CN103594076A - Piezoelectric plate structure - Google Patents
Piezoelectric plate structure Download PDFInfo
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- CN103594076A CN103594076A CN201310585180.XA CN201310585180A CN103594076A CN 103594076 A CN103594076 A CN 103594076A CN 201310585180 A CN201310585180 A CN 201310585180A CN 103594076 A CN103594076 A CN 103594076A
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Abstract
The invention relates to a piezoelectric plate structure suitable for various kinds of piezoelectric type ultrasonic transducers and buzzers. The piezoelectric plate structure comprises a substrate, a piezoelectric ceramic plate and an electric conductor, wherein a first electrode layer is arranged on the upper surface of the piezoelectric ceramic plate, a peripheral electrode layer and a second electrode layer are arranged on the periphery of the lower surface of the piezoelectric ceramic plate, and the first electrode layer is connected with the peripheral electrode layer through a side electrode layer on the side face of the piezoelectric ceramic plate; a first conductive layer, a middle insulation layer and a second conductive layer are sequentially arranged between the piezoelectric ceramic plate and the substrate, a peripheral conductive coil matched with the peripheral electrode layer is arranged on the periphery of the first conductive layer, and a middle conductive layer matched with the second electrode layer is arranged in the middle of the first conductive layer; the electric conductor is used for enabling the second electrode layer on the piezoelectric ceramic plate and the second conductive layer to be connected. Therefore, the piezoelectric plate structure does not need a welding process, cannot produce pollution, only needs to be glued through glue water, is very convenient to produce, high in production efficiency, easy to produce automatically on an industrial scale and can guarantee high reliability of the piezoelectric ceramic plate, and the service life of the piezoelectric plate structure is prolonged.
Description
Technical field
The present invention relates to a kind of piezoelectric patches structure that is applicable to various piezoelectric-type ultrasonic wave sensors and hummer.
Background technology
In existing piezoelectric ceramic ultrasound sensor, the electrode lead-out mode of piezoelectric patches is generally divided into stitch and lead-in wire.Lead-in wire is divided into again a variety of, as the stranded conductor of braided wire, enameled wire, tape insulation etc.Potsherd electrode generally adopts silver electrode, is easy to welding, uses common solder stick or lead-free soldering wire, and electric soldering iron more than 25W can; During welding, note also welding temperature and time, temperature should be good at 350 degrees Celsius below, and the time generally can not be greater than 1 second, easily cause excessive temperature or long weld interval " flying silver ", be off-line, also easily make potsherd scorch, thinner potsherd more should be noted that.Therefore process need is strictly controlled.Except potsherd electrode, also having one is sheet metal or aluminium shell.Sheet metal generally has latten(-tin), iron-nickel alloy sheet, stainless steel substrates, tinplate sheet etc., and wherein latten(-tin) and iron-nickel alloy sheet can directly weld, but than the difficult weldering of potsherd electrode, stainless steel and tinplate sheet need to be used acid scaling powder.Cannot bonding wire in aluminium shell, need perforate in the enclosure to insert fastener, then weld on fastener, very loaded down with trivial details.Meanwhile, welding process solder joint can not be too large, too greatly on performance and below be equipped with impact.Stitch also needs to extract with short lead-in wire.And solder joint may come off in application process, bonding wire has the risk of fracture, therefore relates to the electrode lead-out mode of stitch and lead-in wire, operation inconvenience, and efficiency is low, and cost is high, restive, and has pollution, is unfavorable for environmental protection, and reliability is not high.
Summary of the invention
For above-mentioned technical matters, the invention provides a kind of rational in infrastructure, reliable and stable piezoelectric patches structure, in its production run, without adopting any welding, can not produce pollution, be easy to realize industrial automation and produce.
Realize technical scheme of the present invention as follows:
Piezoelectric patches structure, comprise substrate, be arranged at on-chip piezoelectric ceramic piece, described piezoelectric ceramic piece upper surface is provided with the first electrode layer, piezoelectric ceramic piece lower surface neighboring is provided with peripheral electrode layer, the first electrode layer, peripheral electrode layer connect by the side electrode layer of piezoelectric ceramic piece side, at the lower surface middle part of piezoelectric ceramic piece, are provided with the second electrode lay; Between described piezoelectric ceramic piece and substrate, be disposed with the first conductive layer, intermediate insulating layer, the second conductive layer, on the first conductive layer neighboring, be provided with the peripheral conductive ring matching with above-mentioned peripheral electrode layer, middle part is provided with the middle part conductive layer matching with above-mentioned the second electrode lay; And for connecting the electric conductor of the second electrode lay and the second conductive layer on piezoelectric ceramic piece; Described the first conductive layer, the second conductive layer extend respectively electrode tip.
