CN108617084A - A kind of electromagnetism interference flexible circuit board and production method - Google Patents
A kind of electromagnetism interference flexible circuit board and production method Download PDFInfo
- Publication number
- CN108617084A CN108617084A CN201810631408.7A CN201810631408A CN108617084A CN 108617084 A CN108617084 A CN 108617084A CN 201810631408 A CN201810631408 A CN 201810631408A CN 108617084 A CN108617084 A CN 108617084A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- insulating cement
- cement water
- flexible circuit
- water layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0302—Properties and characteristics in general
- H05K2201/0317—Thin film conductor layer; Thin film passive component
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09209—Shape and layout details of conductors
- H05K2201/0929—Conductive planes
- H05K2201/093—Layout of power planes, ground planes or power supply conductors, e.g. having special clearance holes therein
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of electromagnetism interference flexible circuit board and production methods, wherein electromagnetism interference flexible circuit board includes the electronic component area of circuit board main body and the insulating cement water layer, the conductive adhesive layer that are set gradually from top to bottom in electronic component area upper surface, and the conductive adhesive layer is connect with the earth-return cabling of the circuit board main body.The electromagnetism interference flexible circuit board and production method, by using insulating cement water layer overlay electronic component area, the rough surface in electronic component area can be ignored, to carry out surface insulation, then conductive adhesive layer is used to cover insulating cement water layer, it is connect with the earth-return cabling of circuit board main body, realize the electromagnetic shielding to the electronic component area of circuit board main body, it is simple in structure, it is at low cost, the flexible circuit board of arbitrary pattern can be electromagnetically shielded, applicability is wide.
Description
Technical field
The present invention relates to electronic product electromagnetism interference technical fields, more particularly to a kind of electromagnetism interference flexible circuit
Plate and production method.
Background technology
It is more and more using circuit and electronic component in electronic product with the continuous development of microelectric technique, it is more next
It is more intensive, due to the reduction of the size of electronic device itself, cause the anti-interference ability of device itself to weaken, and electronic device
Between spacing becoming smaller, cause the possibility interfered between each other increasing, be easy to the reliable for operation of electronic product
Property adversely affects.
Therefore, the anti-electromagnetic interference capability of electronic product is the important indicator of electronic product performance, improves electronic product
Electromagnetism interference performance has electronic product important meaning.In order to allow electronic product to have certain electromagnetism interference performance, pass
The flexible circuit board of the electronic product of system can be in routing region covering electromagnetic shielding film as much as possible, but due to component area
Domain needs to carry out the patch of component, and the uneven difficulty increasing for attach screened film of patch rear surface, reduces production
The yields of product improves the cost of product.
Invention content
The object of the present invention is to provide a kind of electromagnetism interference flexible circuit board and production methods, reduce to flexible circuit
The difficulty of the electromagnetic shielding of plate improves process efficiency.
In order to solve the above technical problems, an embodiment of the present invention provides a kind of electromagnetism interference flexible circuit board, including electricity
The electronic component area of road plate body and the insulating cement water layer set gradually from top to bottom in electronic component area upper surface,
Conductive adhesive layer, the conductive adhesive layer are connect with the earth-return cabling of the circuit board main body.
Wherein, the conductive adhesive layer is conductive silver glue-line, conductive gold glue-line, conductive copper glue-line or conductive charcoal glue-line.
Wherein, the thickness of the conductive adhesive layer is 0.02mm~5mm.
Wherein, the insulating cement water layer is heat curing type insulating cement water layer, curable type of drying in the air insulating cement water layer, light curable type insulative glue
Layer or thixotropy insulating cement water layer.
Wherein, the thickness of the edge glue layer is 0.02mm~5mm.
In addition to this, the embodiment of the present invention additionally provides a kind of electromagnetism interference flexible circuit board manufacturing method, including：
It is coated with insulating cement water layer on the surface in the electronic component area of circuit board main body；
In the surface applying conductive glue-line of the insulating cement water layer；
The conductive adhesive layer and the earth-return cabling of the circuit board main body are electrically connected.
Wherein, the conductive adhesive layer is conductive silver glue-line, conductive gold glue-line, conductive copper glue-line or conductive charcoal glue-line.
Wherein, the thickness of the conductive adhesive layer is 0.02mm~5mm.
Wherein, the insulating cement water layer is heat curing type insulating cement water layer, curable type of drying in the air insulating cement water layer, light curable type insulative glue
Layer or thixotropy insulating cement water layer.
Wherein, the thickness of the edge glue layer is 0.02mm~5mm.
The electromagnetism interference flexible circuit board and production method that the embodiment of the present invention is provided, compared with prior art, tool
It has the advantage that：
The electromagnetism interference flexible circuit board and production method, by using insulating cement water layer overlay electronic component
Area can ignore the rough surface in electronic component area, to carry out surface insulation, then use conductive adhesive layer covering exhausted
Edge glue layer is connect with the earth-return cabling of circuit board main body, realizes the electromagnetic screen to the electronic component area of circuit board main body
It covers, it is simple in structure, it is at low cost, the flexible circuit board of arbitrary pattern can be electromagnetically shielded, applicability is wide.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is the present invention
Some embodiments for those of ordinary skill in the art without creative efforts, can also basis
These attached drawings obtain other attached drawings.
Fig. 1 is that a kind of structure of specific implementation mode of electromagnetism interference flexible circuit board provided in an embodiment of the present invention is shown
It is intended to；
Fig. 2 is a kind of specific implementation mode of electromagnetism interference flexible circuit board manufacturing method provided in an embodiment of the present invention
Step flow diagram.
Specific implementation mode
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation describes, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
~Fig. 2 is please referred to Fig.1, Fig. 1 is that one kind of electromagnetism interference flexible circuit board provided in an embodiment of the present invention is specific
The structural schematic diagram of embodiment；Fig. 2 is the one of electromagnetism interference flexible circuit board manufacturing method provided in an embodiment of the present invention
The step flow diagram of kind specific implementation mode.
In a specific embodiment, the electromagnetism interference flexible circuit board, includes the electronics of circuit board main body 10
Component area and the insulating cement water layer 20 set gradually from top to bottom in electronic component area upper surface, conductive adhesive layer 30,
The conductive adhesive layer 30 is connect with the earth-return cabling of the circuit board main body 10.
By using 20 overlay electronic component area of insulating cement water layer, the rough table in electronic component area can be ignored
Then face uses conductive adhesive layer 30 to cover insulating cement water layer 20, the earth-return with circuit board main body 10 to carry out surface insulation
Cabling connects, and realizes the electromagnetic shielding to the electronic component area of circuit board main body 10, simple in structure, at low cost, can be to appointing
The flexible circuit board of meaning pattern is electromagnetically shielded, and applicability is wide.
In the present invention, due to the electronic component area of circuit board main body 10, become carrying out component patch rear surface
It is uneven, using existing electromagnetic shielding film be difficult attach, even if attach successfully, due to electromagnetic shielding film can only with it is limited
The surfaces of some components attaches, and contact area is smaller so that reliability is relatively low, and during on the other hand attaching with first device
Part touches, and be easy to cause device damage or connection is damaged, cause the reliability of product poor.
And when being covered to the surface in electronic component area using the insulating cement water layer 20 in the present invention, by being insulated
Glue layer 20 is amorphous in itself, and has certain viscosity, can be directly bonded in the surface of electronic component, be increased
With the contact area in electronic component area, the reliability of connection is improved, conducting resinl then is set on 20 surface of insulating cement water layer
Layer 30 is used as shielded layer, such conductive adhesive layer 30 to attach class in the plane with traditional electromagnetic shielding film when as shielded layer
Seemingly, comprehensive engagement may be implemented, the surface topography for ignoring the electronic component area of circuit board main body 10 carries out electro-magnetic screen layer
Setting, simple in structure, simple for process, process efficiency is high, reduces technology difficulty, the yields of product is improved, due to almost
The case where there is no the components in active exposure electronic component area, will not damage component.
The present invention is not specifically limited the thickness of conductive adhesive layer 30, insulating cement water layer 20, material, conductive adhesive layer 30
Effect is electromagnetic shielding, and thickness and material are designed depending on different shielding grades.
Conducting resinl in the present invention is a kind of adhesive cured or have certain electric conductivity after dry.It can will be a variety of
Conductive material links together, and makes to be connected the access that storeroom forms electricity.
The present invention does not limit the type of conducting resinl, needs to combine the requirement of specific use environment and production cost
It determines.Conductive adhesive layer 30 in the present invention can be GENERAL TYPE conducting resinl, can also be extraordinary conducting resinl.Wherein, GENERAL TYPE is led
Electric glue only there are certain requirements the electric conductivity and glue-joint strength of conducting resinl, and extraordinary conducting resinl is removed to electric conductivity and glue-joint strength
It there are certain requirements outer, also certain particular/special requirement, such as high temperature resistant, resistance to ultralow temperature, instantaneous solidification, anisotropy and the transparency.
Therefore, if electromagnetism interference flexible circuit board is only applied in general environment, only there is general lower anti-electromagnetism dry
Requirement is disturbed, operating ambient temperature is room temperature, you can the conducting resinl of GENERAL TYPE is used, and if it is military use product or other special
Purposes needs high reliability, needs high temperature resistant, resistance to ultralow temperature etc. extremely exacting terms when, need using extraordinary conductive
Glue.
Therefore, the present invention in conductive adhesive layer 30 material and the working environment of thickness and flexible circuit board temperature humidity with
And electromagnetic environment is closely bound up, needs to use different materials according to different working environment selections.
The conductive adhesive layer 30 can be conductive silver glue layer, or conductive gold glue-line can also be conductive copper glue-line,
Or conductive charcoal glue-line or other types of conducting resinl.
The thickness of heretofore described conductive adhesive layer 30 is generally 0.02mm~5mm.
The effect of insulating cement water layer 20 is will to be carried out between conductive adhesive layer 30 and the surface in electronic component area in the present invention
Insulation selects suitable material and thickness according to different use environments.
Since insulating cement is segmented into thermoplastic cement and thermosetting cement, the former for operating temperature is high, mechanical strength compared with
Small occasion, such as pouring into a mould cable connector, the latter is generally by resin, curing agent, toughener, diluent, filler (or without filling out
Material) etc. be formulated.
Since the insulating cement water layer 20 in the present invention is applied in flexible circuit board, thermosetting cement is generally used,
Thermosetting cement is divided into heat curing type (being heating and curing), curable type of drying in the air (through curing after a certain period of time under room temperature), light according to its curing mode
Curable type and several classes of thixotropy.
Therefore, the insulating cement water layer 20 in the present invention is generally heat curing type insulating cement water layer 20, curable type of drying in the air insulating cement
Water layer 20, light curable type insulating cement water layer 20 or thixotropy insulating cement water layer 20.
Wherein, after thixotropy insulating cement is contacted with workpiece, it can adhere to immediately and form one layer of immobilising homogeneous overburden,
It is mainly used as the surface sheath of compact electric apparatus, electrician and electronic unit；Light curable type insulating cement mainly has unsaturated polyester type and third
Two class of olefin(e) acid type, they can in rapid curing under light action, can clear adhesive and low-temperature adhesion, bonding electrician, electronic product,
The application of optical component etc. is also increasingly extensive
Therefore, it in the coating procedure for carrying out insulating cement water layer 20 in the present invention, selects to close according to different technological requirements
The insulating cement water layer 20 of suitable type.
In addition, the present invention is not specifically limited the thickness of insulative glue everywhere, it can be equal everywhere, can also be
It is unequal everywhere, but be coated with insulating cement water layer 20 and so that its upper surface is plane, then set on the surface of insulating cement water layer 20
Set conductive adhesive layer 30.
The thickness of the general edge glue layer is 0.02mm~5mm.
In one embodiment of the invention, the electromagnetism interference flexible circuit board, includes the electronics of circuit board main body
The thixotropy insulative glue in component area and the 3mm thickness set gradually from top to bottom in electronic component area upper surface
The conductive silver glue-line of layer, 3mm thickness, the conductive silver glue-line are connect with the earth-return cabling of the circuit board main body.
In addition to this, the embodiment of the present invention additionally provides a kind of electromagnetism interference flexible circuit board manufacturing method, including：
S1 is coated with insulating cement water layer on the surface in the electronic component area of circuit board main body；
S2, in the surface applying conductive glue-line of the insulating cement water layer；
The conductive adhesive layer and the earth-return cabling of the circuit board main body are electrically connected by S3.
It is not that the surface directly in electronic component area attaches electricity due to electromagnetism interference flexible circuit board manufacturing method
Magnetic shield film, but it is first coated with insulating cement water layer on its surface, then in the surface applying conductive glue-line of the insulating cement water layer
As electro-magnetic screen layer different-shape is adapted to since insulating cement water layer, conductive adhesive layer are all before shaping amorphous
Circuit board main body, be greatly lowered the technology difficulty of electromagnetic shielding, reduce process costs.
The present invention is not specifically limited the type of conductive adhesive layer, thickness, and the conductive adhesive layer can be conductive silver glue
Any one in layer, conductive gold glue-line, conductive copper glue-line or conductive charcoal glue-line.
The type of conductive adhesive layer employed in the present invention needs the characteristic having according to itself, as high-temperature stability,
Low temperature tolerance characteristics and curing process select the conducting resinl and insulating cement of suitable material in conjunction with manufacturing cost and use environment
Water layer.
Since in the present invention, conductive adhesive layer plays the effect of shielding, thickness can be very thin, and insulating cement water layer plays absolutely
The effect of edge, thickness can also be very thin.
The thickness of the general conductive adhesive layer is 0.02mm~5mm.
For the present invention for used, the insulating cement water layer is thermoplastic glue layer or thermosetting property glue-line.The insulating cement
Water layer is generally heat curing type insulating cement water layer, curable type of drying in the air insulating cement water layer, light curable type insulating cement water layer or thixotropy insulative glue
Layer.
The thickness of the general edge glue layer is 0.02mm~5mm.
In one embodiment of the invention, the electromagnetism interference flexible circuit board manufacturing method, including：In circuit board
The heat curing type insulating cement water layer of the surface coating 3mm thickness in the electronic component area of main body；In the heat curing type insulating cement water layer
Surface coating 3mm thickness conductive silver glue-line；Cabling is returned on the ground of flexible circuit board and opens a wicket, by the conductive silver
Glue-line and the earth-return cabling of the circuit board main body are electrically connected electromagnetism interference flexible circuit board.
The present invention is electromagnetically shielded by way of being coated with insulating cement water layer, conductive adhesive layer in electronic component area, is tied
Structure is simple, anti-electromagnetic interference capability simple for process, improving product.
In conclusion electromagnetism interference flexible circuit board provided in an embodiment of the present invention and production method, by using exhausted
Edge glue layer overlay electronic component area, can ignore the rough surface in electronic component area, to carry out surface insulation,
Then it uses conductive adhesive layer to cover insulating cement water layer, is connect with the earth-return cabling of circuit board main body, realized to circuit board main body
Electronic component area electromagnetic shielding, it is simple in structure, it is at low cost, can to the flexible circuit board of arbitrary pattern carry out electromagnetic screen
It covers, applicability is wide.
Electromagnetism interference flexible circuit board provided by the present invention and production method are described in detail above.Herein
In apply specific case principle and implementation of the present invention are described, the explanation of above example is only intended to sides
Assistant solves the method and its core concept of the present invention.It should be pointed out that for those skilled in the art, not
, can be with several improvements and modifications are made to the present invention under the premise of being detached from the principle of the invention, these improvement and modification are also fallen into
In the protection domain of the claims in the present invention.
Claims (10)
1. a kind of electromagnetism interference flexible circuit board, which is characterized in that electronic component area including circuit board main body and in institute
State insulating cement water layer, conductive adhesive layer that electronic component area upper surface is set gradually from top to bottom, the conductive adhesive layer with it is described
The earth-return cabling of circuit board main body connects.
2. electromagnetism interference flexible circuit board as described in claim 1, which is characterized in that the conductive adhesive layer is conductive silver glue
Layer, conductive gold glue-line, conductive copper glue-line or conductive charcoal glue-line.
3. electromagnetism interference flexible circuit board as claimed in claim 2, which is characterized in that the thickness of the conductive adhesive layer is
0.02mm~5mm.
4. electromagnetism interference flexible circuit board as claimed in claim 3, which is characterized in that the insulating cement water layer is that heat curing type is exhausted
Edge glue layer, curable type of drying in the air insulating cement water layer, light curable type insulating cement water layer or thixotropy insulating cement water layer.
5. electromagnetism interference flexible circuit board as claimed in claim 4, which is characterized in that the thickness of the edge glue layer is
0.02mm~5mm.
6. a kind of electromagnetism interference flexible circuit board manufacturing method, which is characterized in that including：
It is coated with insulating cement water layer on the surface in the electronic component area of circuit board main body；
In the surface applying conductive glue-line of the insulating cement water layer；
The conductive adhesive layer and the earth-return cabling of the circuit board main body are electrically connected.
7. electromagnetism interference flexible circuit board manufacturing method as claimed in claim 6, which is characterized in that the conductive adhesive layer is to lead
Electric elargol layer, conductive gold glue-line, conductive copper glue-line or conductive charcoal glue-line.
8. electromagnetism interference flexible circuit board manufacturing method as claimed in claim 7, which is characterized in that the thickness of the conductive adhesive layer
Degree is 0.02mm~5mm.
9. electromagnetism interference flexible circuit board manufacturing method as claimed in claim 8, which is characterized in that the insulating cement water layer is
Heat curing type insulating cement water layer, curable type of drying in the air insulating cement water layer, light curable type insulating cement water layer or thixotropy insulating cement water layer.
10. electromagnetism interference flexible circuit board manufacturing method as claimed in claim 9, which is characterized in that the edge glue layer
Thickness is 0.02mm~5mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810631408.7A CN108617084A (en) | 2018-06-19 | 2018-06-19 | A kind of electromagnetism interference flexible circuit board and production method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810631408.7A CN108617084A (en) | 2018-06-19 | 2018-06-19 | A kind of electromagnetism interference flexible circuit board and production method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108617084A true CN108617084A (en) | 2018-10-02 |
Family
ID=63665446
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810631408.7A Pending CN108617084A (en) | 2018-06-19 | 2018-06-19 | A kind of electromagnetism interference flexible circuit board and production method |
Country Status (1)
| Country | Link |
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| CN (1) | CN108617084A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111328186A (en) * | 2020-03-07 | 2020-06-23 | 广东亚龙兴新材料有限公司 | Flexible circuit board structure |
| CN112654130A (en) * | 2019-10-11 | 2021-04-13 | 驿科新材料科技(深圳)有限公司 | Circuit board with waterproof and electromagnetic wave preventing functions and manufacturing method thereof |
| CN114900948A (en) * | 2022-04-25 | 2022-08-12 | 京东方科技集团股份有限公司 | Flexible circuit board module, reinforcing method thereof and display device |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07212043A (en) * | 1994-01-20 | 1995-08-11 | Hitachi Cable Ltd | Printed wiring board and multi-wire wiring board |
| CN1271509A (en) * | 1997-10-02 | 2000-10-25 | 松下电器产业株式会社 | Method for mounting semiconductor element to circuit board, and semiconductor device |
| CN204131820U (en) * | 2014-04-14 | 2015-01-28 | 深圳科诺桥科技有限公司 | Electromagnetic shielding film and comprise the flexible circuit board of this electromagnetic shielding film |
| WO2015105340A1 (en) * | 2014-01-08 | 2015-07-16 | 주식회사 두산 | Electromagnetic wave shielding film for flexible printed circuit board and manufacturing method therefor |
| CN206181714U (en) * | 2016-11-30 | 2017-05-17 | 江西合力泰科技有限公司 | Flexible shield membrane, FPC shield assembly and cell -phone touch and show module shield assembly |
-
2018
- 2018-06-19 CN CN201810631408.7A patent/CN108617084A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07212043A (en) * | 1994-01-20 | 1995-08-11 | Hitachi Cable Ltd | Printed wiring board and multi-wire wiring board |
| CN1271509A (en) * | 1997-10-02 | 2000-10-25 | 松下电器产业株式会社 | Method for mounting semiconductor element to circuit board, and semiconductor device |
| WO2015105340A1 (en) * | 2014-01-08 | 2015-07-16 | 주식회사 두산 | Electromagnetic wave shielding film for flexible printed circuit board and manufacturing method therefor |
| CN204131820U (en) * | 2014-04-14 | 2015-01-28 | 深圳科诺桥科技有限公司 | Electromagnetic shielding film and comprise the flexible circuit board of this electromagnetic shielding film |
| CN206181714U (en) * | 2016-11-30 | 2017-05-17 | 江西合力泰科技有限公司 | Flexible shield membrane, FPC shield assembly and cell -phone touch and show module shield assembly |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112654130A (en) * | 2019-10-11 | 2021-04-13 | 驿科新材料科技(深圳)有限公司 | Circuit board with waterproof and electromagnetic wave preventing functions and manufacturing method thereof |
| CN111328186A (en) * | 2020-03-07 | 2020-06-23 | 广东亚龙兴新材料有限公司 | Flexible circuit board structure |
| CN114900948A (en) * | 2022-04-25 | 2022-08-12 | 京东方科技集团股份有限公司 | Flexible circuit board module, reinforcing method thereof and display device |
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Application publication date: 20181002 |