CN206136445U - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN206136445U CN206136445U CN201621160007.0U CN201621160007U CN206136445U CN 206136445 U CN206136445 U CN 206136445U CN 201621160007 U CN201621160007 U CN 201621160007U CN 206136445 U CN206136445 U CN 206136445U
- Authority
- CN
- China
- Prior art keywords
- hole
- circuit board
- welding
- splash guard
- drying agent
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The utility model discloses a circuit board, including circuit board base plate and waterproof board, be provided with the water catch bowl on the waterproof board, it has the drier piece to paste around the water catch bowl, and drier piece top is provided with the welding inoxidizing coating, is provided with the through -hole on the welding inoxidizing coating, it is right to have seted up the through -hole between welding inoxidizing coating, waterproof board, be provided with in the circuit board base plate with the through -hole to the horizontal through -hole of complex, the through -hole to with horizontal through -hole in be provided with conducting coating. The utility model discloses a circuit board can be waterproof, ability protects the parts in the time of the welded, long service life.
Description
Technical field
This utility model is related to electronic device field, more particularly to circuit board.
Background technology
Circuit board makes circuit miniaturization, directly perceivedization, for the batch production and optimization electrical appliance layout lifting of permanent circuit
Act on.Circuit board can be described as printed substrate or printed circuit board (PCB).FPC wiring boards also known as flexible circuit board flexible PCB are
It is a kind of made by with polyimides or mylar as base material that there is height reliability, excellent flexible printed circuit, tool
The characteristics of having high, lightweight Distribution density, thickness of thin, good bending property.
Flexible PCB is a kind of printed circuit board (PCB) made by with polyimides or mylar as base material, is widely used in
MP3, MP4 player, computer, digital camera, mobile phone, medical treatment, automobile, space flight and military field.Because FPC adopts Copper Foil base
Plate, so conduction property is splendid.But existing flexible PCB does not have water-proof function, when making moist or be stained with water, easily
Break down, or even can be short-circuited, damage other hardware.Further, existing flexible PCB is due to the spy of its physical property
Different property, is easily damaged part thereon when soldering part, causes to waste and economic loss.
Utility model content
The technical problems to be solved in the utility model is to provide a kind of energy waterproof, can protect part, prolong when welding
The circuit board of long life.
In order to solve above-mentioned technical problem, scheme of the present utility model is：
Circuit board, including circuit board substrate and the splash guard being bonded on the circuit board substrate, on the splash guard
It is provided with for collecting the water leg of water, drying agent chip is pasted with around the water leg, is provided with above the drying agent chip
Welding overcoat, is provided through in the welding overcoat on the welding overcoat positioned at the surface of the water leg
Through hole；Through hole pair is offered through between the welding overcoat, splash guard simultaneously, is embedded in the circuit board substrate
It is provided with the through hole to the horizontal through hole that uses cooperatively, the through hole pair connects described with being provided with the horizontal through hole
The conductive coating of through hole pair, the through hole is to for leg welding hole.
Further, the welding overcoat is ceramic layer or hard gel layer.
Further, the drying agent chip is silica-gel desiccant.
Further, size of the size of the through hole more than the water leg.
Further, the splash guard is rigid silica plate.
Further, also including the tack coat being adhered between the circuit board substrate and the splash guard, the through hole
To through the tack coat.
Compared with prior art, the beneficial effects of the utility model are：
Circuit board of the present utility model is due to arranging splash guard on circuit board substrate, and arranges on splash guard and catchment
Groove, arranges drying agent chip in the surrounding of water leg, and splash guard can block the water being spread across on circuit board, protection circuit plate, water leg
Water can be assembled, water can be blotted by drying agent chip in time, it is to avoid circuit board breaks down, and then affect normally making for electrical equipment
With the service life of electrical equipment can be extended.
Welding overcoat is provided with above drying agent chip, can be avoided parts being damaged when soldering part, be had
Effect ensures the integrity of electronic product and uses service life.
The tessellation level through hole in the circuit board substrate, conductive coating is arranged in the horizontal through hole.Can with save space,
Also help the beautiful and clean of circuit board.
Through hole to horizontal through hole in be provided with the conductive coating for connecting through hole pair so that through hole to and horizontal through hole it
Between form the closed-loop path of conducting, and using through hole to as leg welding hole, replacing existing jump with the closed-loop path of the conducting
Line, reduces production process, reduces technology difficulty, significantly saves production cost.
Description of the drawings
Longitudinal sectional views of the Fig. 1 for the circuit board of this utility model embodiment.
In figure：1- circuit board substrates, 2- splash guards, 3- water legs, 4- tack coats, 5- drying agent chips, 6- welding overcoats,
7- through holes, 8- through holes pair, 9- conductive coatings, 10- horizontal through hole.