Further, on the middle part conductive layer of described the first conductive layer, intermediate insulating layer, offer the resigning hole passing for above-mentioned electric conductor, one end of electric conductor contacts with the second electrode lay of piezoelectric ceramic piece, the other end contacts with the second conductive layer, realizes like this electric connection between the second electrode lay and the second conductive layer.Resigning hole one can be stepped down to electric conductor, and the 2nd,, can increase the bonding fastness between the first conductive layer, intermediate insulating layer, the second conductive layer.
Further, on described the first conductive layer outside surface, be provided with the non-conductive upper caldding layer that thickness is 9-25um.On described the second conductive layer outside surface, be provided with the non-conductive lower caldding layer that thickness is 9-25um.Adopt nonconducting upper caldding layer, lower caldding layer, can realize the effect of insulation, can also play to corresponding conductive layer the effect of protection in addition.
Further, described resigning hole quantity is 200-400, and diameter is 0.2mm-0.4mm.
Further, described intermediate insulating layer is that polyimide insulating polymeric material is made, and thickness is 20um-30um.Intermediate insulating layer can by the insulation of the first conductive layer, the second conductive layer relevant position separately play the effect of insulation protection, also plays the effect of supporting the first conductive layer, the second conductive layer simultaneously.
Further, described the first conductive layer, the second conductive layer are the Copper Foil of thickness 20um-30um.
Adopted such scheme, by the first conductive layer, intermediate insulating layer, the second conductive layer are set between piezoelectric ceramic piece, substrate, and be electrically connected together as negative pole between the first electrode layer, side electrode layer, peripheral electrode layer; The second electrode lay, the second conductive layer and be electrically connected the positive pole that the two electric conductor forms; And anodal, negative pole is corresponding respectively draws by the second conductive layer, the extended electrode tip of the first conductive layer; Like this in piezoelectric patches structure without adopting welding technology, can not produce pollution, only need to adopt glue bonding just can, produce very conveniently, production efficiency is high, is easy to realize industrialized automatic production; And bonding more firm between adjacent layer, can guarantee the high reliability of piezoelectric patches to extend its serviceable life.
Accompanying drawing explanation
Fig. 1 is the structural representation of piezoelectric patches of the present invention;
Fig. 2 is the schematic diagram of piezoelectric ceramic piece in the present invention;
Fig. 3 is broken away view of the present invention;
Fig. 4 is the further broken away view of Fig. 3;
Embodiment
Below in conjunction with the drawings and specific embodiments, the present invention is further described.
Referring to Fig. 1-4, piezoelectric patches structure, comprises the substrate 1 of being made by aluminium or copper or tinplate or nickel material, is arranged at the piezoelectric ceramic piece 2 of on-chip stupalith, piezoelectric ceramic piece is building block important in ultrasonic piezoelectric transducer, is the oscillator element in piezoelectric transducer.When voltage acts on piezoelectric ceramic piece, piezoelectric ceramic piece will produce mechanically deform with the variation of voltage and frequency.On the other hand, when vibration piezoelectric ceramic piece, can produce an electric charge.Utilize this principle, when giving by a slice piezoelectric ceramic piece and a Vib. that substrate forms, when piezoelectric ceramic piece applies an electric signal, will launch ultrasound wave because of flexural vibrations; Piezoelectric ceramic piece upper surface is provided with the first electrode layer 3 that ag material is made, piezoelectric ceramic piece lower surface neighboring is provided with the peripheral electrode layer 4 that ag material is made, the first electrode layer 3, peripheral electrode layer 4 connect by the silver side electrode layer 5 of piezoelectric ceramic piece side, at the lower surface middle part of piezoelectric ceramic piece, are provided with the second electrode lay 6 that silver material is made; Between piezoelectric ceramic piece and substrate, be disposed with the first conductive layer 7, intermediate insulating layer 8, the second conductive layer 9, on the first conductive layer neighboring, be provided with the peripheral conductive ring 10 matching with above-mentioned peripheral electrode layer 4, peripheral electrode layer 4 contacts with peripheral conductive ring 10, the peripheral conductive ring 10 of such the first electrode layer 3, side electrode layer 5, peripheral electrode layer 4, the first conductive layer 7 forms and is electrically connected, as negative pole, and drawn by electrode tip 11; The first conductive layer 7 middle parts are provided with the middle part conductive layer 12 matching with above-mentioned the second electrode lay 6, between middle part conductive layer and peripheral conductive ring, by interval trough 13, separate, and are not electrically connected; And for connecting the electric conductor of the second electrode lay 6 and the second conductive layer 9 on piezoelectric ceramic piece 2, this electric conductor is the copper product of conduction; Middle part conductive layer 12 is electrically connected as anodal by electric conductor and the second electrode lay, and draws by electrode tip 14.Electrode tip 11, electrode tip 14 are drawn and are welded on pad 18; In concrete enforcement, the first conductive layer, the second conductive layer are the circular Copper Foil of thickness 20um or 25um or 30um, certainly can also be arranged to as required different shapes.In making, piezoelectric ceramic piece and the first conductive layer, substrate and the second conductive layer adopt epoxy glue glue to be combined.Corresponding intermediate insulating layer also extends the insulating end 19 for insulate corresponding with electrode tip 11,14.
Wherein, on the middle part conductive layer 12 of the first conductive layer 7, intermediate insulating layer 8, offer the resigning hole 15 passing for above-mentioned electric conductor, one end of electric conductor contacts with the second electrode lay of piezoelectric ceramic piece, and the other end contacts with the second conductive layer, and electric conductor is the conductive copper being plated in resigning hole; Certainly on the second conductive layer 9, also can offer position, the size resigning hole corresponding with resigning hole on middle part conductive layer 12, intermediate insulating layer 8, be convenient to like this being coated with electric conductor; In concrete enforcement, resigning hole quantity is 200 or 250 or 300 or 350 or 400, and diameter is 0.2mm or 0.3mm or 0.4mm.
On the first conductive layer outside surface, being provided with thickness is the non-conductive upper caldding layer 16 of 9-25um.On the second conductive layer outside surface, being provided with thickness is the non-conductive lower caldding layer 17 of 9-25um, and the thickness of upper caldding layer 16, lower caldding layer 17 can be made for 9um or 15um or 20um or the nonconducting macromolecular material of 25um; In concrete enforcement, the thickness of upper caldding layer 16, lower caldding layer 17 can be arranged to equate, can certainly be arranged to unequal; Intermediate insulating layer is that polyimide insulating polymeric material is made, and thickness is 20um or 25um or 30um.
At this, it should be pointed out that for the person of ordinary skill of the art, without departing from the concept of the premise of the invention, can also make improvement, but these all belong to protection scope of the present invention.
Claims (7)
1. piezoelectric patches structure, comprise substrate, be arranged at on-chip piezoelectric ceramic piece, it is characterized in that, described piezoelectric ceramic piece upper surface is provided with the first electrode layer, piezoelectric ceramic piece lower surface neighboring is provided with peripheral electrode layer, and the first electrode layer, peripheral electrode layer connect by the side electrode layer of piezoelectric ceramic piece side, at the lower surface middle part of piezoelectric ceramic piece, is provided with the second electrode lay; Between described piezoelectric ceramic piece and substrate, be disposed with the first conductive layer, intermediate insulating layer, the second conductive layer, on the first conductive layer neighboring, be provided with the peripheral conductive ring matching with above-mentioned peripheral electrode layer, middle part is provided with the middle part conductive layer matching with above-mentioned the second electrode lay; And for connecting the electric conductor of the second electrode lay and the second conductive layer on piezoelectric ceramic piece; Described the first conductive layer, the second conductive layer extend respectively electrode tip.
2. piezoelectric patches structure according to claim 1, it is characterized in that, on the middle part conductive layer of described the first conductive layer, intermediate insulating layer, offer the resigning hole passing for above-mentioned electric conductor, one end of electric conductor contacts with the second electrode lay of piezoelectric ceramic piece, and the other end contacts with the second conductive layer.
3. piezoelectric patches structure according to claim 1, is characterized in that, is provided with the non-conductive upper caldding layer that thickness is 9-25um on described the first conductive layer outside surface.
4. piezoelectric patches structure according to claim 1, is characterized in that, is provided with the non-conductive lower caldding layer that thickness is 9-25um on described the second conductive layer outside surface.
5. piezoelectric patches structure according to claim 2, is characterized in that, described resigning hole quantity is 200-400, and diameter is 0.2mm-0.4mm.
6. piezoelectric patches structure according to claim 1, is characterized in that, described intermediate insulating layer is that polyimide insulating polymeric material is made, and thickness is 20um-30um.
7. according to the piezoelectric patches structure described in any one in claim 1-6, it is characterized in that, described the first conductive layer, the second conductive layer are the Copper Foil of thickness 20um-30um.
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105704907A (en) * | 2016-02-22 | 2016-06-22 | 汉得利（常州）电子股份有限公司 | Flexible circuit board for reducing impedance of piezoresonator |
| CN105763168A (en) * | 2016-02-22 | 2016-07-13 | 汉得利（常州）电子股份有限公司 | Piezoelectric resonator containing non-adhesive base material flexible circuit board |
| CN108027276A (en) * | 2015-09-30 | 2018-05-11 | 雅马哈株式会社 | Sensor unit and musical instrument |
| CN108648740A (en) * | 2018-06-22 | 2018-10-12 | 肇庆奥迪威传感科技有限公司 | Buzzer, piezoelectricity singing piece and its manufacturing method |
| CN110193442A (en) * | 2019-04-24 | 2019-09-03 | 深圳市尚进电子科技有限公司 | A kind of mesh-type ultrasonic atomization piece and manufacturing process |
| CN113140667A (en) * | 2021-04-22 | 2021-07-20 | 广东奥迪威传感科技股份有限公司 | Piezoelectric vibration device |
| CN116171097A (en) * | 2023-04-25 | 2023-05-26 | 常州威图流体科技有限公司 | Piezoelectric bimorph structure |
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| JP2010035323A (en) * | 2008-07-29 | 2010-02-12 | Ngk Spark Plug Co Ltd | Ultrasonic oscillator and its manufacturing method |
| CN102664234A (en) * | 2012-05-21 | 2012-09-12 | 花毅 | Piezoelectric ceramic actuation element and manufacturing method thereof |
| CN203588666U (en) * | 2013-11-20 | 2014-05-07 | 常州波速传感器有限公司 | Piezoelectric sheet structure |
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2013
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| CN1264104A (en) * | 1999-02-19 | 2000-08-23 | 株式会社村田制作所 | Piezoelectric acoustic assembly |
| JP2010035323A (en) * | 2008-07-29 | 2010-02-12 | Ngk Spark Plug Co Ltd | Ultrasonic oscillator and its manufacturing method |
| CN102664234A (en) * | 2012-05-21 | 2012-09-12 | 花毅 | Piezoelectric ceramic actuation element and manufacturing method thereof |
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Cited By (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108027276A (en) * | 2015-09-30 | 2018-05-11 | 雅马哈株式会社 | Sensor unit and musical instrument |
| US10670453B2 (en) | 2015-09-30 | 2020-06-02 | Yamaha Corporation | Sensor unit and musical instrument |
| US11346709B2 (en) | 2015-09-30 | 2022-05-31 | Yamaha Corporation | Sensor unit and musical instrument |
| CN105704907A (en) * | 2016-02-22 | 2016-06-22 | 汉得利（常州）电子股份有限公司 | Flexible circuit board for reducing impedance of piezoresonator |
| CN105763168A (en) * | 2016-02-22 | 2016-07-13 | 汉得利（常州）电子股份有限公司 | Piezoelectric resonator containing non-adhesive base material flexible circuit board |
| CN105763168B (en) * | 2016-02-22 | 2019-02-19 | 汉得利（常州）电子股份有限公司 | It is a kind of containing whether there is or not the piezo-electric resonators of gum base materials flexible circuit board |
| CN108648740A (en) * | 2018-06-22 | 2018-10-12 | 肇庆奥迪威传感科技有限公司 | Buzzer, piezoelectricity singing piece and its manufacturing method |
| CN110193442A (en) * | 2019-04-24 | 2019-09-03 | 深圳市尚进电子科技有限公司 | A kind of mesh-type ultrasonic atomization piece and manufacturing process |
| US20220008949A1 (en) * | 2019-04-24 | 2022-01-13 | Shenzhen Shang Jin Electronic Science And Technology Co., Ltd. | Ultrasonic atomization piece and manufacturing process thereof |
| CN113140667A (en) * | 2021-04-22 | 2021-07-20 | 广东奥迪威传感科技股份有限公司 | Piezoelectric vibration device |
| CN116171097A (en) * | 2023-04-25 | 2023-05-26 | 常州威图流体科技有限公司 | Piezoelectric bimorph structure |
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| CN103594076B (en) | 2016-04-20 |
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Address after: No.39 Xinggang Road, Zhonglou District, Changzhou City, Jiangsu Province Patentee after: Jiangsu wave speed sensor Co., Ltd Address before: 213000, room 178, No. 706 ERON South Road, bell tower area, Jiangsu, Changzhou Patentee before: BESTAR SENSORTECH Co.,Ltd. |
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