CN103594076B - Piezoelectric plate structure - Google Patents
Piezoelectric plate structure Download PDFInfo
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- CN103594076B CN103594076B CN201310585180.XA CN201310585180A CN103594076B CN 103594076 B CN103594076 B CN 103594076B CN 201310585180 A CN201310585180 A CN 201310585180A CN 103594076 B CN103594076 B CN 103594076B
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Abstract
The present invention relates to a kind of piezoelectric plate structure being applicable to various piezoelectric-type ultrasonic wave sensor and hummer, comprise substrate, piezoelectric ceramic piece, piezoelectric ceramic piece upper surface is provided with the first electrode layer, lower surface neighboring is provided with peripheral electrode layer, the second electrode lay, and the first electrode layer, peripheral electrode layer are connected by the side electrode layer of piezoelectric ceramic piece side; Be provided with the first conductive layer, intermediate insulating layer, the second conductive layer between piezoelectric ceramic piece and substrate successively, the first conductive layer neighboring is provided with the peripheral conductive ring matched with peripheral electrode layer, and middle part is provided with the middle part conductive layer matched with the second electrode lay; For connecting the electric conductor of the second electrode lay and the second conductive layer on piezoelectric ceramic piece; Such piezoelectric ceramics chip architecture, without the need to adopting welding technology, can not produce pollution, only need adopt that glue is bonding just can, produce very convenient, production efficiency is high, is easy to realize industrialized automatic production, the high reliability of piezoelectric ceramic piece can be ensured, extend its serviceable life.
Description
Technical field
The present invention relates to a kind of piezoelectric plate structure being applicable to various piezoelectric-type ultrasonic wave sensor and hummer.
Background technology
In existing piezoelectric ceramic ultrasound sensor, the electrode lead-out mode of piezoelectric patches is generally divided into stitch and lead-in wire.Lead-in wire is divided into again a variety of, as the stranded conductor etc. of braided wire, enameled wire, tape insulation.Potsherd electrode generally adopts silver electrode, and be easy to welding, use common solder stick or lead-free soldering wire, the electric soldering iron of more than 25W can; Note also welding temperature and time during welding, temperature should be good below 350 degrees Celsius, and the time generally can not be greater than 1 second, excessive temperature or long weld interval easily cause " flying silver ", i.e. off-line, also easily make potsherd scorch, thinner potsherd more should be noted that.Therefore process need strictly controls.Except potsherd electrode, also having one is sheet metal or aluminium shell.Sheet metal generally has latten(-tin), iron-nickel alloy sheet, stainless steel substrates, tinplate sheet etc., and wherein latten(-tin) and iron-nickel alloy sheet can directly weld, but than the weldering of potsherd electrode difficulty, stainless steel and tinplate sheet need to use acid scaling powder.Cannot bonding wire in aluminium shell, need perforate in the enclosure to insert fastener, then weld on fastener, very loaded down with trivial details.Meanwhile, welding process solder joint can not be too large, too large on performance and below be equipped with impact.Stitch also needs to extract with short lead-in wire.And solder joint may come off in application process, bonding wire has the risk of fracture, therefore relates to the electrode lead-out mode of stitch and lead-in wire, and operation inconvenience, efficiency is low, and cost is high, restive, and has pollution, is unfavorable for environmental protection, and reliability is not high.
Summary of the invention
For above-mentioned technical matters, the invention provides a kind of rational in infrastructure, reliable and stable piezoelectric plate structure, without the need to adopting any welding in its production run, can not pollution be produced, be easy to realize industrial automation and produce.
Realize technical scheme of the present invention as follows:
Piezoelectric plate structure, comprise substrate, be arranged at on-chip piezoelectric ceramic piece, described piezoelectric ceramic piece upper surface is provided with the first electrode layer, piezoelectric ceramic piece lower surface neighboring is provided with peripheral electrode layer, first electrode layer, peripheral electrode layer are connected by the side electrode layer of piezoelectric ceramic piece side, in the middle part of the lower surface of piezoelectric ceramic piece, be provided with the second electrode lay; The first conductive layer, intermediate insulating layer, the second conductive layer is disposed with between described piezoelectric ceramic piece and substrate, first conductive layer neighboring is provided with the peripheral conductive ring matched with above-mentioned peripheral electrode layer, middle part is provided with the middle part conductive layer matched with above-mentioned the second electrode lay; And for connecting the electric conductor of the second electrode lay and the second conductive layer on piezoelectric ceramic piece; Described first conductive layer, the second conductive layer extend electrode tip respectively.
Further, the middle part conductive layer of described first conductive layer, intermediate insulating layer offer the resigning hole passed for above-mentioned electric conductor, one end of electric conductor contacts with the second electrode lay of piezoelectric ceramic piece, the other end and the second conductive layers make contact, realize the electric connection between the second electrode lay and the second conductive layer like this.Resigning hole one can be stepped down to electric conductor, and two are, can increase the bonding fastness between the first conductive layer, intermediate insulating layer, the second conductive layer.
Further, described first conductive layer outside surface is provided with the non-conductive upper caldding layer that thickness is 9-25um.Described second conductive layer outside surface is provided with the non-conductive lower caldding layer that thickness is 9-25um.Adopt nonconducting upper caldding layer, lower caldding layer, the effect of insulating can be realized, the effect of protection can also be played in addition to corresponding conductive layer.
Further, described resigning hole quantity is 200-400, and diameter is 0.2mm-0.4mm.
Further, described intermediate insulating layer is that polyimide insulating polymeric material is made, and thickness is 20um-30um.Intermediate insulating layer by the insulation of the first conductive layer, the second conductive layer relevant position separately, can play the effect of insulation protection, also plays the effect of support first conductive layer, the second conductive layer simultaneously.
Further, described first conductive layer, the second conductive layer are the Copper Foil of thickness 20um-30um.
Have employed such scheme, by arranging the first conductive layer, intermediate insulating layer, the second conductive layer between piezoelectric ceramic piece, substrate, and the first electrode layer, side electrode layer, being electrically connected together as negative pole between peripheral electrode layer; The positive pole that the second electrode lay, the second conductive layer and the electric conductor both electric connection are formed; And the corresponding electrode tip extraction of being extended by the second conductive layer, the first conductive layer respectively of positive pole, negative pole; Without the need to adopting welding technology in such piezoelectric plate structure, can not pollution be produced, only need adopt glue bonding just can, produce very convenient, production efficiency is high, is easy to realize industrialized automatic production; And bonding relatively firm between adjacent layer, the high reliability of piezoelectric patches can be ensured, extend its serviceable life.
Accompanying drawing explanation
Fig. 1 is the structural representation of piezoelectric patches of the present invention;
Fig. 2 is the schematic diagram of piezoelectric ceramic piece in the present invention;
Fig. 3 is broken away view of the present invention;
Fig. 4 is the further broken away view of Fig. 3;
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further described.
See Fig. 1-4, piezoelectric plate structure, comprises the substrate 1 be made up of aluminium or copper or tinplate or nickel material, is arranged at the piezoelectric ceramic piece 2 of on-chip stupalith, piezoelectric ceramic piece is building block important in ultrasonic piezoelectric transducer, is the oscillator element in piezoelectric transducer.When voltage acts on piezoelectric ceramic piece, piezoelectric ceramic piece will produce mechanically deform with the change of voltage and frequency.On the other hand, when vibrating piezoelectric ceramic piece, then an electric charge can be produced.Utilizing this principle, when giving the Vib. be made up of a slice piezoelectric ceramic piece and a substrate, when namely piezoelectric ceramic piece applies an electric signal, ultrasound wave will be launched because of flexural vibrations; Piezoelectric ceramic piece upper surface is provided with the first electrode layer 3 that ag material is made, piezoelectric ceramic piece lower surface neighboring is provided with the peripheral electrode layer 4 that ag material is made, first electrode layer 3, peripheral electrode layer 4 are connected by the silver side electrode layer 5 of piezoelectric ceramic piece side, are provided with the second electrode lay 6 that silver material is made in the middle part of the lower surface of piezoelectric ceramic piece; The first conductive layer 7, intermediate insulating layer 8, second conductive layer 9 is disposed with between piezoelectric ceramic piece and substrate, first conductive layer neighboring is provided with the peripheral conductive ring 10 matched with above-mentioned peripheral electrode layer 4, peripheral electrode layer 4 contacts with peripheral conductive ring 10, the peripheral conductive ring 10 of such first electrode layer 3, side electrode layer 5, peripheral electrode layer 4, first conductive layer 7 is formed and is electrically connected, as negative pole, and drawn by electrode tip 11; Be provided with the middle part conductive layer 12 matched with above-mentioned the second electrode lay 6 in the middle part of first conductive layer 7, separated by interval trough 13 between middle part conductive layer and peripheral conductive ring, be not namely electrically connected; And for connecting the electric conductor of the second electrode lay 6 and the second conductive layer 9 on piezoelectric ceramic piece 2, this electric conductor is the copper product of conduction; Middle part conductive layer 12 is electrically connected as positive pole by electric conductor and the second electrode lay, and is drawn by electrode tip 14.Electrode tip 11, electrode tip 14 are drawn and are welded on pad 18; In concrete enforcement, the first conductive layer, the second conductive layer are the circular Copper Foil of thickness 20um or 25um or 30um, certainly can also be arranged to different shapes as required.In making, piezoelectric ceramic piece and the first conductive layer, substrate and the second conductive layer adopt epoxy glue glue to be combined.Corresponding intermediate insulating layer also extends and electrode tip 11,14 corresponding insulating ends 19 for insulating.
Wherein, the middle part conductive layer 12 of the first conductive layer 7, intermediate insulating layer 8 offer the resigning hole 15 passed for above-mentioned electric conductor, one end of electric conductor contacts with the second electrode lay of piezoelectric ceramic piece, the other end and the second conductive layers make contact, and electric conductor is the conductive copper be plated in resigning hole; Certainly on the second conductive layer 9, also can offer the resigning hole that position, size are corresponding with resigning hole on middle part conductive layer 12, intermediate insulating layer 8, be convenient to being coated with electric conductor like this; In concrete enforcement, resigning hole quantity is 200 or 250 or 300 or 350 or 400, and diameter is 0.2mm or 0.3mm or 0.4mm.
First conductive layer outside surface is provided with the non-conductive upper caldding layer 16 that thickness is 9-25um.Second conductive layer outside surface is provided with the non-conductive lower caldding layer 17 that thickness is 9-25um, the thickness of upper caldding layer 16, lower caldding layer 17 can be made for the nonconducting macromolecular material of 9um or 15um or 20um or 25um; In concrete enforcement, the thickness of upper caldding layer 16, lower caldding layer 17 can be arranged to equal, can certainly be arranged to unequal; Intermediate insulating layer is that polyimide insulating polymeric material is made, and thickness is 20um or 25um or 30um.
It should be pointed out that for the person of ordinary skill of the art at this, without departing from the concept of the premise of the invention, can also improvement be made, but these all belong to protection scope of the present invention.
Claims (7)
1. piezoelectric plate structure, comprise substrate, be arranged at on-chip piezoelectric ceramic piece, it is characterized in that, described piezoelectric ceramic piece upper surface is provided with the first electrode layer, piezoelectric ceramic piece lower surface neighboring is provided with peripheral electrode layer, and the first electrode layer, peripheral electrode layer are connected by the side electrode layer of piezoelectric ceramic piece side, in the middle part of the lower surface of piezoelectric ceramic piece, be provided with the second electrode lay; The first conductive layer, intermediate insulating layer, the second conductive layer is disposed with between described piezoelectric ceramic piece and substrate, first conductive layer neighboring is provided with the peripheral conductive ring matched with above-mentioned peripheral electrode layer, middle part is provided with the middle part conductive layer matched with above-mentioned the second electrode lay; And for connecting the electric conductor of the second electrode lay and the second conductive layer on piezoelectric ceramic piece; Described first conductive layer, the second conductive layer extend electrode tip respectively.
2. piezoelectric plate structure according to claim 1, it is characterized in that, the middle part conductive layer of described first conductive layer, intermediate insulating layer offer the resigning hole passed for above-mentioned electric conductor, one end of electric conductor contacts with the second electrode lay of piezoelectric ceramic piece, the other end and the second conductive layers make contact.
3. piezoelectric plate structure according to claim 1, is characterized in that, described first conductive layer outside surface is provided with the non-conductive upper caldding layer that thickness is 9-25um.
4. piezoelectric plate structure according to claim 1, is characterized in that, described second conductive layer outside surface is provided with the non-conductive lower caldding layer that thickness is 9-25um.
5. piezoelectric plate structure according to claim 2, is characterized in that, described resigning hole quantity is 200-400, and diameter is 0.2mm-0.4mm.
6. piezoelectric plate structure according to claim 1, is characterized in that, described intermediate insulating layer is that polyimide insulating polymeric material is made, and thickness is 20um-30um.
7. the piezoelectric plate structure according to any one of claim 1-6, is characterized in that, described first conductive layer, the second conductive layer are the Copper Foil of thickness 20um-30um.
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| CN201310585180.XA CN103594076B (en) | 2013-11-20 | 2013-11-20 | Piezoelectric plate structure |
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| CN201310585180.XA CN103594076B (en) | 2013-11-20 | 2013-11-20 | Piezoelectric plate structure |
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| CN103594076B true CN103594076B (en) | 2016-04-20 |
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Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP6839945B2 (en) * | 2015-09-30 | 2021-03-10 | ヤマハ株式会社 | Musical instrument pickups and musical instruments |
| CN105704907A (en) * | 2016-02-22 | 2016-06-22 | 汉得利（常州）电子股份有限公司 | Flexible circuit board for reducing impedance of piezoresonator |
| CN105763168B (en) * | 2016-02-22 | 2019-02-19 | 汉得利（常州）电子股份有限公司 | It is a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board |
| CN108648740A (en) * | 2018-06-22 | 2018-10-12 | 肇庆奥迪威传感科技有限公司 | Buzzer, piezoelectricity singing piece and its manufacturing method |
| CN110193442A (en) * | 2019-04-24 | 2019-09-03 | 深圳市尚进电子科技有限公司 | A kind of mesh-type ultrasonic atomization piece and manufacturing process |
| CN113140667A (en) * | 2021-04-22 | 2021-07-20 | 广东奥迪威传感科技股份有限公司 | Piezoelectric vibration device |
| CN116171097B (en) * | 2023-04-25 | 2023-07-18 | 常州威图流体科技有限公司 | Piezoelectric bimorph structure |
| CN118442288A (en) * | 2024-04-30 | 2024-08-06 | 常州威图流体科技有限公司 | Fluid conveying device and liquid cooling heat dissipation module |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1264104A (en) * | 1999-02-19 | 2000-08-23 | 株式会社村田制作所 | Piezoelectric acoustic assembly |
| CN102664234A (en) * | 2012-05-21 | 2012-09-12 | 花毅 | Piezoelectric ceramic actuation element and manufacturing method thereof |
| CN203588666U (en) * | 2013-11-20 | 2014-05-07 | 常州波速传感器有限公司 | Piezoelectric sheet structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP5374087B2 (en) * | 2008-07-29 | 2013-12-25 | 日本特殊陶業株式会社 | Ultrasonic vibrator and manufacturing method thereof |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1264104A (en) * | 1999-02-19 | 2000-08-23 | 株式会社村田制作所 | Piezoelectric acoustic assembly |
| CN102664234A (en) * | 2012-05-21 | 2012-09-12 | 花毅 | Piezoelectric ceramic actuation element and manufacturing method thereof |
| CN203588666U (en) * | 2013-11-20 | 2014-05-07 | 常州波速传感器有限公司 | Piezoelectric sheet structure |
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Address after: No.39 Xinggang Road, Zhonglou District, Changzhou City, Jiangsu Province Patentee after: Jiangsu wave speed sensor Co., Ltd Address before: 213000, room 178, No. 706 ERON South Road, bell tower area, Jiangsu, Changzhou Patentee before: BESTAR SENSORTECH Co.,Ltd. |
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