work
Belong to substrate, drive the vibration of integral device, the glue in substrate can dissipate a part of vibrational energy, therefore impedance is higher, works as high temperature
When, potsherd and substrate are still the very high elastomer of hardness, and glue softens at high temperature, and energy transmission is very weak, therefore hinder
It is anti-higher compared under room temperature, it largely reduced energy transmission, what electrode layer and base were formed then compensates for this defect without gum base materials,
Energy transmission consume is greatly reduced, reduces impedance, and enhances flexibility without gum base materials, be easy to bend, improve
Lightness.
Further, the hollow hole for making piezoelectric ceramic piece connect with electrode layer is equipped in the middle part of the upper caldding layer, it is described
Electric lines be within the scope of hollow hole, circular piezoelectric ceramic piece be arranged in hollow hole and and electrode layer with epoxy glue glue
It closes, piezoelectric ceramic piece and electrode layer cemented surface are anode, and another side is cathode, and piezoelectric ceramic piece side is equipped with and guides to cathode just
The silver layer of pole, and silver layer extends to anode and anode is cooperated to form the electrode pattern with the cooperation of electrode layer electricity lines.
Piezoelectric ceramic piece is building block important in ultrasonic piezoelectric transducer, is the oscillator member in piezoelectric transducer
Part.When voltage acts on piezoelectric ceramic piece, piezoelectric ceramic piece will generate mechanically deform with the variation of voltage and frequency.It is another
Aspect can then generate a charge when vibrating piezoelectric ceramic piece.Using this principle, when to by a piece of piezoelectric ceramic piece and
When the vibrator that one metal substrate is constituted, i.e. piezoelectric patches apply an electric signal, ultrasonic wave will be launched because of bending vibration.
On the contrary, an electric signal will be generated when applying ultrasonic vibration to piezoelectric chip element.Based on the above effect, can incite somebody to action
Piezoelectric ceramics is used as ultrasonic sensor.This piezoelectric ceramic piece brushes silver-colored technology using side and guides to the back side cathode of potsherd just
1/4 annular that is equipped with of the same face of pole, anode surrounding is connected with back side cathode with side brush silver layer, while designing the electrode of anode
Pattern is allowed to mutually coincide with the electric lines of flexible circuit board, and the positive pole-face in this part is directly used with the electrode layer of flexible circuit board
Epoxy glue glue closes, and realizes circuit interconnection, and the electrode pattern and electrode layer electricity lines of positive pole-face cooperate.
Further, the electric lines includes the arcuate peripheral electricity of annular central electrode district, contre electrode area periphery
Polar region, peripheral electrode area include about symmetrical positive and negative electrode area of contre electrode area, and positive and negative electrode area extends to electrode tip,
Electrode tip is additionally provided with pad, and the electrode pattern is made of round positive polar region and round positive polar region side arc silver band, circle
The positive polar region of shape and silver-colored interband are equipped with spacing, and round positive polar region size is consistent with contre electrode area.Flexible circuit board is on the one hand by base
Piece and piezoelectric ceramic piece realize circuit connection, on the other hand serve as bonding wire or pin, flexible circuit board as described above is by upper covering
Layer, electrode layer, base and a pad are constituted, and 4 components form one piece of flexible circuit board by pressing working procedure, and pad is convenient for
Connection uses, and the structure of flexible circuit board is greatly reduced the volume of product, improves practicability, usability, and first layer is
A kind of nonconducting high molecular material is upper caldding layer, which is the electrode layer for protecting the second layer, and thickness is according to intensity needs
Adjustable, the electric lines of electrode layer matches with piezoelectric ceramic piece anode pattern, and electrode is divided into or so two pieces, i.e. the two poles of the earth, two
Pole is coated under upper caldding layer, and the two poles of the earth are guided to by circuit design at the pad of electrode tip end, and insulation plays in third layer base
Protection and supporting role.
Further, the contre electrode area, corresponding base is equipped with and divides equally distribution micropore at contre electrode area, in
Entreat electrode district micropore, base's micro well locations corresponding, equally distributed micropore can step down to electric conductor, electrode layer micropore with
The conducting of base's micropore, can be effectively reduced the impedance of product, so that consume substantially reduces, effectively extend its service life.
Further, with epoxy glue glued adhesion between the substrate and base.
Further, the base, upper caldding layer material be PI or PU, upper caldding layer is with a thickness of 9-25um, base
With a thickness of 23-33um, base, the thickness of upper caldding layer is adjustable according to actually required intensity, and upper caldding layer is used for guard electrode
Layer, prevents it to be scratched abrasion, to influence its electric conductivity and prevent circuit breaker.
Further, the electrode layer is copper-foil conducting electricity, copper-foil conducting electricity with a thickness of 25um, copper-foil conducting electricity thickness according to
Electric conductivity is adjustable with intensity.
Further, the micropore size is φ 0.1mm-0.3mm, pitch of holes 0.3-0.8mm.
Further, the base edge is equipped with multiple location holes.
Beneficial effect obtained by the present invention is: using the above scheme, electrode layer and base are formed by lamination without matrix
Material greatly reduces the impedance value under the impedance value of product, especially hot environment (100 DEG C), and lower 25 DEG C of room temperature by under 170 Ω
50 ohm are dropped to, 100 DEG C of high temperature drop to 50 Ω by 300 Ω, and the resonance impedance value of product is reduced, in-fighting is greatly reduced,
The service life for extending product improves substrate flexibility, is easy to bend, makes transparency without glue between electrode layer and base
It is good.
Detailed description of the invention
Through the following detailed description taken in conjunction with the accompanying drawings, present invention objects, features and advantages above-mentioned and other will become
Obviously.
Fig. 1 is the structural schematic diagram of the embodiment of the present invention 1.
Fig. 2 is the disassembly diagram of Fig. 1.
Fig. 3 is the structural schematic diagram of 1 flexible circuit board of the embodiment of the present invention.
Fig. 4 is the structural schematic diagram of 2 flexible circuit board of the embodiment of the present invention.
Fig. 5 is the cross section structure schematic diagram of substrate of the present invention.
Fig. 6 is the cross section structure schematic diagram of prior art substrate.
Fig. 7 is the comparison diagram for having gum base materials with no two set product resonance impedance value Rs of gum base materials.
Wherein: 1 is piezoelectric ceramic piece, and 2 be flexible circuit board, and 2.1 be base, and 2.2 be copper-foil conducting electricity, and 2.3 be upper covering
Layer, 2.4 be pad, and 2.5 be brush silver layer, and 3 be substrate, and 4 be micropore.
Specific embodiment
The following describes the present invention in detail with reference to the accompanying drawings and embodiments.
Embodiment 1: as shown in Figure 1 and Figure 2, a kind of containing whether there is or not the piezo-electric resonator of gum base materials flexible circuit board including mutual
Piezoelectric ceramic piece 1, flexible circuit board 2 and the substrate 3 of pressing, flexible circuit board 2 is by base 2.1, base as shown in figs. 3 and 5
Copper-foil conducting electricity 2.2 on 2.1 is constituted, and copper-foil conducting electricity 2.2 and base 2.1 are connected with the molded method lamination of no glue-line, copper-foil conducting electricity
Upper caldding layer 2.3 is also covered with outside 2.2, with epoxy glue glued adhesion, upper caldding layer between upper caldding layer 2.3 and copper-foil conducting electricity 2.2
2.3, base 2.1 is polyimides (PI) insulating polymeric material, upper caldding layer 2.3 with a thickness of 20um, the thickness of base 2.1
Degree is 25um, copper-foil conducting electricity 2.2 with a thickness of 25um, substrate 3 and 2.1 other end of base are with epoxy glue glued adhesion, copper-foil conducting electricity
2.2 be electric texture structure, and electric lines includes the arcuate peripheral electrode district of annular central electrode district, contre electrode area periphery, periphery
Electrode district includes the two poles of the earth about the symmetrical spoon-shaped structure in contre electrode area, and the two poles of the earth of spoon-shaped structure are opposite, spoon-shaped structure
The two poles of the earth a part extend outward to form electrode tip, set pad 2.4 at electrode tip, pad 2.4 is for connecting, corresponding base
2.1 be racket shape, and contre electrode area periphery is also additionally provided with four sections of mutually connection electrode arcs for not connecting, close to the two poles of the earth in four sections
Connection electrode arc is connected with corresponding the two poles of the earth respectively, and corresponding upper caldding layer 2.3 is racket shape, and upper caldding layer 2.3 is led with protecting
Electrolytic copper foil 2.2 prevents it to be scratched abrasion, to influence its electric conductivity and prevent circuit breaker, and upper caldding layer 2.3
Corresponding at contre electrode area, connection electrode arc be equipped with circular hollow out pore structure, circular hollow hole size and piezoelectric ceramics
The cooperation of 1 size of piece, the anode of piezoelectric ceramic piece 1 with contre electrode area with epoxy glue glued adhesion, the anode of piezoelectric ceramic piece 1 be equipped with
The electrode pattern of the electric lines connection of copper-foil conducting electricity 2.2, electrode pattern is by 1/4 annular on circular positive polar region and positive polar region side
Cathode arc is constituted, and 1 side of piezoelectric ceramic piece, which corresponds to, is equipped with brush silver layer 2.5 at cathode arc, brush silver layer 2.5 makes piezoelectric ceramic piece 1
Back side cathode guide to the same face of anode, be greatly reduced volume, be equipped with spacing between round positive polar region and cathode arc, it is round
Spacing is slightly larger than the spacing between contre electrode area and connection electrode arc, round positive polar region size and center between positive polar region and cathode arc
Electrode district is consistent, and positive polar region is equipped with 1/4 section of camber protrusion relative to the cathode arc other side, so that positive polar region and contre electrode area phase
It is connected when connecing with the pole in the two poles of the earth.
Substrate 3 and piezoelectric ceramic piece 1 are realized circuit connection by 2 one side of flexible circuit board, on the other hand serve as bonding wire or
Pin is easy to use with reducing the volume of this product, and 4 components of flexible circuit board 2 are soft by one piece of pressing working procedure composition
Property wiring board, upper caldding layer 2.3 protect its on the inside of copper-foil conducting electricity 2.2, and the thickness of upper caldding layer 2.3 according to intensity needs can
It adjusts, the electric lines of copper-foil conducting electricity 2.2 matches with the positive pattern of piezoelectric ceramic piece 1, and electrode, which is divided into, controls two pieces, i.e., and two
Pole, the two poles of the earth are coated under upper caldding layer 2.3, and the two poles of the earth are guided at the pad 2.4 of electrode tip end by circuit design, base
The thickness of 2.1 insulation protections and supporting role, base 2.1 can be adjusted according to actually required intensity.
Without glue among copper-foil conducting electricity 2.2 and base 2.1, it is laminated and is connected with method laminated into type, copper-foil conducting electricity 2.2 and base
2.1 form without gum base materials, eliminate glue bring resistance, will there is gum base materials and FPCB and piezoelectric ceramic piece without gum base materials
1, aluminium substrate 3 is glued, tests the resonance impedance value Rs (100 DEG C of 25 DEG C of room temperature and high temperature) of two set products, the comparison referring to shown in Fig. 7
Value, it will be apparent that no gum base materials greatly reduce the impedance value under the impedance value of product, especially hot environment (100 DEG C), high temperature
100 DEG C drop to 50 Ω by 300 Ω, drop to 50 ohm by 170 Ω at 25 DEG C of room temperature, greatly reduce the resonance impedance of product
Value, the energy transmission that piezoelectric ceramic piece 1 vibrates when work drive the vibration of integral device, the glue in substrate to metal substrate 3
Can dissipate a part of vibrational energy, therefore impedance is higher, and when high temperature, potsherd and substrate 3 are still the very high elastomer of hardness,
And glue softens at high temperature, energy transmission is very weak, therefore impedance is higher compared under room temperature, largely reduced energy transmission, conductive
What copper foil 2.2 and base 2.1 were formed then compensates for this defect without gum base materials, greatly reduces energy transmission consume, reduces
Impedance, and without gum base materials enhance flexibility, be easy to bend, improve transparency, the in-fighting of product is greatly reduced, is extended
The service life of product, and corresponding base 2.1 is equipped with and divides equally distribution micropore 4 at contre electrode area, contre electrode area,
Contre electrode area micropore, base micro well locations are corresponding and are connected, and the aperture of micropore 4 is φ 0.1mm, pitch of holes 0.3mm, uniformly
The micropore of distribution can step down to electric conductor, can be effectively reduced the impedance of product, so that consume is further dropped significantly
It is low, its service life is effectively extended, 2.1 edge of base is equipped with multiple location holes, and location hole is convenient for the use of this product
Installation.
Embodiment 2: it is shown in reference picture 1, Fig. 2, it is a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board, including phase
Piezoelectric ceramic piece 1, flexible circuit board 2 and the substrate 3 mutually pressed, flexible circuit board 2 as shown in Figure 4, Figure 5 is by base 2.1, base
Copper-foil conducting electricity 2.2 in 2.1 upper and lower end faces is constituted, and the copper-foil conducting electricity 2.2 of upper and lower end faces and base 2.1 are with no glue-line pressure
Method of forming lamination connects, and upper caldding layer 2.3 is also covered with outside copper-foil conducting electricity 2.2, between upper caldding layer 2.3 and copper-foil conducting electricity 2.2
With epoxy glue glued adhesion, upper caldding layer 2.3, base 2.1 are polyimides (PI) insulating polymeric material, upper caldding layer 2.3
With a thickness of 25um, base 2.1 with a thickness of 25um, copper-foil conducting electricity 2.2 with a thickness of 30um, substrate 3 and 2.1 lower end surface of base
Copper-foil conducting electricity 2.2 with epoxy glue glued adhesion, the copper-foil conducting electricity 2.2 of piezoelectric ceramic piece 1 and 2.1 upper surface of base with epoxy glue glued adhesion,
Piezoelectric ceramic piece 1 is connected with the electrode pattern of its anode with the cooperation of the point lines of 2.2 corresponding position of lower end surface copper-foil conducting electricity, electric lines
Arcuate peripheral electrode district including annular central electrode district, contre electrode area periphery, peripheral electrode area includes about contre electrode
The two poles of the earth of the symmetrical spoon-shaped structure in area, the two poles of the earth of spoon-shaped structure are opposite, and the two poles of the earth a part of spoon-shaped structure extends outwardly shape
At electrode tip, pad 2.4 is set at electrode tip, for pad 2.4 for connecting, corresponding base 2.1 is racket shape, outside contre electrode area
It encloses and is also additionally provided with four sections of mutually connection electrode arcs for not connecting, the connection electrode arc in four sections close to the two poles of the earth is respectively with corresponding two
Pole connection, corresponding upper caldding layer 2.3 are racket shape, and upper caldding layer 2.3 prevents it to be scratched mill to protect copper-foil conducting electricity 2.2
Damage, to influence its electric conductivity and prevent circuit breaker, and upper caldding layer 2.3 corresponds to contre electrode area, connection electricity
Circular hollow out pore structure is equipped at polar arc, circular hollow hole size and 1 size of piezoelectric ceramic piece cooperate, piezoelectric ceramic piece 1
Anode with contre electrode area with epoxy glue glued adhesion, the anode of piezoelectric ceramic piece 1, which is equipped with, to be connect with the electric lines of copper-foil conducting electricity 2.2
Electrode pattern, electrode pattern are made of 1/4 annular cathode arc on circular positive polar region and positive polar region side, piezoelectric ceramic piece 1
Side, which corresponds to, is equipped with brush silver layer 2.5 at cathode arc, brush silver layer 2.5 makes the back side cathode of piezoelectric ceramic piece 1 guide to the same of anode
On one side, it is greatly reduced volume, spacing is equipped between round positive polar region and cathode arc, spacing is omited between round positive polar region and cathode arc
Greater than the spacing between contre electrode area and connection electrode arc, round positive polar region size is consistent with contre electrode area, and positive polar region is opposite
It is equipped with 1/4 section of camber protrusion in the cathode arc other side, so that positive polar region is led when connecting with contre electrode area with the pole in the two poles of the earth
It is logical.
Substrate 3 and piezoelectric ceramic piece 1 are realized circuit connection by 2 one side of flexible circuit board, on the other hand serve as bonding wire or
Pin is easy to use with reducing the volume of this product, and 4 components of flexible circuit board 2 are soft by one piece of pressing working procedure composition
Property wiring board, upper caldding layer 2.3 protect its on the inside of copper-foil conducting electricity 2.2, and the thickness of upper caldding layer 2.3 according to intensity needs can
It adjusts, the electric lines of copper-foil conducting electricity 2.2 matches with the positive pattern of piezoelectric ceramic piece 1, and electrode, which is divided into, controls two pieces, i.e., and two
Pole, the two poles of the earth are coated under upper caldding layer 2.3, and the two poles of the earth are guided at the pad 2.4 of electrode tip end by circuit design, base
The thickness of 2.1 insulation protections and supporting role, base 2.1 can be adjusted according to actually required intensity.
Without glue among copper-foil conducting electricity 2.2 and base 2.1, it is laminated and is connected with method laminated into type, copper-foil conducting electricity 2.2 and base
2.1 form without gum base materials, eliminate glue bring resistance, greatly reduce the impedance value of product, especially hot environment
Impedance value under (100 DEG C), 100 DEG C of high temperature drop to 50 Ω by 300 Ω, drop to 50 ohm by 170 Ω at 25 DEG C of room temperature, greatly
Reduce the resonance impedance value of product greatly, the energy transmission that piezoelectric ceramic piece 1 vibrates when work drives whole to metal substrate 3
The vibration of device, the glue in substrate can dissipate a part of vibrational energy, therefore impedance is higher, when high temperature, potsherd and substrate 3
It is still the very high elastomer of hardness, and glue softens at high temperature, energy transmission is very weak, therefore impedance is higher compared under room temperature,
It largely reduced energy transmission, what copper-foil conducting electricity 2.2 and base 2.1 were formed then compensates for this defect without gum base materials, drops significantly
Low energy transmission consume, reduces impedance, and enhances flexibility without gum base materials, is easy to bend, improves transparency, greatly
The in-fighting for reducing product greatly, extends the service life of product, and corresponding base at contre electrode area, contre electrode area
2.1 are equipped with respectively distribution micropore 4, and contre electrode area micropore, base's micro well locations are corresponding and are connected, and the aperture of micropore 4 is φ
0.1mm, pitch of holes 0.3mm, equally distributed micropore can step down to electric conductor, can be effectively reduced the resistance of product
It is anti-, so that consume further substantially reduces, its service life is effectively extended, 2.1 edge of base is equipped with multiple positioning
Hole, location hole are installed convenient for the use of this product.
The above description is only a preferred embodiment of the present invention, is not intended to limit the scope of the invention, all utilizations
Equivalent structure or equivalent flow shift made by description of the invention and accompanying drawing content is applied directly or indirectly in other correlations
Technical field, be included within the scope of the present invention.
Claims (8)
1. it is a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board, including piezoelectric ceramic piece, the flexible wire being laminated
Road plate and substrate, it is characterised in that: the flexible circuit board is made of electrode layer, the base connecting with electrode layer, described
Electrode layer and base press without glue-line to be connected, and is also covered with upper caldding layer, the piezoelectric ceramic piece and electrode layer outside electrode layer
It being fitted and connected, electrode layer is equipped with the electric lines connecting with piezoelectric ceramic piece, and the substrate is fitted and connected with base, base,
Upper caldding layer is polymer insulation material, and the electrode layer is equipped with the electrode tip extended outward, corresponding base, on cover
Cap rock is equipped with the extended structure of cooperation electrode tip；
The electric lines includes the arcuate peripheral electrode district of annular central electrode district, contre electrode area periphery, peripheral electrode area
Including the two poles of the earth about the symmetrical spoon-shaped structure in contre electrode area, the two poles of the earth of spoon-shaped structure are opposite, the two poles of the earth of spoon-shaped structure
A part extends outward to form electrode tip, pad is set at electrode tip, electrode pattern is by circular positive polar region and positive polar region side
1/4 annular cathode arc constitute, piezoelectric ceramic piece side, which corresponds to, is equipped with brush silver layer at cathode arc, brush silver layer makes piezoelectric ceramic piece
Spacing is equipped between round positive polar region and cathode arc, spacing is greater than contre electrode area and connection electrode between round positive polar region and cathode arc
Spacing between arc, round positive polar region size is consistent with contre electrode area, and positive polar region is equipped with 1/4 section of arc relative to the cathode arc other side
Type protrusion, so that positive polar region is connected when connecting with contre electrode area with the pole in the two poles of the earth.
2. according to claim 1 a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board, it is characterised in that: institute
The hollow hole for making piezoelectric ceramic piece connect with electrode layer is equipped in the middle part of the upper caldding layer stated, the electric lines is in hollow hole model
In enclosing, circular piezoelectric ceramic piece is arranged in hollow hole simultaneously and electrode layer is with epoxy glue glued adhesion, piezoelectric ceramic piece and electrode layer
Cemented surface is anode, and another side is cathode, and piezoelectric ceramic piece side is equipped with the silver layer that cathode is guided to anode, and silver layer extends to
Anode simultaneously cooperates anode to form the electrode pattern with the cooperation of electrode layer electricity lines.
3. according to claim 1 a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board, it is characterised in that: institute
Corresponding base, which is equipped with, at the contre electrode area that states, contre electrode area divides equally distribution micropore, and contre electrode area micropore, base are micro-
Hole site is corresponding.
4. according to claim 1 a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board, it is characterised in that: institute
With epoxy glue glued adhesion between the substrate stated and base.
5. according to claim 1 a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board, it is characterised in that: institute
The material of the base, upper caldding layer that state is PI or PU, and upper caldding layer is with a thickness of 9-25um, groundwork thickness 23-33um.
6. according to claim 1 a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board, it is characterised in that: institute
The electrode layer stated be copper-foil conducting electricity, copper-foil conducting electricity with a thickness of 25um.
7. according to claim 3 a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board, it is characterised in that: institute
Stating micropore size is φ 0.1mm-0.3mm, pitch of holes 0.3-0.8mm.
8. according to claim 1 a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board, it is characterised in that: institute
The base edge stated is equipped with multiple location holes.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201610096482.4A CN105763168B (en) | 2016-02-22 | 2016-02-22 | It is a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board |
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| CN201610096482.4A CN105763168B (en) | 2016-02-22 | 2016-02-22 | It is a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board |
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| CN105763168B true CN105763168B (en) | 2019-02-19 |
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| CN106558649B (en) * | 2016-11-08 | 2019-11-26 | 广东奥迪威传感科技股份有限公司 | Ultrasonic sensor and its manufacturing method |
| CN114441028B (en) * | 2020-10-30 | 2024-04-23 | 深圳富桂精密工业有限公司 | Stamping abnormality detection system |
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| CN103594076A (en) * | 2013-11-20 | 2014-02-19 | 常州波速传感器有限公司 | Piezoelectric plate structure |
| CN103857183A (en) * | 2012-12-05 | 2014-06-11 | 昆山雅森电子材料科技有限公司 | Combined type flexible printed circuit board structure |
| CN205017684U (en) * | 2015-09-18 | 2016-02-03 | 昆山龙朋精密电子有限公司 | Adopt one -course three -layer flexible circuit board of fine copper preparation inlayer |
| CN205490447U (en) * | 2016-02-22 | 2016-08-17 | 汉得利（常州）电子股份有限公司 | Piezoelectric resonator who contains no matrix material flexible printed circuit, FPC |
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2016
- 2016-02-22 CN CN201610096482.4A patent/CN105763168B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103857183A (en) * | 2012-12-05 | 2014-06-11 | 昆山雅森电子材料科技有限公司 | Combined type flexible printed circuit board structure |
| CN103594076A (en) * | 2013-11-20 | 2014-02-19 | 常州波速传感器有限公司 | Piezoelectric plate structure |
| CN205017684U (en) * | 2015-09-18 | 2016-02-03 | 昆山龙朋精密电子有限公司 | Adopt one -course three -layer flexible circuit board of fine copper preparation inlayer |
| CN205490447U (en) * | 2016-02-22 | 2016-08-17 | 汉得利（常州）电子股份有限公司 | Piezoelectric resonator who contains no matrix material flexible printed circuit, FPC |
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| CN105763168A (en) | 2016-07-13 |
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