CN204598454U - The ground structure of circuit board and power consumption equipment - Google Patents
The ground structure of circuit board and power consumption equipment Download PDFInfo
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- CN204598454U CN204598454U CN201520239838.6U CN201520239838U CN204598454U CN 204598454 U CN204598454 U CN 204598454U CN 201520239838 U CN201520239838 U CN 201520239838U CN 204598454 U CN204598454 U CN 204598454U
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- circuit board
- substrate
- screw
- panel beating
- hole
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Abstract
The utility model provides a kind of ground structure of circuit board, the wiring comprising substrate and arrange on the substrate, described wiring comprises earth connection, substrate offers the through hole that runs through described substrate and at least one is located in the pad structure of this through hole, this pad structure is provided with the scolding tin be connected with described earth connection, when using screw, through described through hole, this circuit board is fixed on panel beating, described pad structure electrically crimps with described screw and/or described panel beating.Solving printed circuit board (PCB) will by the problem of line body ground connection, can be directly effectively connected with the panel beating connecing the earth by screw, not only can play fixing effect, and the safety ground effectively of the ground of printed circuit board (PCB), there is the advantage that cost is low, efficiency is high.
Description
Technical field
The utility model relates to circuit board technology, particularly relates to a kind of ground structure and power consumption equipment of circuit board.
Background technology
Normally, PCB (Printed Circuit Board, printed circuit board) ground connection need by a wire be connected to connect the earth panel beating, such wire is connected needs welding sequence with PCB, wire is connected the operation also wanting a screw fixing with panel beating, there is cost high, inefficient problem.
Utility model content
The utility model object is the ground structure providing a kind of circuit board, is intended to high, the inefficient problem of earth connection cost solving traditional circuit board.
The utility model provides a kind of ground structure of circuit board, the wiring comprising substrate and arrange on the substrate, described wiring comprises earth connection, substrate offers the through hole that runs through described substrate and at least one is located in the pad structure of this through hole, this pad structure is provided with the scolding tin be connected with described earth connection, when using screw, through described through hole, this circuit board is fixed on panel beating, described pad structure electrically crimps with described screw and/or described panel beating.
Further, described pad structure comprises perforate, is layed in the copper foil layer of this perforate inwall and is filled in the described scolding tin of described perforate, and described copper foil layer is connected with described earth connection.
Further, described perforate is opened in the first surface of described substrate; Or, be opened in the second surface relative with described first surface of described substrate; Or, run through described first surface and described second surface.
Further, when using screw, through described through hole, this circuit board is fixed on panel beating, nut and/or the described panel beating of described scolding tin and described screw electrically crimp.
Further, the diameter of described perforate is greater than 0.8mm, and is less than 2mm.
The utility model additionally provides a kind of power consumption equipment, comprises the ground structure of above-mentioned circuit board.
Above-mentioned grounding design scheme solves printed circuit board (PCB) will by the problem of line body ground connection, can be directly effectively connected with the panel beating connecing the earth by screw, not only can play fixing effect, and the safety ground effectively of the ground of printed circuit board (PCB), there is the advantage that cost is low, efficiency is high
Accompanying drawing explanation
Fig. 1 is the cross-sectional view of the ground structure of circuit board in the utility model preferred embodiment;
Fig. 2 is the plan structure schematic diagram of the ground structure of circuit board in the utility model preferred embodiment;
The cross-sectional view of through hole and perforate in the ground structure that Fig. 3 is circuit board shown in Fig. 1;
The cross-sectional view of pad structure in the ground structure that Fig. 4 is circuit board shown in Fig. 1.
Embodiment
In order to make the technical problems to be solved in the utility model, technical scheme and beneficial effect clearly understand, below in conjunction with drawings and Examples, the utility model is further elaborated.Should be appreciated that specific embodiment described herein only in order to explain the utility model, and be not used in restriction the utility model.
Refer to Fig. 1 and Fig. 2, ground structure in circuit board practical on power consumption equipment in the utility model preferred embodiment, this ground structure comprises substrate 10 and is arranged on the wiring (scheming not shown) on this substrate 10, described wiring comprises earth connection, substrate 10 offers the through hole 110 that runs through described substrate 10 and at least one is located in the pad structure 120 of this through hole 110, this pad structure 120 is provided with the scolding tin 123 be connected with described earth connection, when using screw 20, through described through hole 110, this circuit board is fixed on panel beating 30, described pad structure 120 electrically crimps with described screw 20 and/or described panel beating 30.In Fig. 2 embodiment, pad structure 120 is 8
Above-mentioned pcb terminal grounding design method solves printed circuit board (PCB) will by the problem of line body ground connection, can be directly effectively connected with the panel beating 30 connecing the earth by screw 20, not only can play fixing effect, and the safety ground effectively of the ground of printed circuit board (PCB).
Composition graphs 1, Fig. 3 and Fig. 4, pad structure 120 comprises perforate 121, is layed in the copper foil layer 122 of this perforate 121 inwall and is filled in the described scolding tin 123 of described perforate 121, and described copper foil layer 122 is connected with described earth connection.In the present embodiment, perforate 121 runs through the first surface of described substrate 10 and described second surface.So, when using screw 20, through described through hole 110, this circuit board is fixed on panel beating 30, nut 201 and the described panel beating 30 of described scolding tin 123 and described screw 20 all electrically crimp.
That is, after circuit board completes welding procedure, scolding tin 123 can be in the vias attached by perforate 121, and the levels of substrate 10 helps welding zone also can enclose scolding tin 123.As shown in Figure 4, in order to ensure that there is certain distance in panel beating 30 and other region of circuit board but at ground area and circuit board contacts, panel beating 30 earthing screw hole is for protruding design; When circuit board is fixed with panel beating 30 by screw 20, because scolding tin 123 is soft metals, by screw 20 effect with panel beating 30 pressure, scolding tin 123 flattens and to increase with the contact-making surface of screw 20 and panel beating 30, and the earth connection of such substrate 10 reaches the effect of safety ground.
In other embodiments, described perforate 121 can not be through-hole structure.It can be opened in the first surface of described substrate 10, and now, when using screw 20, through described through hole 110, this circuit board is fixed on panel beating 30, described scolding tin 123 electrically crimps with the nut 201 of described screw 20.In addition, can also be the second surface relative with described first surface being opened in described substrate 10.When using screw 20, through described through hole 110, this circuit board is fixed on panel beating 30, described scolding tin 123 electrically crimps with described panel beating 30
In the present embodiment, the diameter of described perforate 121 is greater than 0.8mm, and is less than 2mm.Be preferably 1.2mm.And in fact, the size of through hole 110 and perforate 121, size, shape, quantity, adjust flexibly according to practical application, combine, to obtain best upper tin effect.
The foregoing is only preferred embodiment of the present utility model; not in order to limit the utility model; all do within spirit of the present utility model and principle any amendment, equivalent to replace and improvement etc., all should be included within protection range of the present utility model.
Claims (6)
1. the ground structure of a circuit board, the wiring comprising substrate and arrange on the substrate, described wiring comprises earth connection, it is characterized in that, described substrate offers the through hole that runs through described substrate and at least one is located in the pad structure of this through hole, this pad structure is provided with the scolding tin be connected with described earth connection, and when using screw, through described through hole, this circuit board is fixed on panel beating, described pad structure electrically crimps with described screw and/or described panel beating.
2. the ground structure of circuit board as claimed in claim 1, it is characterized in that, described pad structure comprises perforate, is layed in the copper foil layer of this perforate inwall and is filled in the described scolding tin of described perforate, and described copper foil layer is connected with described earth connection.
3. the ground structure of circuit board as claimed in claim 2, it is characterized in that, described perforate is opened in the first surface of described substrate; Or, be opened in the second surface relative with described first surface of described substrate; Or, run through described first surface and described second surface.
4. the ground structure of as claimed in claim 2 or claim 3 circuit board, is characterized in that, when using screw, through described through hole, this circuit board is fixed on panel beating, nut and/or the described panel beating of described scolding tin and described screw electrically crimp.
5. the ground structure of circuit board as claimed in claim 2 or claim 3, it is characterized in that, the diameter of described perforate is greater than 0.8mm, and is less than 2mm.
6. a power consumption equipment, is characterized in that, comprises the ground structure of the circuit board described in any one of claim 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520239838.6U CN204598454U (en) | 2015-04-20 | 2015-04-20 | The ground structure of circuit board and power consumption equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520239838.6U CN204598454U (en) | 2015-04-20 | 2015-04-20 | The ground structure of circuit board and power consumption equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204598454U true CN204598454U (en) | 2015-08-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520239838.6U Active CN204598454U (en) | 2015-04-20 | 2015-04-20 | The ground structure of circuit board and power consumption equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN204598454U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107750089A (en) * | 2017-12-08 | 2018-03-02 | 无锡隆盛科技股份有限公司 | A kind of air throttle grounding structure of circuit board |
| CN116406149A (en) * | 2023-03-01 | 2023-07-07 | 通用技术集团国测时栅科技有限公司 | Method for assembling multipoint grounding of circuit board |
-
2015
- 2015-04-20 CN CN201520239838.6U patent/CN204598454U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107750089A (en) * | 2017-12-08 | 2018-03-02 | 无锡隆盛科技股份有限公司 | A kind of air throttle grounding structure of circuit board |
| CN116406149A (en) * | 2023-03-01 | 2023-07-07 | 通用技术集团国测时栅科技有限公司 | Method for assembling multipoint grounding of circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |