CN205082062U - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
- Publication number
- CN205082062U CN205082062U CN201520777856.XU CN201520777856U CN205082062U CN 205082062 U CN205082062 U CN 205082062U CN 201520777856 U CN201520777856 U CN 201520777856U CN 205082062 U CN205082062 U CN 205082062U
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- opening
- flexible pcb
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- substrate layer
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Abstract
The utility model provides a flexible circuit board includes a substrate layer, one forms on the first conducting wire layer on this substrate layer surface, one forms the keeping away from the enhancement piece of this first conducting wire layer one side and form the at least electronic component in this first conducting wire layer one side of this substrate layer, this electronic component of includes at least one ground connection pad, this conducting wire layer includes at least one first ground connection circuit, this flexible circuit board still includes a through -hole that has a perfect understanding this substrate layer and this first ground connection circuit, is full of first tin cream in this through -hole, and this ground connection pad is connected through this first tin cream and this first ground connection circuit and enhancement piece electricity. The utility model discloses not only for realizing that the electricity connection of strengthening the ground connection pad three of piece, flexible circuit board and part provides probably, still for the ground connection pad of part provides the support, reduces the ground connection pad and peels off the damage risk.
Description
Technical field
The utility model relates to field of circuit boards, particularly relates to a kind of flexible PCB.
Background technology
Reinforced sheet is the conventional accessory on flexible PCB, generally fits in the part back side, ensure that the evenness in flexible PCB plate face, avoids the stripping of part, strengthens flexible PCB hardness, ease of assembly, and the ground connection keeping flexible PCB simultaneously.
At flexible PCB product scope, the design of current reinforced sheet is usually adopt to form through hole in the position corresponding with the ground pad of part, with non-conductive glue layer, reinforced sheet is fitted on flexible PCB again, in through hole, finally pour into tin cream be directly electrically connected with reinforced sheet with the ground pad of tin cream by part.This kind of method can only accomplish reinforced sheet and ground pad conducting, the conducting simultaneously of reinforced sheet/ground pad/flexible PCB line-to-ground face three can not be accomplished.And the ground pad of this kind of mode part does not have flexible PCB to support, if upper tin quantity not sufficient, the serious stripping of ground pad that more can cause damages.
Utility model content
In view of this, the utility model provides a kind of flexible PCB that can solve the problems of the technologies described above.
A kind of flexible PCB, this flexible PCB comprises the first conductive circuit layer, that a substrate layer, is formed in this substrate layer surface and is formed in the reinforced sheet away from this first conductive circuit layer side of this substrate layer and is formed at least one electronic component of this first conductive circuit layer side, this electronic component comprises at least one ground pad, and this conductive circuit layer comprises at least one first ground path; It is characterized in that, this flexible PCB also comprises the through hole of this substrate layer through and this first ground path, is full of the first tin cream in this through hole, and this ground pad is electrically connected with this first ground path and reinforced sheet by this first tin cream.
The flexible PCB that the utility model provides, the through hole running through this substrate layer and the first conductive circuit layer is defined between two ground paths, and in through hole, fill full tin cream, the electrical connection not being only the ground pad three realizing reinforced sheet, flexible PCB and part provides possibility, can also provide support for the ground pad of part, the risk that the stripping reducing ground pad damages.
Accompanying drawing explanation
Fig. 1 is the most preferred embodiment of the flexible PCB that the utility model provides.
Fig. 2 is the vertical view of the flexible PCB shown in Fig. 1.
Main element symbol description
Following embodiment will further illustrate the utility model in conjunction with above-mentioned accompanying drawing.
Embodiment
Below in conjunction with Fig. 1 ~ 2 and embodiment, the structure of a kind of flexible PCB 100 that the technical program provides is described in further detail.
This flexible PCB 100 can be single layer board, double-layer circuit board or multilayer circuit board.In the present embodiment, this flexible PCB 100 is double-layer circuit board.
This flexible PCB 100 is divided into ungrounded district 101 and access area 102 artificially.
This flexible PCB 100 comprises a substrate layer 10, be formed in first conductive circuit layer 20 on relative two surfaces of this substrate layer 10 and the second conductive circuit layer 30, be formed in this first conductive circuit layer 20 away from the first cover layer 50 on the surface of this substrate layer 10, be formed in this second conductive circuit layer 30 away from the second cover layer 60 and on the surface of this substrate layer 10 be formed in this second cover layer 50 away from the reinforced sheet 70 on the surface of this second conductive circuit layer 30.
The material of this substrate layer 10 can be polyimides (polyimide, PI), PETG (PolyethyleneTerephthalate, PET) one, in the material such as PEN (PolyethyleneNaphthalate, PEN).
This first conductive circuit layer 20 comprises at least one first signal line 21, at least one first ground path 22 and at least one power circuit (not shown).
This second conductive circuit layer 30 comprises at least one secondary signal circuit 31, at least one second ground path 32 and at least one power circuit (not shown).
This first signal line 21, this secondary signal circuit 31 and this power circuit (not shown) are positioned at this ungrounded district 101, and this first ground path 22 and this second ground path 32 are positioned at this access area 102.
This flexible PCB 100 is also formed with the through hole 40 running through this first ground path 22, this substrate layer 10 and this second ground path 32.This through hole 40 is formed after making forms this first conductive circuit layer 20 and this second conductive circuit layer 30.Particularly, this through hole 40 can be formed by machine drilling or the mode of laser drill.
In the present embodiment, the diameter of this through hole 40 is 1.0mm.In other embodiments, the diameter of this through hole 40 can change according to actual needs.
This first cover layer 50 comprises multiple first opening 51 and at least one second opening 52.This first signal line 21 of part is out exposed in this first opening 51, and this through hole 40 is out exposed in this second opening 52.The width of this second opening 52 is equal with the width of this first ground path 22.
Particularly, this first opening 51 and this second opening 52 can be formed by machine drilling or the mode of laser drill.
The position that this second cover layer 60 comprises at least one 3rd opening the 61, three opening 61 is relative with the position of this second opening 52, and this through hole 40 is out exposed in the 3rd opening 61.
Particularly, the 3rd opening 61 can be formed by machine drilling or the mode of laser drill.
This reinforced sheet 70 is fitted on the surface away from this second conductive circuit layer 30 of this second cover layer 60 by a non-conductive glue layer 80.This non-conductive glue layer 80 comprises a glue-line opening 81, and the position of this glue-line opening 81 is relative with the position of the 3rd opening 61.The size of this glue-line opening 81 and the consistent size of the 3rd opening 61.
Particularly, this glue-line opening 81 can be formed by machine drilling or the mode of laser drill.
In the present embodiment, this second opening 52, this through hole 40, the 3rd opening 61 are with regard to the central axes of this glue-line opening 81.
This first cover layer 50 side of this flexible PCB 100 is also provided with at least one electronic component 200.This electronic component 200 comprises first surface 201 and a second surface 202 relative with this first surface 201.This second surface 202 is relative with this first cover layer 50.This second surface 202 is formed with multiple pin 203 and at least one ground pad 204.This pin 203 multiple is relative with this first opening 51 position multiple, and this ground pad 204 is relative with the position of this second opening 52.
The size of this ground pad 204 equals or is slightly less than the size of this second opening 52.In this through hole 40, the 3rd opening 61 and this glue-line opening 81, the first tin cream 92 is filled, until this first tin cream 92 is full of this first opening 52, this through hole 40, the 3rd opening 61 and this glue-line opening 81 from this second opening 52.
In the present embodiment, the size of this second opening 52, the 3rd opening 61 and this glue-line opening 81 is all identical, and its diameter is roughly 2.0mm.Now, the cross section of this first tin cream 92 presents class " work " font.This second opening 52, this through hole 40, the 3rd opening 61 are with regard to the central axes of this glue-line opening 81.
This reinforced sheet 70, this second ground path 32, this first ground path 22 and this ground pad 204 are electrically connected by this first tin cream 92.
The size of this pin 203 equals or is slightly less than the size of this first opening 51.Be formed with the second tin cream 91 in this first opening 51, this pin 203 is electrically connected with this first signal line 21 by this second tin cream 91.
The flexible PCB 100 that the utility model provides, 1) in this access area 102, define the through hole 40 running through this substrate layer and conductive circuit layer, and this first tin cream 92 is full of in this second opening 52, this through hole 40, the 3rd opening 61 and this glue-line opening 81, achieve the electrical connection between this reinforced sheet 70, the ground path 22 and 23 of this flexible PCB 100 and ground pad 204 three of electronic component 200; 2) because this through hole 40 runs through this ground path 22,23 and this substrate layer 10, this ground path 22,23 can be provided support for the ground pad 204 of this electronic component 200, and then the stripping reducing this ground pad 204 damage risk.
Be understandable that, above embodiment is only used for the utility model is described, is not used as restriction of the present utility model.For the person of ordinary skill of the art, according to other various corresponding change and distortion that technical conceive of the present utility model is made, within the protection range all dropping on the utility model claim.
Claims (9)
1. a flexible PCB, this flexible PCB comprises the first conductive circuit layer, that a substrate layer, is formed in this substrate layer surface and is formed in the reinforced sheet away from this first conductive circuit layer side of this substrate layer and is formed at least one electronic component of this first conductive circuit layer side, this electronic component comprises at least one ground pad, and this conductive circuit layer comprises at least one first ground path; It is characterized in that, this flexible PCB also comprises the through hole of this substrate layer through and this first ground path, is full of the first tin cream in this through hole, and this ground pad is electrically connected with this first ground path and reinforced sheet by this first tin cream.
2. flexible PCB as claimed in claim 1, is characterized in that: also comprise the non-conductive glue layer between this reinforced sheet and this substrate layer, and this non-conductive glue layer is formed to should the glue-line opening of through hole, this first tin cream be full of this glue-line opening.
3. flexible PCB as claimed in claim 2, is characterized in that: the size of this glue-line opening is greater than the size of this through hole, the central axis of this glue-line opening and the central axes of this through hole.
4. flexible PCB as claimed in claim 1, is characterized in that: this electronic component also comprises multiple pin, and this flexible PCB also comprises the second tin cream of this pin of electrical connection and this first signal line.
5. flexible PCB as claimed in claim 4, it is characterized in that, this flexible PCB also comprise one be formed in this first conductive circuit layer away from the first cover layer on the surface of this substrate layer, this first cover layer is between this first conductive circuit layer and this electronic component and comprise one first opening and one second opening, this first signal line of part is out exposed in this first opening, this through hole is out exposed in this second opening, be full of this first tin cream in this second opening, in this first opening, be full of this second tin cream.
6. flexible PCB as claimed in claim 5, it is characterized in that, the size of this second opening is greater than the size of this through hole, the central axis of this second opening and the central axes of this through hole.
7. flexible PCB as claimed in claim 1, it is characterized in that, this flexible PCB also comprises second conductive circuit layer between this substrate layer and this reinforced sheet, this second conductive circuit layer comprises at least one second ground path, this through hole runs through this second ground path, and this first tin cream is electrically connected this first ground path and this second ground path.
8. flexible PCB as claimed in claim 7, it is characterized in that, this flexible PCB also comprise one be formed in this second conductive circuit layer away from the second cover layer on the surface of this substrate layer, this second cover layer comprises one the 3rd opening, and the 3rd opening communicates with this through hole.
9. flexible PCB as claimed in claim 8, is characterized in that, the 3rd opening and this second opening measure-alike, the central axis of the 3rd opening and the central axes of this through hole.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520777856.XU CN205082062U (en) | 2015-10-09 | 2015-10-09 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520777856.XU CN205082062U (en) | 2015-10-09 | 2015-10-09 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205082062U true CN205082062U (en) | 2016-03-09 |
Family
ID=55434431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520777856.XU Active CN205082062U (en) | 2015-10-09 | 2015-10-09 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205082062U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211564A (en) * | 2016-08-31 | 2016-12-07 | 大连吉星电子股份有限公司 | A kind of flexible circuit panel element and ground connection steel disc attachment means and method |
| CN114967247A (en) * | 2021-02-27 | 2022-08-30 | 华为技术有限公司 | Backlight assembly and display module |
-
2015
- 2015-10-09 CN CN201520777856.XU patent/CN205082062U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106211564A (en) * | 2016-08-31 | 2016-12-07 | 大连吉星电子股份有限公司 | A kind of flexible circuit panel element and ground connection steel disc attachment means and method |
| CN106211564B (en) * | 2016-08-31 | 2018-11-09 | 大连吉星电子股份有限公司 | A kind of flexible circuit panel element and ground connection steel disc attachment device and method |
| CN114967247A (en) * | 2021-02-27 | 2022-08-30 | 华为技术有限公司 | Backlight assembly and display module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170301 Address after: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Patentee after: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee after: Peng Ding Polytron Technologies Inc Address before: 518105 Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Patentee before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee before: Zhending Technology Co., Ltd. |
|
| CP03 | Change of name, title or address |
Address after: Guangdong city of Shenzhen province Baoan District Songgang street Chuanyan Luo Lu Yan Co-patentee after: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee after: Peng Ding Holdings (Shenzhen) Limited by Share Ltd Co-patentee after: Peng Ding Polytron Technologies Inc Address before: 518000 Guangdong city of Shenzhen province Baoan District Songgang streets Yan Chuanyan Luzhen Luo Ding Technology Park plant A1 building to building A3 Co-patentee before: Hongqisheng Precision Electronic (Qinhuangdao) Co., Ltd. Patentee before: Fuku Precision Components (Shenzhen) Co., Ltd. Co-patentee before: Peng Ding Polytron Technologies Inc |
|
| CP03 | Change of name, title or address |