Specific embodiment
Below in conjunction with the accompanying drawings specific embodiment of the present utility model is described further.Here it should be noted that
For the explanation of these embodiments is used to help understand this utility model, but do not constitute to restriction of the present utility model.This
Outward, as long as technical characteristic involved in this utility model disclosed below each embodiment does not constitute conflict each other
Can just be mutually combined.
Refer to Fig. 1, circuit board of the present utility model, including circuit board substrate 1 and be bonded on circuit board substrate 1
Splash guard 2 by made by rigid silica, are provided with splash guard 2 for collecting the water leg 3 of water, glue around water leg 3
Drying agent chip 5 is posted, drying agent chip 5 is silica-gel desiccant.Welding overcoat 6 is provided with above drying agent chip 5, overcoat is welded
6 is ceramic layer or hard gel layer.It is provided through on welding overcoat 6 in welding protection positioned at the surface of water leg 3
The through hole 7 of layer 6, the size of through hole 7 are more than the size of water leg 3.While opening up between overcoat 6, splash guard 2 through welding
There is through hole to 8, be embedded in circuit board substrate 1 and be provided with the horizontal through hole 10 used cooperatively to 8 with through hole, through hole is to 8 and water
Conductive coating 9 of the through hole of connection to 8 is provided with flat through hole 10, through hole is leg welding hole to 8.
Circuit board of the present utility model also includes the tack coat 4 being adhered between circuit board substrate 1 and splash guard 2, bonding
There are the compositionss of binding agent, binding agent dimethyl silicone polymer glue and silicon ester resin on layer 4.Through hole is also extended through in bonding to 8
Layer 4.
In sum, circuit board of the present utility model is due to arranging splash guard on circuit board substrate, and on splash guard
Water leg is set, drying agent chip is set in the surrounding of water leg, splash guard can block the water being spread across on circuit board, protection circuit
Water can be assembled by plate, water leg, water can be blotted by drying agent chip in time, it is to avoid circuit board breaks down, and then affect electrical equipment
Normal use, the service life of electrical equipment can be extended.
Welding overcoat is provided with above drying agent chip, can be avoided parts being damaged when soldering part, be had
Effect ensures the integrity of electronic product and uses service life.
The tessellation level through hole in the circuit board substrate, conductive coating is arranged in the horizontal through hole.Can with save space,
Also help the beautiful and clean of circuit board.
Through hole to horizontal through hole in be provided with the conductive coating for connecting through hole pair so that through hole to and horizontal through hole it
Between form the closed-loop path of conducting, and using through hole to as leg welding hole, replacing existing jump with the closed-loop path of the conducting
Line, reduces production process, reduces technology difficulty, significantly saves production cost.
Embodiment of the present utility model is explained in detail above in association with accompanying drawing, but this utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, it is in the case of without departing from this utility model principle and spirit, right
These embodiments carry out various changes, modification, replacement and modification, still fall within protection domain of the present utility model.
Claims (6)
1. circuit board, it is characterised in that：It is including circuit board substrate and the splash guard being bonded on the circuit board substrate, described
It is provided with splash guard for collecting the water leg of water, drying agent chip is pasted with around the water leg, on the drying agent chip
Side is provided with welding overcoat, is provided through in the weldering on the welding overcoat positioned at the surface of the water leg
Take over control the through hole of sheath；Through hole pair is offered through between the welding overcoat, splash guard simultaneously, the circuit is embedded in
It is provided with plate substrate with the through hole to the horizontal through hole for using cooperatively, is provided with the through hole pair and the horizontal through hole
Connect the conductive coating of the through hole pair, the through hole is to for leg welding hole.
2. circuit board according to claim 1, it is characterised in that：The welding overcoat is ceramic layer or hard gel
Layer.
3. circuit board according to claim 1, it is characterised in that：The drying agent chip is silica-gel desiccant.
4. circuit board according to claim 1, it is characterised in that：Chi of the size of the through hole more than the water leg
It is very little.
5. circuit board according to claim 1, it is characterised in that：The splash guard is rigid silica plate.
6. circuit board according to claim 1, it is characterised in that also include：Bonding and the circuit board substrate with it is described
Tack coat between splash guard, the through hole is to through the tack coat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621160007.0U CN206136445U (en) | 2016-11-01 | 2016-11-01 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621160007.0U CN206136445U (en) | 2016-11-01 | 2016-11-01 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206136445U true CN206136445U (en) | 2017-04-26 |
Family
ID=58575847
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621160007.0U Expired - Fee Related CN206136445U (en) | 2016-11-01 | 2016-11-01 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206136445U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107787114A (en) * | 2017-10-25 | 2018-03-09 | 芜湖市纯至网络科技有限公司 | A kind of waterproof circuit board |
-
2016
- 2016-11-01 CN CN201621160007.0U patent/CN206136445U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107787114A (en) * | 2017-10-25 | 2018-03-09 | 芜湖市纯至网络科技有限公司 | A kind of waterproof circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170426 Termination date: 20201101 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |