CN106255317A - A kind of convenient splicing durable type HDI flexible circuit board and processing technique thereof - Google Patents
A kind of convenient splicing durable type HDI flexible circuit board and processing technique thereof Download PDFInfo
- Publication number
- CN106255317A CN106255317A CN201610702986.6A CN201610702986A CN106255317A CN 106255317 A CN106255317 A CN 106255317A CN 201610702986 A CN201610702986 A CN 201610702986A CN 106255317 A CN106255317 A CN 106255317A
- Authority
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- China
- Prior art keywords
- conductive layer
- wiring board
- board body
- splicing
- base material
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/145—Arrangements wherein electric components are disposed between and simultaneously connected to two planar printed circuit boards, e.g. Cordwood modules
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/05—Flexible printed circuits [FPCs]
- H05K2201/058—Direct connection between two or more FPCs or between flexible parts of rigid PCBs
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention discloses a kind of convenient splicing durable type HDI flexible circuit board and processing technique thereof, including wiring board body, described wiring board body left end is provided with splicing slot, described wiring board body right-hand member is provided with fixture block, elastic pressuring plate, the size of described fixture block matches with splicing slot, described elastic pressuring plate two ends are fixed on wiring board body both sides, described wiring board body includes: the first coverlay, first conductive layer, base material, second conductive layer and the second coverlay, first conductive layer and the first coverlay are provided with first and sink, copper facing, it is provided with second on second conductive layer to sink with the second coverlay, copper facing, blind hole sequentially passes through the first conductive layer, base material is to the second conductive layer.The wiring board of specification of the same race can be spliced by the present invention as required, solves the trouble of welding operation and the problem that not prison welding is solid.Also can be split by the wiring board spliced, and will not damage wiring board body after splitting, repeatable utilization rate is big, fully saves assembly cost.
Description
Technical field
The present invention relates to wiring board techniques field, be specifically related to a kind of convenient splicing durable type HDI flexible circuit board and
Its processing technique.
Background technology
Flexible PCB also known as " soft board ", i.e. FPC plate.The printed circuit made with flexible insulating substrate.Flexible electrical
Road provides excellent electrical property, can meet the smaller and design needs of more high-density installation, it helps reduce assembling procedure
With enhancing reliability.Flexible PCB is the only solution meeting miniaturization of electronic products and movement requirement.Can be free
Bend, wind, fold, the dynamic bending of millions of times can be born and do not damage wire, can require arbitrarily according to space layout
Arrange, and arbitrarily move at three dimensions and stretch, thus reach components and parts assembling and the integration of wire connection；Flexible circuit
Plate can be substantially reduced the volume and weight of electronic product, is suitable for electronic product and develops to high density, miniaturization, highly reliable direction
Need.Therefore, FPC plate in fields such as space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital cameras or
It is widely used on product.
In actual applications, the most rectangular wiring board, owing to the wiring board of standard does not reaches what it was actually needed
Length, it is generally required to multiple independent wiring boards are stitched together reach certain length, but wiring board splicing in prior art
Time, it is by the way of welding, this mode not only to use substantial amounts of tin cream, wastes resource, and once welds error, will
The place of failure welding again solves postwelding and again welds, not only complex operation, and is easily damaged wiring board.
It is thus desirable to a kind of circuit board structure that can immediately splice, on the basis of not damaging wiring board, it is possible to meet
The needs that wiring board splices according to Len req.
Summary of the invention
Goal of the invention: for the problem and shortage of above-mentioned existence of the prior art, it is an object of the invention to provide one
Convenient splicing durable type HDI flexible circuit board and processing technique thereof.
Technical scheme: for reaching above-mentioned purpose, a kind of convenient splicing durable type HDI flexible circuit board of the present invention,
Wiring board body, described wiring board body left end is provided with splicing slot, and described wiring board body right-hand member is provided with fixture block, elastic pressure
Sheet, the size of described fixture block matches with splicing slot, and described elastic pressuring plate two ends are fixed on wiring board body both sides, described
Wiring board body includes: the first coverlay, the first conductive layer, base material, the second conductive layer and the second coverlay, wherein, and described base
Material is positioned in the middle of wiring board body, and the first conductive layer and the second conductive layer are bonded in up and down the two of base material respectively by transparent adhesive tape
Side, the first conductive layer has the first heavy, copper facing, and first heavy, copper facing is provided with the first coverlay, and the second conductive layer is provided with the
Two heavy, copper facing, are provided with the second coverlay below second heavy, copper facing, and blind hole sequentially passes through the first conductive layer, base material to second conduction
Layer.
Further, described splicing slot and buckle are all in " Z " type, and the height of described pocket edges is 1-2mm.Splicing
Draw-in groove and buckle are in " Z " type, and fixed form is firm, is difficult to loosen, and coordinate the elastic pressuring plate on the right side of wiring board body, by two pieces of lines
The stitching portion of road plate is pushed down, it is to avoid junction
Further, described splicing slot be respectively provided on two sides with convex edge, the width of described convex edge from left to right becomes narrow gradually.Convex
The design on edge makes the hardness of the outer of splicing slot become big, it is ensured that fastness during splicing, the design of convex edge simultaneously is also convenient for
Manually splicing slot and buckle are opened
Further, described blind hole sidewall is provided with hole copper, and the thickness of described hole copper is 10-12um, and described hole copper is respectively with blind
First conductive layer of the left and right sides, hole, the second conductive layer are connected.
Further, described base material is made up of polyimide PET material.
Further, described first conductive layer and the second conductive layer are Copper Foil, aluminium foil or native silver.
Technique scheme is it can be seen that the invention have the benefit that
A kind of convenient splicing durable type HDI flexible circuit board of the present invention and processing technique thereof, wiring board body left end is provided with
Splicing slot, right-hand member is provided with buckle, can be spliced by the wiring board of specification of the same race as required, solve the fiber crops of welding operation
Tired and that not prison welding is solid problem.Also the wiring board spliced can be split, and wiring board will not be damaged after splitting originally
Body, repeatable utilization rate is big, fully saves assembly cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of the present invention；
Fig. 2 is the internal structure schematic diagram of wiring board body of the present invention.
1-wiring board body, 11-the first coverlay, 12-the first conductive layer, 13-base material, 14-the second conductive layer, 15-
Two coverlays, 16-first are heavy, copper facing, 17-second are heavy, copper facing, 18-blind hole, 19-hole copper, 2-splicing slot, 3-buckle, 4-
Elastic pressuring plate.
Embodiment
Below in conjunction with the accompanying drawings and specific embodiment, it is further elucidated with the present invention.
Embodiment
A kind of convenient splicing durable type HDI flexible circuit board as shown in Figure 1-2, wiring board body 1, described wiring board is originally
Body 1 left end is provided with splicing slot 2, and described wiring board body 1 right-hand member is provided with fixture block 3, elastic pressuring plate 4, the size of described fixture block 3 with
Splicing slot 2 matches, and described elastic pressuring plate 4 two ends are fixed on wiring board body 1 both sides, and described wiring board body 1 includes:
First coverlay the 11, first conductive layer 12, base material the 13, second conductive layer 14 and the second coverlay 15, wherein, described base material 13
Being positioned in the middle of wiring board body 1, the first conductive layer 12 and the second conductive layer 14 are bonded in base material 13 by transparent adhesive tape respectively
Up and down both sides, the first conductive layer 12 has the first heavy, copper facing 16, and first heavy, copper facing 16 is provided with the first coverlay 11, and second
Conductive layer 12 is provided with the second heavy, copper facing 17, is provided with the second coverlay 15 below second heavy, copper facing 17, and blind hole 18 is worn successively
Cross the first conductive layer 12, base material 13 to the second conductive layer 14.
Splicing slot 2 described in the present embodiment and buckle 3 are all in " Z " type, and the height at described draw-in groove 2 edge is 1-2mm.
Splicing slot and buckle, in " Z " type, fixation, are difficult to loosen
Splicing slot 2 described in the present embodiment be respectively provided on two sides with convex edge, the width of described convex edge from left to right becomes narrow gradually.
The sidewall of blind hole 18 described in the present embodiment is provided with hole copper 19, and the thickness of described hole copper 19 is 10-12um, described hole
Copper 19 is connected with first conductive layer the 12, second conductive layer 14 of blind hole 18 left and right sides respectively.
Base material 13 described in the present embodiment is made up of polyimide PET material.
Described in the present embodiment, the first conductive layer 12 and the second conductive layer 14 are Copper Foil, aluminium foil or native silver.
A kind of convenient splicing durable type HDI flexible circuit board and processing technique thereof, concrete processing technique is as follows:
(1): selected base material 14, required specification is cut into according to technological requirement and dimensions paper cutter；
(2): bond the first conductive layer 12 and the second conductive layer 14 in the both sides up and down of base material 13 by transparent adhesive tape, exist the most respectively
Lay dry film and carry out pressing on first conductive layer 12 and the second conductive layer 14, by scraper, drive air away, it is ensured that vacuum shape
State；
(3): base material 13 is etched circuit, etching machine to be cleaned before etching, it is to avoid residue scratches figure, according to processing request
It is etched, under the temperature conditions of 45 °, on uniform spray etching medicinal liquid to dry film, is etched, by anti-for unwanted place
Reflecting, expose base material 13, make its circuit shape after lift-off processing, place it in striping liquid and rinse, dry film dissolves in this
Planting liquid, finally the circuit surface to etching is cleaned processing, and removes pollution and the oxidation on surface, and then placing into temperature is
The baking machine of 70-90 DEG C is dried；
(4): be placed in boring machine table use laser after drying and the first conductive layer 12, base material the 13, second conductive layer 14 are entered
Row punctures boring, generates blind hole 18, providing holes copper 19 on blind hole 18 wall so that it is with the first conductive layer 12 and the second conductive layer 14
Connect；
(5): on the first conductive layer 12, lay the first heavy, copper facing 18 the most again, the second conductive layer 15 lays the second heavy, plating
Copper 19；
: the first coverlay 11 and the second coverlay 15 are attached by transparent adhesive tape, and put into temperature and be 160-180 DEG C (6)
Baking machine solidify, wiring board molding;
(7): be processed splicing slot 2 and buckle 3, and process in the both sides of splicing slot 2 that width becomes narrow gradually is convex
Edge, by splicing slot 2 riveting that processes at the left end of wiring board body 1, buckle 3 riveting is fixed on the right side of wiring board body 1
End；
(8): riveting elastic pressuring plate 4 on the right side of wiring board body 1, elastic pressuring plate 4 is made to stretch out distance on the right side of wiring board body 1
0.5cm-1cm。
Embodiment is merely to illustrate the present invention rather than limits the scope of the present invention, after having read the present invention, this
Skilled person all falls within the application claims limited range to the various equivalences of the present invention.
Claims (7)
1. a convenient splicing durable type HDI flexible circuit board, it is characterised in that: wiring board body (1), described wiring board body
(1) left end is provided with splicing slot (2), and described wiring board body (1) right-hand member is provided with fixture block (3), elastic pressuring plate (4), described fixture block
(3) size matches with splicing slot (2), and described elastic pressuring plate (4) two ends are fixed on wiring board body (1) both sides, described
Wiring board body (1) including: the first coverlay (11), the first conductive layer (12), base material (13), the second conductive layer (14) and second
Coverlay (15), wherein, described base material (13) is positioned in the middle of wiring board body (1), the first conductive layer (12) and the second conduction
Layer (14) is bonded in the both sides up and down of base material (13) respectively by transparent adhesive tape, and the first conductive layer (12) has the first heavy, copper facing
(16), first heavy, copper facing (16) is provided with the first coverlay (11), and the second conductive layer (12) is provided with the second heavy, copper facing
(17), second heavy, copper facing (17) lower section is provided with the second coverlay (15), blind hole (18) sequentially pass through the first conductive layer (12),
Base material (13) is to the second conductive layer (14).
A kind of convenient splicing durable type HDI flexible circuit board the most according to claim 1, it is characterised in that: described splicing
Draw-in groove (2) and buckle (3) are all in " Z " type, and the height at described draw-in groove (2) edge is 1-2mm.
A kind of convenient splicing durable type HDI flexible circuit board the most according to claim 2, it is characterised in that: described splicing
Draw-in groove (2) be respectively provided on two sides with convex edge, the width of described convex edge from left to right becomes narrow gradually.
A kind of convenient splicing durable type HDI flexible circuit board the most according to claim 1, it is characterised in that: described blind hole
(18) sidewall is provided with hole copper (19), and the thickness in described hole copper (19) is 10-12um, described hole copper (19) respectively with blind hole (18)
First conductive layer (12) of the left and right sides, the second conductive layer (14) are connected.
A kind of convenient splicing durable type HDI flexible circuit board the most according to claim 1, it is characterised in that: described base material
(13) it is made up of polyimide PET material.
A kind of convenient splicing durable type HDI flexible circuit board the most according to claim 1, it is characterised in that: described first
Conductive layer (12) and the second conductive layer (14) are Copper Foil, aluminium foil or native silver.
A kind of convenient splicing durable type HDI flexible circuit board the most according to claim 1 and processing technique thereof, have its feature
It is: concrete processing technique is as follows:
(1): selected base material (13), required specification is cut into according to technological requirement and dimensions paper cutter；
(2): bond the first conductive layer (12) and the second conductive layer (14) in the both sides up and down of base material (13) by transparent adhesive tape, then
On the first conductive layer (12) and the second conductive layer (14), lay dry film respectively and carry out pressing, by scraper, driving air away, really
Fidelity dummy status；
(3): base material (13) is etched circuit, etching machine to be cleaned before etching, it is to avoid residue scratches figure, wants according to processing
Ask and be etched, under the temperature conditions of 45 °, on uniform spray etching medicinal liquid to dry film, be etched, by unwanted place
Reflection is fallen, and exposes base material (13), makes its circuit shape after lift-off processing, places it in striping liquid and rinses, and dry film is solvable
In this kind of liquid, finally the circuit surface to etching is cleaned processing, and removes pollution and the oxidation on surface, then places into temperature
Degree is dried for the baking machine of 70-90 DEG C；
(4): be placed in boring machine table use laser after drying by the first conductive layer (12), base material (13), the second conductive layer
(14) carry out puncturing boring, generate blind hole (18), providing holes copper (19) on blind hole (18) wall so that it is with the first conductive layer (12)
Connect with the second conductive layer (14)；
(5): on the first conductive layer (12), lay the first heavy, copper facing (16) the most again, the second conductive layer (14) lays the
Two heavy, copper facing (17)；
: the first coverlay (11) and the second coverlay (15) are attached by transparent adhesive tape, and to put into temperature be 160-(6)
The baking machine of 180 DEG C solidifies, wiring board molding;
(7): splicing slot (2) and buckle (3) are processed, and process width in the both sides of splicing slot (2) gradually to become
Narrow convex edge, by splicing slot (2) riveting that processes at the left end of wiring board body, buckle (3) riveting is fixed on wiring board
The right-hand member of body；
(8) elastic pressuring plate (4): at wiring board body (1) right side riveting elastic pressuring plate (4), is made to stretch out wiring board body (1) right side
Distance 0.5cm-1cm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610702986.6A CN106255317A (en) | 2016-08-23 | 2016-08-23 | A kind of convenient splicing durable type HDI flexible circuit board and processing technique thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610702986.6A CN106255317A (en) | 2016-08-23 | 2016-08-23 | A kind of convenient splicing durable type HDI flexible circuit board and processing technique thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106255317A true CN106255317A (en) | 2016-12-21 |
Family
ID=57595802
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610702986.6A Pending CN106255317A (en) | 2016-08-23 | 2016-08-23 | A kind of convenient splicing durable type HDI flexible circuit board and processing technique thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106255317A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106817838A (en) * | 2017-03-28 | 2017-06-09 | 西华大学 | A kind of Upper conductive layer of net substrate |
| CN109168252A (en) * | 2018-10-26 | 2019-01-08 | 业成科技（成都）有限公司 | Circuit board and preparation method thereof |
| CN111511125A (en) * | 2020-04-27 | 2020-08-07 | Oppo（重庆）智能科技有限公司 | A lamination equipment that is arranged in USB seat and FPC welding process |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1531387A (en) * | 2003-03-17 | 2004-09-22 | 广达电脑股份有限公司 | Printed circuit board tenon coupling structure and manufacture thereof |
| US20060234521A1 (en) * | 2003-04-30 | 2006-10-19 | J.S.T. Mfg. Co., Ltd. | Connection structure of printed wiring board |
| CN204272499U (en) * | 2014-12-22 | 2015-04-15 | 湖北瑞蓬科技有限公司 | Spliced type pcb board |
-
2016
- 2016-08-23 CN CN201610702986.6A patent/CN106255317A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1531387A (en) * | 2003-03-17 | 2004-09-22 | 广达电脑股份有限公司 | Printed circuit board tenon coupling structure and manufacture thereof |
| US20060234521A1 (en) * | 2003-04-30 | 2006-10-19 | J.S.T. Mfg. Co., Ltd. | Connection structure of printed wiring board |
| CN204272499U (en) * | 2014-12-22 | 2015-04-15 | 湖北瑞蓬科技有限公司 | Spliced type pcb board |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106817838A (en) * | 2017-03-28 | 2017-06-09 | 西华大学 | A kind of Upper conductive layer of net substrate |
| CN109168252A (en) * | 2018-10-26 | 2019-01-08 | 业成科技（成都）有限公司 | Circuit board and preparation method thereof |
| CN111511125A (en) * | 2020-04-27 | 2020-08-07 | Oppo（重庆）智能科技有限公司 | A lamination equipment that is arranged in USB seat and FPC welding process |
| CN111511125B (en) * | 2020-04-27 | 2021-10-15 | Oppo（重庆）智能科技有限公司 | A lamination equipment that is arranged in USB seat and FPC welding process |
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| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
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| AD01 | Patent right deemed abandoned |
Effective date of abandoning: 20190416 |
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| AD01 | Patent right deemed abandoned |